Cooling growth base station

Abstract

The utility model relates to the technical field of chemical vapor deposition growth, in particular to a cooling growth base station. A cooling growth base station comprises a cooling supporting table, the cooling supporting table is an integrated cooling supporting table formed through 3D printing, a cooling channel is formed in the integrated cooling supporting table in a printing mode, the deformation resistance of the cooling supporting table is integrally improved, and the cooling channel is formed in the integrated cooling supporting table in a printing mode, so that the cooling effect is improved. The structure, the position and the like of the cooling channel are more accurate, it is guaranteed that the cooling uniformity of the cooling supporting table is better, the cooling channel can be arranged close to the upper surface of the cooling supporting table as far as possible through integrated forming, the cooling capacity of the cooling supporting table is improved, temperature balance of the single crystal diamonds is guaranteed, and the growth quality of the single crystal diamonds is good.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical vapor deposition growth, in particular to a cooling growth base. Background Art

[0002] Single crystal diamond has extremely excellent properties and is widely used in mechanics, electronics, optics, thermal conductivity and other fields. Since the 1950s, researchers have developed a variety of diamond preparation methods, including high temperature and high pressure method, hot wire method, DCCVD method, MPCVD method, etc. Among them, MPCVD method is considered to be the best method to prepare high-quality diamonds and realize their application in electronic devices.

[0003] During the cultivation process, the single crystal diamond sheet is placed on a deposition table, which includes a substrate table and a molybdenum ring. During the cultivation process, the seed crystal temperature of the single crystal diamond sheet needs to be maintained within a certain temperature range. A cooling support table is provided under the deposition table. The substrate table conducts heat with the cooling support table to reasonably control the temperature of the single crystal diamond sheet. Therefore, the cooling capacity and cooling uniformity of the cooling support table directly affect the synthesis quality of the single crystal diamond.

[0004] However, the existing cooling support table is generally a copper table, including a split copper table body and a cooling pipe buried in the copper table body. After the cooling pipe is buried, the split copper table body is connected into an integral structure by welding. Since the copper table body of this cooling support table is connected by welding, there is welding stress inside, and it is easy to deform due to long-term heat during use. In order to avoid excessive welding deformation, the split thickness of the copper table body is relatively thick, resulting in poor cooling capacity. The buried cooling pipe has a large randomness in processing, resulting in uneven cooling of the substrate table and a large temperature difference between each single crystal diamond, which affects the growth quality and process control. Utility Model Content

[0005] The utility model aims to provide a cooling growth base, which is used to solve the problem that the cooling support platform of the existing cooling growth base adopts a structure of split welding and buried cooling pipes, which is easy to deform and has a poor cooling effect.

[0006] The cooling growth base of the utility model adopts the following technical scheme: a cooling growth base, including a cooling support platform, the cooling support platform is an integrated cooling support platform formed by 3D printing, and a cooling channel is printed inside the integrated cooling support platform.

[0007] Furthermore, a heat conducting plate is placed on the cooling support platform, the heat conducting plate and the cooling support platform are independently arranged and cover the upper surface of the cooling support platform, and the upper surface of the heat conducting plate is used to support the deposition platform.

[0008] Furthermore, the cooling channel is a planar spiral cooling channel.

[0009] Furthermore, the planar spiral cooling channel is a double spiral cooling channel, both ends of the double spiral cooling channel located at the edge of the cooling support platform are connected, and both ends of the double spiral cooling channel located in the middle of the cooling support platform constitute water inlets and outlets respectively.

[0010] Furthermore, the planar spiral cooling channel is a single spiral cooling channel, and the water inlet and outlet of the single spiral cooling channel are respectively located at the edge and the middle of the cooling support platform.

[0011] Furthermore, the cooling channel is arranged close to the upper surface of the cooling support platform.

[0012] Furthermore, the cooling support platform is a copper platform.

[0013] Furthermore, the heat conducting plate is a copper plate.

[0014] The cooling growth base of the utility model is a newly designed cooling growth base. The beneficial effects of the cooling growth base of the utility model are: by setting the cooling support platform as an integrated cooling support platform formed by 3D printing, the deformation resistance of the cooling support platform is improved, and a cooling channel is printed and formed in the integrated cooling support platform, so that the cooling channel is formed in one piece, and the structure and position of the cooling channel are more precise, ensuring better cooling uniformity of the cooling support platform. The integrated molding can also make the cooling channel as close to the upper surface of the cooling support platform as possible, thereby improving the cooling capacity of the cooling support platform, ensuring the temperature balance of each single crystal diamond and ensuring good growth quality of the single crystal diamond. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of an embodiment of a cooling growth base of the utility model when in use;

[0016] Figure 2 It is a schematic diagram of the structure of the cooling channel inside the cooling support platform.

[0017] In the figure: 1. Cooling support table; 2. Double helix cooling channel; 3. Copper tube; 4. Heat conduction plate; 5. Substrate table; 6. Molybdenum ring; 7. Single crystal diamond. DETAILED DESCRIPTION

[0018] The features and performance of the present invention are further described in detail below in conjunction with the embodiments.

[0019] First, the technical solution of the utility model is generally described as follows:

[0020] Since the seed crystal temperature of the single crystal diamond sheet needs to be maintained within a certain temperature and temperature difference range during the cultivation process, a cooling support table is generally provided under the deposition table used to cultivate the single crystal diamond sheet. The deposition table includes a substrate table and a molybdenum ring. The substrate table conducts heat with the cooling support table to reasonably control the temperature of the single crystal diamond sheet. Therefore, the cooling capacity and cooling uniformity of the cooling support table directly affect the synthesis quality of the single crystal diamond.

[0021] The existing cooling support platform is generally formed by burying pipes in the copper platform body and then performing buried welding processing. Specifically, the cooling support platform includes a split copper platform body and a cooling pipe buried in the copper platform body. After the cooling pipe is buried, the split copper platform body is connected into an integral structure by welding. Since the copper platform body of this cooling support platform is connected by welding, there is welding stress inside, and it is easy to deform due to long-term heat during use. In order to avoid excessive welding deformation, the split thickness of the copper platform body is relatively thick, resulting in poor cooling capacity, and the buried cooling pipe processing is highly random, resulting in uneven cooling of the substrate table and a large temperature difference between each single crystal diamond, which affects the growth quality and process control.

[0022] Based on the above problems, the utility model designs a cooling growth base. The cooling growth base of the utility model includes a cooling support platform, which is used to perform temperature control on the substrate platform. The key point of the utility model is that the cooling support platform is set to be an integrated cooling support platform formed by 3D printing, and a cooling channel is printed in the integrated cooling support platform. First of all, this integrated cooling support platform has improved anti-deformation ability, which can make the overall structure thinner and improve the cooling capacity of the cooling support platform. The structure and position of the cooling channel integrated in the cooling support platform are more precise, thereby ensuring better cooling uniformity of the cooling support platform.

[0023] Specific embodiments of the cooling growth base of the utility model:

[0024] The schematic diagram of the structure of the cooling growth base of the utility model is as follows Figure 1 As shown, a cooling growth base includes a cooling support platform 1, which is an integrated cooling support platform formed by 3D printing. A cooling channel is printed inside the integrated cooling support platform, and the cooling channel includes a water inlet and an outlet. Two copper tubes 3 are connected to the bottom of the cooling support platform 1, and the copper tubes 3 are respectively connected to the water inlet and outlet, so that cooling water is passed into the cooling channel to cool the cooling support platform 1.

[0025] The integrated cooling support platform formed by 3D printing enhances the ability of the cooling support platform 1 to resist water pressure deformation, improves the cooling accuracy of the cooling support platform 1, and has higher product accuracy, making the structure of the cooling channel more precise, thereby improving the cooling uniformity of the cooling support platform 1. In addition, the production efficiency of 3D printing is higher, and no waste is generated during the production process, thus saving manpower and material resources.

[0026] The cooling support table 1 is directly used to support the deposition table. The structure is simple, but impurities will inevitably be deposited on the cooling support table 1 during use. The staff may cause surface damage during the cleaning operation. The one-piece cooling support table formed by 3D printing is costly, and the entire one-piece cooling support table is inconvenient to disassemble and repair. The overall replacement cost after damage is high. In this embodiment, preferably, a heat conducting plate 4 is placed on the top of the cooling support table 1. The heat conducting plate 4 is independently set apart from the cooling support table 1 and covers the upper surface of the cooling support table 1. The upper surface of the heat conducting plate 4 is used to support the deposition table. The heat conducting plate 4 is placed above the cooling support table 1. The two are independently set apart. In this way, when impurities are deposited on the heat conducting plate 4 during use, it is convenient to disassemble the heat conducting plate 4 for cleaning and maintenance. When the surface is damaged during operation, the heat conducting plate 4 can be replaced separately, which is convenient for cleaning and maintenance. Replacing the heat conducting plate 4 separately reduces the cost.

[0027] Since the substrate stage 5 and the molybdenum ring 6 of the deposition stage are both annular structures, in order to improve the cooling uniformity of the cooling support stage 1, preferably, the cooling channel is a planar spiral cooling channel. The planar spiral cooling channel rotates evenly around the substrate stage 5, so that the cooling support stage 1 is evenly cooled, and the growth temperature of the single crystal diamond 7 is well controlled. Of course, in other embodiments, the cooling channel can also be set as a uniformly arranged continuous S-shaped water cooling channel.

[0028] In order to make the cooling uniformity of the cooling support platform 1 better and make the copper tube 3 below easier to arrange, preferably, as Figure 2 As shown, the planar spiral cooling channel is a double spiral cooling channel 2, the two ends of the double spiral cooling channel 2 located at the edge of the cooling support platform 1 are connected, and the two ends of the double spiral cooling channel 2 located in the middle of the cooling support platform 1 respectively constitute the water inlet and outlet. In this way, the copper tube 3 is arranged vertically downward corresponding to the water inlet and outlet in the middle, the structure is more compact, and the cooling of the double spiral cooling channel 2 is more uniform.

[0029] Of course, the plane spiral cooling channel can also be set as a single spiral cooling channel, and the water inlet and outlet of the single spiral cooling channel are respectively located at the middle position and the edge position of the cooling support platform 1. In this way, the cooling water flows from the water inlet at the middle position to the water outlet at the edge position, and the copper tube 3 is vertically arranged one by one corresponding to the water inlet and outlet at the middle position and the edge position.

[0030] In order to improve the cooling capacity of the cooling support table 1, preferably, the cooling channel is arranged close to the upper surface of the cooling support table 1, so that the cooling channel is closer to the substrate stage 5, the cooling effect on the substrate stage 5 is improved, and when the heat conducting plate 4 is arranged, the cooling effect is not affected due to the increase in thickness corresponding to the substrate stage 5. Of course, in other embodiments, while ensuring a good cooling effect, the cooling channel can also be arranged in the middle position of the height direction of the cooling support table 1.

[0031] In this embodiment, in order to improve the heat dissipation effect and ensure the good structural strength of the growth base, preferably, the heat conducting plate 4 and the cooling support platform 1 are copper plates and copper platforms. Copper materials are not easily deformed by heat, have low cost, and have good heat conduction effect. Of course, in other embodiments, the heat conducting plate 4 and the cooling support platform 1 can also be made of stainless steel or aluminum.

[0032] Specifically, the molybdenum ring 6 is sleeved on the substrate stage 5, the substrate stage 5 and the molybdenum ring 6 are placed at the center of the heat conducting plate 4, the outer circumference of the heat conducting plate 4 is consistent with the outer circumference of the cooling support stage 1, and the heat conducting plate 4 is fitted and covered on the cooling support stage 1, ensuring that the substrate stage 5 is more stable, ensuring uniform seed crystal deposition, and making the reliability of diamond growth higher. Or in other embodiments, the outer circumference of the heat conducting plate 4 is slightly larger than the outer circumference of the cooling support stage 1.

[0033] Through the above description of the specific embodiments of the cooling growth base of the utility model, it can be seen that the cooling growth base of the utility model improves the deformation resistance of the cooling support platform by making the cooling support platform an integrated cooling support platform formed by 3D printing, and a double-helix cooling channel is formed in the integrated cooling support platform. The structure and position of the cooling channel of the integrated cooling support platform formed by 3D printing are more precise, thereby ensuring better cooling uniformity of the cooling support platform. The integrated molding can also make the overall structure smaller, thereby improving the cooling capacity of the cooling support platform.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The patent protection scope of the present invention shall be based on the claims. All equivalent structural changes made using the description and drawings of the present invention shall be included in the protection scope of the present invention.

Claims

1. A cooling growth base, characterized in that: It comprises a cooling support platform, which is an integrated cooling support platform formed by 3D printing, and a cooling channel is printed in the integrated cooling support platform, and the cooling channel is a planar spiral cooling channel.

2. The cooling growth base according to claim 1, characterized in that: A heat conducting plate is placed on the cooling support platform. The heat conducting plate and the cooling support platform are independently arranged and cover the upper surface of the cooling support platform. The upper surface of the heat conducting plate is used to support the deposition platform.

3. The cooling growth base according to claim 1, characterized in that: The planar spiral cooling channel is a double spiral cooling channel, the two ends of the double spiral cooling channel located at the edge of the cooling support platform are connected, and the two ends of the double spiral cooling channel located in the middle of the cooling support platform constitute water inlets and outlets respectively.

4. The cooling growth base according to claim 1, characterized in that: The planar spiral cooling channel is a single spiral cooling channel, and the water inlet and outlet of the single spiral cooling channel are respectively located at the edge and the middle of the cooling support platform.

5. The cooling growth base according to claim 1, characterized in that: The cooling channel is arranged close to the upper surface of the cooling support platform.

6. The cooling growth base according to claim 1, characterized in that: The cooling support platform is a copper platform.

7. The cooling growth base according to claim 2, characterized in that: The heat conducting plate is a copper plate.

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