Polishing device for semiconductor sample lead

Abstract

The utility model provides a polishing device for a semiconductor sample lead, which relates to the technical field of semiconductor processing and comprises a limiting frame, a driving mechanism and a rotating part mounted in the limiting frame. The rotating part is embedded in the limiting frame and rotationally connected with the limiting frame through a rotating groove, a grinding and polishing belt is installed on the rotating part, the grinding and polishing belt is symmetric about the symmetric axis of the rotating part, and the grinding and polishing belt is fixedly connected with the rotating part through a mounting part; a limiting mechanism is installed at the opening end of one side of the limiting frame, a receding notch is formed in the center of the limiting mechanism, a limiting piece is installed on the limiting mechanism, and a limiting hole is formed in the center of the limiting piece; by arranging the limiting mechanism and the limiting piece, the problem that in the prior art, a lead shakes back and forth in a grinding and polishing belt, and grinding and polishing operation of a polishing machine on a semiconductor sample is not facilitated is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a polishing device for semiconductor sample leads. Background Art

[0002] In the process of finishing the diode axial products, if the product leads are discolored or contaminated, they need to be polished with a polishing machine to improve the gloss of the semiconductor leads.

[0003] In the prior art, when a polishing machine is used to polish the leads of semiconductor samples, due to the small number of samples and different sample models, the leads are often polished by manual control. When the semiconductor samples are polished using the polishing structure of the polishing machine, the polishing machine runs at a high speed, causing the leads to swing back and forth in the polishing belt, which is not conducive to the polishing operation of the semiconductor samples by the polishing machine. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies of the prior art, the utility model provides a polishing device for semiconductor sample leads, which solves the problem in the prior art that when the semiconductor sample is polished by the polishing structure of the polishing machine, the leads shake back and forth in the grinding and polishing belt.

[0006] (II) Technical solution

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] In the utility model, the polishing device comprises a limit frame, a driving mechanism, and a rotating member installed in the limit frame;

[0009] The rotating member is embedded in the limiting frame and is rotatably connected to the limiting frame through the rotating groove. A grinding and polishing belt is installed on the rotating member. The grinding and polishing belt is symmetrical along the symmetry axis of the rotating member. The grinding and polishing belt is fixedly connected to the rotating member through the mounting member.

[0010] A limiting mechanism is installed at one open end of one side of the limiting frame, a clearance slot is provided at the center of the limiting mechanism, a limiting member is installed on the limiting mechanism, and a limiting hole is provided at the center of the limiting member;

[0011] The limiting hole and the giving way slot are concentric.

[0012] Furthermore, the limiting member is detachably connected to the limiting mechanism.

[0013] Furthermore, a plurality of threaded columns are arranged on one side of the limiting member close to the limiting mechanism, and the plurality of threaded columns are evenly distributed on the limiting member. The threaded columns pass through the limiting mechanism and are fixedly connected to the limiting mechanism via nuts.

[0014] Furthermore, the plurality of threaded columns and the limiting member are integrally formed.

[0015] Furthermore, the polishing device also includes a support seat and a back plate installed on the support seat, the limit frame is fixedly connected to the support seat, the driving mechanism is installed on the side of the back plate close to the rotating part, the driving mechanism includes a fixed block and a driving rod, the driving rod passes through the center of the fixed block and is rotatably connected to the fixed block, the end of the driving rod away from the fixed block is rotatably connected to the back plate, and the fixed block is fixedly connected to the rotating part through a connecting member.

[0016] Furthermore, the limiting mechanism is provided with a plurality of fan-shaped grooves.

[0017] (III) Beneficial effects

[0018] The utility model provides a polishing device for semiconductor sample leads. Compared with the prior art, it has the following beneficial effects:

[0019] By setting a limiting mechanism and a limiting part, when using a polishing device for polishing, the lead of the semiconductor sample passes through the limiting hole on the limiting part, and the limiting hole is adapted to the outer diameter of the lead, so as to limit the lead and improve the stability of the lead, thereby facilitating the high-speed rotating grinding and polishing belt to grind and polish the outer surface of the lead, thereby solving the problem in the prior art that the lead swings back and forth in the grinding and polishing belt, which is not conducive to the polishing machine to grind and polish the semiconductor sample. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A perspective view of a polishing device for semiconductor sample leads;

[0022] Figure 2 for Figure 1 Enlarged view in the middle;

[0023] Figure 3 for Figure 1 A three-dimensional diagram of the middle rotating member installed in the limiting frame;

[0024] Figure 4 for Figure 3 The enlarged view of point B in the middle;

[0025] Figure 5 for Figure 3 Enlarged view of point C in the middle;

[0026] Figure 6 for Figure 3 A three-dimensional diagram of the rotating part;

[0027] Figure 7 for Figure 1 Schematic diagram of the structure;

[0028] Figure 8 for Figure 1 A schematic diagram of the structure when the rotating member and the limiting mechanism are installed with the fixed block;

[0029] Fig. 9 for Figure 8 Stereoscopic image after flipping.

[0030] Reference numerals:

[0031] 10. Support seat; 11. Back plate; 12. Fixed block; 121. Connecting piece; 122. Driving rod; 13. Limiting frame; 20. Rotating piece; 201. High-speed wheel; 21. Grinding and polishing belt; 211. Mounting piece; 30. Limiting mechanism; 301. Giving slot; 31. Limiting piece; 311. Limiting hole; 312. Threaded column; 313. Nut. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] The embodiment of the present application solves the problem in the prior art that when the semiconductor sample is polished using the polishing structure of the polishing machine, the leads of the semiconductor sample sway back and forth in the grinding and polishing belt, thereby improving the stability of the leads of the semiconductor sample in the grinding and polishing mechanism when the semiconductor sample is polished.

[0034] The technical solution in the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0035] like Figure 1-Figure 9As shown, by setting a limiting mechanism and a limiting part, when using a polishing device for polishing, the lead of the semiconductor sample passes through the limiting hole on the limiting part, and the limiting hole is adapted to the outer diameter of the lead, so as to limit the lead and improve the stability of the lead, thereby facilitating the high-speed rotating grinding and polishing belt to grind and polish the outer surface of the lead, thereby solving the problem in the prior art that the lead swings back and forth in the grinding and polishing belt, which is not conducive to the polishing machine to grind and polish the semiconductor sample.

[0036] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] Example:

[0038] like Figure 1-Figure 4 As shown, a polishing device for semiconductor sample leads includes a limit frame 13, a driving mechanism, and a rotating member 20 installed in the limit frame 13;

[0039] The rotating member 20 is embedded in the limiting frame 13 and is rotatably connected to the limiting frame 13 through the rotating groove. A grinding and polishing belt 21 is installed on the rotating member 20. The grinding and polishing belt 21 is symmetrical along the symmetry axis of the rotating member 20. The grinding and polishing belt 21 is fixedly connected to the rotating member 20 through the mounting member 211.

[0040] A limiting mechanism 30 is installed at one open end of the limiting frame 13, a notch 301 is provided at the center of the limiting mechanism 30, a limiting member 31 is installed on the limiting mechanism 30, and a limiting hole 311 is provided at the center of the limiting member 31;

[0041] The limiting hole 311 and the clearance slot 301 are concentric.

[0042] By setting a limiting mechanism 30 and a limiting member 31, the limiting mechanism 30 is used to block the rotating member 20 rotating in the limiting frame 13 to prevent the danger caused by the high-speed running grinding and polishing belt 21, and the limiting member 31 set on the limiting mechanism 30 can limit the semiconductor sample lead that needs to be polished. When using the polishing device for polishing, the semiconductor sample lead passes through the limiting hole 311 on the limiting member 31, and the limiting hole 311 is adapted to the outer diameter of the lead to limit the lead, thereby improving the stability of the lead, thereby facilitating the high-speed rotating grinding and polishing belt 21 to grind and polish the outer surface of the lead, thereby solving the problem in the prior art that the lead swings back and forth in the grinding and polishing belt 21, which is not conducive to the polishing machine to grind and polish the semiconductor sample.

[0043] The limiting mechanism 30 and the limiting frame 13 are detachable, so as to facilitate the inspection and repair of the rotating member 20 inside the limiting frame 13. The limiting mechanism 30 can be installed with the limiting frame 13 by bolts or other means.

[0044] Specifically, a plurality of fan-shaped grooves are provided on the limiting mechanism 30 . By providing a plurality of fan-shaped grooves, the grinding and polishing belt 21 on the rotating member 20 can be polished through the fan-shaped grooves.

[0045] like Figure 2-Figure 3 as well as Figure 5 As shown, the limiting member 31 is detachably connected to the limiting mechanism 30;

[0046] Specifically, a plurality of threaded columns 312 are arranged on one side of the limiting member 31 close to the limiting mechanism 30. The plurality of threaded columns 312 are evenly distributed on the limiting member 31. The threaded columns 312 pass through the limiting mechanism 30 and are fixedly connected to the limiting mechanism 30 through nuts 313.

[0047] The plurality of threaded columns 312 are integrally formed with the limiting member 31 .

[0048] By setting the limiting member 31 in a detachable installation mode with the limiting mechanism 30, different limiting members 31 are replaced, and the apertures of the limiting holes 311 in different limiting members 31 are different. Therefore, replacing different limiting members 31 can limit semiconductor sample leads with different outer diameters.

[0049] like Figure 6 As shown, a plurality of high-speed wheels 201 are installed inside the rotating member 20 , and the plurality of high-speed wheels 201 are evenly distributed around the rotating member 20 .

[0050] like Figure 1 , Figure 7-Figure 9 As shown, the polishing device further includes a support seat 10 and a back plate 11 mounted on the support seat 10, and the limit frame 13 is fixedly connected to the support seat 10;

[0051] The driving mechanism is installed on one side of the back plate 11 close to the rotating member 20, and the driving mechanism includes a fixed block 12 and a driving rod 122. The driving rod 122 passes through the center of the fixed block 12 and is rotatably connected to the fixed block 12. One end of the driving rod 122 away from the fixed block 12 is rotatably connected to the back plate 11, and the fixed block 12 is fixedly connected to the rotating member 20 via a connecting member 121.

[0052] When using the polishing device, a driving motor is used to provide driving force for the driving rod 122. Specifically, a limiting piece 31 that meets the outer diameter size of the semiconductor sample lead to be polished is fixed to the limiting mechanism 30 through a nut 313. Then, the semiconductor sample lead to be polished is passed through the limiting hole 311 of the limiting piece 31 for limiting. The driving motor is started to provide driving force for the driving rod 122. During the rotation of the driving rod 122, the grinding and polishing belt 21 on the rotating part 20 is controlled to polish the lead.

[0053] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0054] 1. By setting a limiting mechanism 30 and a limiting member 31, when using a polishing device for polishing, the lead of the semiconductor sample passes through the limiting hole 311 on the limiting member 31. The limiting hole 311 is adapted to the outer diameter of the lead, so as to limit the lead and improve the stability of the lead, thereby facilitating the high-speed rotating grinding and polishing belt 21 to grind and polish the outer surface of the lead, thereby solving the problem in the prior art that the lead swings back and forth in the grinding and polishing belt 21, which is not conducive to the polishing machine to grind and polish the semiconductor sample.

[0055] 2. By setting the limiting member 31 to be detachable from the limiting mechanism 30, different limiting members 31 can be replaced. The apertures of the limiting holes 311 in different limiting members 31 are different. Therefore, replacing different limiting members 31 can limit semiconductor sample leads with different outer diameters.

[0056] 3. The limiting mechanism 30 is provided with a plurality of fan-shaped grooves. By providing a plurality of fan-shaped grooves, the grinding and polishing belt 21 on the rotating member 20 can be polished through the fan-shaped grooves.

[0057] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0058] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A polishing device for semiconductor sample leads, characterized in that: It comprises a limit frame (13), a driving mechanism, and a rotating member (20) installed in the limit frame (13); The rotating member (20) is embedded in the limiting frame (13) and is rotatably connected to the limiting frame (13) through a rotating groove; a grinding and polishing belt (21) is installed on the rotating member (20); the grinding and polishing belt (21) is symmetrical along the symmetry axis of the rotating member (20); and the grinding and polishing belt (21) is fixedly connected to the rotating member (20) through a mounting member (211); A limiting mechanism (30) is installed at one open end of one side of the limiting frame (13), a clearance notch (301) is provided at the center of the limiting mechanism (30), a limiting member (31) is installed on the limiting mechanism (30), and a limiting hole (311) is provided at the center of the limiting member (31); The limiting hole (311) and the clearance slot (301) are concentric.

2. A semiconductor sample lead polishing device as claimed in claim 1, characterized in that: The limiting member (31) is detachably connected to the limiting mechanism (30).

3. A semiconductor sample lead polishing device as claimed in claim 1, characterized in that: A plurality of threaded columns (312) are arranged on one side of the limiting member (31) close to the limiting mechanism (30); the plurality of threaded columns (312) are evenly distributed on the limiting member (31); the threaded columns (312) pass through the limiting mechanism (30) and are fixedly connected to the limiting mechanism (30) via nuts (313).

4. A semiconductor sample lead polishing device as claimed in claim 3, characterized in that: The plurality of threaded columns (312) and the limiting member (31) are integrally formed.

5. A semiconductor sample lead polishing device as claimed in claim 1, characterized in that: The polishing device also includes a support seat (10) and a back plate (11) mounted on the support seat (10); the limit frame (13) is fixedly connected to the support seat (10); the driving mechanism is mounted on a side of the back plate (11) close to the rotating member (20); the driving mechanism includes a fixed block (12) and a driving rod (122); the driving rod (122) passes through the center of the fixed block (12) and is rotatably connected to the fixed block (12); one end of the driving rod (122) away from the fixed block (12) is rotatably connected to the back plate (11); and the fixed block (12) is fixedly connected to the rotating member (20) via a connecting member (121).

6. A semiconductor sample lead polishing device as claimed in claim 1, characterized in that: The limiting mechanism (30) is provided with a plurality of fan-shaped grooves.

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