Automatic overheating heat dissipation structure of power transformer

Abstract

The utility model discloses an overheating automatic heat dissipation structure of a power transformer, which comprises a heat dissipation seat and a transformer body arranged in the heat dissipation seat, a second heat dissipation assembly is arranged in the heat dissipation seat and comprises a semiconductor chilling plate, the upper end of the semiconductor chilling plate is provided with a refrigeration silicon wafer, and the lower end of the semiconductor chilling plate is provided with a heat dissipation groove. The transformer body is heated after being used, so that the temperature difference is formed on the upper and lower side walls of the semiconductor chilling plate, the semiconductor chilling plate performs thermoelectric power generation, power output by the semiconductor chilling plate drives the refrigeration silicon wafer to perform refrigeration, and the temperature difference is continuously formed on the upper and lower side walls of the semiconductor chilling plate for power generation; and heat energy emitted by the transformer body is converted into electric energy to dissipate heat of the transformer body. According to the utility model, the fan is arranged and is driven by the electric power output by the semiconductor chilling plate, secondary heat dissipation is carried out on the transformer body by utilizing wind energy, the heat dissipation capability of the transformer body is improved, an external power supply is not needed, and the use cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of power transformers, in particular to an overheated automatic heat dissipation structure of a power transformer. Background Art

[0002] The power transformer is a soft magnetic electromagnetic component with the functions of power transmission, voltage conversion and insulation isolation. It is widely used in power supply technology and power electronics technology. Power transformers are used in almost all electronic products. Its principle is simple, but the winding process of the transformer will have different requirements according to different usage occasions (different uses). The functions of the transformer are mainly: voltage conversion; impedance conversion; isolation; voltage stabilization (magnetic saturation transformer), etc. The commonly used core shapes of transformers are generally E-type and C-type cores.

[0003] Chinese patent document CN218730284U discloses a power transformer that is easy to dissipate heat, including a power transformer, the power transformer including a transformer body, the power transformer fixedly installed inside a heat sink, the heat sink is also provided with a condensation assembly for dissipating heat to the transformer body, the condensation assembly includes a condensation water pipe that takes the heat transferred in the transformer body out of the heat sink, and a condensation water tank is provided on one side of the condensation assembly, the condensation water tank is used to store condensate and form a condensation loop with the condensation water pipe. The power transformer that is easy to dissipate heat in the above device is deficient, the device uses liquid to dissipate heat, this method has safety hazards, if the liquid leaks, it will directly lead to the direct scrapping of the power transformer, the use cost is high, and secondly, the circulating water pump of the above device needs an external power supply to start, which increases the use cost again. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes an overheated automatic heat dissipation structure for a power transformer.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an automatic heat dissipation structure for overheating of a power transformer, comprising a heat sink and a transformer body arranged inside the heat sink, a heat dissipation component 2 is arranged inside the heat sink, and the heat dissipation component 2 includes a semiconductor refrigeration plate, and a refrigeration silicon chip is arranged on the upper end of the semiconductor refrigeration plate. When the transformer body generates heat after use, a temperature difference is formed on the upper and lower side walls of the semiconductor refrigeration plate, so that the semiconductor refrigeration plate performs temperature difference power generation, and the electricity output by the semiconductor refrigeration plate drives the refrigeration silicon chip to cool, so that the upper and lower side walls of the semiconductor refrigeration plate continue to form a temperature difference to generate electricity, so that the heat energy emitted by the transformer body is converted into electrical energy to dissipate the heat of the transformer body.

[0006] Preferably, the side wall of the heat sink is provided with a heat sink component 1, the heat sink component 1 includes a cover plate, the side wall of the cover plate is provided with a fan slot, a fan seat is provided inside the cover plate, the fan seat is located in the fan slot, and a fan is provided inside the fan seat;

[0007] The electric power output by the semiconductor cooling plate drives the fan, and the wind energy output by the fan is used to dissipate the heat of the transformer body, thereby realizing secondary heat dissipation of the transformer body.

[0008] Preferably, a heat sink groove is provided on the side wall of the heat sink, the heat sink second is located in the heat sink groove, and the heat sink groove is located at one end of the outer wall of the heat sink in a dovetail shape, and a heat sink plate is provided on the upper end of the cooling silicon chip;

[0009] It is used to dissipate heat from the side walls of the cooling silicon chip to ensure continuous power generation of the semiconductor cooling chip.

[0010] Preferably, six groups of heat dissipation components 2 are arranged inside the heat dissipation seat;

[0011] It is used to increase the heat dissipation capacity of the transformer body, and secondly to provide stable power to ensure the operation of the fan.

[0012] Preferably, the side wall of the heat sink is provided with a second filter screen, and the side wall of the cover plate is provided with a first filter screen;

[0013] Used for filtering to prevent impurities from being blown into the transformer body when using wind energy for cooling, thus affecting the use of the transformer body.

[0014] Preferably, a support bar is provided inside the heat sink;

[0015] It is used to support the transformer body and ensure that there is a gap between the transformer body and the heat sink, so that the fan can perform secondary cooling on the transformer body.

[0016] Preferably, a sealing ring is provided inside the heat sink, and the sealing ring is located in the heat sink component groove;

[0017] It is used to prevent water from entering the heat sink from the heat sink component slot, thereby protecting the transformer body.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, firstly, the transformer body generates heat after use, and then a temperature difference is formed between the upper and lower walls of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet generates electricity by temperature difference. The electricity output by the semiconductor refrigeration sheet drives the refrigeration silicon chip to cool, and the upper and lower walls of the semiconductor refrigeration sheet continuously form a temperature difference to generate electricity. This setting converts the heat energy emitted by the transformer body into electrical energy to dissipate the heat of the transformer body, thereby realizing the first heat dissipation of the transformer body. The structure is simple and convenient for later use and maintenance.

[0020] 2. In the utility model, a fan is provided, and the fan is driven by the power output by the semiconductor refrigeration sheet, so as to realize the secondary heat dissipation of the transformer body by utilizing wind energy, increase the heat dissipation capacity of the transformer body, and avoid damage to the transformer body due to excessive temperature. Moreover, the setting does not require an external power supply, and directly converts heat energy into electrical energy, thereby reducing the use cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional explosion diagram of an automatic heat dissipation structure for overheating of a power transformer proposed by the utility model Figure 1 ;

[0022] Figure 2 A three-dimensional explosion diagram of an automatic heat dissipation structure for overheating of a power transformer proposed by the utility model Figure 2 ;

[0023] Figure 3 It is a three-dimensional exploded view of a heat dissipation component 1 in an overheated automatic heat dissipation structure of a power transformer proposed by the utility model;

[0024] Figure 4 A three-dimensional diagram of a heat sink in an overheated automatic heat dissipation structure of a power transformer proposed by the utility model;

[0025] Figure 5 The utility model discloses a stereoscopic diagram of a heat dissipation component 2 in an overheated automatic heat dissipation structure of a power transformer.

[0026] Legend:

[0027] 1. Heat sink; 11. Heat sink component 2; 111. Semiconductor refrigeration sheet; 112. Refrigeration silicon wafer; 113. Heat sink; 114. Sealing ring; 12. Support bar; 13. Heat sink component slot; 14. Second filter; 2. Heat sink component 1; 21. Cover; 22. Fan slot; 23. Fan seat; 231. Fan; 24. First filter; 3. Transformer body. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] Reference Figure 1-5 The utility model provides an embodiment: an automatic heat dissipation structure for overheating of a power transformer, comprising a heat sink 1 and a transformer body 3 arranged inside the heat sink 1, a heat dissipation component 11 is arranged inside the heat sink 1, the heat dissipation component 11 comprises a semiconductor cooling sheet 111, and a cooling silicon sheet 112 is arranged on the upper end of the semiconductor cooling sheet 111.

[0031] This arrangement generates heat through the transformer body 3 after use, so that a temperature difference is formed on the upper and lower walls of the semiconductor refrigeration plate 111, so that the semiconductor refrigeration plate 111 performs temperature difference power generation, so that the electricity output by the semiconductor refrigeration plate 111 drives the refrigeration silicon chip 112 to cool, so that the upper and lower walls of the semiconductor refrigeration plate 111 continuously form a temperature difference to generate electricity, so that the heat energy emitted by the transformer body 3 is converted into electrical energy to dissipate the heat of the transformer body 3, no external power supply is required, and the heat energy is directly converted into electrical energy, thereby reducing the cost of use.

[0032] A heat dissipation component 2 is arranged on the side wall of the heat dissipation seat 1. The heat dissipation component 2 includes a cover plate 21. A fan slot 22 is arranged on the side wall of the cover plate 21. A fan seat 23 is arranged inside the cover plate 21. The fan seat 23 is located in the fan slot 22. A fan 231 is arranged inside the fan seat 23. A heat dissipation component slot 13 is arranged on the side wall of the heat dissipation seat 1. A heat dissipation component 2 11 is located in the heat dissipation component slot 13. The heat dissipation component slot 13 is located at one end of the outer wall of the heat dissipation seat 1 in a dovetail shape. A heat dissipation plate 113 is arranged on the upper end of the refrigeration silicon chip 112. Six groups of heat dissipation components 2 11 are arranged inside the heat dissipation seat 1. A second filter screen 14 is arranged on the side wall of the heat dissipation seat 1. A first filter screen 24 is arranged on the side wall of the cover plate 21. A support bar 12 is arranged inside the heat dissipation seat 1. A sealing ring 114 is arranged inside the heat dissipation seat 1. The sealing ring 114 is located in the heat dissipation component slot 13.

[0033] Working principle: first, the transformer body 3 generates heat after use, and then a temperature difference is formed on the upper and lower walls of the semiconductor refrigeration sheet 111, and then the semiconductor refrigeration sheet 111 generates electricity by temperature difference, and then the electricity output by the semiconductor refrigeration sheet 111 drives the refrigeration silicon chip 112 to cool, and then the upper and lower walls of the semiconductor refrigeration sheet 111 continue to form a temperature difference to generate electricity, and then the heat energy emitted by the transformer body 3 is converted into electrical energy to dissipate the transformer body 3 for the first time, and then the electricity output by the semiconductor refrigeration sheet 111 drives the fan 231 to dissipate the transformer body 3 for the second time, thereby increasing the heat dissipation capacity of the transformer body 3.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic heat dissipation structure for overheating of a power transformer, comprising a heat dissipation seat (1) and a transformer body (3) arranged inside the heat dissipation seat (1), characterized in that: The heat sink (1) is provided with a second heat sink component (11) inside. The second heat sink component (11) comprises a semiconductor cooling sheet (111). A cooling silicon chip (112) is provided at the upper end of the semiconductor cooling sheet (111). The transformer body (3) generates heat after use, so that a temperature difference is formed between the upper and lower side walls of the semiconductor cooling sheet (111), so that the semiconductor cooling sheet (111) performs temperature difference power generation, so that the power output by the semiconductor cooling sheet (111) drives the cooling silicon chip (112) to perform cooling, so that a temperature difference is continuously formed between the upper and lower side walls of the semiconductor cooling sheet (111) to generate power, so that the heat energy emitted by the transformer body (3) is converted into electric energy to dissipate heat from the transformer body (3).

2. The overheat automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: The side wall of the heat sink (1) is provided with a heat sink component (2), the heat sink component (2) comprises a cover plate (21), the side wall of the cover plate (21) is provided with a fan slot (22), a fan seat (23) is arranged inside the cover plate (21), the fan seat (23) is located in the fan slot (22), and a fan (231) is arranged inside the fan seat (23).

3. The overheat automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: The side wall of the heat sink (1) is provided with a heat sink component groove (13), the heat sink component 2 (11) is located in the heat sink component groove (13), and the heat sink component groove (13) is located at one end of the outer wall of the heat sink (1) in a dovetail shape, and a heat sink plate (113) is provided on the upper end of the cooling silicon chip (112).

4. The overheat automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: Six groups of heat dissipation components 2 (11) are arranged inside the heat dissipation seat (1).

5. The overheat automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: The side wall of the heat sink (1) is provided with a second filter screen (14), and the side wall of the cover plate (21) is provided with a first filter screen (24).

6. The overheat automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: A support bar (12) is arranged inside the heat sink (1).

7. The overheated automatic heat dissipation structure of a power transformer according to claim 1, characterized in that: A sealing ring (114) is arranged inside the heat sink (1), and the sealing ring (114) is located in the heat sink component groove (13).

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