Vehicle-mounted intelligent fusion host device

Abstract

The utility model provides a vehicle-mounted intelligent fusion host device, relates to the field of vehicle-mounted host architectures for trains, and solves the problem that the existing vehicle-mounted host architecture applying a vertically-inserted processor board card has limitations on heat dissipation, compatibility and hardware type selection. The device comprises a case, a heat dissipation plate and a plurality of processor units, a fusion host backboard is arranged in the case, and a horizontal insertion port is formed in the fusion host backboard; the plurality of processor units are sequentially arranged in the length direction of the case and are in plug-in connection with the fusion host backboard in a transverse plug-in manner, and the upper surface of each processor unit in the horizontal direction is a corresponding hot surface; the heat dissipation plate forms an upper surface enclosure of the case, and the hot surface of each processor unit is connected with the lower surface of the heat dissipation plate; according to the utility model, the high efficiency of thermal management and the compatibility and expansibility of hardware architecture are comprehensively considered as an optimal hardware basis, and support is provided for algorithm execution and energy management.

Description

Technical Field

[0001] The utility model relates to the field of vehicle-mounted host architecture for trains, and in particular to a vehicle-mounted intelligent fusion host device. Background Art

[0002] In the current design of on-board computing platforms for trains, especially for applications such as advanced driver assistance systems (ADAS), autonomous vehicle control systems, vehicle detection and monitoring intelligent identification systems, and on-board infotainment systems, the demand for processor performance is growing. Traditional on-board host designs often face severe thermal management challenges and hardware architecture limitations, which are directly related to system stability, passenger experience, and even driving safety, and have become technical issues that need to be solved urgently.

[0003] In the existing vehicle-mounted host design, the processor boards are inserted vertically and side by side. Although this layout has a certain degree of flexibility in space utilization, it leads to serious heat concentration problems. Due to the small distance between the boards and the limited internal space of the host, it is difficult to effectively dissipate the heat. In order to solve the heat dissipation problem, multiple sets of high-power fans have to be added to the upper and lower surfaces of the host. Although this has alleviated the high temperature condition to a certain extent, the resulting noise pollution has seriously affected the comfort of the car and the riding experience of passengers. Especially when taking the subway in a quiet environment at night, the noise pollution is more obvious, and complaints to the subway company due to noise problems are often made.

[0004] In addition, the existing vehicle host backplane design is mainly oriented to x86 architecture processing chips. This design limitation makes the system lack flexibility in hardware selection. Especially under the current technological trend, ARM architecture processors have attracted widespread attention due to their high energy efficiency and suitability for mobile devices and specific computing tasks (such as image recognition and deep learning algorithms). However, due to the limitations of the backplane interface, x86 architecture and ARM architecture chips cannot be mixed in the same system, limiting the system's potential in processing power, energy efficiency and algorithm optimization.

[0005] When executing complex algorithms such as image recognition and deep learning, the traditional x86 architecture processing chips used in vehicle hosts often face huge resource pressure. Such algorithms are highly dependent on large-scale parallel computing, resulting in extremely high processor resource utilization, slow system response speed, and even frequent pseudo-death states or unexpected automatic shutdowns. Such failures not only affect the normal data collection and processing process, but may also directly lead to the loss of train detection data and even cause train suspension, seriously threatening driving safety and the accuracy of intelligent driving decisions.

[0006] In view of the above technical bottlenecks, there is an urgent need for an innovative vehicle host design solution that can fundamentally improve the heat dissipation mechanism and reduce noise pollution, while breaking the limitations of a single architecture, achieving effective integration of heterogeneous computing resources, and improving the system's ability to process complex algorithms and overall stability. Utility Model Content

[0007] Based on the current status of the background technology, the purpose of this utility model is to solve the limitations of the existing vehicle-mounted host architecture using vertical plug-in processor boards in terms of heat dissipation, compatibility and hardware selection, and therefore proposes a vehicle-mounted intelligent fusion host device. This utility model changes the processor board from a vertical plug-in layout to a horizontal plug-in layout, and comprehensively considers the efficiency of thermal management, the compatibility and scalability of the hardware architecture, as the optimal hardware foundation, to provide support for algorithm execution and energy management; this utility model can ensure driving safety while providing a more intelligent and comfortable riding experience.

[0008] The utility model adopts the following technical solutions to achieve the purpose:

[0009] A vehicle-mounted intelligent fusion host device, the device comprising a chassis, a heat sink and multiple processor units; a fusion host backplane is arranged inside the chassis, and a horizontal plug interface is provided on the fusion host backplane; multiple processor units are arranged in sequence along the length direction of the chassis and are plug-connected to the fusion host backplane in a horizontal plug-in manner, and the upper surface of each processor unit in the horizontal direction is a corresponding thermal surface; the heat sink constitutes the upper surface enclosure of the chassis, and the thermal surface of each processor unit is connected to the lower surface of the heat sink.

[0010] Specifically, the device also includes a power supply unit, a storage unit, a DI / DO unit, a TRDP / MVB board, an AP board and a switch board; the power supply unit, the storage unit, the DI / DO unit, the TRDP / MVB board, the AP board and the switch board are all plug-in connected to the fusion host backplane in a horizontal plug-in manner.

[0011] Specifically, the power supply unit is used to connect to an external 110VDC power supply to provide power to each module unit in the fusion host, and the TRDP / MVB board is used to connect the external TRDP signal line and the external MVB signal line; each of the processor units has a network port, and the network port of the switching board and each of the processor units can be used to connect to the vehicle-mounted detection equipment.

[0012] Furthermore, a first high-speed signal transmission line and a second high-speed signal transmission line are provided on the fusion host backplane; the first high-speed signal transmission line matches the pin definition of the x86 processing chip, and the second high-speed signal transmission line matches the pin definition of the ARM processing chip; an interface bridge chip is also provided on the fusion host backplane, and the interface bridge chip is respectively connected to the first high-speed signal transmission line and the second high-speed signal transmission line.

[0013] Furthermore, each of the processor units includes a processing chip carrier; the processing chip carrier carries the x86 processing chip or the ARM processing chip; and the upper surfaces of the x86 processing chip and the ARM processing chip in the horizontal direction are both corresponding thermal surfaces.

[0014] Preferably, there are multiple heat sinks, the number of the heat sinks is the same as the number of the processor units, and the positions of the multiple heat sinks correspond one-to-one with the positions of the multiple processor units in the vertical direction; the upper surface of the heat sink is a fin structure, and the lower surface of the heat sink is connected to the thermal surface of the x86 processing chip or the ARM processing chip through a copper heat pipe.

[0015] Preferably, a plurality of variable frequency fans are also arranged inside the chassis, the number of the variable frequency fans is the same as the number of the processor units, and the positions of the plurality of variable frequency fans correspond to the positions of the plurality of heat sinks; each heat sink is provided with a mounting port corresponding to the corresponding variable frequency fan, and each of the variable frequency fans has a horizontal blowing direction.

[0016] Specifically, the number of the processor units is 3, namely the first processor unit, the second processor unit and the third processor unit; the first processor unit, the second processor unit and the third processor unit are arranged in sequence along the length direction of the chassis and are plugged in and connected to the fusion host backplane in a horizontal manner; the panel where the external plug-in interface of each processor unit is located constitutes the front panel of the chassis.

[0017] Preferably, the power supply unit is located below the first processor unit, the storage unit and the DI / DO unit are located in sequence below the second processor unit, and the TRDP / MVB board, the AP board and the switch board are located in sequence below the third processor unit; the panel where the external interfaces of the power supply unit, the storage unit, the DI / DO unit, the TRDP / MVB board, the AP board and the switch board are located constitutes the front panel of the chassis.

[0018] Preferably, the chassis is a 3U chassis; handles are respectively provided at both ends of the front panel of the chassis along the length direction.

[0019] In summary, due to the adoption of this technical solution, the beneficial effects of the utility model are as follows:

[0020] 1. Heterogeneous integration and enhanced scalability: The utility model can achieve full compatibility and flexible mixed insertion of multiple processors such as x86 architecture, ARM architecture and even domestic chips through the backplane high-speed routing impedance matching design, breaking the traditional architecture barriers, broadening the scope of application scenarios, and meeting the diverse vehicle computing needs.

[0021] 2. Efficient heat dissipation mechanism: This utility model innovates the layout of the processor board from vertical plug-in to horizontal plug-in. The thermal interface of each processor can directly fit the heat dissipation device on the upper surface of the host. Combined with the copper tube heat conduction technology, it ensures the rapid conduction and uniform distribution of heat energy. This design not only effectively avoids internal heat accumulation, but also uses a hidden variable frequency fan to quickly dissipate the heat of the host, while reducing operating noise and improving the passenger's riding experience.

[0022] 3. Compact design and space optimization: The 3U chassis space optimization layout makes it possible to control the size of the fusion host while improving computing power and integrating hardware support for advanced processing modules. It combines high performance with miniaturization, saves precious installation space in the car, and meets the high standards of integration and space utilization of modern trains.

[0023] 4. Improved system stability and energy efficiency: Through the optimization of the above heat dissipation solution, the utility model can effectively solve the heat dissipation problem when the high-power processor is running, significantly reduce the risk of system failure or automatic shutdown due to overheating, ensure the continuity and integrity of train detection data, and improve driving safety. At the same time, the flexible configuration of heterogeneous computing resources promotes the improvement of energy efficiency and provides a solid foundation for long-term stable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of the intelligent fusion host device of the utility model;

[0025] Figure 2 It is a top view of the internal processor structure of the intelligent fusion host device of the utility model;

[0026] Figure 3 It is a schematic front view of the layout structure of the host in the prior art.

[0027] The meanings of the symbols in the accompanying drawings are as follows:

[0028] 1-chassis, 11-handle, 2-heat sink, 21-variable frequency fan, 3-fusion host backplane, 31-conventional backplane, 41-first processor unit, 42-second processor unit, 43-third processor unit, 44-processing chip carrier, 5-power supply unit, 6-storage unit, 7-DI / DO unit, 8-TRDP / MVB board, 9-AP board, 10-switch board. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Generally, the components of the embodiment of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1

[0032] like Figure 1 and Figure 2 As shown, a vehicle-mounted intelligent fusion host device includes a chassis 1, a heat sink 2 and multiple processor units; a fusion host backplane 3 is arranged inside the chassis 1, and a horizontal plug interface is arranged on the fusion host backplane 3; multiple processor units are arranged in sequence along the length direction of the chassis 1 and are plug-connected to the fusion host backplane 3 in a horizontal plug-in manner, and the upper surface of each processor unit in the horizontal direction is a corresponding thermal surface; the heat sink 2 constitutes the upper surface enclosure of the chassis 1, and the thermal surface of each processor unit is connected to the lower surface of the heat sink 2.

[0033] In order to improve the components of the device, in this embodiment, the device also includes a power supply unit 5, a storage unit 6, a DI / DO unit 7, a TRDP / MVB board 8, an AP board 9 and a switch board 10; the power supply unit 5, the storage unit 6, the DI / DO unit 7, the TRDP / MVB board 8, the AP board 9 and the switch board 10 are all plug-in connected to the fusion host backplane 3 in a horizontal plug-in manner.

[0034] The power supply unit 5 can be used to connect an external 110VDC power supply to power each module unit; the storage unit 6 is used to store the data of each module unit. The DI / DO unit 7 is a digital input / output unit, which can be freely combined and expanded according to the actual functions required by the train to realize the monitoring and control of the on-board functional data.

[0035] The TRDP / MVB board 8 is connected with an external TRDP signal line and an external MVB signal line, which is used to be compatible with the input of these two types of signals; the TRDP signal comes from the train communication network real-time data protocol, which is specially designed for real-time data exchange between various subsystems in the train control system; the MVB signal comes from the multi-function vehicle bus, which is an important part of the train communication network and is widely used in rail transit vehicles to realize communication and data exchange between different devices inside the vehicle.

[0036] The AP board 9 refers to a board integrated or dedicated to providing wireless network access services, which can convert wired networks into wireless signals and provide network connections for surrounding wireless devices. It is a wireless access point related board. In addition, each processor unit has a network port, and the switch board 10 and the network port of each processor unit can be used to connect to the on-board detection equipment. The on-board detection equipment can be a series of devices integrated in the train control system for real-time monitoring, fault diagnosis and data analysis; these devices are connected to the processor unit and the switch board to achieve comprehensive monitoring of the train operation status to ensure driving safety and system reliability.

[0037] In this embodiment, in order to enable the intelligent fusion host device to support the mixed plug-in function of the x86 architecture processing chip and the ARM architecture processing chip, the fusion host backplane 3 is designed with compatibility layout, thereby expanding the application scenarios of the fusion host.

[0038] In the fusion host backplane 3, a first high-speed signal transmission line and a second high-speed signal transmission line are designed. Both types of signal transmission lines can cover PCIe, USB and Ethernet, etc.; and the first high-speed signal transmission line matches the pin definition of the x86 processing chip, and the second high-speed signal transmission line matches the pin definition of the ARM processing chip. The matching content may include precise layout structure, line length, etc., so as to ensure the signal integrity and electrical characteristics compatibility of processing chips with different architectures.

[0039] At the same time, better wiring technology and high-quality materials can be used, such as low-loss PCB materials, differential pair signal line design, termination resistor matching, decoupling capacitor arrangement, etc., to reduce signal attenuation, reflection and crosstalk, and ensure the quality of high-speed signals in long-distance transmission, which is crucial for x86 and ARM processing chips that support high-frequency operations at the same time.

[0040] In addition, an interface bridge chip is also provided on the fusion host backplane 3, and the interface bridge chip is respectively connected to the first high-speed signal transmission line and the second high-speed signal transmission line, so as to realize the necessary communication protocol conversion between the processing chips of the two architectures of x86 and ARM, such as PCIe-to-PCIe bridging, bus arbitration logic, etc., to ensure efficient data exchange and resource sharing between heterogeneous processors.

[0041] Therefore, combined with the characteristics of the above-mentioned fusion host backplane 3, such as Figure 2 As shown, the processor units in this embodiment include a processing chip carrier 44; the processing chip carrier 44 is equipped with an x86 processing chip or an ARM processing chip; the upper surfaces of the x86 processing chip and the ARM processing chip in the horizontal direction are both corresponding thermal surfaces, and the corresponding heat dissipation effect is achieved by connecting the heat sink 2.

[0042] Example 2

[0043] Based on Example 1, this example describes the heat dissipation of the vehicle-mounted intelligent fusion host device. Figure 3 , which represents a host computer connected by conventional vertical plug-in method in the prior art. The host computer sequentially arranges a power supply unit 5, a storage unit 6, three vertical processor units, and an AP board 9 along the length direction of its chassis 1; these functional units are plugged into a conventional backplane 31 inside the chassis 1. In the prior art host computer, the vertical side surface of each processor unit is a corresponding thermal surface, and the structure is also a structure in which a corresponding processing chip is mounted on a processing chip carrier 44.

[0044] In the existing method, a conventional fan or variable frequency fan 21 is directly set on the top plate of the chassis 1, and its blowing direction is vertical to achieve heat dissipation. Since the three processing chips with the largest heat are in the middle of the chassis 1 and are closely arranged, the hot surfaces overlap densely, and there is no targeted heat dissipation measure, a large amount of internal heat will accumulate, thereby affecting the performance of the host.

[0045] like Figure 1 As shown, based on the device structure of Example 1, this embodiment is equipped with the same number of heat sinks 2 for multiple processor units arranged in sequence along the length direction of the chassis 1 and connected in a horizontal plug-in manner. All heat sinks 2 directly form the upper surface enclosure of the chassis 1, and the positions of the multiple heat sinks 2 correspond one by one to the positions of the multiple processor units in the vertical direction. This structural design allows the thermal surface of the processing chip of this embodiment to be in close contact with the upper heat sink 2, while the lower surface of the heat sink 2 is connected to the thermal surface of the x86 processing chip or the ARM processing chip through a copper heat pipe, and the upper surface of the heat sink 2 is designed as a fin-type structure, so that the heat dissipation effect is greatly enhanced, which can effectively avoid the accumulation of heat inside the chassis 1.

[0046] In this embodiment, a plurality of variable frequency fans 21 are further arranged inside the chassis 1, the number of the variable frequency fans 21 is the same as the number of the processor units, and the positions of the plurality of variable frequency fans 21 correspond to the positions of the plurality of heat sinks 2. Each heat sink 2 is provided with a mounting port corresponding to the corresponding variable frequency fan 21. Different from the prior art, each variable frequency fan 21 in this embodiment has a horizontal blowing direction. This structural feature enables the heat inside and on the surface of the chassis 1 to be uniformly and quickly dissipated under the action of blowing, and the variable frequency fans 21 are hidden in the chassis 1, and the external structure is neat and beautiful. Due to the comprehensive improvement of the heat dissipation performance, the power of the variable frequency fans 21 can be saved and become relatively quiet, thereby reducing the noise pollution during use.

[0047] Example 3

[0048] Based on Example 2, this example provides a preferred structural configuration solution for a vehicle-mounted intelligent fusion host device. Figure 1 As shown, the number of processor units is determined to be 3, namely, the first processor unit 41, the second processor unit 42 and the third processor unit 43. The first processor unit 41, the second processor unit 42 and the third processor unit 43 are arranged in sequence along the length direction of the chassis 1 and are plugged and connected to the fusion host backplane 3 in a horizontal plug-in manner; the panel where the external plug-in interface of each processor unit is located constitutes the front panel of the chassis 1.

[0049] The preferred arrangement of the remaining functional modules is also as follows Figure 1 As shown, the power supply unit 5 is located below the first processor unit 41; the storage unit 6 and the DI / DO unit 7 are located below the second processor unit 42 in sequence; the TRDP / MVB board 8, the AP board 9 and the switch board 10 are located below the third processor unit 43 in sequence.

[0050] The panels where the external plug-in interfaces of the power supply unit 5, storage unit 6, DI / DO unit 7, TRDP / MVB board 8, AP board 9 and switch board 10 are located constitute the front panel of the chassis 1. In addition, the chassis 1 of the present embodiment is a 3U chassis, which is a standard rack-mounted chassis, widely used in industrial control, server deployment, network equipment and other electronic systems that need to be installed in a cabinet, and is therefore also suitable for the on-board application of the present embodiment in a train. Handles 11 are respectively provided at both ends of the front panel of the chassis 1 along the length direction for easy picking and movement; the application of the 3U chassis makes the fusion host more miniaturized and saves the installation space in the vehicle.

[0051] To sum up, the vehicle-mounted intelligent fusion host device of the utility model, through innovative heat dissipation structure design, flexible heterogeneous processor compatibility solution and compact space layout strategy, not only solves the key problems such as heat dissipation, noise, and architecture compatibility in the existing technology, but also significantly improves the performance and reliability of the vehicle-mounted computing platform, providing strong technical support for the development of intelligent transportation systems.

Claims

1. A vehicle-mounted intelligent fusion host device, characterized in that: The device comprises a chassis (1), a heat sink (2) and a plurality of processor units; a fusion host backplane (3) is arranged inside the chassis (1), and a horizontal plug interface is arranged on the fusion host backplane (3); the plurality of processor units are arranged in sequence along the length direction of the chassis (1) and are plug-connected to the fusion host backplane (3) in a horizontal plug-in manner, and the upper surface of each processor unit in the horizontal direction is a corresponding thermal surface; the heat sink (2) constitutes the upper surface enclosure of the chassis (1), and the thermal surface of each processor unit is connected to the lower surface of the heat sink (2).

2. The vehicle-mounted intelligent fusion host device according to claim 1, characterized in that: The device also includes a power supply unit (5), a storage unit (6), a DI / DO unit (7), a TRDP / MVB board (8), an AP board (9) and a switch board (10); the power supply unit (5), the storage unit (6), the DI / DO unit (7), the TRDP / MVB board (8), the AP board (9) and the switch board (10) are all plug-connected to the fusion host backplane (3) in a horizontal plug-in manner.

3. The vehicle-mounted intelligent fusion host device according to claim 1, characterized in that: The fusion host backplane (3) is provided with a first high-speed signal transmission line and a second high-speed signal transmission line; the first high-speed signal transmission line matches the pin definition of the x86 processing chip, and the second high-speed signal transmission line matches the pin definition of the ARM processing chip; the fusion host backplane (3) is also provided with an interface bridge chip, and the interface bridge chip is respectively connected to the first high-speed signal transmission line and the second high-speed signal transmission line.

4. The vehicle-mounted intelligent fusion host device according to claim 3, characterized in that: Each of the processor units comprises a processing chip carrier (44); the processing chip carrier (44) carries the x86 processing chip or the ARM processing chip; the upper surfaces of the x86 processing chip and the ARM processing chip in the horizontal direction are both corresponding thermal surfaces.

5. The vehicle-mounted intelligent fusion host device according to claim 4, characterized in that: There are a plurality of heat sinks (2), the number of the heat sinks (2) is the same as the number of the processor units, and the positions of the plurality of heat sinks (2) correspond one-to-one with the positions of the plurality of processor units in the vertical direction; the upper surface of the heat sink (2) is a fin-type structure, and the lower surface of the heat sink (2) is connected to the thermal surface of the x86 processing chip or the ARM processing chip via a copper heat pipe.

6. The vehicle-mounted intelligent fusion host device according to claim 5, characterized in that: A plurality of variable frequency fans (21) are also arranged inside the chassis (1); the number of the variable frequency fans (21) is the same as the number of the processor units, and the positions of the plurality of variable frequency fans (21) correspond to the positions of the plurality of heat sinks (2); each heat sink (2) is provided with a mounting opening corresponding to the corresponding variable frequency fan (21), and each variable frequency fan (21) has a horizontal blowing direction.

7. The vehicle-mounted intelligent fusion host device according to claim 2, characterized in that: The number of the processor units is three, namely a first processor unit (41), a second processor unit (42) and a third processor unit (43); the first processor unit (41), the second processor unit (42) and the third processor unit (43) are arranged in sequence along the length direction of the chassis (1) and are plugged and connected to the fusion host backplane (3) in a horizontal plug-in manner; the panel where the external plug-in interface of each processor unit is located constitutes the front panel of the chassis (1).

8. The vehicle-mounted intelligent fusion host device according to claim 7, characterized in that: The power supply unit (5) is located below the first processor unit (41), the storage unit (6) and the DI / DO unit (7) are located below the second processor unit (42) in sequence, and the TRDP / MVB board (8), the AP board (9) and the switch board (10) are located below the third processor unit (43) in sequence; the panels where the external plug-in interfaces of the power supply unit (5), the storage unit (6), the DI / DO unit (7), the TRDP / MVB board (8), the AP board (9) and the switch board (10) are located constitute the front panel of the chassis (1).

9. The vehicle-mounted intelligent fusion host device according to claim 8, characterized in that: The chassis (1) is a 3U chassis; handles (11) are respectively provided at both ends of the front panel of the chassis (1) in the length direction.

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