Efficient heat dissipation type mold frame

Abstract

The utility model relates to the technical field of die frames, and particularly discloses an efficient heat dissipation type die frame which comprises a lower die and an upper die, die grooves are formed in the surface of the upper die and the surface of the lower die, heat dissipation structures are arranged on the surface of the upper die and the surface of the lower die, each heat dissipation structure comprises four supports and two heat dissipation plates, the four supports are fixedly connected to the two sides of the lower die and the two sides of the upper die respectively, bolts slidably penetrate through the surfaces of the supports, the two heat dissipation plates are located on one side of the lower die and one side of the upper die respectively, limiting arms are fixedly connected to the two sides of each heat dissipation plate, and limiting holes are formed in the surfaces of the limiting arms. The size of the limiting holes is matched with the size of the plug pins, a plurality of heat dissipation fins are fixedly connected to one side of the heat dissipation plate, and rectangular holes are formed in the sides, close to the heat dissipation plate, of the lower die and the upper die. The die frame solves the problems that an existing die frame is poor in heat dissipation effect, and a die is prone to deformation under long-term high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of mold frame, in particular to a high-efficiency heat dissipation type mold frame. Background Art

[0002] The mold frame is a semi-finished product of the mold. The mold frame is the supporting structure of the injection mold. It bears the weight and pressure of the entire mold. The mold frame is usually composed of several pieces of steel and fixed together by bolts and locating pins. It can be said to be the skeleton of the entire mold. A large number of products will be produced using molds, and the mold frame is an inseparable part of the mold.

[0003] The existing related technologies often have the following defects: the mold frame generates a lot of heat during use, which is mainly due to the friction and pressure of the mold during the plastic injection molding process, causing the temperature to rise. The existing mold is composed of several pieces of steel with a tight structure and insufficient space for air circulation, resulting in poor heat dissipation. High temperature will cause the mold material to expand and contract. Long-term high temperature can easily cause the mold to deform, affecting the processing accuracy.

[0004] Therefore, the utility model provides a high-efficiency heat dissipation type mold frame. Utility Model Content

[0005] The utility model aims to solve the shortcomings of the prior art that the existing mold frame has poor heat dissipation effect and is prone to mold deformation under long-term high temperature, and proposes a high-efficiency heat dissipation mold frame.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an efficient heat dissipation mold frame, comprising a lower mold and an upper mold, the surfaces of the upper mold and the lower mold are provided with mold grooves, the surfaces of the upper mold and the lower mold are provided with heat dissipation structures, the heat dissipation structure comprises four brackets and two heat dissipation plates, the four brackets are respectively fixedly connected to the two sides of the lower mold and the upper mold, a latch is slidably penetrated through the surface of the bracket, the two heat dissipation plates are respectively located on one side of the lower mold and the upper mold, both sides of the heat dissipation plate are fixedly connected to a limiting arm, the surface of the limiting arm is provided with a limiting hole, the size of the limiting hole is adapted to the size of the latch, and one side of the heat dissipation plate is fixedly connected to a plurality of heat dissipation fins.

[0007] The effect achieved by the above components is: by setting the heat dissipation structure, it is convenient to limit the heat dissipation plate on the surface of the mold frame, thereby avoiding the situation where the heat dissipation effect is poor due to the tight structure, and then improving the heat dissipation effect of the mold frame when in use.

[0008] Preferably, a rectangular hole is opened on one side of the lower mold and the upper mold close to the heat sink, and a heat conducting plate is provided on the inner wall sliding latch of the rectangular hole, and the heat conducting plate is fixedly connected to the surface of the heat sink.

[0009] The effect achieved by the above components is that the heat conducting plate will slide into the mold groove through the rectangular hole, and when the mold core is installed in the mold groove for use, the heat conducting plate can achieve the effect of improving the heat dissipation of the heat sink.

[0010] Preferably, the arc surface of the latch is sleeved with a spring, and two ends of the spring are fixedly connected to the latch and the bracket respectively.

[0011] The effect achieved by the above components is that the bolt will move toward the limit arm with the help of the contraction force of the spring, and the spring can improve the stability of the bolt inserted into the limit hole and prevent the bolt from slipping out of the limit hole due to sliding.

[0012] Preferably, a plurality of circular holes are formed on the surface of the heat dissipation fins.

[0013] The effects achieved by the above components are: improving the air flow between the heat dissipation fins, and further improving the heat dissipation effect of the heat dissipation fins.

[0014] Preferably, the surface of the heat sink is provided with a cleaning structure, which includes two support plates, the two support plates are fixedly connected to a slide rail on one side away from the heat sink, the inner walls of the two slide rails are slidably connected to a rectangular plate, the rectangular plate is rotatably connected to a threaded rod on the side away from the heat sink, a pressure plate is threadedly connected to the surface of the threaded rod, and a cleaning pad is fixedly connected to the side of the rectangular plate close to the heat sink.

[0015] The effect achieved by the above components is: by setting up a cleaning structure, it is easy to clean the heat sink fins, thereby avoiding the situation where impurities adhere to the surface of the heat sink fins and reduce the heat dissipation effect of the heat sink when using the mold frame, thereby ensuring the efficient heat dissipation effect of the mold frame.

[0016] Preferably, a plurality of grooves are formed on the surface of the cleaning pad, and the size of the grooves matches the size of the heat dissipation fins.

[0017] The effect achieved by the above components is that the groove improves the fit between the cleaning pad and the heat sink fins, thereby ensuring that the cleaning pad can completely wipe the heat sink fins.

[0018] Preferably, a plurality of fixing rods are fixedly connected to the inner wall of the slide rail, and the arc surface of the fixing rods is sleeved with a cylinder.

[0019] The effect achieved by the above components is: the rectangular plate will slide on the inner wall of the slide rail and along the surface of the cylinder, and the cylinder will rotate on the surface of the fixed rod with the help of the force of the rectangular plate moving. The cylinder can reduce the friction of the rectangular plate when it slides in the slide rail, thereby facilitating the pulling of the slide rail.

[0020] In summary:

[0021] 1. In the utility model, by setting a heat dissipation structure, the heat dissipation plate can be respectively attached to the surface of the lower mold or the upper mold, and the heat dissipation plate will drive the limit arm to slide into the bracket. At this time, the latch is released, and the latch will move in the direction close to the limit arm with the help of the contraction force of the spring until the latch is inserted into the limit hole. The latch reaches the position of the limit arm, and then limits the position of the heat dissipation plate, and limits the heat dissipation plate on the surface of the mold frame, thereby improving the heat dissipation effect of the mold frame when in use.

[0022] 2. In the utility model, by setting a cleaning structure, the rectangular plate is pulled, and the rectangular plate will slide on the inner wall of the slide rail. The movement of the rectangular plate will drive the cleaning pad to slide along the surface of the heat sink fins, thereby wiping off impurities attached to the heat sink fins, thereby preventing impurities from adhering to the surface of the heat sink fins and reducing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0024] Figure 2 It is a structural schematic diagram of the upper mold of the utility model;

[0025] Figure 3 This is a schematic diagram of the disassembled structure of the upper mold of the utility model;

[0026] Figure 4 It is a structural schematic diagram of the heat dissipation plate of the utility model;

[0027] Figure 5 For this utility model Figure 4 Schematic diagram of the local structure in.

[0028] Legend: 1. Lower mold; 2. Upper mold; 3. Mold groove; 4. Heat dissipation structure; 401. Bracket; 402. Latch; 403. Heat dissipation plate; 404. Heat dissipation fin; 405. Limit arm; 406. Limit hole; 407. Rectangular hole; 408. Heat conduction plate; 409. Spring; 410. Round hole; 5. Cleaning structure; 51. Support plate; 52. Slide rail; 53. Rectangular plate; 54. Threaded rod; 55. Press plate; 56. Cleaning pad; 57. Fixing rod; 58. Cylinder. DETAILED DESCRIPTION

[0029] Reference Figure 1As shown, the utility model provides a technical solution: an efficient heat dissipation type mold frame, including a lower mold 1 and an upper mold 2, the surfaces of the upper mold 2 and the lower mold 1 are both provided with mold grooves 3, and the surfaces of the upper mold 2 and the lower mold 1 are provided with heat dissipation structures 4. By providing the heat dissipation structure 4, it is convenient to limit the heat dissipation plate 403 on the surface of the mold frame, thereby avoiding the situation of poor heat dissipation effect due to the tight structure, thereby improving the heat dissipation effect of the mold frame when in use. The surface of the heat dissipation plate 403 is provided with a cleaning structure 5. By providing the cleaning structure 5, it is convenient to clean the heat dissipation fins 404, thereby avoiding the situation that impurities adhere to the surface of the heat dissipation fins 404 and reduce the heat dissipation effect of the heat dissipation fins 404 when the mold frame is used, thereby ensuring the efficient heat dissipation effect of the mold frame.

[0030] The specific settings and functions of the heat dissipation structure 4 and the cleaning structure 5 are described in detail below.

[0031] Reference Figure 2 and Figure 3 As shown, in this embodiment: the heat dissipation structure 4 includes four brackets 401 and two heat dissipation plates 403, the four brackets 401 are respectively fixedly connected to the two sides of the lower mold 1 and the upper mold 2, and the surface of the bracket 401 is slidably penetrated by a pin 402, and the two heat dissipation plates 403 are respectively located on one side of the lower mold 1 and the upper mold 2, and both sides of the heat dissipation plate 403 are fixedly connected with a limiting arm 405, and a limiting hole 406 is provided on the surface of the limiting arm 405, and the size of the limiting hole 406 is adapted to the size of the pin 402, and one side of the heat dissipation plate 403 is fixedly connected with a plurality of heat dissipation fins 404. A rectangular hole 407 is provided on one side of the lower mold 1 and the upper mold 2 near the heat sink 403. The inner wall of the rectangular hole 407 has a heat conducting plate 408 for sliding the latch 402. The heat conducting plate 408 is fixedly connected to the surface of the heat sink 403. The heat conducting plate 408 passes through the rectangular hole 407 and slides into the die groove 3. When the mold core is installed in the die groove 3 for use, the heat conducting plate 408 can improve the heat dissipation effect of the heat sink 403. The arc surface of the latch 402 is covered with a spring 409. The two ends of the spring 409 are respectively fixedly connected to the latch 402 and the bracket 401. The latch 402 will move toward the direction close to the limit arm 405 with the help of the contraction force of the spring 409. The spring 409 can improve the stability of the latch 402 inserted into the limit hole 406 and prevent the latch 402 from slipping out of the limit hole 406 due to sliding. A plurality of circular holes 410 are formed on the surface of the heat dissipation fins 404 , thereby improving the air flow between the heat dissipation fins 404 and further improving the heat dissipation effect of the heat dissipation fins 404 .

[0032] Reference Figure 4 and Figure 5As shown, specifically, the cleaning structure 5 includes two support plates 51, and the two support plates 51 are fixedly connected to the side away from the heat sink 403 with a slide rail 52, and the inner walls of the two slide rails 52 are slidably connected to a rectangular plate 53, and the side of the rectangular plate 53 away from the heat sink 403 is rotatably connected to a threaded rod 54, and the surface of the threaded rod 54 is threadedly connected to a pressing plate 55, and the side of the rectangular plate 53 close to the heat sink 403 is fixedly connected to a cleaning pad 56. The surface of the cleaning pad 56 is provided with a plurality of grooves, and the size of the grooves is adapted to the size of the heat sink fins 404, and the grooves are used to improve the fit between the cleaning pad 56 and the heat sink fins 404, thereby ensuring that the cleaning pad 56 can completely wipe the heat sink fins 404. The inner wall of the slide rail 52 is fixedly connected with a plurality of fixed rods 57, and the arc surface of the fixed rod 57 is sleeved with a cylinder 58. The rectangular plate 53 will slide on the inner wall of the slide rail 52 and along the surface of the cylinder 58. The cylinder 58 will rotate on the surface of the fixed rod 57 with the help of the force of the rectangular plate 53 moving. The cylinder 58 can reduce the friction force when the rectangular plate 53 slides in the slide rail 52, thereby facilitating the pulling of the slide rail 52.

[0033] Working principle: before the mold frame needs to be used, first simultaneously latch 402, latch 402 will move away from lower mold 1 and upper mold 2 and slide in bracket 401, latch 402 will stretch spring 409 when moving, when latch 402 moves to a suitable position, heat sink 403 is respectively attached to the surface of lower mold 1 or upper mold 2, heat sink 403 will drive heat conducting plate 408 to slide into rectangular hole 407, heat conducting plate 408 will slide into mold groove 3 through rectangular hole 407, when the mold core is installed in mold groove 3 for use, heat conducting plate 408 can improve the heat dissipation effect of heat sink 403, so as to In order to further efficiently dissipate heat from the mold, when the heat sink 403 fits the specific surface of the lower mold 1 and the upper mold 2, the heat sink 403 will drive the limit arm 405 to slide into the bracket 401. At this time, the latch 402 is released, and the latch 402 will move toward the limit arm 405 with the help of the contraction force of the spring 409 until the latch 402 is inserted into the limit hole 406. The latch 402 reaches the position of limiting the limit arm 405, thereby limiting the position of the heat sink 403. The spring 409 improves the stability of the latch 402 inserted into the limit hole 406 and prevents the latch 402 from slipping out of the limit hole 406 due to sliding.

[0034] When the heat sink 404 needs to be cleaned, the threaded rod 54 is first rotated, and the threaded rod 54 will rotate on the surface of the rectangular plate 53. The rotation of the threaded rod 54 will drive the pressure plate 55 to move away from the slide rail 52 with the help of the thread. When the pressure plate 55 is out of contact with the slide rail 52, the rectangular plate 53 is pulled, and the rectangular plate 53 slides on the inner wall of the slide rail 52 and along the surface of the cylinder 58. The cylinder 58 rotates on the surface of the fixed rod 57 with the help of the moving force of the rectangular plate 53, and the cylinder 58 reduces the friction of the rectangular plate 53 when it slides in the slide rail 52. The cleaning pad 56 can slide along the surface of the heat sink 404 to wipe off the impurities attached to the heat sink 404, thereby preventing the impurities from adhering to the surface of the heat sink 404 and reducing the heat dissipation effect. After the impurities are wiped off, the threaded rod 54 is rotated in the opposite direction. The rotation of the threaded rod 54 can drive the pressure plate 55 to move toward the direction close to the slide rail 52 with the help of the thread, until the pressure plate 55 is tightly fitted to the surface of the slide rail 52, thereby limiting the position of the rectangular plate 53.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

Claims

1. An efficient heat dissipation mold frame, comprising a lower mold (1) and an upper mold (2), wherein the surfaces of the upper mold (2) and the lower mold (1) are both provided with mold grooves (3), and the surfaces of the upper mold (2) and the lower mold (1) are provided with heat dissipation structures (4), characterized in that: The heat dissipation structure (4) comprises four brackets (401) and two heat dissipation plates (403). The four brackets (401) are respectively fixedly connected to the two sides of the lower mold (1) and the upper mold (2). A latch (402) is slidably penetrated through the surface of the bracket (401). The two heat dissipation plates (403) are respectively located on one side of the lower mold (1) and the upper mold (2). Both sides of the heat dissipation plate (403) are fixedly connected to a limiting arm (405). A limiting hole (406) is provided on the surface of the limiting arm (405). The size of the limiting hole (406) is matched with the size of the latch (402). One side of the heat dissipation plate (403) is fixedly connected to a plurality of heat dissipation fins (404).

2. The high-efficiency heat dissipation mold frame according to claim 1, characterized in that: A rectangular hole (407) is provided on one side of the lower mold (1) and the upper mold (2) close to the heat sink (403); a sliding latch (402) on the inner wall of the rectangular hole (407) has a heat conduction plate (408); and the heat conduction plate (408) is fixedly connected to the surface of the heat sink (403).

3. The high-efficiency heat dissipation mold frame according to claim 1, characterized in that: The arc surface of the latch (402) is sleeved with a spring (409), and the two ends of the spring (409) are respectively fixedly connected to the latch (402) and the bracket (401).

4. The high-efficiency heat dissipation mold frame according to claim 1, characterized in that: A plurality of circular holes (410) are provided on the surface of the heat dissipation fin (404).

5. The high-efficiency heat dissipation mold frame according to claim 1, characterized in that: The surface of the heat dissipation plate (403) is provided with a cleaning structure (5), and the cleaning structure (5) comprises two support plates (51), and the sides of the two support plates (51) away from the heat dissipation plate (403) are fixedly connected to a slide rail (52), and the inner walls of the two slide rails (52) are slidably connected to a rectangular plate (53), and the side of the rectangular plate (53) away from the heat dissipation plate (403) is rotatably connected to a threaded rod (54), and the surface of the threaded rod (54) is threadedly connected to a pressure plate (55), and the side of the rectangular plate (53) close to the heat dissipation plate (403) is fixedly connected to a cleaning pad (56).

6. The high-efficiency heat dissipation mold frame according to claim 5, characterized in that: The surface of the cleaning pad (56) is provided with a plurality of grooves, the size of the grooves being adapted to the size of the heat dissipation fins (404).

7. The high-efficiency heat dissipation mold frame according to claim 5, characterized in that: A plurality of fixing rods (57) are fixedly connected to the inner wall of the slide rail (52), and a cylinder (58) is sleeved on the arc surface of the fixing rod (57).

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