Semiconductor chip surface polishing device

Abstract

The utility model discloses a semiconductor chip surface polishing device which comprises a machine table and a polishing machine body, a sliding groove is formed in the top end of the machine table, a containing table is fixedly arranged at the center of the machine table, two symmetrical sliding blocks are connected into the sliding groove in a sliding mode, a driving mechanism is arranged on the machine table, and an L-shaped moving plate is fixedly arranged at the top ends of the two sliding blocks. A moving rod is fixedly arranged on one side of the moving plate, a moving block is fixedly arranged at the end, away from the moving plate, of the moving rod, a sliding groove is formed in one side of the moving block, a sliding block is slidably connected into the sliding groove, a clamping block is fixedly arranged at the end, away from the sliding groove, of the sliding block, a rubber pad is fixedly arranged on the clamping block, and a lifting mechanism is arranged on the moving block. The clamping device is reasonable in structure, the two sliding blocks can be driven to get close to each other through the arrangement of the driving mechanism until the two clamping blocks and the rubber pad clamp a semiconductor chip, the heights of the two clamping blocks and the rubber pad can be adjusted through the arrangement of the lifting mechanism, and finally the semiconductor chips with different thicknesses can be clamped conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip production equipment, in particular to a semiconductor chip surface polishing device. Background Art

[0002] Semiconductor chips refer to semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. Not only silicon chips, but also common semiconductor materials such as gallium arsenide and germanium. In order to meet the needs of mass production, the electrical properties of semiconductors must be predictable and stable, so the purity of dopants and the quality of semiconductor lattice structures must be strictly required.

[0003] At present, semiconductor chips need to be polished during processing, and the surface polishing operation can be performed on semiconductor chips by automated equipment. However, the above equipment and devices are usually only suitable for chips of a single thickness when fixing the chips, and the applicability is not strong. To solve the above problems, a solution is proposed below. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor chip surface polishing device to solve the problems raised in the above background technology.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] A semiconductor chip surface polishing device comprises a machine table and a polishing machine body installed on the top of the machine table, a slide groove is provided on the top of the machine table, a placing table is fixedly provided on the center of the machine table, two symmetrical sliders are slidably connected inside the slide groove, a driving mechanism for driving the two sliders to approach each other is provided on the machine table, an L-shaped moving plate is fixedly provided on the top of the two sliders, a moving rod is fixedly provided on one side of the moving plate, a moving block is fixedly provided on the end of the moving rod away from the moving plate, a sliding groove is provided on one side of the moving block, a sliding block is slidably connected inside the sliding groove, a clamping block is fixedly provided on the end of the sliding block away from the sliding groove, a rubber pad is fixedly provided on the clamping block, and a lifting mechanism for driving the sliding block and the clamping block to rise and fall is provided on the moving block.

[0007] Preferably, four universal wheels are fixedly provided at the bottom of the machine, and a stabilizing mechanism is provided at the bottom of the machine.

[0008] Preferably, the stabilizing mechanism includes four support plates fixed to the bottom of the machine, the tops of the four support plates are provided with internal thread grooves, a threaded rod 1 is threadedly connected to the internal thread groove, a stabilizing plate is fixed to the bottom end of the threaded rod 1, and a nut is threadedly connected to the top end of the threaded rod 1.

[0009] Preferably, the driving mechanism includes a motor fixedly mounted on one side of the outer wall of the machine, the output shaft of the motor passes through the outer wall of the machine and a threaded rod 2 is fixedly mounted on the output shaft, a threaded rod 3 is fixedly mounted on one end of the threaded rod 2 away from the motor and is rotatably connected to the inner wall of the slide groove, the spirals of the threaded rod 2 and the threaded rod 3 are opposite and are respectively threadedly connected to the two sliders.

[0010] Preferably, the lifting mechanism comprises a lifting rod fixedly mounted on the top of the sliding block, an internal threaded hole penetrates through the top of the moving block, an external thread matching the internal threaded hole is arranged on the outside of the lifting rod, and a turning handle is fixedly mounted on the top of the lifting rod.

[0011] The beneficial effects of the utility model are as follows: the two sliders can be driven to approach each other by the setting of the driving mechanism, until the two clamping blocks on the two sliders clamp the semiconductor chip, wherein the setting of the rubber pad can prevent the clamping blocks from damaging the semiconductor chip; the setting of the lifting mechanism can adjust the heights of the two clamping blocks and the rubber pad, and finally it is convenient to clamp semiconductor chips of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of an embodiment;

[0013] Figure 2 for Figure 1 A magnified view of part A;

[0014] Figure 3 for Figure 1 A magnified view of part B;

[0015] Figure 4 It is a partial cross-sectional view of an embodiment.

[0016] Figure numerals: 1. machine table; 11. slide groove; 12. slider; 13. moving plate; 14. moving rod; 15. moving block; 151. sliding groove; 16. sliding block; 17. clamping block; 18. rubber pad; 2. polishing machine body; 3. placing table; 4. universal wheel; 5. stabilizing mechanism; 51. supporting plate; 52. threaded rod one; 53. stabilizing disk; 54. nut; 6. driving mechanism; 61. motor; 62. threaded rod two; 63. threaded rod three; 7. lifting mechanism; 71. lifting rod; 72. turning handle. DETAILED DESCRIPTION

[0017] The following is only a preferred embodiment of the present invention, and the protection scope is not limited to this embodiment. All technical solutions under the concept of the present invention should belong to the protection scope of the present invention. The same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom" and "top", "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0018] like Figures 1 to 4 As shown, a semiconductor chip surface polishing device includes a machine platform 1 and a polishing machine body 2 installed on the top of the machine platform 1. The polishing machine body 2 is an existing polishing machine that can perform surface polishing on semiconductor chips. Four universal wheels 4 are fixedly arranged at the bottom of the machine platform 1, and a stabilizing mechanism 5 is arranged at the bottom of the machine platform 1. The arrangement of the four universal wheels 4 can facilitate the operator to push the machine platform 1 and adjust the position of the machine platform 1. The arrangement of the stabilizing mechanism 5 can stabilize the machine platform 1 that has completed position adjustment.

[0019] The stabilizing mechanism 5 includes four support plates 51 fixedly arranged at the bottom of the machine platform 1. The tops of the four support plates 51 are provided with internal thread grooves, and a threaded rod 52 is threadedly connected to the internal thread grooves. A stabilizing plate 53 is fixedly arranged at the bottom of the threaded rod 52, and a nut 54 is threadedly connected to the top of the threaded rod 52. When the operator rotates the stabilizing plate 53, the threaded rod 52 can be driven to rotate downward inside the internal thread groove, and the upward rotation of the threaded rod 52 can drive the stabilizing plate 53 to move downward together until it is flush with the universal wheel 4, and then the nut 54 is tightened onto the threaded rod 52, so that the stabilizing plate 53 is fixed to the support plate 51.

[0020] A placement table 3 is fixedly provided at the center of the machine 1, and the placement table 3 can be used to place semiconductor chips. A slide groove 11 is opened at the top of the machine 1, and two symmetrical sliders 12 are slidably connected inside the slide groove 11. The machine 1 is provided with a driving mechanism 6 for driving the two sliders 12 to approach each other; through the setting of the driving mechanism 6, the two sliders 12 can be driven to slide inside the slide groove 11 respectively until the two sliders 12 approach each other.

[0021] The driving mechanism 6 includes a motor 61 fixedly mounted on one side of the outer wall of the machine 1, the output shaft of the motor 61 passes through the outer wall of the machine 1 and a threaded rod 2 62 is fixedly mounted on the output shaft, a threaded rod 3 63 is fixedly mounted on the end of the threaded rod 2 62 away from the motor 61 and is rotatably connected to the inner wall of the slide groove 11, the spirals of the threaded rod 2 62 and the threaded rod 3 63 are opposite and are respectively threadedly connected to the two sliders 12; by starting the motor 61, the threaded rod 2 62 and the threaded rod 3 63 can be driven to rotate respectively, and since the spirals of the threaded rod 2 62 and the threaded rod 3 63 are opposite, when the two rotate, they can respectively drive the two sliders 12 to approach each other inside the slide groove 11.

[0022] An L-shaped moving plate 13 is fixedly arranged at the top of the two sliders 12, a moving rod 14 is fixedly arranged at one side of the moving plate 13, a moving block 15 is fixedly arranged at the end of the moving rod 14 away from the moving plate 13, a sliding groove 151 is opened at one side of the moving block 15, a sliding block 16 is slidably connected inside the sliding groove 151, a clamping block 17 is fixedly arranged at the end of the sliding block 16 away from the sliding groove 151, and a rubber pad 18 is fixedly arranged on the clamping block 17; when the slider 12 slides toward the placement table 3, it can respectively drive the moving plate 13, the moving rod 14, the moving block 15, the sliding block 16, the clamping block 17 and the rubber pad 18 to move together until the two clamping blocks 17 clamp the semiconductor chip, wherein the arrangement of the rubber pad 18 can prevent the clamping block 17 from damaging the semiconductor chip.

[0023] The moving block 15 is provided with a lifting mechanism 7 for driving the sliding block 16 and the clamping block 17 to move up and down. The lifting mechanism 7 includes a lifting rod 71 fixedly arranged at the top of the sliding block 16. An internal threaded hole penetrates through the top of the moving block 15. The lifting rod 71 is provided with an external thread matching the internal threaded hole. A turning handle 72 is fixedly arranged at the top of the lifting rod 71. When the operator turns the turning handle 72, the lifting rod 71 threadedly connected to the internal threaded hole can be driven to move downward. The downward movement of the lifting rod 71 can drive the sliding block 16 to slide downward in the sliding groove 151. When the sliding block 16 slides downward, it can respectively drive the clamping block 17 and the rubber pad 18 to slide downward together, so that the clamping block 17 and the rubber pad 18 can clamp semiconductor chips of different thicknesses.

[0024] By setting the driving mechanism 6, the two sliders 12 can be driven to approach each other until the two clamping blocks 17 on the two sliders 12 clamp the semiconductor chip, wherein the setting of the rubber pad 18 can prevent the clamping blocks 17 from damaging the semiconductor chip; the setting of the lifting mechanism 7 can adjust the heights of the two clamping blocks 17 and the rubber pad 18, and finally facilitate the clamping of semiconductor chips of different thicknesses.

[0025] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip surface polishing device, comprising a machine platform (1) and a polishing machine body (2) mounted on the top of the machine platform (1), characterized in that: The machine (1) has a top end provided with a slide groove (11), a placement platform (3) fixedly provided at the center of the machine (1), two symmetrical sliders (12) slidably connected inside the slide groove (11), a driving mechanism (6) for driving the two sliders (12) to move closer to each other is provided on the machine (1), an L-shaped moving plate (13) is fixedly provided at the top ends of the two sliders (12), a moving rod (14) is fixedly provided at one side of the moving plate (13), and the moving rod (14) is moved away from the moving plate (13). A moving block (15) is fixedly provided at one end of the plate (13), a sliding groove (151) is provided on one side of the moving block (15), a sliding block (16) is slidably connected inside the sliding groove (151), a clamping block (17) is fixedly provided at one end of the sliding block (16) away from the sliding groove (151), a rubber pad (18) is fixedly provided on the clamping block (17), and a lifting mechanism (7) for driving the sliding block (16) and the clamping block (17) to rise and fall is provided on the moving block (15).

2. A semiconductor chip surface polishing device according to claim 1, characterized in that: Four universal wheels (4) are fixedly arranged at the bottom end of the machine platform (1), and a stabilizing mechanism (5) is arranged at the bottom of the machine platform (1).

3. A semiconductor chip surface polishing device according to claim 2, characterized in that: The stabilizing mechanism (5) comprises four support plates (51) fixedly mounted on the bottom of the machine platform (1), the tops of the four support plates (51) are provided with internal thread grooves, a threaded rod (52) is threadedly connected to the internal thread groove, a stabilizing plate (53) is fixedly mounted on the bottom of the threaded rod (52), and a nut (54) is threadedly connected to the top of the threaded rod (52).

4. A semiconductor chip surface polishing device according to claim 1, characterized in that: The driving mechanism (6) comprises a motor (61) fixedly mounted on one side of the outer wall of the machine platform (1); an output shaft of the motor (61) passes through the outer wall of the machine platform (1) and a second threaded rod (62) is fixedly mounted on the output shaft; a third threaded rod (63) rotatably connected to the inner wall of the slide groove (11) is fixedly mounted on one end of the second threaded rod (62) away from the motor (61); the second threaded rod (62) and the third threaded rod (63) have opposite spirals and are respectively threadedly connected to the two sliders (12).

5. A semiconductor chip surface polishing device according to claim 1, characterized in that: The lifting mechanism (7) comprises a lifting rod (71) fixedly mounted on the top of the sliding block (16); an internal thread hole penetrates through the top of the moving block (15); an external thread matching the internal thread hole is disposed on the outside of the lifting rod (71); and a turning handle (72) is fixedly mounted on the top of the lifting rod (71).

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