Electronic water pump and vehicle thermal management system with same

Abstract

The utility model provides an electronic water pump and a vehicle thermal management system with the same. The electronic water pump comprises a pump shell provided with an inlet and an outlet, and a fluid channel is formed between the inlet and the outlet; the motor is arranged in a motor cavity in the pump shell; the impeller is arranged in the impeller cavity in the pump shell and connected with the motor so as to be driven by the motor to enable fluid flowing in from the inlet to be discharged from the outlet through the fluid channel; the heating assembly is arranged in the fluid channel and is used for heating the fluid; the fluid channel comprises a heating section, the heating assembly is arranged on the heating section, and the heating section is arranged around the axial direction of the impeller. According to the water heater, the fluid quickly reaches the heating section where the heating assembly is located after passing through the impeller, the fluid is evenly distributed in the circumferential direction of the impeller under the flow guiding effect of the impeller, the heating efficiency is improved, and the heat loss is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle thermal management systems, and in particular to an electronic pump and a vehicle thermal management system having the same. Background Art

[0002] In the thermal management system of new energy vehicles, the electronic water pump is one of the key components, which is mainly used to adjust and control the temperature of the vehicle coolant to ensure that the vehicle can maintain a good working condition in various environments. With the popularization and development of new energy vehicles, the performance requirements of their thermal management systems are also constantly increasing, requiring efficient heating capabilities and stable working performance.

[0003] Therefore, designing an electronic water pump that can efficiently heat the coolant and reduce heat loss is of great significance to improving the overall performance of new energy vehicles. Summary of the invention

[0004] In order to solve the above technical problems, the present application proposes an electronic water pump and a vehicle thermal management system having the same, so as to solve the problems of low heating efficiency and serious heat loss of the electronic water pump.

[0005] In order to achieve one of the above-mentioned application purposes, an embodiment of the present application provides an electronic water pump, comprising:

[0006] A pump housing, the pump housing having an inlet and an outlet, and a fluid passage between the inlet and the outlet;

[0007] A motor is disposed in a motor cavity in the pump housing;

[0008] an impeller, disposed in an impeller chamber in the pump housing and connected to the motor so as to be driven by the motor to discharge the fluid flowing into the inlet through the fluid passage and out of the outlet;

[0009] A heating component, disposed in the fluid channel to heat the fluid;

[0010] The fluid channel comprises a heating section, the heating assembly is arranged in the heating section, and the heating section is arranged around the axial direction of the impeller.

[0011] As a further improvement of an embodiment of the present application, the impeller chamber includes a cover body, and a matching portion is provided at one end of the motor chamber close to the cover body, and the cover body is matched with the matching portion to form the heating section therebetween.

[0012] As a further improvement of an embodiment of the present application, the heating component is placed horizontally in the heating section and divides the heating section into a first flow channel and a second flow channel, and the first flow channel and the second flow channel are respectively connected to the water outlet and the outlet of the impeller.

[0013] As a further improvement of an embodiment of the present application, the inlet is formed on the cover body, and the outlet is formed on the matching portion and / or the cover body.

[0014] As a further improvement of an embodiment of the present application, the heating component is annular and is arranged around the circumference of the impeller.

[0015] As a further improvement of an embodiment of the present application, the outer periphery of the heating component is disposed against at least one of the cover body and the matching portion.

[0016] As a further improvement of an embodiment of the present application, the heating component includes:

[0017] A first heat conducting plate, adjacent to the cover;

[0018] A second heat conducting plate, adjacent to the matching portion, a sealed cavity being formed between the first heat conducting plate and the second heat conducting plate;

[0019] A heating film is located in the sealed cavity;

[0020] The heating assembly also includes a plurality of first support parts, one end of the first support part abuts against the first heat conducting plate, and the other end abuts against the cover body, the plurality of first support parts are arranged at intervals along the circumference of the first heat conducting plate, and a first liquid passage is formed between two adjacent first support parts.

[0021] As a further improvement of an embodiment of the present application, the heating assembly also includes a plurality of second support parts, one end of the second support part abuts against the second heat conduction plate, and the other end abuts against the matching part, and the plurality of second support parts are arranged at intervals along the circumference of the second heat conduction plate, and a second liquid passage is formed between adjacent second support parts.

[0022] As a further improvement of an embodiment of the present application, the electronic water pump further includes:

[0023] A circuit board assembly, wherein the circuit board assembly is disposed on the cover body and is located on a side of the cover body away from the pump housing;

[0024] A circuit board protection cover is arranged on a side of the cover body away from the pump housing and covers the cover body, and the circuit board assembly is arranged between the circuit board protection cover and the cover body.

[0025] In order to achieve one of the above-mentioned application purposes, an embodiment of the present application further provides a vehicle thermal management system, including the electronic water pump as described above.

[0026] Compared with the prior art, the present application has the following beneficial effects: in the electronic water pump of the present application and the vehicle thermal management system having the same, the fluid quickly reaches the heating section where the heating component is located after passing through the impeller, that is, the fluid is heated after passing through the impeller, and the heating section is arranged around the axial direction of the impeller, so that the fluid can be evenly distributed along the circumference of the impeller under the guidance of the impeller, thereby improving the heating efficiency and reducing heat loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings provided herein are used to further illustrate the understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0028] Figure 1 is a cross-sectional schematic diagram of an electronic water pump according to an embodiment of the present application, wherein the direction indicated by the arrow is the flow direction of the fluid in the electronic water pump;

[0029] Figure 2 This is a schematic diagram of an explosion of an electronic water pump according to an embodiment of the present application;

[0030] Figure 3 This is a schematic structural diagram of a heating element according to an embodiment of the present application;

[0031] Figure 4 is a cross-sectional view of a heating element according to an embodiment of the present application;

[0032] Figure 5 FIG. 1 is an exploded schematic diagram of a heating element according to an embodiment of the present application.

[0033] 100. Electronic water pump; 1. Pump housing; 11. Inlet; 12. Outlet; 13. Motor cavity; 131. Matching part; 14. Impeller cavity; 141. Cover body; 2. Motor; 3. Impeller; 4. Heating component; 41. First heat conducting plate; 42. Second heat conducting plate; 43. Heating film; 44. Thermal conductive adhesive layer; 45. First supporting part; 46. First liquid passage; 47. Second supporting part; 48. Second liquid passage; 49. Electrical connector; 5. Fluid passage; 51. Heating section; 511. First flow channel; 512. Second flow channel; 6. Circuit board assembly; 61. Circuit board; 62. Power element; 7. Circuit board protective cover. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of this application clearer, the technical solution of this application will be clearly and completely described in combination with the specific embodiments of this application and the corresponding drawings. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0035] In the various drawings of the present application, for the sake of convenience of illustration, some dimensions of structures or parts are exaggerated relative to other structures or parts, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0036] It should be understood that, unless otherwise clearly specified and limited, in the description of this application, the terms "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0037] An embodiment of the present application provides a vehicle thermal management system, including an electronic water pump 100. The electronic water pump 100 can be used to implement thermal management of the vehicle, ensuring that the vehicle can maintain an optimal operating temperature and operating state under various operating conditions, thereby improving the overall performance and reliability of the vehicle.

[0038] See also Figure 1 to Figure 2 The electronic water pump 100 includes a pump housing 1, a motor 2, an impeller 3 and a heating component 4.

[0039] The pump housing 1 has an inlet 11 and an outlet 12, and a fluid channel 5 is provided between the inlet 11 and the outlet 12. A motor chamber 13 and an impeller chamber 14 are provided in the pump housing 1, the motor 2 is disposed in the motor chamber 13, the impeller 3 is disposed in the impeller chamber 14, and the impeller 3 is connected to the motor 2, so that the impeller 3 is driven by the motor 2 to discharge the fluid flowing into the inlet 11 from the outlet 12 through the fluid channel 5.

[0040] Of course, the fluid here can be water, or other fluid that can be used for heating.

[0041] The heating component 4 is disposed in the fluid channel 5 to heat the fluid. The fluid channel 5 includes a heating section 51 , the heating component 4 is disposed in the heating section 51 , and the heating section 51 is disposed around the axial direction of the impeller 3 .

[0042] In this way, the fluid quickly reaches the heating section 51 where the heating component 4 is located after passing through the impeller 3, that is, the fluid is heated after passing through the impeller 3, and the heating section 51 is arranged around the axial direction of the impeller 3, so that the fluid can be evenly distributed along the circumference of the impeller 3 under the guidance of the impeller 3, and further after being heated by the heating component 4, the heating efficiency is improved and the heat loss is reduced.

[0043] The impeller chamber 14 includes a cover 141, and a matching portion 131 is provided at one end of the motor chamber 13 close to the cover 141. The cover 141 is matched with the matching portion 131 to form the heating section 51 therebetween. The matching design of the cover 141 and the matching portion 131 helps to better fix and seal the heating assembly 4, ensure the heat concentration in the heating section 51, improve the heating efficiency and reduce the heat loss.

[0044] The heating component 4 is placed horizontally in the heating section 51, and the heating section 51 is divided into a first flow channel 511 and a second flow channel 512, wherein the first flow channel 511 and the second flow channel 512 are respectively connected to the water outlet of the impeller 3 and the outlet 12. In this way, not only the contact area between the fluid and the heating component 4 can be increased, but also the fluid can be evenly heated when passing through the first flow channel 511 and the second flow channel 512, thereby further improving the heating efficiency.

[0045] The inlet 11 is formed on the cover 141 , and the outlet 12 is formed on the matching portion 131 and / or the cover 141 , so that the layout of the fluid channel 5 can be optimized, the flow path of the fluid can be shortened, and the heating efficiency can be improved.

[0046] See also Figure 1 to Figure 2 In one embodiment, the outlet 12 is formed at the mating portion 131 and the cover body 141. Specifically, the outlet 12 is formed at the connection between the mating portion 131 and the cover body 141, that is, the outlet 12 is connected to the mating portion 131 and the cover body 141 at the same time, thereby facilitating the installation and positioning of the heating component 4.

[0047] In another embodiment, the outlet 12 is formed at the matching portion 131 , so that the fluid path of the fluid in the electronic water pump 100 can be shortened, thereby reducing the heat loss of the heated fluid and improving the heating efficiency.

[0048] In another embodiment, the outlet 12 is formed on the cover 141 , so that the fluid is diverted under the obstruction of the heating component 4 , so that the fluid can be more fully in contact with the heating component 4 , thereby improving the heating efficiency.

[0049] Preferably, the heating component 4 is annular and is arranged around the circumference of the impeller 3, so that the fluid distributed around the impeller 3 can be heated simultaneously, which not only increases the contact area between the fluid and the heating component 4, making the heat evenly distributed around the circumference of the impeller 3 and improving the heating efficiency, but also avoids local overheating, thereby extending the service life of the heating component 4.

[0050] The outer periphery of the heating component 4 is disposed against at least one of the cover body 141 and the matching portion 131 , thereby ensuring the stability of the heating component 4 and facilitating installation and positioning.

[0051] Preferably, the position of the outlet 12 corresponds to the position of the heating component 4, so as to facilitate the fluid to be discharged as soon as possible after being heated by the heating component 4, and can increase the contact area between the fluid and the outer surface of the heating component 4, thereby having a better heating effect.

[0052] See also Figure 1 to Figure 2 In one embodiment, the outer periphery of the heating component 4 is disposed against the cover 141 and the connecting portion 131, that is, the heating component 4 is against the connection between the connecting portion 131 and the cover 141, that is, the heating component 4 is in contact with both the connecting portion 131 and the cover 141. Preferably, the outlet 12 is formed at the connecting portion 131 and the cover 141, that is, the outlet 12 is formed at the connection between the connecting portion 131 and the cover 141, and the position of the outlet 12 corresponds to the position of the heating component 4, so that the fluid can flow through not only the side surface of the heating component 4 facing the cover 141, but also the side surface of the heating component 4 facing the connecting portion 131 under the pumping of the impeller 3, and then be sent out through the outlet 12, thereby ensuring the effective heating area and improving the heating efficiency.

[0053] In another embodiment, the periphery of the heating component 4 is disposed against the cover 141. Preferably, the outlet 12 is formed on the cover 141, and the position of the outlet 12 corresponds to the position of the heating component 4, so that the fluid can be pumped by the impeller 3, not only flowing through the side surface of the heating component 4 facing the matching portion 131 and then sent out through the outlet 12, but also flowing through the side surface of the heating component 4 away from the matching portion 131 and then sent out through the outlet 12, thereby ensuring the effective heating area and improving the heating efficiency.

[0054] In another embodiment, the outer periphery of the heating component 4 is disposed against the matching portion 131. Preferably, the outlet 12 is formed at the matching portion 131, and the position of the outlet 12 corresponds to the position of the heating component 4, so that the fluid can be pumped by the impeller 3, not only flowing through the side surface of the heating component 4 facing the cover body 141 and then sent out through the outlet 12, but also flowing through the side surface of the heating component 4 away from the cover body 141 and then sent out through the outlet 12, thereby ensuring the effective heating area and improving the heating efficiency.

[0055] Combination Figures 1 to 5In one embodiment, the heating component 4 includes a first heat conducting plate 41, a second heat conducting plate 42 and a heating film 43, wherein the first heat conducting plate 41 is adjacent to the cover 141, the second heat conducting plate 42 is adjacent to the matching portion 131, a sealed cavity is formed between the first heat conducting plate 41 and the second heat conducting plate 42, and the heating film 43 is located in the sealed cavity. In this way, the heat conduction efficiency of the heating film 43 through the first heat conducting plate 41 and the second heat conducting plate 42 can be improved, while the heating film 43 is prevented from directly contacting the fluid to avoid causing a short circuit in the electronic water pump 100, and the service life of the heating film 43 and the heating component 4 can be extended.

[0056] Preferably, the heating film 43 is perpendicular to the axis of the impeller 3 , so that the effective heating area of ​​the heating component 4 can be increased.

[0057] The heating film 43 is connected to at least one of the first heat conducting plate 41 and the second heat conducting plate 42 via a heat conducting adhesive layer 44 .

[0058] Specifically, the first heat conducting plate 41 and the second heat conducting plate 42 are both ring-shaped, so as to improve the heating uniformity of the fluid in the circumferential direction of the heating component 4 .

[0059] Preferably, at least two heating films 43 are provided, at least two heating films 43 are stacked and two adjacent heating films 43 are bonded by a thermally conductive adhesive layer 44. Stacking at least two heating films 43 can increase the heating area and further improve the heating efficiency. Bonding the two adjacent heating films 43 by the thermally conductive adhesive layer 44 can not only bond the two adjacent heating films 43 together, but also help to evenly conduct heat, avoid local overheating, and improve the uniformity of heat distribution.

[0060] The heating component 4 also includes a plurality of first support portions 45, one end of the first support portion 45 abuts against the first heat conducting plate 41, and the other end abuts against the cover body 141, thereby facilitating the fixing and supporting of the heating component 4; the plurality of first support portions 45 are arranged at intervals along the circumference of the first heat conducting plate 41, and a first liquid passage 46 is formed between two adjacent first support portions 45, so that the fluid can pass uniformly along the circumference of the heating component 4, thereby optimizing the heating effect of the fluid.

[0061] The heating component 4 also includes a plurality of second supporting portions 47, one end of the second supporting portion 47 abuts against the second heat conducting plate 42, and the other end abuts against the matching portion 131, so as to facilitate the installation, positioning and fixed support of the heating component 4; the plurality of second supporting portions 47 are arranged at intervals along the circumference of the second heat conducting plate 42, and second liquid passages 48 are formed between adjacent second supporting portions 47, so as to allow the fluid to pass uniformly from the circumference of the heating component 4, thereby optimizing the heating effect of the fluid.

[0062] See also Figure 1 to Figure 2 The electronic water pump 100 further includes a circuit board assembly 6, which supplies power to the heating assembly 4. The circuit board assembly 6 is disposed on the cover 141 and is located on the side of the cover 141 away from the pump housing 1, which not only facilitates the installation and replacement of the circuit board assembly 6, so that the unheated fluid can be used to dissipate the heat of the circuit board assembly 6, but also improves the heating efficiency of the electronic water pump 100.

[0063] See also Figure 1 to Figure 2 The electronic water pump 100 further includes a circuit board protection cover 7, which is disposed on a side of the cover body 141 away from the pump housing 1 and covers the cover body 141, and the circuit board assembly 6 is disposed between the circuit board protection cover 7 and the cover body 141. The cooperation between the circuit board protection cover 7 and the cover body 141 can not only encapsulate the circuit board assembly 6 to prevent the circuit board assembly 6 from being exposed to the external environment and causing a short circuit or damage, thereby improving the safety and reliability of the electronic water pump 100, but also facilitates the installation, replacement and maintenance of the circuit board assembly 6.

[0064] See also Figure 1 to Figure 2 The circuit board assembly 6 includes a circuit board 61 and a power element 62 mounted on the circuit board 61. The power element 62 is arranged on a side of the circuit board 61 facing the cover body 141, so that sufficient heat dissipation of the power element 62 can be ensured.

[0065] The power element 62 may be an insulated gate bipolar transistor (IGBT), which combines the advantages of a power transistor and a power field effect transistor and has good characteristics.

[0066] See also Figures 1 to 5 The heating assembly 4 further includes an electrical connector 49 , which connects the heating film 43 and the circuit board assembly 6 , thereby achieving electrical connection between the heating assembly 4 and the circuit board assembly 6 .

[0067] Compared with the prior art, the beneficial effect of the present application is that: in the electronic water pump 100 of the present application and the vehicle thermal management system having the same, the fluid quickly reaches the heating section 51 where the heating component 4 is located after passing through the impeller 3, that is, the fluid is heated after passing through the impeller 3, and the heating section 51 is arranged around the axial direction of the impeller 3, so that the fluid can be evenly distributed along the circumference of the impeller 3 under the guidance of the impeller 3, and further after being heated by the heating component 4, the heating efficiency is improved and the heat loss is reduced.

[0068] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0069] The above is only a preferred implementation of the present application. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept of the present application, and these all fall within the scope of protection of the present application.

Claims

1. An electronic water pump, comprising: A pump housing, the pump housing having an inlet and an outlet, and a fluid passage between the inlet and the outlet; A motor is disposed in a motor cavity in the pump housing; an impeller, disposed in an impeller chamber in the pump housing and connected to the motor so as to be driven by the motor to discharge the fluid flowing into the inlet through the fluid passage and out of the outlet; A heating component, disposed in the fluid channel to heat the fluid; It is characterized in that the fluid channel includes a heating section, the heating component is arranged in the heating section, and the heating section is arranged around the axial direction of the impeller.

2. The electronic water pump according to claim 1, characterized in that: The impeller chamber comprises a cover body, and a matching portion is provided at one end of the motor chamber close to the cover body. The cover body is matched with the matching portion and the heating section is formed between the two.

3. The electronic water pump according to claim 2, characterized in that: The heating component is placed horizontally in the heating section and divides the heating section into a first flow channel and a second flow channel. The first flow channel and the second flow channel are connected to the water outlet and the outlet of the impeller respectively.

4. The electronic water pump according to claim 2, characterized in that: The inlet is formed on the cover body, and the outlet is formed on the matching portion and / or the cover body.

5. The electronic water pump according to claim 1, characterized in that: The heating component is annular and is arranged around the circumference of the impeller.

6. The electronic water pump according to claim 2, characterized in that: The outer periphery of the heating component is disposed against at least one of the cover body and the matching portion.

7. The electronic water pump according to claim 2, characterized in that: The heating assembly comprises: A first heat conducting plate, adjacent to the cover; A second heat conducting plate, adjacent to the matching portion, a sealed cavity being formed between the first heat conducting plate and the second heat conducting plate; A heating film is located in the sealed cavity; The heating assembly also includes a plurality of first support parts, one end of the first support part abuts against the first heat conducting plate, and the other end abuts against the cover body, the plurality of first support parts are arranged at intervals along the circumference of the first heat conducting plate, and a first liquid passage is formed between two adjacent first support parts.

8. The electronic water pump according to claim 7, characterized in that: The heating component also includes a plurality of second support parts, one end of the second support part abuts against the second heat conducting plate, and the other end abuts against the matching part. The plurality of second support parts are arranged at intervals along the circumference of the second heat conducting plate, and a second liquid passage is formed between adjacent second support parts.

9. The electronic water pump according to claim 2, characterized in that: Also includes: A circuit board assembly, wherein the circuit board assembly is disposed on the cover body and is located on a side of the cover body away from the pump housing; A circuit board protection cover is arranged on a side of the cover body away from the pump housing and covers the cover body, and the circuit board assembly is arranged between the circuit board protection cover and the cover body.

10. A vehicle thermal management system, characterized in that: The electronic water pump comprises the electronic water pump as claimed in any one of claims 1 to 9.

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