PCBA board suitable for high-temperature and high-humidity environment

Abstract

The utility model relates to the technical field of PCBA boards, and discloses a PCBA board suitable for a high-temperature and high-humidity environment, which comprises two circuit boards, two sides of the outer part of one circuit board are fixedly connected with mounting blocks, the mounting blocks are internally provided with mounting grooves, the inner parts of the mounting grooves are slidably connected with connecting rods, and the connecting rods are fixedly connected with the circuit boards. A clamping block is rotatably connected to one end of the connecting rod, a moving groove is formed in the inner side wall of the mounting groove, a pressing rod is slidably connected to the interior of the moving groove, a first spring is fixedly connected to one end of the outer side of the pressing rod, a fixing groove is further formed in the mounting block, and a heat dissipation assembly is mounted outside the circuit board. According to the utility model, through the cooperation of the clamping blocks, the plugging blocks, the pressing rods, the fixing blocks, the mounting blocks and other structures, the splicing and fixing effects are conveniently realized, and a plurality of PCBA boards can be connected together through splicing and fixing, so that the strength and the stability of the whole structure are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCBA boards, in particular to a PCBA board suitable for high temperature and high humidity environments. Background Art

[0002] Printed circuit board, also known as printed circuit board, printed circuit board, often uses the English abbreviation PCB, is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. However, a PCBA board that can be quickly spliced ​​on the market still has various shortcomings and cannot meet production needs. The existing PCBA board connects two PCBA boards by welding. Although the welding is firm, the splicing efficiency is low and it is not convenient for subsequent disassembly. For this reason, technicians in this field have proposed a PCBA board suitable for high temperature and high humidity environments. Utility Model Content

[0003] In order to make up for the above shortcomings, the utility model provides a PCBA board suitable for high temperature and high humidity environment, aiming to improve the problems of inability to flexibly splice, subsequent disassembly and maintenance difficulties, and inability to effectively dissipate heat and prevent moisture for the PCBA board.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a PCBA board suitable for a high temperature and high humidity environment, comprising two circuit boards, wherein mounting blocks are fixedly connected to both sides of the outside of one of the circuit boards, a mounting groove is provided inside the mounting block, a connecting rod is slidably connected inside the mounting groove, a clamping block is rotatably connected to one end of the connecting rod, a movable groove is provided on the inner side wall of the mounting groove, a pressing rod is slidably connected inside the movable groove, a spring is fixedly connected to one end of the outer side of the pressing rod, a fixing groove is also provided inside the mounting block, and a heat dissipation component is installed outside the circuit board.

[0005] As a further description of the above technical solution:

[0006] The heat dissipation assembly includes a plurality of moisture-proof plates, which are fixedly connected to the outside of two circuit boards. The outside of the moisture-proof plates is provided with a plurality of heat dissipation holes. A heat sink is fixedly connected to the top of the circuit board, and the outer surfaces of the two circuit boards are coated with silicone grease.

[0007] As a further description of the above technical solution:

[0008] The other circuit board is fixedly connected to both sides of its exterior with fixed blocks, a sliding groove is provided inside the fixed block, a plug-in block is slidably connected to the sliding groove, a card slot is provided inside the plug-in block, a second spring is fixedly connected to the outer side of the plug-in block, and the other end of the second spring is fixedly connected to one side of the inner wall of the sliding groove.

[0009] As a further description of the above technical solution:

[0010] The heat sink is made of copper material, the heat sink is fixedly connected to the circuit board via heat conductive adhesive, and the moisture-proof plate is fixedly connected to the circuit board via polyurethane sealant.

[0011] As a further description of the above technical solution:

[0012] A buckling block is fixedly connected to one outer side of one of the circuit boards, and a buckling groove is provided on one outer side of the other circuit board.

[0013] As a further description of the above technical solution:

[0014] One end of the spring 1 is fixedly connected to the outer end of the pressing rod, and the other end of the spring 1 is fixedly connected to the bottom of the moving groove.

[0015] As a further description of the above technical solution:

[0016] One end of the connecting rod is rotatably connected to the clamping block, and the other end of the connecting rod is rotatably connected to an outer end of the pressing rod.

[0017] As a further description of the above technical solution:

[0018] The card slot and the card block are plug-fitted, and the plug-in block and the fixing slot are plug-fitted.

[0019] The utility model has the following beneficial effects:

[0020] 1. In the utility model, the splicing and fixing effect is conveniently achieved through the cooperation of the card block, the plug-in block, the pressing rod, the fixing block, the mounting block and the like. Through the splicing and fixing, multiple PCBA boards can be connected together, thereby increasing the strength and stability of the overall structure.

[0021] 2. In the utility model, the heat dissipation and moisture-proofing effect is conveniently achieved through the cooperation of structures such as silicone grease, heat sink, moisture-proof plate, and heat dissipation holes. The circuit board will generate heat when working. Excessive temperature may cause the performance of components to decline or even be damaged. Through effective heat dissipation design, the working temperature of the circuit board can be reduced. Under the effect of moisture-proofing, it is ensured that the circuit board is not easily corroded, oxidized, and short-circuited by moisture, thereby comprehensively improving the stability and reliability of the circuit board and extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional diagram of a PCBA board suitable for high temperature and high humidity environments proposed by the utility model;

[0023] Figure 2 A schematic diagram of the circuit board structure of a PCBA board suitable for high temperature and high humidity environments proposed by the utility model;

[0024] Figure 3 This is a schematic diagram of a snap-fit ​​block structure of a PCBA board suitable for high temperature and high humidity environments proposed by the utility model;

[0025] Figure 4 This is a cross-sectional view of a mounting block of a PCBA board suitable for a high temperature and high humidity environment proposed by the utility model.

[0026] Legend:

[0027] 1. Moisture-proof plate; 2. Heat dissipation hole; 3. Fixed block; 4. Plug block; 5. Mounting block; 6. Press rod; 7. Circuit board; 8. Heat sink; 9. Silicone grease; 10. Snap-fit ​​groove; 11. Snap-fit ​​block; 12. Card slot; 13. Card block; 14. Connecting rod; 15. Spring 1; 16. Moving groove; 17. Mounting groove; 18. Sliding groove; 19. Spring 2; 20. Fixed groove. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Reference Figure 1 , Figure 3 and Figure 4 The utility model provides an embodiment: a PCBA board suitable for a high temperature and high humidity environment, comprising two circuit boards 7, wherein both sides of the outside of one of the circuit boards 7 are fixedly connected with mounting blocks 5, a mounting groove 17 is provided inside the mounting block 5, a connecting rod 14 is slidably connected inside the mounting groove 17, a clamping block 13 is rotatably connected to one end of the connecting rod 14, a moving groove 16 is provided on the inner side wall of the mounting groove 17, a pressing rod 6 is slidably connected inside the moving groove 16, a spring 15 is fixedly connected to one end of the outer side of the pressing rod 6, a fixing groove 20 is also provided inside the mounting block 5, and a heat dissipation component is installed outside the circuit board 7.

[0030] The other circuit board 7 is fixedly connected to fixed blocks 3 on both sides of its exterior, a sliding groove 18 is provided inside the fixed block 3, a plug-in block 4 is slidably connected to the sliding groove 18, a card slot 12 is provided inside the plug-in block 4, a spring 2 19 is fixedly connected to the outer side of the plug-in block 4, and the other end of the spring 2 19 is fixedly connected to one side of the inner wall of the sliding groove 18.

[0031] A snap-fit ​​block 11 is fixedly connected to one side of the outside of one of the circuit boards 7, a snap-fit ​​groove 10 is opened on one side of the outside of the other circuit board 7, one end of a spring 15 is fixedly connected to the outer end of the pressing rod 6, the other end of the spring 15 is fixedly connected to the bottom of the movable groove 16, one end of the connecting rod 14 is rotatably connected to the block 13, the other end of the connecting rod 14 is rotatably connected to the outer end of the pressing rod 6, the groove 12 is plug-fitted to the block 13, and the plug-in block 4 is plug-fitted to the fixed groove 20.

[0032] Specifically, when two circuit boards 7 need to be spliced, the plug-in blocks 4 on both sides are pulled to slide outward along the inner wall of the sliding groove 18, so that the spring 19 is in a relaxed state, and the circuit board 7 fixed with the snap-fit ​​block 11 is inserted into the other circuit board 7 with the snap-fit ​​groove 10. At this time, the plug-in block 4 is inserted into the fixed groove 20 provided in the mounting block 5, and then the pressing rod 6 is pressed inward, so that the pressing rod 6 slides along one side of the inner wall of the mounting groove 17, and then slides along the inner wall of the movable groove 16. The spring 15 is moved so that the spring 15 is in an extruded state, and then the connecting rod 14 is driven to rotate inside the mounting groove 17, thereby driving the movement of the card block 13, so that the card block 13 is separated from the fixing groove 20 and enters the inside of the mounting groove 17. At this time, the plug-in block 4 enters the fixing groove 20 under the action of the spring 2 19, and then the pressing rod 6 is released. At this time, under the action of the spring 15, the pressing rod 6 pops outward, so that the card block 13 is stuck in the card groove 12, thereby completing the fixation of the two circuit boards 7.

[0033] Reference Figure 1 and Figure 2 The heat dissipation component includes multiple moisture-proof plates 1, which are fixedly connected to the outer sides of two circuit boards 7. Multiple heat dissipation holes 2 are opened on the outer sides of the moisture-proof plates 1. A heat sink 8 is fixedly connected to the top of the circuit board 7. The outer surfaces of the two circuit boards 7 are coated with silicone grease 9. The heat sink 8 is made of copper material. The heat sink 8 is fixedly connected to the circuit board 7 through thermal conductive glue. The moisture-proof plate 1 and the circuit board 7 are fixedly connected through polyurethane sealant.

[0034] Specifically, the moisture-proof plate 1 has a moisture-proof protection effect on the circuit board 7. The surface of the circuit board 7 is coated with silicone grease 9. Under the action of the silicone grease 9, the circuit board 7 can be well cooled. The heat sink 8 is fixed to the circuit board 7 by thermal conductive glue. The thermal conductive glue has a good heat transfer effect, and then the heat is transported outward through the heat sink 8. The heat sink 8 is made of copper, so that the heat can be quickly transferred outward. The heat absorbed by the silicone grease 9 and the heat sink 8 is transmitted outward through the heat dissipation holes 2. The moisture-proof plate 1 and the circuit board 7 are sealed by polyurethane sealant. The polyurethane sealant has good weather resistance and sealing properties, thereby effectively ensuring the moisture-proofness of the circuit board 7 and preventing the circuit board 7 from being damaged by moisture, thereby preventing damage to electronic components.

[0035] Working principle: when the two circuit boards 7 need to be fastened and fixed, the plug-in block 4 is pulled outward to make the plug-in block 4 move outward along the inner wall of the sliding groove 18, so that the spring 2 19 is in a compressed and relaxed state, and then the plug-in block 4 is inserted into the fixed groove 20, and the circuit board 7 with the fastening block 11 is also inserted into the circuit board 7 with the fastening groove 10. At this time, the pressing rod 6 is pressed inward to make the pressing rod 6 slide along the inner wall of the installation groove 17 first and then along the inner wall of the movable groove 16, so that the spring 15 is in an extruded state, and at the same time, the connecting rod 14 is driven to rotate, so that the card block 13 is disengaged from the fixed groove 20 and moves to the through hole of the installation block 5. At this time, the plug-in block 4 is completely connected with the fixed groove under the action of the spring 2 19. The inner wall of 20 is fitted, and then the pressing rod 6 is loosened, and under the action of the spring 15, the pressing rod 6 is popped out, so that the connecting rod 14 is rotated inside the installation groove 17, thereby driving the card block 13 to enter the card slot 12 opened in the plug-in block 4, thereby effectively fixing the plug-in block 4, that is, completing the splicing and fixing of the two circuit boards 7. When the circuit board 7 needs to be cooled, when the circuit board 7 is in operation, the heat generated by the circuit board 7 at this time will be absorbed and dissipated by the silicone grease 9 and the heat sink 8, and the heat absorbed by the silicone grease 9 and the heat sink 8 will be discharged through the heat dissipation hole 2, so as to achieve an effect of cooling the circuit board 7. Under the action of the moisture-proof plate 1, a moisture-proof effect on the circuit board 7 is achieved.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCBA board suitable for high temperature and high humidity environment, comprising two circuit boards (7), characterized in that: Both sides of the outside of one of the circuit boards (7) are fixedly connected to mounting blocks (5); a mounting groove (17) is provided inside the mounting block (5); a connecting rod (14) is slidably connected inside the mounting groove (17); one end of the connecting rod (14) is rotatably connected to a clamping block (13); a movable groove (16) is provided on the inner side wall of the mounting groove (17); a pressing rod (6) is slidably connected inside the movable groove (16); a spring (15) is fixedly connected to the outer end of the pressing rod (6); a fixing groove (20) is also provided inside the mounting block (5); and a heat dissipation component is installed outside the circuit board (7).

2. The PCBA board suitable for high temperature and high humidity environment according to claim 1, characterized in that: The heat dissipation assembly comprises a plurality of moisture-proof plates (1), the moisture-proof plates (1) being fixedly connected to the outer sides of two circuit boards (7), the outer sides of the moisture-proof plates (1) being provided with a plurality of heat dissipation holes (2), the tops of the circuit boards (7) being fixedly connected with heat sinks (8), and the outer surfaces of the two circuit boards (7) being coated with silicone grease (9).

3. The PCBA board suitable for high temperature and high humidity environment according to claim 1, characterized in that: The other circuit board (7) is fixedly connected to a fixed block (3) on both sides of its exterior, a sliding groove (18) is provided inside the fixed block (3), a plug-in block (4) is slidably connected to the sliding groove (18), a card slot (12) is provided inside the plug-in block (4), a spring (19) is fixedly connected to the exterior of the plug-in block (4), and the other end of the spring (19) is fixedly connected to one side of the inner wall of the sliding groove (18).

4. The PCBA board suitable for high temperature and high humidity environment according to claim 2, characterized in that: The heat sink (8) is made of copper material, the heat sink (8) is fixedly connected to the circuit board (7) via heat-conducting adhesive, and the moisture-proof plate (1) is fixedly connected to the circuit board (7) via polyurethane sealant.

5. The PCBA board suitable for high temperature and high humidity environment according to claim 1, characterized in that: A buckling block (11) is fixedly connected to an outer side of one of the circuit boards (7), and a buckling groove (10) is provided on an outer side of the other circuit board (7).

6. The PCBA board suitable for high temperature and high humidity environment according to claim 2, characterized in that: One end of the spring one (15) is fixedly connected to the outer end of the pressing rod (6), and the other end of the spring one (15) is fixedly connected to the bottom of the moving groove (16).

7. The PCBA board suitable for high temperature and high humidity environment according to claim 1, characterized in that: One end of the connecting rod (14) is rotatably connected to the clamping block (13), and the other end of the connecting rod (14) is rotatably connected to an outer end of the pressing rod (6).

8. The PCBA board suitable for high temperature and high humidity environment according to claim 3, characterized in that: The card slot (12) and the card block (13) are plug-fitted, and the plug-in block (4) and the fixing slot (20) are plug-fitted.

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