High-brightness COB screen with novel heat dissipation structure

Abstract

A high-brightness COB screen with a novel heat dissipation structure comprises a circuit substrate, LED light-emitting bodies, a heat conduction part, a light guide cover and a heat dissipation part, and the LED light-emitting bodies are distributed in an array mode and welded to the circuit substrate; the heat conduction parts are distributed on the circuit substrate in an array mode, wrap the LED light-emitting bodies and are made of transparent heat conduction materials. The light guide covers are distributed in an array mode and cover the heat conduction part, the ends, away from the heat conduction part, of the light guide covers are in a prismatic table shape, and the light guide covers are made of transparent heat conduction materials. The heat dissipation part is filled between the light guide covers and is connected with the circuit substrate. According to the utility model, heat directly generated by the LED luminous body is transferred to the heat dissipation part by utilizing the heat conduction part and the light guide cover, and is dissipated by the heat dissipation part; and heat generated by the circuit substrate is directly transmitted to the heat dissipation part for heat dissipation, so that the heat dissipation performance can be greatly improved through the structure. In addition, the lens structure formed by the heat conduction part and the light guide cover can change the transmission path of light rays, so that the moire phenomenon can be eliminated under the condition that the brightness is not lost.

Description

Technical Field

[0001] The utility model relates to the field of display screens, in particular to a high-brightness COB screen with a novel heat dissipation structure. Background Art

[0002] COB is a display screen manufacturing process that directly solders LED luminous bodies on PCB boards. Currently, most COBs are made by directly covering the entire PCB with transparent resin and other materials after soldering the LED luminous bodies to protect the LED luminous bodies and their gold wires from external damage. However, transparent resin has poor heat dissipation capacity and is not conducive to LED light emission. Temperature has an impact on the luminous efficiency of LED luminous bodies. Therefore, the existing practice of covering the entire PCB board with transparent resin is likely to affect the luminous efficiency of the LED display screen, and may even affect the displayed color and cause color difference problems.

[0003] On the other hand, since the LED light emitters are arranged in an array, they have a certain periodicity. When the camera equipment shoots the LED screen, obvious moiré phenomenon often occurs. However, the moiré phenomenon is not the information required by the captured image itself, so it needs to be eliminated. In the prior art, a whole diffuser is generally installed in front of the LED screen, and the diffuser is used for atomization to reduce the sharpness, thereby changing the spatial frequency to eliminate the moiré phenomenon. Although this technology can eliminate moiré, it will reduce the brightness of the screen.

[0004] Therefore, the existing LED display screens have room for improvement in terms of color difference, color uniformity, brightness, heat dissipation, etc. Utility Model Content

[0005] The utility model aims to solve the above problems and provide a high-brightness COB screen with a novel heat dissipation structure which is conducive to heat dissipation and can eliminate moiré patterns without reducing brightness.

[0006] In order to solve the above problems, the utility model provides a high-brightness COB screen with a new heat dissipation structure, characterized in that it includes a circuit substrate, LED illuminants, a heat-conducting part, a light guide cover and a heat-dissipating part, the LED illuminants are distributed in an array and welded on the circuit substrate; the heat-conducting part is distributed in an array on the circuit substrate and wraps the LED illuminants therein, and the heat-conducting part is made of a transparent heat-conducting material; the light guide cover is distributed in an array and is covered on the heat-conducting part, and its end away from the heat-conducting part is in a prism shape, and the light guide cover is made of a transparent heat-conducting material; the heat-dissipating part is filled between the light guide covers and connected to the circuit substrate.

[0007] Furthermore, the heat conducting portion and the light guide cover have different refractive indices.

[0008] Furthermore, the refractive index of the heat dissipation portion is different from the refractive index of the light guide cover.

[0009] Furthermore, the heat dissipation part is made of a thermally conductive material with conductive properties.

[0010] Furthermore, the end of the heat conducting part opposite to the circuit substrate forms a convex lens having a first curved surface, and the end of the light guide cover facing the heat conducting part forms a concave lens having a second curved surface; the first curved surface is bonded to the second curved surface.

[0011] Furthermore, the focal points of the convex lens and the concave lens are located in the same plane, and the plane is parallel to the surface of the circuit substrate.

[0012] Furthermore, a surface of the heat dissipation portion is flush with a surface of the light guide cover.

[0013] The beneficial contribution of the utility model is that it effectively solves the above-mentioned problems. The high-contrast COB screen of the utility model is provided with a heat-conducting part, a light-guiding cover and a heat-dissipating part on the LED light-emitting body, and the heat-conducting part and the light-guiding cover are used to transfer the heat directly generated by the LED light-emitting body to the heat-dissipating part, and the heat generated by the circuit substrate is directly transferred to the heat-dissipating part for heat dissipation. Through this structure, the heat dissipation performance can be greatly improved, so that the luminous efficiency of the LED light-emitting body can be guaranteed, and the color difference problem can be avoided as much as possible. In addition, the heat-conducting part and the light-guiding cover are made of transparent heat-conducting materials, and the lens structure formed by them can also change the transmission path of the light, so that the light emitted by the LED light-emitting body with dot matrix distribution is more diffused, and the spatial frequency of the original LED light-emitting body is changed, so that the moiré phenomenon can be eliminated. The high-brightness COB screen with a new heat dissipation structure of the utility model has the characteristics of simple structure, easy processing, and easy mass production. It has strong practicality and should be vigorously promoted. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 It is a schematic diagram of the structural decomposition of the utility model.

[0016] Figure 3 It is a schematic diagram of the structural principle of the utility model.

[0017] The accompanying drawings indicate: circuit substrate 10 , LED light emitting body 20 , heat conducting portion 30 , first curved surface 31 , light guide cover 40 , second curved surface 41 , heat dissipating portion 50 . DETAILED DESCRIPTION

[0018] The following embodiments are provided to further explain and supplement the present invention and do not constitute any limitation to the present invention.

[0019] like Figure 1 , Figure 2 , Figure 3 As shown, the high-brightness COB screen with a novel heat dissipation structure of the utility model includes a circuit substrate 10, an LED light emitting body 20, a heat conducting part 30, a light guide cover 40 and a heat dissipation part 50.

[0020] The circuit substrate 10 is a known circuit substrate 10 , which is not limited in this embodiment.

[0021] The LED illuminators 20 are distributed in an array on the circuit substrate 10 and are soldered on the circuit substrate 10 using a known process. Typically, the LED illuminators 20 include three LED light-emitting chips, which correspond to a red LED chip, a blue LED chip, and a green LED chip in the three primary colors of RGB, respectively. Of course, the specific configuration of the LED illuminators 20 is not limited, the color thereof is not limited, and the number of LED light-emitting chips included therein is also not limited.

[0022] The heat conducting part 30 is used to conduct the heat emitted by the LED light emitting body 20 outwards, and at the same time acts as a lens to refract and diffuse the light. The heat conducting part 30 is distributed in an array on the circuit substrate 10, and wraps the LED light emitting body 20 therein. The heat conducting part 30 wraps the LED light emitting body 20, which is conducive to the LED light emitting body 20 directly transferring heat to the heat conducting part 30, and then transferring heat from the heat conducting part 30 to the heat dissipation part 50 outwards. The heat conducting parts 30 are spaced apart from each other, and the distance between them can be set as needed. The heat conducting part 30 is made of a transparent heat conducting material, for example, a heat conducting and light transmissive silicone material.

[0023] Furthermore, in order to facilitate better diffusion of light and eliminate the moiré effect, a convex lens is formed at the end of the heat conducting portion 30 opposite to the circuit substrate 10, and the convex lens is provided with a first curved surface 31. The first curved surface 31 is a part of a spherical surface. The focus of the convex lens is located inside the heat conducting portion 30. When the light emitted by the LED light emitter 20 passes through the first curved surface 31, the light is refracted, which can change the original transmission angle, making the light more diffused, so as to eliminate or weaken the non-luminous dark area between two adjacent LED light emitters 20.

[0024] The focal points of all the heat conducting parts 30 should be located on the same plane, which is parallel to the circuit substrate 10 .

[0025] The light guide cover 40 is used to transfer the heat transferred by the heat conducting part 30 to the outside, and at the same time acts as a lens to refract and diffuse the light. The light guide covers 40 are distributed in an array and are covered on the heat conducting part 30. The light guide cover 40 wraps the heat conducting part 30 inside and is in close contact with the heat conducting part 30, so that the heat of the heat conducting part 30 can be transferred to the light guide cover 40. The light guide cover 40 is made of a transparent heat conducting material, for example, a heat conducting and light transmissive silicone material.

[0026] The end of the light guide cover 40 away from the heat conducting portion 30 is in a prism shape, and the size of the top is smaller than the size of the bottom close to the heat conducting portion 30. In this embodiment, the top of the light guide cover 40 is in a rectangular prism shape.

[0027] Two adjacent light guide covers 40 are spaced apart from each other, and the distance between the spaced apart distances can be set as required.

[0028] The tops of the light guide covers 40 are located on the same plane.

[0029] The light guide cover 40 is formed into a concave lens at one end facing the heat conducting part 30, and is provided with a second curved surface 41. The second curved surface 41 is in contact with the first curved surface 31. Therefore, the second curved surface 41 is also a part of a spherical surface. The focus of the concave lens is located inside the heat conducting part 30. When the light emitted by the LED light emitting body 20 passes through the first curved surface 31 and the second curved surface 41, the light is refracted, which can change the original transmission angle, making the light more diffuse, so as to eliminate or weaken the non-luminous dark area between two adjacent LED light emitting bodies 20.

[0030] Furthermore, the refractive index of the light guide cover 40 is inconsistent with that of the heat conduction portion 30 , so that the transmission angle can be continuously changed through multiple refractions, thereby making the light more diffused, thereby changing the spatial frequency and facilitating the elimination of the moiré phenomenon.

[0031] Since the heat conducting part 30 and the light guide cover 40 are made of transparent materials, they are lens structures rather than diffusion plate structures. Therefore, they can eliminate the moiré phenomenon without significantly reducing the display brightness of the screen or the sharpness of the picture.

[0032] The heat dissipation part 50 is used for heat dissipation, and is filled between the light guide covers 40 and connected to the circuit substrate 10. The heat dissipation part 50 is made of a heat conductive material, so it has good heat conduction performance and is conducive to heat dissipation.

[0033] The heat dissipation portion 50 is in direct contact with the circuit substrate 10 , so it can directly dissipate the heat on the circuit substrate 10 to the outside, which is beneficial to ensure the uniformity of temperature at various locations on the circuit substrate 10 .

[0034] The heat dissipation portion 50 is in contact with the light guide cover 40 , so the heat transferred from the LED light emitting body 20 to the light guide cover 40 via the heat conduction portion 30 can be transferred to the heat dissipation portion 50 , thereby facilitating heat dissipation to the outside.

[0035] Furthermore, the heat dissipation part 50 is made of a heat-conducting material with electrical conductivity, and is filled between the light guide covers 40 , and can also play a certain electromagnetic shielding role.

[0036] Furthermore, the surface of the heat dissipation portion 50 is flush with the surface of the light guide cover 40 , so that dust accumulation on the screen surface can be avoided, thereby facilitating improvement in brightness and brightness uniformity.

[0037] The heat dissipation part 50 may be light-transmissive or opaque. To avoid brightness loss, the heat dissipation part 50 is preferably light-transmissive, and its refractive index is different from that of the light guide cover 40. In this way, when the light of the LED light emitting body 20 is transmitted to the interface between the light guide cover 40 and the heat dissipation part 50, it can be refracted again, thereby changing the transmission direction and diffusing, changing the original spatial frequency of the LED light emitting body 20, and thus facilitating the elimination of the moiré phenomenon.

[0038] The heat dissipation part 50 can be formed by doping the conductive material into the heat conductive material, and after the materials are evenly mixed, they are filled between the light guide cover 40, and after curing, the heat dissipation part 50 can be formed. The heat dissipation material can be a well-known high thermal conductivity conductive adhesive material, which is mainly composed of resin and conductive filler. For example, silver powder or nano silver powder is added to the resin material, which not only plays the role of heat conduction and electricity conduction, but also the silver powder particles themselves have certain reflective properties, which can act as a diffusion example to diffuse the light, change the spatial frequency of the LED light emitting body 20 and help eliminate the moiré phenomenon.

[0039] Thus, the high-brightness COB screen with a novel heat dissipation structure of the utility model is formed, which has good heat dissipation performance, thereby facilitating the guarantee of luminous efficiency and color uniformity. In addition, it can eliminate the moiré phenomenon without losing the brightness and sharpness of the picture. The high-brightness COB screen with a novel heat dissipation structure of the utility model has a better display effect and is very practical.

[0040] Although the present invention is disclosed through the above embodiments, the scope of the present invention is not limited thereto, and the above components may be replaced with similar or equivalent elements known to those skilled in the art without departing from the concept of the present invention.

Claims

1. A high brightness COB screen with a new heat dissipation structure, characterized in that: It includes: A circuit substrate (10); LED light emitters (20) are distributed in an array and welded on the circuit substrate (10); The heat conducting parts (30) are distributed in an array on the circuit substrate (10) and wrap the LED light emitters (20) therein, and the heat conducting parts (30) are made of a transparent heat conducting material; The light guide covers (40) are distributed in an array and are covered on the heat conducting portion (30), and one end of the light guide covers (40) that is away from the heat conducting portion (30) is in a prism shape. The light guide covers (40) are made of a transparent heat conducting material; The heat dissipation portion (50) is filled between the light guide covers (40) and connected to the circuit substrate (10).

2. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 1, characterized in that: The heat conducting portion (30) and the light guide cover (40) have different refractive indices.

3. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 1, characterized in that: The refractive index of the heat dissipation portion (50) is different from the refractive index of the light guide cover (40).

4. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 1, characterized in that: The heat dissipation portion (50) is made of a heat-conducting material having electrical conductivity.

5. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 1, characterized in that: The end of the heat conducting part (30) opposite to the circuit substrate (10) forms a convex lens, which is provided with a first curved surface (31). One end of the light guide cover (40) facing the heat conduction portion (30) forms a concave lens, which is provided with a second curved surface (41); The first curved surface (31) and the second curved surface (41) are in contact with each other.

6. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 5, characterized in that: The focal points of the convex lens and the concave lens are located in the same plane, and the plane where the focal points are located is parallel to the surface of the circuit substrate (10).

7. The high brightness COB screen with a novel heat dissipation structure as claimed in claim 1, characterized in that: The surface of the heat dissipation portion (50) is flush with the surface of the light guide cover (40).

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