Pass-type spray cleaning equipment for chip fragile disk
By setting up cleaning strips and cleaning tubes in the chip crunch disk spray cleaning equipment, and using the design of protection and buffer components, the problem that existing equipment cannot thoroughly clean the blind spots on the surface of the items is solved, achieving more efficient cleaning results and higher product quality.
Patent Information
- Application Number
- CN202421198886.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-29
AI Technical Summary
Existing chip brittle disk spray cleaning equipment cannot thoroughly clean blind spots on the surface of the article, resulting in dirt or residue retention, affecting the cleaning effect, reducing product quality and possibly introducing contaminants in the chip manufacturing process.
A chip brittle disk pass spray cleaning device is designed. By setting a cleaning strip and cleaning pipe in the cleaning box, the items are cleaned three times during the cleaning process, and through the setting of the protective components and buffer components, the items are ensured to be buffered during the cleaning process to avoid damage.
This equipment can significantly improve the thoroughness of cleaning items, reduce dirt residue, improve product quality and chip reliability, enhance cleaning efficiency and item qualification rate.
Smart Images
Figure CN222551506U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip crisp disks, in particular to a chip crisp disk through-type spray cleaning equipment. Background Art
[0002] Chip tray through-type spray cleaning equipment plays a vital role in semiconductor manufacturing and integrated circuit (IC) packaging. With the continuous advancement of semiconductor technology and the shrinking chip size, the cleanliness requirements in the chip manufacturing process are getting higher and higher. As an important tool for carrying and transmitting chips, the cleanliness of the chip tray surface directly affects the quality and performance of the chip.
[0003] In the prior art, when cleaning an object, the object is directly placed on a conveyor belt, and then driven by the conveyor belt, the object is spray-cleaned in a cleaning box. However, this cleaning method may result in the dead corners on the surface of the object not being thoroughly cleaned, thereby leaving dirt or residues, affecting the cleaning effect. This may lead to a decline in product quality, and even introduce contaminants during the chip manufacturing process, affecting the performance and reliability of the chip; therefore, it does not meet the existing needs, and we propose a chip crisp plate through-type spray cleaning equipment. Utility Model Content
[0004] The utility model provides a chip crisp plate through-type spray cleaning equipment, which has the beneficial effect of cleaning the items as clean as possible, and solves the problem that in the prior art mentioned in the above background technology, when cleaning the items, the items are directly placed on the conveyor belt, and then driven by the conveyor belt, and the items are sprayed and cleaned in the cleaning box, but this cleaning method may cause the dead corners on the surface of the items to not be thoroughly cleaned, thereby leaving dirt or residues, affecting the cleaning effect. This may lead to a decline in product quality, and even introduce pollutants in the chip manufacturing process, affecting the performance and reliability of the chip.
[0005] The utility model provides the following technical solution: a chip crisp plate through-type spray cleaning equipment, comprising a shell, a cleaning box is fixedly connected to the side of the shell, a cleaning bar is installed in the middle of the cleaning box, a cleaning pipe is connected to the side of the cleaning bar, a support frame is fixedly connected to the bottom of the cleaning box, a fixing sheet is fixedly installed at the bottom of the support frame, a support plate is fixedly connected to the middle of the support frame, and a collection box is connected above the support plate;
[0006] A first rack is provided on the side of the support plate, a second rack is provided in the middle of the cleaning box, the middle of the second rack is clamped and connected with the placement plate through a clamping assembly, a fixed block is fixedly connected to the side of the placement plate, a protective plate is inserted in the middle of the fixed block, a buffer assembly is provided in the middle of the fixed block, and a protective assembly is provided in the middle of the placement plate.
[0007] As an optional solution of the chip crisp disk through-type spray cleaning equipment described in the utility model, wherein: a card slot is opened in the middle of the support plate, an elastic plate is snap-connected in the middle of the card slot, the side of the elastic plate is fixedly connected to the collection box, a protective box is fixedly installed on the side of the support frame, a rotating shaft is fixedly installed in the middle of the protective box, a first gear is installed on one side of the rotating shaft, and a second gear is installed on the other side of the rotating shaft, and the first gear and the second gear are both engaged with the first rack.
[0008] As an optional solution of the chip crisp plate through-type spray cleaning equipment described in the utility model, wherein: an adjustment device is fixedly installed on the side of the cleaning box, an electric box is placed at the bottom of the support frame, and a pulley is fixedly installed at the bottom of the electric box.
[0009] As an optional solution of a chip brittle disk through-type spray cleaning equipment described in the utility model, wherein: the buffer assembly includes a buffer groove opened in the middle of the fixed block, a connecting plate is fixedly connected to the bottom of the buffer groove, a buffer cylinder is fixedly installed in the middle of the connecting plate, a buffer rod is inserted in the middle of the buffer cylinder, a fixed shaft is fixedly installed in the middle of the buffer cylinder, and a rotating rod is hinged on the side of the fixed shaft.
[0010] As an optional solution for the chip crisp disk through-type spray cleaning equipment described in the utility model, wherein: the end of the rotating rod is hinged with a mounting shaft, the mounting shaft is fixedly installed in the middle of the slider, the end of the buffer groove is fixedly connected to a mounting frame, a sliding groove is opened in the middle of the mounting frame, the slider is slidably connected in the middle of the sliding groove, and a sliding spring is fixedly connected to the side of the slider.
[0011] As an optional solution of a chip brittle disk through-type spray cleaning equipment described in the utility model, wherein: the clamping assembly includes a limit groove opened in the middle of the protective plate, a limit spring is installed in the middle of the limit groove, the limit spring is sleeved on the side of the plug-in rod, and the bottom of the plug-in rod is fixedly connected to a connecting plate.
[0012] As an optional solution of a chip crisp disk through-type spray cleaning equipment described in the utility model, the protection component includes a mounting groove opened in the middle of the placement plate, the end of the mounting groove is fixedly connected to a push rod, the bottom of the push rod is fixedly installed with a contact plate, both sides of the contact plate are fixedly connected with contact rods, and the side of the contact rod is fixedly installed with a protection rod.
[0013] As an optional solution for a chip brittle disk through-type spray cleaning equipment described in the utility model, wherein: the protection rod is inserted in the middle of the protection tube, the bottom of the contact plate is fixedly connected to a mounting spring, the bottom of the mounting spring is fixedly connected to a mounting plate, and the bottom of the mounting plate is fixedly installed with a connecting rod.
[0014] The utility model has the following beneficial effects:
[0015] 1. This chip crisp plate through-type spray cleaning equipment, when cleaning the items, the staff first places the items on the placement plate, and then when the second rack is running, the items will be driven into the cleaning box, and then the items will first pass through the cleaning bar, the surface of the items will be cleaned by the cleaning bar, and then they will be sprayed and cleaned through the cleaning pipe. When the items pass through the cleaning box, they will be cleaned three times to make the cleaning of the items as thorough as possible. During the cleaning process of the items, through the setting of the protection component, when the cleaning pipes on both sides are cleaned at the same time, the protection component will buffer and protect the items, thereby greatly improving the cleaning efficiency.
[0016] 2. In the chip crisp plate through-type spray cleaning equipment, during the movement of objects, if the placement plate contacts the first gear and the second gear, through the setting of the buffer component and the clamping component, when the teeth of the gear are engaged with the rack, the teeth will squeeze the connecting plate, and then the plug-in rod will squeeze the limit spring, so that the clamping component will be extended and retracted, thereby affecting the transportation of the placement plate during the transportation process. Through the setting of the buffer component, if the gear is encountered during the cleaning process, the buffer component will be compressed under the impact force of the cleaning pipe, thereby buffering and protecting the objects, greatly improving the qualified rate of the objects. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.
[0018] Figure 2 It is a schematic diagram of the placement plate structure of the utility model.
[0019] Figure 3 This is a schematic diagram of the support plate structure of the utility model.
[0020] Figure 4 This is a schematic diagram of the card slot structure of the utility model.
[0021] Figure 5 This is a schematic diagram of the structure of the buffer component of the utility model.
[0022] Figure 6 It is a schematic diagram of the structure of the clamping assembly of the utility model.
[0023] Figure 7 This is a schematic diagram of the protection component structure of the utility model.
[0024] In the figure: 110, fixing plate; 120, supporting frame; 130, protection box; 140, rotating shaft; 150, first gear; 160, second gear; 170, first rack; 180, second rack; 190, placing plate; 200, cleaning box; 210, collecting box; 220, electric box; 230, pulley; 240, cleaning strip; 250, cleaning pipe; 260, adjusting device; 270, housing; 280, fixing block; 290, protection plate; 300, connecting plate; 301, clamping assembly; 310, limiting groove; 320, limiting spring; 330, plug rod; 340, support plate; 350, elastic plate; 360, card slot; 370, mounting slot; 380, protection rod; 390, protection tube; 400, push rod; 410, contact plate; 420, contact rod; 430, connecting rod; 440, mounting plate; 460, mounting spring; 470, buffer slot; 480, connecting piece; 490, buffer tube; 500, buffer rod; 510, fixed shaft; 520, rotating rod; 530, mounting frame; 540, slide slot; 550, mounting shaft; 560, slider; 570, sliding spring; 580, buffer assembly; 590, protection assembly. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] Embodiment 1: This embodiment is intended to promote the solution of the existing technology that when cleaning items, the items are directly placed on the conveyor belt, and then driven by the conveyor belt, the items will be sprayed and cleaned in the cleaning box. However, this cleaning method may cause the dead corners on the surface of the items to not be thoroughly cleaned, leaving dirt or residues, affecting the cleaning effect. This may lead to a decline in product quality and even introduce contaminants in the chip manufacturing process, affecting the performance and reliability of the chip. Please refer to Figure 1-Figure 7 A chip crisp disk through-type spray cleaning equipment includes a shell 270, a cleaning box 200 is fixedly connected to the side of the shell 270, a cleaning bar 240 is installed in the middle of the cleaning box 200, a cleaning pipe 250 is connected to the side of the cleaning bar 240, a support frame 120 is fixedly connected to the bottom of the cleaning box 200, a fixing sheet 110 is fixedly installed at the bottom of the support frame 120, a support plate 340 is fixedly connected to the middle of the support frame 120, and a collection box 210 is connected above the support plate 340.
[0027] A first rack 170 is provided on the side of the support plate 340, a second rack 180 is provided in the middle of the cleaning box 200, the middle of the second rack 180 is engaged with the placement plate 190 through a locking assembly 301, a fixed block 280 is fixedly connected to the side of the placement plate 190, a protective plate 290 is inserted in the middle of the fixed block 280, a buffer assembly 580 is provided in the middle of the fixed block 280, and a protective assembly 590 is provided in the middle of the placement plate 190.
[0028] A slot 360 is provided in the middle of the support plate 340, and an elastic plate 350 is engaged with the middle of the slot 360. The side of the elastic plate 350 is fixedly connected to the collection box 210. A protective box 130 is fixedly installed on the side of the support frame 120, and a rotating shaft 140 is fixedly installed in the middle of the protective box 130. A first gear 150 is installed on one side of the rotating shaft 140, and a second gear 160 is installed on the other side of the rotating shaft 140. Both the first gear 150 and the second gear 160 are meshed with the first rack 170.
[0029] When cleaning the items, the staff first places the items on the placement plate 190, and then transfers them through the second rack 180 to the cleaning box 200. In the cleaning box 200, the items are first cleaned by the cleaning strip 240, and then rinsed by the cleaning pipe 250, and repeated three times to ensure that the cleaning is as thorough as possible. During the cleaning process, when both sides of the placement plate 190 are rinsed at the same time, the protection rod 380 and the protection tube 390 in the protection component 590 can be used for buffering protection to avoid damage to the placement plate 190 and the items as much as possible.
[0030] If an item is being cleaned and a gear happens to mesh with a rack, then during cleaning, through the arrangement of the slider 560, the rotating rod 520, the buffer rod 500 and the buffer cylinder 490 in the buffer assembly 580, when impacted, the buffer rod 500 will extend and retract in the buffer cylinder 490, and then the slider 560 will squeeze the sliding spring 570 in the slide groove 540, thereby providing buffer protection thereto.
[0031] In this embodiment: when cleaning the articles, the staff first places the articles on the placement plate 190, and then when the second rack 180 is in operation, the articles will be driven into the cleaning box 200, and then the articles will first pass through the cleaning bar 240, and the surface of the articles will be cleaned by the cleaning bar 240, and then they will be sprayed and cleaned by the cleaning pipe 250. When the articles pass through the cleaning box 200, they will be cleaned three times, so as to make the cleaning of the articles as thorough as possible. During the cleaning process of the articles, through the setting of the protection component 590, when the cleaning pipes 250 on both sides are cleaned at the same time, the protection component 590 will buffer and protect the articles, thereby greatly improving the cleaning efficiency.
[0032] Embodiment 2: This embodiment is intended to promote the solution of the problem of not affecting the movement of an object when it is moved. This embodiment is an improvement made on the basis of Embodiment 1. For details, please refer to Figure 1-Figure 7 An adjusting device 260 is fixedly installed on the side of the cleaning box 200. During the cleaning process, the amount of water during cleaning is controlled by the adjusting device 260. An electric box 220 is placed at the bottom of the support frame 120, and a pulley 230 is fixedly installed at the bottom of the electric box 220.
[0033] The buffer assembly 580 includes a buffer groove 470 opened in the middle of the fixed block 280, a connecting plate 480 is fixedly connected to the bottom of the buffer groove 470, a buffer cylinder 490 is fixedly installed in the middle of the connecting plate 480, a buffer rod 500 is inserted in the middle of the buffer cylinder 490, a fixed shaft 510 is fixedly installed in the middle of the buffer cylinder 490, a rotating rod 520 is hinged on the side of the fixed shaft 510, an installation shaft 550 is hinged on the end of the rotating rod 520, the installation shaft 550 is fixedly installed in the middle of the slider 560, an installation frame 530 is fixedly connected to the end of the buffer groove 470, a sliding groove 540 is opened in the middle of the installation frame 530, a slider 560 is slidably connected in the middle of the sliding groove 540, and a sliding spring 570 is fixedly connected to the side of the slider 560.
[0034] The locking assembly 301 includes a limit groove 310 opened in the middle of the protection plate 290, a limit spring 320 is installed in the middle of the limit groove 310, the limit spring 320 is sleeved on the side of the plug-in rod 330, and the bottom of the plug-in rod 330 is fixedly connected to the connecting plate 300, and the protection assembly 590 includes a mounting groove 370 opened in the middle of the placement plate 190, the end of the mounting groove 370 is fixedly connected to the push rod 400, the bottom of the push rod 400 is fixedly installed with a contact plate 410, both sides of the contact plate 410 are fixedly connected with contact rods 420, the side of the contact rod 420 is fixedly installed with a protection rod 380, the protection rod 380 is plugged in the middle of the protection tube 390, the bottom of the contact plate 410 is fixedly connected with a mounting spring 460, the bottom of the mounting spring 460 is fixedly connected with the mounting plate 440, and the bottom of the mounting plate 440 is fixedly installed with a connecting rod 430.
[0035] In this embodiment: during the movement of objects, if the placement plate 190 contacts the first gear 150 and the second gear 160, through the setting of the buffer component 580 and the locking component 301, when the teeth of the gear are engaged with the rack, the teeth will squeeze the connecting plate 300. At this time, the plug-in rod 330 will squeeze the limit spring 320, causing the locking component 301 to retract and retract, thereby affecting the transportation of the placement plate 190 during the transportation process. Through the setting of the buffer component 580, if a gear is encountered during the cleaning process, the buffer component 580 will be compressed under the impact force of the cleaning tube 250, thereby buffering and protecting the objects, greatly improving the qualified rate of the objects.
[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0037] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A chip and crisp plate through-type spray cleaning device, comprising a housing (270), characterized in that: A cleaning box (200) is fixedly connected to the side of the housing (270), a cleaning bar (240) is installed in the middle of the cleaning box (200), a cleaning pipe (250) is connected to the side of the cleaning bar (240), a support frame (120) is fixedly connected to the bottom of the cleaning box (200), a fixing plate (110) is fixedly installed at the bottom of the support frame (120), a support plate (340) is fixedly connected to the middle of the support frame (120), and a collection box (210) is connected above the support plate (340); The side of the support plate (340) is provided with a first rack (170), the middle of the cleaning box (200) is provided with a second rack (180), the middle of the second rack (180) is snap-connected with the placement plate (190) through a snap-connecting assembly (301), the side of the placement plate (190) is fixedly connected with a fixing block (280), the middle of the fixing block (280) is plugged with a protective plate (290), the middle of the fixing block (280) is provided with a buffer assembly (580), and the middle of the placement plate (190) is provided with a protective assembly (590).
2. The chip crisp plate through-type spray cleaning equipment according to claim 1, characterized in that: A slot (360) is provided in the middle of the support plate (340), and an elastic plate (350) is snap-connected in the middle of the slot (360). The side of the elastic plate (350) is fixedly connected to the collection box (210). A protection box (130) is fixedly installed on the side of the support frame (120), and a rotating shaft (140) is fixedly installed in the middle of the protection box (130). A first gear (150) is installed on one side of the rotating shaft (140), and a second gear (160) is installed on the other side of the rotating shaft (140). The first gear (150) and the second gear (160) are both meshed with a first rack (170).
3. The chip crisp plate through-type spray cleaning equipment according to claim 1, characterized in that: An adjusting device (260) is fixedly installed on the side of the cleaning box (200), an electric box (220) is placed at the bottom of the support frame (120), and a pulley (230) is fixedly installed at the bottom of the electric box (220).
4. The chip crisp plate through-type spray cleaning equipment according to claim 1, characterized in that: The buffer assembly (580) comprises a buffer groove (470) opened in the middle of the fixed block (280), a connecting plate (480) is fixedly connected to the bottom of the buffer groove (470), a buffer cylinder (490) is fixedly installed in the middle of the connecting plate (480), a buffer rod (500) is inserted in the middle of the buffer cylinder (490), a fixed shaft (510) is fixedly installed in the middle of the buffer cylinder (490), and a rotating rod (520) is hinged on the side of the fixed shaft (510).
5. The chip crisp plate through-type spray cleaning equipment according to claim 4, characterized in that: The end of the rotating rod (520) is hinged with a mounting shaft (550), and the mounting shaft (550) is fixedly mounted on the middle of the slider (560). The end of the buffer groove (470) is fixedly connected with a mounting frame (530), and a sliding groove (540) is provided in the middle of the mounting frame (530), and the slider (560) is slidably connected to the middle of the sliding groove (540), and a sliding spring (570) is fixedly connected to the side of the slider (560).
6. The chip crisp plate through-type spray cleaning equipment according to claim 1, characterized in that: The engaging assembly (301) comprises a limiting groove (310) provided in the middle of the protection plate (290), a limiting spring (320) being installed in the middle of the limiting groove (310), the limiting spring (320) being sleeved on the side of the plug-in rod (330), and the bottom of the plug-in rod (330) being fixedly connected to a connecting plate (300).
7. The chip crisp plate through-type spray cleaning equipment according to claim 1, characterized in that: The protection component (590) comprises a mounting groove (370) opened in the middle of the placement plate (190), a support rod (400) is fixedly connected to the end of the mounting groove (370), a contact plate (410) is fixedly installed at the bottom of the support rod (400), contact rods (420) are fixedly connected to both sides of the contact plate (410), and a protection rod (380) is fixedly installed on the side of the contact rod (420).
8. The chip crisp plate through-type spray cleaning equipment according to claim 7, characterized in that: The protection rod (380) is inserted into the middle of the protection tube (390), the bottom of the contact plate (410) is fixedly connected to a mounting spring (460), the bottom of the mounting spring (460) is fixedly connected to a mounting plate (440), and the bottom of the mounting plate (440) is fixedly installed with a connecting rod (430).