Direct insertion type triode lead frame

Abstract

The utility model discloses a direct insertion type triode lead frame, which comprises a transverse rib, a plurality of direct insertion type triode leads uniformly penetrate through the top of the transverse rib from left to right, each direct insertion type triode lead comprises a plurality of pins, and each pin fixedly penetrates through the top of the transverse rib through integral pouring. The top end of each pin is fixedly connected with a silver-plated plastic-sealed end through integral pouring, and bottom ribs are connected among the bottom ends of the pins in the plurality of in-line triode leads through integral pouring. According to the utility model, through cutting the first crease and the second crease, uniform segmentation of the in-line triode lead on the lead frame is completed, the situation of non-uniform plastic package and non-uniform size during installation is ensured not to occur, and through indication segmentation of the first crease and the second crease, the segmentation efficiency is improved. And moreover, complicated processing is not carried out through redundant materials, the structure is simple, the investment is low, the manufacturing cost is low, and the practicability is good.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a direct-insertion triode lead frame. Background Art

[0002] With the development of the times, semiconductor components are constantly moving towards low cost, miniaturization and integration, and the performance of devices will double every year. The transistor is an electronic component with a very wide range of applications. It is widely used in various electronic and electrical fields such as energy-saving lamps, chargers, power transmission and transformation, switching power supplies, household appliances and automotive electronics; especially in recent years, various electronic communication products such as iPhone and iPad have appeared on the market, bringing new happiness and fun to people's lives.

[0003] The existing direct-insert transistor lead frame has a complex structure. The frame and the transistor lead are processed as one piece. During installation, they need to be cut to length according to the number of installation requirements. Since there are no marks on the surface of the frame, the transistor leads cannot be quickly and evenly divided, resulting in uneven plastic sealing of different sizes during installation, which increases the difficulty of mounting components and reduces the efficiency of mounting components.

[0004] Therefore, it is necessary to provide a direct-insertion transistor lead frame to solve the above technical problems. Utility Model Content

[0005] The utility model aims to provide a direct-insertion transistor lead frame to solve the problem that the transistor lead frame is complex in structure and difficult to split in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a direct-insert transistor lead frame, comprising: a horizontal rib, a plurality of direct-insert transistor leads are uniformly penetrated through the top of the horizontal rib from left to right, the direct-insert transistor leads include a plurality of pins, each pin is fixed through the top of the horizontal rib by integral casting, the top of each pin is fixedly connected to a silver-plated plastic-sealed end by integral casting, a bottom rib is connected between the bottom ends of the internal pins of the plurality of direct-insert transistor leads by integral casting, a first fold is pressed on the front side of the bottom rib between two adjacent direct-insert transistor leads, and a second fold is pressed on the front side of the horizontal rib between two adjacent direct-insert transistor leads.

[0007] Preferably, the first fold can evenly divide the bottom rib according to the position of the leads of the direct-insertion transistor.

[0008] Preferably, the second fold can evenly divide the transverse ribs according to the positions of the leads of the direct-insertion transistor.

[0009] Preferably, each direct-insertion transistor lead has five internal pins.

[0010] Preferably, a punching hole penetrating the first fold is formed on the bottom rib.

[0011] Preferably, the bottom of the transverse rib is provided with a lug that matches the bending of the second fold through integral casting.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: the plug-in transistor lead frame completes uniform segmentation of the plug-in transistor leads on the lead frame by cutting at the first fold and the second fold, ensuring that uneven plastic sealing and uneven sizes will not occur during installation, and the first fold and the second fold are used to indicate the segmentation, which is convenient for the upstream and downstream industries of semiconductor devices to mount devices, and there is no tedious processing with excess materials, the structure is simple, the investment is small, the production cost is low, and the practicality is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic front view of the structure of the utility model;

[0014] Figure 2 It is a schematic side view of the structure of the utility model;

[0015] Figure 3 for Figure 1 The three-dimensional diagram of the molding structure of the direct-insertion transistor lead product is shown.

[0016] In the figure: 1, horizontal rib; 2, direct-insert transistor lead; 3, bottom rib; 4, first fold; 5, second fold; 21, pin; 22, silver-plated plastic terminal. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-3The utility model provides a technical solution: a direct-insert transistor lead frame, comprising: a horizontal rib 1, a plurality of direct-insert transistor leads 2 are uniformly penetrated from left to right on the top of the horizontal rib 1, the direct-insert transistor lead 2 comprises a plurality of pins 21, each pin 21 is fixed through the top of the horizontal rib 1 by integral casting, a silver-plated plastic-sealed end 22 is fixedly connected to the top of each pin 21 by integral casting, a bottom rib 3 is connected between the bottom ends of the pins 21 inside the plurality of direct-insert transistor leads 2 by integral casting, a first fold 4 is pressed on the front of the bottom rib 3 between two adjacent direct-insert transistor leads 2, a second fold 5 is pressed on the front of the horizontal rib 1 between two adjacent direct-insert transistor leads 2, the silver-plated plastic-sealed end 22 inside the direct-insert transistor lead 2 is a segmented silver-plated area, and can be spliced ​​into a complete injection molding frame by injection molding.

[0019] See also Figure 1-2 The first fold 4 can evenly divide the bottom rib 3 according to the position of the direct-insert transistor lead 2. The first fold 4 evenly divides the bottom rib 3 to ensure that the length of the bottom rib 3 on each direct-insert transistor lead 2 is equal, which is convenient for installation.

[0020] See also Figure 1-2 The second fold 5 can evenly divide the transverse rib 1 according to the position of the direct-insert transistor lead 2. The second fold 5 evenly divides the transverse rib 1 to ensure that the length of the transverse rib 1 on each direct-insert transistor lead 2 is equal, which is convenient for installation.

[0021] See also Figure 1-2 The number of internal pins 21 of each direct-insertion transistor lead 2 is five.

[0022] See also Figure 1-2 A punching hole penetrating through the first fold 4 is provided on the bottom rib 3 , so that the area of ​​the bottom rib 3 at the connection of the first fold 4 is smaller, which facilitates the division of the bottom rib 3 .

[0023] See also Figure 1-2 The bottom of the transverse rib 1 is integrally cast with a lug that matches the bending of the second fold 5, and the lug is used to facilitate the plastic sealing and installation of the equally cut transverse rib 1 and the straight-insertion three-stage tube lead 2.

[0024] Working principle: Figure 1-3As shown, when using the direct-insert transistor lead frame, first, by cutting the first fold 4, the bottom rib 3 can be evenly divided, and then the bottom ends of the direct-insert transistor leads 2 on the lead frame can be separated one by one, and then by cutting the second fold 5, the transverse rib 1 can be evenly divided, and the top ends of the direct-insert transistor leads 2 on the lead frame can be separated one by one, completing the even division of the direct-insert transistor leads 2 on the lead frame, ensuring that there will be no uneven plastic sealing and uneven sizes during installation, and indicating the division through the first fold 4 and the second fold 5, it is convenient for the upstream and downstream industries of semiconductor devices to mount devices, and there is no cumbersome processing through excess materials, the structure is simple, the investment is small, the production cost is low, and the practicability is good. This is the characteristic of the direct-insert transistor lead frame.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A direct-insertion transistor lead frame, comprising: A transverse rib (1), characterized in that a plurality of direct-insert transistor leads (2) are uniformly penetrated from left to right on the top of the transverse rib (1), the direct-insert transistor leads (2) comprising a plurality of pins (21), each pin (21) being fixedly penetrated through the top of the transverse rib (1) by integral casting, the top of each pin (21) being fixedly connected to a silver-plated plastic-sealed end (22) by integral casting, a bottom rib (3) being connected between the bottom ends of the pins (21) inside the plurality of direct-insert transistor leads (2) by integral casting, a first fold (4) being pressed on the front of the bottom rib (3) between two adjacent direct-insert transistor leads (2), and a second fold (5) being pressed on the front of the transverse rib (1) between two adjacent direct-insert transistor leads (2).

2. The direct-insertion transistor lead frame according to claim 1, characterized in that: The first fold (4) can evenly divide the bottom rib (3) according to the position of the direct-insertion transistor lead (2).

3. The direct-insertion transistor lead frame according to claim 1, characterized in that: The second fold (5) can evenly divide the transverse rib (1) according to the position of the direct-insertion transistor lead (2).

4. The direct-insertion transistor lead frame according to claim 1, characterized in that: Each direct-insertion transistor lead (2) has five internal pins (21).

5. The direct-insertion transistor lead frame according to claim 1, characterized in that: The bottom rib (3) is provided with a punched hole penetrating the first fold (4).

6. The direct-insertion transistor lead frame according to claim 1, characterized in that: The bottom of the transverse rib (1) is provided with a lug that is bent to match the second fold (5) through integral casting.

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