Semiconductor wafer wet process drying device

Abstract

The utility model discloses a semiconductor wafer wet process drying device, which relates to the technical field of semiconductor manufacturing and comprises a vacuum drying cavity, a drying groove and a hydraulic sealing cover plate assembly arranged between the vacuum drying cavity and the drying groove. According to the invention, the classical Malangori drying technology is adopted in the drying tank to ensure that the surface of the wafer is preliminarily dried, then the wafer is transferred to the vacuum drying cavity, the vacuum degree is ensured, and evaporation of residual moisture on the surface of the wafer is remarkably accelerated by applying negative pressure, so that thorough drying is realized; according to the method, by combining the Malangori effect and vacuum drying, the problem of accelerated oxidation of the wafer surface caused by heating drying in an existing hot deionized water lifting drying method is solved, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer wet process drying device. Background Art

[0002] At present, etching technology in the semiconductor manufacturing process is mainly divided into two categories: wet and dry. Wet cleaning, as a key technology for wafer cleaning, involves the study of the adsorption and removal mechanism of pollutants and the chemical reaction on the wafer surface, which is crucial for the development of efficient cleaning processes. Although dry technology is gradually developing in the industry, it cannot completely replace wet cleaning due to its inherent limitations, such as difficulty in removing particulate impurities. Therefore, wet cleaning will remain an essential step in the foreseeable future.

[0003] In this context, improving wet cleaning performance is not only crucial to ensuring device performance and yield, but also of great significance to maintaining the stability and controllability of the production process. After wet cleaning, the wafer needs to be dried. To prevent re-contamination during the drying stage. Currently, drying technologies include rotary centrifugal drying, Marangoni drying, and IPA drying. Each method has its advantages and limitations. For example, centrifugal drying may leave water marks, and isopropyl alcohol vapor drying may cause gel defects.

[0004] A wafer cleaning and drying device using the Marangoni effect is disclosed in Chinese patent application number CN218918801U, comprising: a box body; a wafer carrying and moving assembly for receiving wafers, driving the wafers to shift in parallel and lifting the wafers in a vertical direction; a double spray assembly, comprising an air outlet located at the top and a liquid outlet located at the bottom, wherein during the wafer rising process, the liquid outlet sprays liquid to a first area on the wafer surface while the air outlet sprays air to a second area on the wafer surface, wherein the first area intersects with the second area and is located below the second area, so that the Marangoni effect occurs at the intersection position to strip off pollutants on the wafer surface.

[0005] The above patent adopts the Marangoni effect combined with temperature-controlled hot deionized water pulling drying method to dry the wafer, but the increase in temperature during the drying process will accelerate the oxidation of the wafer surface. Utility Model Content

[0006] The utility model provides a semiconductor wafer wet process drying device, which is used to solve the problems raised in the background technology.

[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A semiconductor wafer wet process drying device comprises a vacuum drying chamber, a drying tank, and a hydraulic sealing cover plate assembly, wherein the hydraulic sealing cover plate assembly is arranged between the vacuum drying chamber and the drying tank.

[0009] Preferably, a deionized water inlet, a nitrogen nozzle, and an IPA nozzle are provided in the drying tank, a double door is provided on the top of the drying tank, a drain outlet is provided at the bottom of the drying tank, and a base is provided at the bottom of the drying tank.

[0010] Preferably, the nitrogen nozzle and the IPA nozzle are arranged in parallel.

[0011] Preferably, the vacuum drying chamber is arranged above the drying tank, a vacuum tube is arranged on the side of the vacuum drying chamber, a single-door cover is connected to the top of the vacuum drying chamber, and a sealing buckle is arranged at the closing position of the single-door cover.

[0012] Preferably, the hydraulic sealing cover plate assembly comprises a left hydraulic column, the upper end of the left hydraulic column is fixedly connected to a first hydraulic barrel, the upper end of the first hydraulic barrel is fixedly connected to a first hydraulic rod, the upper end of the first hydraulic rod is fixedly connected to a sealing plate, and the sealing plate is provided with a crystal boat base;

[0013] The sealing plate can be inserted between the vacuum drying chamber and the drying tank.

[0014] Preferably, the hydraulic sealing cover plate assembly includes a right hydraulic column, which is fixedly connected to the right side of the drying tank, a second hydraulic barrel is fixedly connected to the upper end of the right hydraulic column, and a second hydraulic rod is fixedly connected above the second hydraulic barrel.

[0015] Preferably, a roller assembly is fixedly connected to the lower end of the left hydraulic column, and the roller assembly is rotatably connected to a track, and limiters are provided at both ends of the track.

[0016] Preferably, it also includes a robot, which is arranged above the vacuum drying chamber and is used to grab a wafer boat carrying wafers.

[0017] Preferably, the roller assembly includes a first fixed plate, the first fixed plate is fixedly connected to the lower end of the left hydraulic column, the first fixing plate is rotatably connected to a first connecting rod and one end of a second connecting rod, the first connecting rod and the second connecting rod are arranged in parallel, the other ends of the first connecting rod and the second connecting rod are rotatably connected to the second fixed plate, an elastic member is arranged between the first connecting rod and the second connecting rod, one end of the elastic member is connected to an end of the first connecting rod close to the second fixed plate, and the other end of the elastic member is connected to an end of the second connecting rod close to the first fixed plate.

[0018] Preferably, a support member is fixedly connected to the lower end of the second fixing plate;

[0019] The lower end of the second fixing plate is rotatably connected to one end of a mounting rod, the other end of the mounting rod is rotatably connected to a roller, and the roller is rotatably connected to the track;

[0020] The middle section of the mounting rod is rotatably connected to one end of an elastic telescopic member, and the other end of the elastic telescopic member is rotatably connected to the supporting member.

[0021] Compared with the prior art, the present invention has at least the following beneficial effects:

[0022] The present application uses the classic Marangoni drying technology in the drying tank to ensure the initial drying of the wafer surface, and then transfers the wafer to the vacuum drying chamber to ensure the vacuum degree. By applying negative pressure, the evaporation of residual water on the wafer surface is significantly accelerated, thereby achieving thorough drying;

[0023] The present application solves the problem of accelerated oxidation of the wafer surface caused by heating and drying in the existing hot deionized water pulling and drying method by combining the Marangoni effect and vacuum drying, thereby improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the roller assembly of the utility model.

[0026] In the figure: 10, left hydraulic column; 11, first hydraulic barrel; 12, first hydraulic rod; 13, sealing plate; 14, crystal boat base; 15, right hydraulic column; 16, second hydraulic barrel; 17, second hydraulic rod; 18, vacuum tube; 19, vacuum drying chamber; 20, single door cover; 21, deionized water inlet; 22, nitrogen nozzle; 23, IPA nozzle; 24, base; 25, drying tank; 26, drain outlet; 27, crystal boat; 28, wafer; 29, double door; 30, sealing buckle; 31, limiter; 32, roller assembly; 33, track; 34, manipulator; 321, first fixed plate; 322, first connecting rod; 323, second fixed plate; 324, second connecting rod; 325, elastic member; 326, support member; 327, mounting rod; 328, roller; 329, elastic telescopic member. DETAILED DESCRIPTION

[0027] In the present utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present utility model. They are only used to distinguish the protective components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0028] Example 1

[0029] See also Figure 1 A semiconductor wafer wet process drying device includes a vacuum drying chamber 19, a drying tank 25, and a hydraulic sealing cover plate assembly, wherein the hydraulic sealing cover plate assembly is arranged between the vacuum drying chamber 19 and the drying tank 25.

[0030] The working principle and beneficial effects of the above scheme:

[0031] The present application uses the classic Marangoni drying technology in the drying tank 25 to ensure the initial drying of the wafer surface, and then transfers the wafer to the vacuum drying chamber 19 to ensure the vacuum degree, and significantly accelerates the evaporation of residual water on the wafer surface by applying negative pressure, thereby achieving thorough drying;

[0032] The present application solves the problem of accelerated oxidation of the wafer surface caused by heating and drying in the existing hot deionized water pulling and drying method by combining the Marangoni effect and vacuum drying, thereby improving the product yield.

[0033] Example 2

[0034] See also Figure 1 On the basis of Example 1, a deionized water inlet 21, a nitrogen nozzle 22, and an IPA nozzle 23 are provided in the drying tank 25, a double door 29 is provided at the top of the drying tank 25, a drain outlet 26 is provided at the bottom of the drying tank 25, and a base 24 is provided at the bottom of the drying tank 25.

[0035] The nitrogen nozzle 22 and the IPA nozzle 23 are arranged in parallel.

[0036] The vacuum drying chamber 19 is arranged above the drying tank 25, a vacuum tube 18 is arranged on the side of the vacuum drying chamber 19, a single-door cover plate 20 is connected to the top of the vacuum drying chamber 19, and a sealing buckle 30 is arranged at the closing position of the single-door cover plate 20.

[0037] The hydraulic sealing cover plate assembly includes a left hydraulic column 10, the upper end of which is fixedly connected to a first hydraulic barrel 11, the upper end of which is fixedly connected to a first hydraulic rod 12, the upper end of which is fixedly connected to a sealing plate 13, and a wafer boat base 14 is provided on the sealing plate 13;

[0038] The sealing plate 13 can be inserted between the vacuum drying chamber 19 and the drying tank 25 .

[0039] The hydraulic sealing cover plate assembly includes a right hydraulic column 15 , which is fixedly connected to the right side of the drying tank 25 , and a second hydraulic barrel 16 is fixedly connected to the upper end of the right hydraulic column 15 , and a second hydraulic rod 17 is fixedly connected above the second hydraulic barrel 16 .

[0040] A roller assembly 32 is fixedly connected to the lower end of the left hydraulic column 10 . The roller assembly 32 is rotatably connected to a track 33 . Limiters 31 are provided at both ends of the track 33 .

[0041] The vacuum drying chamber 19 further includes a robot arm 34 , which is disposed above the vacuum drying chamber 19 and is used to grab the wafer boat 27 carrying the wafers 28 .

[0042] This application is to dry the wafer according to the following steps:

[0043] S1. The wafer boat 27 carrying the wafer 28 is placed in the drying tank 25 by the robot 34. At this time, the drying tank 25 is filled with deionized water through the deionized water inlet 21. The base 24 of the wafer boat is used to fix the position of the wafer boat in the tank;

[0044] S2. The robot 34 places the wafer boat 27 into the drying tank 25 and closes the top door 29 of the tank;

[0045] S3. The water in the drying tank 25 is quickly discharged through the drain port 26. At this time, the parallel nitrogen nozzles 22 and the parallel IPA nozzles 23 in the drying tank 25 simultaneously spray IPA and nitrogen, so that the tank is filled with a mixed atmosphere. The wafer 28 is quickly exposed to the space with IPA and nitrogen flow, and the water is removed by the generated Marangoni flow.

[0046] S4. When the wafer 28 is subjected to Marangoni drying in the drying tank 25, the hydraulic sealing cover plate assembly is located at the leftmost position of the drying tank 25;

[0047] S5. When the drying tank 25 is finished, the robot lifts the wafer boat 27 carrying the wafer 28 to the top of the device, at which time the door 29 of the drying tank 25 is closed;

[0048] S6. Under the action of the stopper 31, the sealing plate 13 moves along the track 33 through the roller 32 to the bottom of the vacuum drying chamber 19. At this time, under the coordinated action of the right hydraulic column 15, the hydraulic rods 12 and 17, under the action of the hydraulic barrels 11 and 16, push the sealing plate 13 of the hydraulic sealing cover plate assembly to the bottom of the vacuum drying tank 19 until it is sealed;

[0049] S7. The robot 34 places the wafer boat 27 carrying the wafer 28 on the wafer boat base 14. At this time, the robot 34 moves to the top of the device.

[0050] S8. Cover the single door cover 20 of the vacuum drying chamber 19, and buckle the cover with the cover seal buckle 30 to maintain airtightness;

[0051] S9. At this time, a vacuum device is used to pump the internal air pressure of the vacuum drying chamber 19 to 10-4 Pa through the vacuum tube 18, so that the negative pressure in the chamber is maintained in a high vacuum environment for about 5 minutes, so that all the water stains on the surface of the wafer are evaporated;

[0052] S10. After the vacuum drying is completed, the vacuum tube 18 is depressurized to restore the air pressure in the vacuum drying chamber 19 to atmospheric pressure;

[0053] S11. At this time, the cover seal buckle 30 is opened, the single door cover 20 automatically rises, and the robot 34 takes out the wafer boat 27 carrying the wafer 28, and the drying process is completed;

[0054] S12. Under the action of the hydraulic rod 12 and the hydraulic rod 17 in the hydraulic barrel 11 and the hydraulic barrel 16, the sealing plate 13 slowly descends to the initial position below the vacuum drying chamber 19;

[0055] S13. After the sealing plate 13 returns to the initial position, the left hydraulic column 10 moves to the left initial position along the track 33 through the roller 32. Under the action of the limiter 31, the left hydraulic column 10 returns to its left initial position, and a drying process cycle ends.

[0056] The working principle and beneficial effects of the above scheme:

[0057] This application adopts the classic Marangoni drying technology in the lower layer, which combines the rapid discharge of deionized water, isopropyl alcohol (IPA) and nitrogen drying to ensure the initial drying of the wafer surface. The upper layer is designed as a vacuum drying chamber to ensure its vacuum degree. By applying negative pressure to it, the evaporation of residual water on the wafer surface is significantly accelerated, thereby achieving thorough drying. The present invention abandons the traditional hot deionized water process and further prevents the accelerated oxidation of the wafer surface during the drying process. This double-layer structure design not only improves the drying efficiency, but also enhances the uniformity and reliability of the drying process, prevents color difference and damage caused by insufficient drying, and provides a better drying solution for semiconductor manufacturing processes.

[0058] Example 3

[0059] See also Figure 2 On the basis of Examples 1 and 2, the roller assembly 32 includes a first fixed plate 321, which is fixedly connected to the lower end of the left hydraulic column 10, and the first connecting rod 322 and one end of the second connecting rod 324 are rotatably connected to the first fixed plate 321. The first connecting rod 322 and the second connecting rod 324 are arranged in parallel, and the other ends of the first connecting rod 322 and the second connecting rod 324 are rotatably connected to the second fixed plate 323. An elastic member 325 is arranged between the first connecting rod 322 and the second connecting rod 324, and one end of the elastic member 325 is connected to one end of the first connecting rod 322 close to the second fixed plate 323, and the other end of the elastic member 325 is connected to one end of the second connecting rod 324 close to the first fixed plate 321.

[0060] The lower end of the second fixing plate 323 is fixedly connected to a supporting member 326;

[0061] The lower end of the second fixing plate 323 is rotatably connected to one end of a mounting rod 327, and the other end of the mounting rod 327 is rotatably connected to a roller 328, and the roller 328 is rotatably connected to the track 33;

[0062] The middle section of the mounting rod 327 is rotatably connected to one end of an elastic telescopic member 329 , and the other end of the elastic telescopic member 329 is rotatably connected to the supporting member 326 .

[0063] The working principle and beneficial effects of the above scheme:

[0064] The present application sets a roller assembly 32 at the lower end of the left hydraulic column 10 that needs to be moved. When the sealing plate 13 seals the vacuum drying groove 19, the left hydraulic column 10 is pressurized, stretching the elastic member 325 and extending the elastic telescopic member 329 until the support member 326 abuts the track 33 to ensure the stability of the seal. When the left hydraulic column 10 is pressurized, the left hydraulic column 10 will move downward when it is subjected to a certain pressure. While ensuring the sealing effect, damage to the seal between the sealing plate 13 and the vacuum drying groove 19 caused by excessive extrusion is avoided.

[0065] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A semiconductor wafer wet process drying device, characterized in that: It comprises a vacuum drying chamber (19), a drying tank (25), and a hydraulic sealing cover plate assembly, wherein the hydraulic sealing cover plate assembly is arranged between the vacuum drying chamber (19) and the drying tank (25); The drying tank (25) is provided with a deionized water inlet (21), a nitrogen nozzle (22), and an IPA nozzle (23); the top of the drying tank (25) is provided with a double door (29); the bottom of the drying tank (25) is provided with a drain outlet (26); and the bottom of the drying tank (25) is provided with a base (24); The vacuum drying chamber (19) is arranged above the drying tank (25), a vacuum tube (18) is arranged on the side of the vacuum drying chamber (19), a single-door cover plate (20) is connected to the top of the vacuum drying chamber (19), and a sealing buckle (30) is arranged at the closing position of the single-door cover plate (20).

2. A semiconductor wafer wet process drying device according to claim 1, characterized in that: The nitrogen nozzle (22) and the IPA nozzle (23) are arranged in parallel.

3. The semiconductor wafer wet process drying device according to claim 1, characterized in that: The hydraulic sealing cover plate assembly comprises a left hydraulic column (10), the upper end of the left hydraulic column (10) is fixedly connected to a first hydraulic barrel (11), the upper end of the first hydraulic barrel (11) is fixedly connected to a first hydraulic rod (12), the upper end of the first hydraulic rod (12) is fixedly connected to a sealing plate (13), and a crystal boat base (14) is arranged on the sealing plate (13); The sealing plate (13) can be inserted between the vacuum drying chamber (19) and the drying tank (25).

4. The semiconductor wafer wet process drying device according to claim 1, characterized in that: The hydraulic sealing cover plate assembly comprises a right hydraulic column (15), the right hydraulic column (15) is fixedly connected to the right side of the drying tank (25), the upper end of the right hydraulic column (15) is fixedly connected to a second hydraulic barrel (16), and the upper end of the second hydraulic barrel (16) is fixedly connected to a second hydraulic rod (17).

5. The semiconductor wafer wet process drying device according to claim 3, characterized in that: A roller assembly (32) is fixedly connected to the lower end of the left hydraulic column (10), and the roller assembly (32) is rotatably connected to a track (33). Limiters (31) are provided at both ends of the track (33).

6. The semiconductor wafer wet process drying device according to claim 1, characterized in that: It also includes a robot (34), which is arranged above the vacuum drying chamber (19) and is used to grab a wafer boat (27) carrying wafers (28).

7. The semiconductor wafer wet process drying device according to claim 5, characterized in that: The roller assembly (32) comprises a first fixed plate (321), the first fixed plate (321) is fixedly connected to the lower end of the left hydraulic column (10), a first connecting rod (322) and one end of a second connecting rod (324) are rotatably connected to the first fixed plate (321), the first connecting rod (322) and the second connecting rod (324) are arranged in parallel, the other ends of the first connecting rod (322) and the second connecting rod (324) are rotatably connected to the second fixed plate (323), an elastic member (325) is arranged between the first connecting rod (322) and the second connecting rod (324), one end of the elastic member (325) is connected to one end of the first connecting rod (322) close to the second fixed plate (323), and the other end of the elastic member (325) is connected to one end of the second connecting rod (324) close to the first fixed plate (321).

8. The semiconductor wafer wet process drying device according to claim 7, characterized in that: The lower end of the second fixing plate (323) is fixedly connected to a support member (326); The lower end of the second fixing plate (323) is rotatably connected to one end of a mounting rod (327), the other end of the mounting rod (327) is rotatably connected to a roller (328), and the roller (328) is rotatably connected to the track (33); The middle section of the mounting rod (327) is rotatably connected to one end of an elastic telescopic member (329), and the other end of the elastic telescopic member (329) is rotatably connected to the support member (326).

Images