Computer heat dissipation module liner with electric conduction, heat dissipation and buffering functions

Abstract

The utility model discloses a computer heat dissipation module liner with conductive heat dissipation buffer functions, which comprises silica gel, a silica gel protective film, a single-sided MYLAR adhesive tape and a single-sided copper foil adhesive tape III, the silica gel protective film is arranged at the lower half part of the single-sided copper foil adhesive tape III, the single-sided MYLAR adhesive tape is arranged at the upper half part of the single-sided copper foil adhesive tape III, and the silica gel protective film is arranged at the lower half part of the single-sided copper and silica gel is arranged on one side, far away from the single-side copper foil adhesive tape III, of the single-side MYLAR adhesive tape According to the utility model, the silica gel with the hardness of 70 + / -5 degrees is designed to play a strong buffer role, components are more effectively protected, the single-sided MYLAR adhesive tape has an insulation function, and the single-sided copper foil adhesive tape I, the single-sided copper foil adhesive tape II and the single-sided copper foil adhesive tape III all have conductivity, a shielding effect and a heat dissipation function in the X-Y direction and the Z direction. The single-face copper foil adhesive tape I, the single-face copper foil adhesive tape II and the single-face copper foil adhesive tape III are overlapped, so that the heat dissipation function can be enhanced, and the computer heat dissipation module liner product has good electric conduction, heat dissipation and buffering functions.

Description

Technical Field

[0001] The utility model belongs to the technical field of pads, and in particular relates to a computer heat dissipation module pad with conductive heat dissipation buffering function. Background Art

[0002] With the rapid development of electronic information technology, computers have become an indispensable part of modern social life. In order to ensure the normal use of computers, heat dissipation modules such as radiators are usually set on the heat generating components of the computers to dissipate heat. However, the heat dissipation function of existing computer heat dissipation modules is limited, and they usually lack special pads, so there is still a lot of room for improvement.

[0003] Therefore, the utility model provides a computer heat dissipation module pad with conductive heat dissipation buffer function. Utility Model Content

[0004] In order to solve the technical problems existing in the prior art, the purpose of the utility model is to provide a computer heat dissipation module pad with conductive heat dissipation buffer function.

[0005] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the utility model is:

[0006] A computer heat dissipation module pad with conductive heat dissipation buffering function comprises matching silicone, silicone protective film, single-sided MYLAR tape and single-sided copper foil tape III, wherein the silicone protective film is arranged on the lower half of the single-sided copper foil tape III, the single-sided MYLAR tape is arranged on the upper half of the single-sided copper foil tape III, and the silicone is arranged on a side of the single-sided MYLAR tape away from the single-sided copper foil tape III.

[0007] Furthermore, the silica gel is bonded together with the single-sided MYLAR tape by means of AB double-sided tape.

[0008] Furthermore, the model of the silicone is YH-BK70542U, the thickness is 0.542±0.05mm, and the hardness is 70±5°; the model of the AB double-sided tape is SH-98510AS, one side of the AB double-sided tape is a silicone surface, which is bonded to the silicone, and the other side of the AB double-sided tape is an acrylic adhesive surface, which is bonded to the single-sided MYLAR tape.

[0009] Furthermore, matching special-shaped holes are provided in the lower halves of the silicone protective film and the single-sided copper foil tape III, and the silicone protective film and the single-sided copper foil tape III are placed vertically from top to bottom and the special-shaped holes of the two completely overlap.

[0010] Furthermore, the single-sided MYLAR tape is bonded together with the upper half of the single-sided copper foil tape III by stacking the single-sided copper foil tape I and the single-sided copper foil tape II from top to bottom.

[0011] Furthermore, the model of the single-sided MYLAR tape is FTBFAP-20, the thickness is 0.02-0.025mm, and the viscosity is ≥1000g / 25mm; the models of the single-sided copper foil tape I and the single-sided copper foil tape II are both 3M 1060TC-45, the thickness is 0.045mm, the viscosity is 1300g / in, the impedance is 0.015ohms, and the shielding efficiency is 40-70dB.

[0012] Furthermore, the upper half of the single-sided copper foil tape III is provided with a concave structure 1 and a concave structure 2 on opposite sides thereof.

[0013] Furthermore, the model of the silicone protective film is S7530L-50B, the thickness is 0.085±0.003mm, and the viscosity is 20-50g / 25mm.

[0014] Furthermore, the single-sided copper foil tape III has a model of TESA 60238, a thickness of 0.045 mm, a viscosity of ≥4.5 N / cm, a surface impedance of <0.7 Ω / sq, and a vertical impedance of <0.1 Ω / in. 2 .

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The utility model discloses a computer heat dissipation module pad with conductive heat dissipation buffering function, comprising compatible silica gel, silica gel protective film, single-sided MYLAR tape and single-sided copper foil tape III, the silica gel protective film is arranged on the lower half of the single-sided copper foil tape III, the single-sided MYLAR tape is arranged on the upper half of the single-sided copper foil tape III, and the silica gel is arranged on a side of the single-sided MYLAR tape away from the single-sided copper foil tape III. The utility model plays a strong buffering role by designing silica gel with a hardness of 70±5°, and more effectively protects components. The silica gel and the single-sided MYLAR tape are conveniently connected together by designing AB double-sided adhesive tape. The single-sided MYLAR tape has an insulating function and is printed with black ink on the surface, which is consistent with the surface effect of the single-sided copper foil tape III. The single-sided copper foil tape I, the single-sided copper foil tape II, and the single-sided copper foil tape III all have conductive properties in the XY direction and the Z direction, shielding effect and heat dissipation function. The three-layer superposition of the single-sided copper foil tape I, the single-sided copper foil tape II, and the single-sided copper foil tape III can enhance the heat dissipation function, so that the computer heat dissipation module pad product has a good conductive heat dissipation buffer function. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0019] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0020] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0021] like Figure 1-2 As shown, a computer heat dissipation module gasket with conductive heat dissipation buffering function includes compatible silica gel 1, AB double-sided adhesive tape 2, silica gel protective film 3, single-sided MYLAR tape 4, single-sided copper foil tape I5, single-sided copper foil tape II6 and single-sided copper foil tape III7, wherein compatible special-shaped holes 8 are provided on the silica gel protective film 3 and the single-sided copper foil tape III7 for realizing positioning, the silica gel protective film 3 and the single-sided copper foil tape III7 are vertically placed from top to bottom and the special-shaped holes 8 of the two completely overlap, the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are completely overlapped from top to bottom and are bonded together with the upper half 71 of the single-sided copper foil tape III7 by using the adhesive surface of the single-sided copper foil tape II6, and the single-sided copper foil tape III7 is completely overlapped with the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6. An inner concave structure 1 711 and an inner concave structure 2 712 are respectively provided on opposite sides of the upper half 71 of the foil tape III7; the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are placed completely overlapping from top to bottom to form a shape that matches the upper half 71 of the single-sided copper foil tape III7; the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are placed above the single-sided copper foil tape III7; the silica gel 1 and the AB double-sided tape 2 are placed completely overlapping from top to bottom and are bonded to the single-sided MYLAR tape 4 using the acrylic adhesive surface of the AB double-sided tape 2; the shape formed by the silica gel 1 and the AB double-sided tape 2 are placed completely overlapping from top to bottom to form a square and matches the single-sided MYLAR tape 4.

[0022] The model of silica gel 1 is YH-BK70542U, black, with a thickness of 0.542±0.05mm and a hardness of 70±5°. It can play a strong buffering role and more effectively protect components. The surface of silica gel 1 does not need to be brushed with treatment agent, which is convenient for operation.

[0023] The model of AB double-sided adhesive tape 2 is SH-98510AS, transparent, and 0.1mm thick. AB double-sided adhesive tape 2 has double-sided adhesive properties, one side is a silicone surface, and the other side is an acrylic adhesive surface. The silicone surface faces upward and the acrylic adhesive surface faces downward. The adhesive properties are 1.1N / mm (silicone surface), 0.44N / mm (acrylic adhesive surface). The silicone 1 is connected to the AB double-sided adhesive tape 2 through the silicone surface of the AB double-sided adhesive tape 2, and the AB double-sided adhesive tape 2 is bonded to the single-sided MYLAR tape 4 through its acrylic adhesive surface.

[0024] The model of the silicone protective film 3 is S7530L-50B, blue, with a thickness of 0.085±0.003mm, and a viscosity of 20-50g / 25mm. The adhesive surface faces downward, and the adhesive is stable. The silicone protective film 3 uses its adhesive surface to bond with the lower half 72 of the single-sided copper foil tape III 7. When the silicone protective film 3 is removed, the surface of the single-sided copper foil tape III 7 will not be damaged. The silicone protective film 3 will not cover the silicone 1, the AB double-sided tape 2, the single-sided MYLAR tape 4, the single-sided copper foil tape I 5, and the single-sided copper foil tape II 6.

[0025] The model of single-sided MYLAR tape 4 is FTBFAP-20, black, with a thickness of 0.02-0.025mm, viscosity: ≥1000g / 25mm, adhesive side facing down, with insulation function, black ink printed on the surface, consistent with the surface effect of single-sided copper foil tape III7.

[0026] The model of single-sided copper foil tape I5 is 3M 1060TC-45, copper color, thickness of 0.045 mm, viscosity: 1300 g / in, impedance: 0.015 ohms, shielding efficiency: 40-70 dB, adhesive side facing downward.

[0027] The model of single-sided copper foil tape II 6 is 3M 1060TC-45, copper color, thickness 0.045mm, viscosity: 1300g / in, impedance: 0.015ohms, shielding efficiency: 40-70dB, adhesive side facing down.

[0028] Single-sided copper foil tape I5 and single-sided copper foil tape II6 use single-sided copper foil tape, which has conductivity in XY direction and Z direction, shielding effect and heat dissipation function.

[0029] The model of single-sided copper foil tape III7 is TESA 60238, one side is black and the other side is copper, thickness is 0.045mm, viscosity: ≥4.5N / cm, surface impedance: <0.7Ω / sq, vertical impedance: <0.1Ω / in 2 , the adhesive surface faces downward, and it has conductive properties in the XY and Z directions, shielding effects, and heat dissipation functions.

[0030] The stacking of three layers of single-sided copper foil tape Ⅰ5, single-sided copper foil tape Ⅱ6 and single-sided copper foil tape Ⅲ7 can enhance the heat dissipation function.

[0031] A method for using a computer heat dissipation module pad with conductive heat dissipation buffering function comprises the following steps:

[0032] The computer cooling module gasket is placed on the release film through the adhesiveness of the silicone protective film 3 and the single-sided copper foil tape III 7;

[0033] When in use, take the ears 73 at both ends of the single-sided copper foil tape III7 and remove the computer cooling module pad as a whole from the release film; then use the silicone protective film 3 and the special-shaped holes 8 on the single-sided copper foil tape III7 for positioning, and use the adhesion of the silicone protective film 3 and the single-sided copper foil tape III7 to attach the computer cooling module pad as a whole to the corresponding position; finally, remove the silicone protective film 3.

[0034] Example 1

[0035] like Figure 1-2 As shown, a computer heat dissipation module gasket with conductive heat dissipation buffering function includes compatible silica gel 1, AB double-sided adhesive tape 2, silica gel protective film 3, single-sided MYLAR tape 4, single-sided copper foil tape I5, single-sided copper foil tape II6 and single-sided copper foil tape III7, wherein compatible special-shaped holes 8 are provided on the silica gel protective film 3 and the single-sided copper foil tape III7 for realizing positioning, the silica gel protective film 3 and the single-sided copper foil tape III7 are vertically placed from top to bottom and the special-shaped holes 8 of the two completely overlap, the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are completely overlapped from top to bottom and are bonded together with the upper half 71 of the single-sided copper foil tape III7 by using the adhesive surface of the single-sided copper foil tape II6, and the single-sided copper foil tape III7 is completely overlapped with the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6. An inner concave structure 1 711 and an inner concave structure 2 712 are respectively provided on opposite sides of the upper half 71 of the foil tape III7; the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are placed completely overlapping from top to bottom to form a shape that matches the upper half 71 of the single-sided copper foil tape III7; the single-sided MYLAR tape 4, the single-sided copper foil tape I5 and the single-sided copper foil tape II6 are placed above the single-sided copper foil tape III7; the silica gel 1 and the AB double-sided tape 2 are placed completely overlapping from top to bottom and are bonded to the single-sided MYLAR tape 4 using the acrylic adhesive surface of the AB double-sided tape 2; the shape formed by the silica gel 1 and the AB double-sided tape 2 are placed completely overlapping from top to bottom to form a square and matches the single-sided MYLAR tape 4.

[0036] The model of silica gel 1 is YH-BK70542U, black, 0.542mm thick, 70° hardness, which can play a strong buffering role and more effectively protect components. The surface of silica gel 1 does not need to be brushed with treatment agent, which is convenient for operation.

[0037] The model of AB double-sided adhesive tape 2 is SH-98510AS, transparent, and 0.1mm thick. AB double-sided adhesive tape 2 has double-sided adhesive properties, one side is a silicone surface, and the other side is an acrylic adhesive surface. The silicone surface faces upward and the acrylic adhesive surface faces downward. The adhesive properties are 1.1N / mm (silicone surface), 0.44N / mm (acrylic adhesive surface). The silicone 1 is connected to the AB double-sided adhesive tape 2 through the silicone surface of the AB double-sided adhesive tape 2, and the AB double-sided adhesive tape 2 is bonded to the single-sided MYLAR tape 4 through its acrylic adhesive surface.

[0038] The model of the silicone protective film 3 is S7530L-50B, blue, 0.085mm thick, 20g / 25mm stickiness, the adhesive surface faces downward, the stickiness is stable, the silicone protective film 3 uses its adhesive surface to bond with the lower half 72 of the single-sided copper foil tape III 7, and the surface of the single-sided copper foil tape III 7 will not be damaged when the silicone protective film 3 is removed. The silicone protective film 3 will not cover the silicone 1, AB double-sided tape 2, single-sided MYLAR tape 4, single-sided copper foil tape I 5, and single-sided copper foil tape II 6.

[0039] The model of single-sided MYLAR tape 4 is FTBFAP-20, black, 0.02mm thick, viscosity: ≥1000g / 25mm, adhesive side facing down, with insulation function, black ink printed on the surface, consistent with the surface effect of single-sided copper foil tape III7.

[0040] The model of single-sided copper foil tape I5 is 3M 1060TC-45, copper color, thickness of 0.045 mm, viscosity: 1300 g / in, impedance: 0.015 ohms, shielding efficiency: 40 dB, adhesive side facing downward.

[0041] The model of single-sided copper foil tape II 6 is 3M 1060TC-45, copper color, thickness 0.045mm, viscosity: 1300g / in, impedance: 0.015ohms, shielding efficiency: 40dB, adhesive side facing down.

[0042] Single-sided copper foil tape I5 and single-sided copper foil tape II6 use single-sided copper foil tape, which has conductivity in XY direction and Z direction, shielding effect and heat dissipation function.

[0043] The model of single-sided copper foil tape III7 is TESA 60238, one side is black and the other side is copper, thickness is 0.045mm, viscosity: ≥4.5N / cm, surface impedance: <0.7Ω / sq, vertical impedance: <0.1Ω / in 2 , the adhesive surface faces downward, and it has conductive properties in the XY and Z directions, shielding effects, and heat dissipation functions.

[0044] The stacking of three layers of single-sided copper foil tape I5, single-sided copper foil tape II6 and single-sided copper foil tape III7 can enhance the heat dissipation function.

[0045] A method for using a computer heat dissipation module pad with conductive heat dissipation buffering function comprises the following steps:

[0046] The computer cooling module gasket is placed on the release film through the adhesiveness of the silicone protective film 3 and the single-sided copper foil tape III 7;

[0047] When in use, take the ears 73 at both ends of the single-sided copper foil tape III7 and remove the computer cooling module pad as a whole from the release film; then use the silicone protective film 3 and the special-shaped holes 8 on the single-sided copper foil tape III7 for positioning, and use the adhesion of the silicone protective film 3 and the single-sided copper foil tape III7 to attach the computer cooling module pad as a whole to the corresponding position; finally, remove the silicone protective film 3.

[0048] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0049] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A computer heat dissipation module pad with conductive heat dissipation buffer function, characterized in that: It includes matching silicone, silicone protective film, single-sided MYLAR tape and single-sided copper foil tape III, the silicone protective film is arranged on the lower half of the single-sided copper foil tape III, the single-sided MYLAR tape is arranged on the upper half of the single-sided copper foil tape III, and the silicone is arranged on the side of the single-sided MYLAR tape away from the single-sided copper foil tape III.

2. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The silica gel is bonded together with the single-sided MYLAR tape by means of AB double-sided adhesive tape.

3. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 2, characterized in that: The model of the silicone is YH-BK70542U, the thickness is 0.542±0.05mm, and the hardness is 70±5°; the model of the AB double-sided tape is SH-98510AS, one side of the AB double-sided tape is a silicone surface, which is bonded to the silicone, and the other side opposite to the AB double-sided tape is an acrylic adhesive surface, which is bonded to the single-sided MYLAR tape.

4. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The lower halves of the silicone protective film and the single-sided copper foil tape III are provided with matching special-shaped holes, and the silicone protective film and the single-sided copper foil tape III are placed vertically from top to bottom and the special-shaped holes of the two completely overlap.

5. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The single-sided MYLAR tape is bonded together with the upper half of the single-sided copper foil tape III by stacking the single-sided copper foil tape I and the single-sided copper foil tape II from top to bottom.

6. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 5, characterized in that: The model of the single-sided MYLAR tape is FTBFAP-20, the thickness is 0.02-0.025mm, and the viscosity is ≥1000g / 25mm; the models of the single-sided copper foil tape I and the single-sided copper foil tape II are both 3M 1060TC-45, the thickness is 0.045mm, the viscosity is 1300g / in, the impedance is 0.015ohms, and the shielding efficiency is 40-70dB.

7. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The upper half of the single-sided copper foil tape III is provided with a concave structure 1 and a concave structure 2 on opposite sides thereof.

8. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The model of the silicone protective film is S7530L-50B, the thickness is 0.085±0.003mm, and the viscosity is 20-50g / 25mm.

9. The computer heat dissipation module pad with conductive heat dissipation buffer function according to claim 1, characterized in that: The single-sided copper foil tape III has a model of TESA 60238, a thickness of 0.045 mm, a viscosity of ≥4.5 N / cm, a surface impedance of <0.7 Ω / sq, and a vertical impedance of <0.1 Ω / in. 2 .

Images