Radiator

Abstract

The radiator comprises a base body, at least one heat conductor made of heat conduction materials or structures is arranged on the base body, an elastic piece is arranged between the heat conductor and the base body, the heat conductor and the base body are completely or partially separated through the elastic piece, a gap is formed between the heat conductor and the base body, and the heat conductor can rotate or move relative to the base body.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation of circuit boards, in particular to a radiator. Background Art

[0002] With the development of science and technology, the power consumption of electronic components such as various chips, capacitors, inductors, MOS tubes on PCB circuit boards such as m2 solid-state or gigabit network cards or graphics cards is getting higher and higher, and the heat generation is getting more and more serious. The heat dissipation demand of the device is becoming more and more serious. In addition, since the heat dissipation surfaces of the components are different in height and very close after being installed on the board, it is not easy to install a liquid cooling head for them separately. Therefore, a liquid cooling radiator with a multi-heat dissipation surface liquid cooling head that can dissipate heat for electronic components of different heights at the same time is born. However, at present, the multi-heat dissipation surface liquid cooling head often uses a machining center to mill the entire piece of thermal conductive material to produce the required high and low heat dissipation surfaces and grooves or columnar arrays. Its production cost is high, and it is time-consuming and inefficient. At the same time, due to the different heights of multiple heat sources, it is difficult to have good contact with all of them during installation. A slight deviation may cause excessive local pressure and damage the chip.

[0003] Therefore, it is necessary to propose a radiator to solve the problems of the current radiator being expensive, difficult to use, and easy to fracturing the heat source. Summary of the invention

[0004] The present invention discloses a radiator, which reduces production costs by simplifying the design structure. By enabling the heat conductor to float or rotate freely relative to the base body, the heat source is prevented from being crushed or having poor contact due to excessive pressure or incorrect angle, thereby reducing the difficulty of installation and use, improving the manufacturing tolerance, and reducing costs.

[0005] Specifically:

[0006] A heat sink is disclosed, comprising a substrate, wherein at least one heat conductor composed of a heat-conducting material or structure is arranged on the substrate, wherein the heat-conducting material or structure comprises copper, silver, aluminum, graphite or a phase-change heat pipe, an elastic member is arranged between the heat conductor and the substrate, wherein the elastic member comprises a sealing ring, a rubber pad, a soft glue, an air bag, a piston cavity or a spring, wherein the elastic member completely or partially separates the heat conductor from the substrate so as to generate an adjustment gap between the heat conductor and the substrate, wherein a mounting structure is arranged on the substrate, wherein the mounting structure comprises a screw, a screw hole, a buckle, a pressure plate or a binding band, wherein the mounting structure mounts the substrate on a circuit board so that the heat conductor is in close contact with a first type of heat source on the circuit board, wherein the elastic member is compressed and deformed during the contact process so as to change the adjustment gap, and at this time, the heat conductor completes a relative rotation or displacement with respect to the substrate, wherein the first type of heat source is a component with the highest heat density on the circuit board, including a silicon wafer or a power device.

[0007] In at least one specific embodiment of the present invention, a limiting structure is provided on the heat conductor or the substrate, and the limiting structure includes screws or screw holes or buckles or pressure plates or binding straps. The limiting structure loosely mounts the heat conductor on the substrate and fixes the adjustment range of the adjustment gap.

[0008] In at least one specific embodiment of the present invention, it includes an indicating structure, which is fixed on the substrate or on the heat conductor. The indicating structure includes a mounting part or a pressure-sensitive part. The mounting part includes a screw or a screw hole or a buckle or a pressure plate or a strap. The mounting part changes simultaneously with the change of the adjustment gap. The change of the mounting part includes a change in the mutual distance between the mounting parts or a deformation of the mounting part body. The pressure-sensitive part includes a pressure-sensitive element or a pressure-sensitive coating or a pressure gauge. The pressure-sensitive part changes simultaneously with the change of the adjustment gap. The change of the pressure-sensitive part includes a change in electrical value or color or reading. The electrical value includes resistance value or capacitance value or current value or voltage value or inductance value.

[0009] In at least one specific embodiment of the present invention, the substrate is composed of a heat-conducting material or structure, the substrate is attached to a second type of heat source, the second type of heat source is a component on the circuit board whose heat density is between 0% and 70% of the first type of heat source, the second type of heat source includes a storage chip or a power supply chip, and a heat-conducting fluid or a heat-conducting solid is provided between the substrate and the heat source, the heat-conducting fluid includes thermal grease or thermal glue or thermal mud, and the heat-conducting solid includes a copper block or an aluminum block.

[0010] In at least one specific embodiment of the present invention, a first cold liquid channel is provided in the heat conductor, or the heat conductor and the substrate are sealed and fitted to each other to form a first cold liquid channel between the heat conductor and the substrate, and the first cold liquid channel has a first inlet and a first outlet.

[0011] In at least one specific embodiment of the present invention, the heat conductor is provided with a groove on one side of the first cold liquid channel, and a first channel cover is provided above the groove. The first channel cover is closely attached to the groove to form the first cold liquid channel. The first channel cover leaves space on both sides of the groove to allow cold liquid to enter and exit the first cold liquid channel, thereby forming a first inlet and a first outlet of the first cold liquid channel.

[0012] In at least one specific embodiment of the present invention, a second cold liquid channel is provided in the base, or a cover plate is provided on the base, and the base and the cover plate are sealed and fitted to form a second cold liquid channel, and the second cold liquid channel is provided with a second inlet and a second outlet.

[0013] In at least one specific embodiment of the present invention, the first cold liquid channel and the second cold liquid channel are interconnected to form a total inlet and a total outlet. After the cold liquid flows in through the total inlet, at least part of the cold liquid first enters the first cold liquid channel and then the second cold liquid channel and finally flows out from the total outlet, or first enters the second cold liquid channel and then the first cold liquid channel and finally flows out from the total outlet, or first flows through part of the second cold liquid channel and then enters the first cold liquid channel and then returns to the remaining second cold liquid channel and finally flows out from the total outlet, or enters the first cold liquid channel and the second cold liquid channel at the same time and finally flows out from the total outlet.

[0014] In at least one specific embodiment of the present invention, the first cold liquid channel is connected in parallel to the parallel point in the second cold liquid channel, and an elastic isolation member is provided between the first cold liquid channel and the second cold liquid channel. The elastic isolation member includes a sealing ring or a rubber pad or an air bag or a hose. The elastic isolation member deforms synchronously when the adjustment gap changes, so that the elastic isolation member always partially or completely isolates the liquid path at the parallel point of the second cold liquid channel, so that part of the cold liquid or all of the cold liquid flows from the second cold liquid channel on one side of the elastic isolation member through the first inlet into the first cold liquid channel, and then flows out of the first cold liquid channel from the first outlet on the other side of the elastic isolation member and returns to the remaining second cold liquid channel.

[0015] Preferably, when the mounting structure mounts the base on the circuit board, the mounting structure is fixed at the mounting position on the circuit board, and the first distance is smaller than the second distance, the first distance being the average distance between various positions on the surface where the elastic member is projected and the center of the first type of heat source surface, and the second distance being the average distance between various positions on the surface where the mounting position is projected and the center of the first type of heat source surface.

[0016] Preferably, the first distance is less than 70% of the second distance.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] By splitting the complex shape of the existing integrated liquid cooling head heat-conducting base plate into a combination of multiple simple shapes, the cumbersome processing steps originally required by the processing center are replaced with simpler and cheaper processing steps, thereby improving productivity and reducing production costs.

[0019] By adding an adjustment gap and an elastic member between the heat conductor and the base, the heat conductor and the base can move relative to each other after being pressed, thereby avoiding damage due to stress concentration of the heat source and reducing the difficulty of installation.

[0020] By providing an indication structure, it is easy to see whether the heat conductor is in good contact with the heat source, thereby improving installation convenience.

[0021] By setting up a cooling liquid channel, the overall heat dissipation capacity is improved.

[0022] By decoupling the heat conductor from the substrate and reducing the torque of the heat conductor's rotation, the force required to rotate or displace the heat conducting surface on the heat conductor is greatly reduced, making it easier for the heat conducting surface to fit with the heat dissipation surface and more difficult to crack the heat dissipation surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a preferred radiator structure diagram.

[0024] Figure 2 The figure is a comparison diagram of the radiator state when the elastic member is compressed and uncompressed.

[0025] Figure 3 This is a preferred radiator structure diagram.

[0026] Figure 4 This is a preferred structural diagram of the first cooling liquid channel.

[0027] Figure 5 This is a preferred combined structural diagram of the first cooling liquid channel and the second cooling liquid channel.

[0028] In the figure, 1-circuit board, 11-first type of heat source, 12-second type of heat source, 2-base, 21-mounting part, 22-copper block, 3-heat conductor, 31-limiting structure, 32-indicating structure, 33-first cold liquid channel, 34-first inlet, 35-first outlet, 36-groove, 37-first channel cover, 4-elastic part, 41-gap, 5-cover body, 51-second inlet, 52-second outlet, 53-elastic isolation part, 54-second cold liquid channel. DETAILED DESCRIPTION

[0029] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In at least one specific embodiment of the present invention, Figure 1As shown, it is a preferred overall structure diagram of a heat sink. In this embodiment, the stopper 31 is a set of screws, which pass through the through holes on the base 2 and are screwed into the threaded holes of the heat conductor 3. A rubber ring is sandwiched between the base 2 and the heat conductor 3 as an elastic member 4. The base 2, the heat conductor 3, and the elastic member 4 constitute the heat sink as a whole. Another set of screws as mounting members 21 pass through the through holes on the base 2, the through holes or threaded holes on the circuit board 1 to fix the heat sink as a whole to the circuit board 1. The first type of heat source 11 (core) on the circuit board 1 is tightly fitted with the heat conductor 3, and the second type of heat source 12 (storage chip or power supply chip) is tightly fitted with the base.

[0031] Figure 2 It is a preferred comparison diagram of the radiator state when the elastic member is compressed and not compressed. In this embodiment, when the elastic member 4 is not under pressure, the gap 41 is the largest, as shown in the upper half of the figure. When the heat conductor 3 is in close contact with the first type of heat source 11, the elastic member 4 is compressed, and the gap 41 is reduced at the same time as shown in the lower half of the figure. At this time, the limiting structure 31 is no longer in close contact with the base 2, so it can also serve as an indication structure 32. When it is observed that all the indication structures 32 in this example are no longer in close contact with the base 2, it indicates that the heat conductor 3 is in complete and close contact with the first type of heat source. In this embodiment, the heat conductor 3 can rotate and displace relative to the base 2 at the same time, while in other embodiments it can only displace but not rotate.

[0032] In at least one specific embodiment of the present invention, Figure 3 As shown, the base 2 is made of a heat-conducting material and is in close contact with the second type of heat source 12 on the circuit board 1 through the copper block 22, so that the first type of heat source 11 and the second type of heat source 12 on the circuit board 1 can simultaneously obtain improved heat dissipation.

[0033] In at least one specific embodiment of the present invention, Figure 4 As shown, a groove 36 is provided on the side of the heat conductor 3 facing away from the first lightning heat source, and a first channel cover 37 is provided on the groove 36. Both ends of the groove 36 are left empty to form a first inlet 34 and a first outlet 35. The groove 36, the first channel cover 37, the first inlet 34, and the first outlet 35 together form a first cold liquid channel 33.

[0034] In some embodiments, an inlet is disposed in the middle of the first channel cover plate 37 , and the cold liquid enters through the inlet, flows along the groove 36 , and finally flows out from a plurality of outlets.

[0035] In at least one specific embodiment of the present invention, Figure 5As shown, the first cold liquid channel 33 formed by the heat conductor 3 and the first channel cover plate 37 is connected in parallel to the second cold liquid channel 54 formed by the base 2 and the cover body 5. An elastic isolator 53 is provided between the first channel cover plate 37 and the second cold liquid channel 54 to isolate the second cold liquid channel 54 into two parts, one part is connected to the first inlet 34 of the first cold liquid channel 33, and the other part is connected to the first outlet 35, so that the cold liquid enters the second cold liquid channel 54 from the second inlet 51, passes through the first cold liquid channel 33, returns to the remaining second cold liquid channel 54, and finally flows out from the second outlet 52 to form a complete liquid path. The elastic isolator 53 deforms synchronously when the gap 41 changes to keep the flow direction of the liquid path unchanged.

[0036] In at least one specific embodiment of the present invention, the first inlet 34 and the second inlet 51 are integrated into one, or the second inlet 35 and the second outlet 52 are integrated into one.

[0037] After adopting the above scheme, the heat conductor 3 can change the angle or distance between the heat conductor 3 and the substrate 2 within the adjustment range of the gap 4 when it is in close contact with the first type of heat source 11, so as to prevent the first type of heat source 11 and the heat conductor 3 from being damaged due to excessive pressure or being damaged due to stress concentration caused by an incorrect angle. At the same time, an indication structure is provided, so that it becomes clear at a glance whether the heat conductor 3 is in good contact with the first type of heat source, which reduces the difficulty of installation and improves safety.

[0038] The above description is only preferably used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art can still make other modifications to the technical solution of the present invention or replace some of the technical features therein with equivalents, or split or merge some of them. Any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the technical solution of the present invention are all covered by the protection scope of the present invention.

Claims

1. A radiator, characterized in that: The invention comprises a substrate, on which at least one heat conductor made of a heat-conducting material or structure is arranged, wherein the heat-conducting material or structure comprises copper, silver, aluminum, graphite or a phase-change heat pipe, an elastic member is arranged between the heat conductor and the substrate, wherein the elastic member comprises a sealing ring, a rubber pad, a soft glue, an air bag, a piston cavity or a spring, wherein the elastic member completely or partially separates the heat conductor from the substrate so as to generate an adjustment gap between the heat conductor and the substrate, and an installation structure is arranged on the substrate, wherein the installation structure comprises a screw, a screw hole, a buckle, a pressure plate or a binding band, wherein the installation structure installs the substrate on a circuit board so that the heat conductor is in close contact with a first type of heat source on the circuit board, wherein the elastic member is compressed and deformed during the process of close contact so as to change the adjustment gap, and at this time, the heat conductor completes a relative rotation or displacement with respect to the substrate, wherein the first type of heat source is a component with the highest heat density on the circuit board including a silicon wafer or a power device.

2. A heat sink according to claim 1, characterized in that: The heat conductor or the base is provided with a limiting structure, which includes screws or screw holes or buckles or pressure plates or binding straps. The limiting structure loosely mounts the heat conductor on the base and fixes the adjustment range of the adjustment gap.

3. A heat sink according to claim 1, characterized in that: The invention comprises an indicating structure, wherein the indicating structure is fixed on the substrate or on the heat conductor, the indicating structure comprises a mounting part or a pressure-sensitive part, the mounting part comprises a screw or a screw hole or a buckle or a pressure plate or a binding strap, the mounting part changes simultaneously with the change of the adjusting gap, the change of the mounting part comprises a change of the mutual distance of the mounting parts or a deformation of the mounting part body, the pressure-sensitive part comprises a pressure-sensitive element or a pressure-sensitive coating or a pressure gauge, the pressure-sensitive part changes simultaneously with the change of the adjusting gap, the change of the pressure-sensitive part comprises a change of an electrical value or a color or a reading, and the electrical value comprises a resistance value or a capacitance value or a current value or a voltage value or an inductance value.

4. The heat sink according to claim 1, characterized in that: The substrate is made of a heat-conducting material or structure, and the substrate is attached to a second type of heat source. The second type of heat source is a component on the circuit board whose heat density is between 0% and 70% of the first type of heat source. The second type of heat source includes a storage chip or a power supply chip. A heat-conducting fluid or a heat-conducting solid is provided between the substrate and the heat source. The heat-conducting fluid includes heat-conducting silicone grease, heat-conducting glue or heat-conducting mud, and the heat-conducting solid includes a copper block or an aluminum block.

5. The heat sink according to claim 1, characterized in that: The heat conductor is provided with a first cold liquid channel, or the heat conductor and the base are sealed and attached to each other to form a first cold liquid channel between the heat conductor and the base, and the first cold liquid channel is provided with a first inlet and a first outlet.

6. A heat sink according to claim 5, characterized in that: The heat conductor is provided with a groove on one side of the first cold liquid channel, and a first channel cover is provided above the groove. The first channel cover is closely attached to the groove to form the first cold liquid channel. The first channel cover leaves space on both sides of the groove to allow cold liquid to enter and exit the first cold liquid channel, thereby forming a first inlet and a first outlet of the first cold liquid channel.

7. The heat sink according to claim 5, characterized in that: A second cold liquid channel is provided in the base, or a cover plate is provided on the base, and the base and the cover plate are sealed and attached to form the second cold liquid channel, and the second cold liquid channel is provided with a second inlet and a second outlet.

8. A heat sink according to claim 7, characterized in that: The first cold liquid channel and the second cold liquid channel are interconnected to form a total inlet and a total outlet. After the cold liquid flows in through the total inlet, at least part of the cold liquid first enters the first cold liquid channel and then the second cold liquid channel and finally flows out from the total outlet, or first enters the second cold liquid channel and then the first cold liquid channel and finally flows out from the total outlet, or first flows through part of the second cold liquid channel and then enters the first cold liquid channel and then returns to the remaining second cold liquid channel and finally flows out from the total outlet, or enters the first cold liquid channel and the second cold liquid channel at the same time and finally flows out from the total outlet.

9. The heat sink according to claim 7, characterized in that: When the mounting structure mounts the base on the circuit board, the mounting structure is fixed at the mounting position on the circuit board, and the first distance is smaller than the second distance. The first distance is the average distance between various positions on the surface where the elastic member is projected and the center of the first type of heat source surface, and the second distance is the average distance between various positions on the surface where the mounting position is projected and the center of the first type of heat source surface.

10. The heat sink according to claim 9, characterized in that: The first distance is less than 70% of the second distance.

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