Chip side surface and back surface inspection tool
By designing a tool for inspection on the side and back of the chip, the problems of excessive force, jitter, glue residues and other problems in manual inspection in the prior art are solved, and more convenient and accurate inspection and chip recycling are achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202421230241.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-31
AI Technical Summary
In the prior art, the side and back inspection of the chips relies on manual confirmation, and there are problems such as excessive force causing chip cracks, ionic wind causing chip shaking, glue residue, inconvenience in inspection, and lack of chip recycling, which affects measurement results and production efficiency.
A chip side and back inspection tool is designed, including base, card slots of different sizes, observation slots, through holes, exhaust pipes, rubber tubes and embedded grooves. The chip is fixed through a negative pressure state to facilitate observation and provide a chip recycling position.
This tool improves the convenience and accuracy of the side and back inspection of the chip, reduces chip damage and glue residue problems, meets the needs of production beats, and improves production efficiency.
Smart Images
Figure CN222562629U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chips, in particular to a tool for inspecting the side and back sides of chips. Background Art
[0002] In the semiconductor packaging process, the chip segmentation needs to be checked after the DP (die preparation) station, especially after the blade machining (die saw). Figure 3 As shown in the figure, due to the selection of blades, the characteristics of the processed products, the state of the machine, the choice of film and other comprehensive factors, abnormal chip collapse on the front, side and back sides will occur, such as Figure 4 As shown, it affects the strength of the chip, such as Figure 5 As shown, the product will eventually fail the test at the subsequent packaging and testing stations.
[0003] The inspection of the front of the chip mainly uses AOI (Automated Optical Inspection), which can effectively detect defects on the front of the chip. However, the inspection of the side and back of the chip still relies on manual confirmation. The specific operation process is that the operator uses tweezers to manually remove the chip from the wafer, and then sticks it to the DAF empty film, and observes the side and back of the chip under a high-power microscope. However, the current inspection of the side and back of the chip has the following problems: 1. The operator needs to use force to stick the chip to the DAF when using tweezers. Excessive force may cause chip cracks, especially for the inspection of thin chips, which will eventually affect the measurement results. 2. The measuring microscope is generally equipped with an ion blower to reduce the adverse ESD factors during the measurement process, but the ion wind will cause the chip stuck on the DAF to shake constantly, which is not conducive to observing the actual results of the chip, such as Figure 6 3. There will be glue residue on the contact surface between the chip and DAF when the chip is stuck on DAF, which is not conducive to further inspection of the contact surface between the chip and DAF. 4. When inspecting the back of the chip, the front of the entire chip will be completely adhered to DAF, which is not conducive to subsequent cleaning. If the chip debris continues to the subsequent packaging process with the product, it may cause nozzle contamination at the DB station (die bond), and the product is at risk of contamination and die damage, such as Figure 7 5. After the data collection of the side and back of the chip is completed, there is no chip recycling place, which does not meet the production line production rhythm requirements. Summary of the invention
[0004] The utility model provides a chip side and back inspection tool to overcome the deficiencies of the prior art.
[0005] In order to achieve the above-mentioned purpose, a chip side and back inspection tool is designed, including a base, a plurality of card slots of different sizes are provided on the upper end of one side of the base, an observation groove is provided on the upper end of the other side of the base, a plurality of through holes are provided in the observation groove, and the through holes are connected to the rubber tube through the exhaust pipe. An embedded groove is provided in the base, and a support plate is provided in the embedded groove.
[0006] One side of the base is provided with a plurality of scale lines of different heights.
[0007] The base is in the shape of a rectangular block structure.
[0008] A handle is provided on one side of the support plate.
[0009] The card slot is arranged vertically, and the observation slot is arranged horizontally.
[0010] Compared with the prior art, the utility model has a simple structure, is easy to process, enhances the convenience of inspection, designs several different card slots for chips of different sizes and thicknesses, enhances applicability, and increases the recycling position of discarded chips to meet the needs of production rhythm. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a structural schematic diagram of the utility model.
[0012] Figure 2 for Figure 1 A partial enlarged view of point A in the middle.
[0013] Figure 3 It is a schematic diagram of blade machining in the prior art.
[0014] Figure 4 It is a schematic diagram of abnormal chip chipping caused by blade machining in the prior art.
[0015] Figure 5 This is a schematic diagram showing that a product in the prior art cannot pass the test.
[0016] Figure 6 It is a schematic diagram of the chip stuck on the DAF shaking continuously due to ion wind in the prior art.
[0017] Figure 7 This is a schematic diagram of product contamination and damage caused in the prior art. DETAILED DESCRIPTION
[0018] The utility model is further described below with reference to the accompanying drawings. Embodiment 1
[0019] like Figure 1 to Figure 2As shown, a plurality of slots 2 of different sizes are provided at the upper end of one side of the base 1, an observation slot 3 is provided at the upper end of the other side of the base 1, a plurality of through holes 4 are provided in the observation slot 3, and the through holes 4 are connected to the rubber tube 6 through the exhaust pipe 5. An embedded groove 7 is provided in the base 1, and a support plate 8 is provided in the embedded groove 7.
[0020] A plurality of scale lines 9 of different heights are provided on one side of the base 1 , so that the depth of the card slot 2 can be known through the markings on the scale lines 9 , thereby selecting a suitable card slot 2 according to the size of the chip 11 .
[0021] In this embodiment, the base 1 is in the shape of a rectangular block structure.
[0022] A handle is provided on one side of the support plate 8 to facilitate taking the support plate 8 .
[0023] In this embodiment, the card slot 2 is arranged vertically, and the observation slot 3 is arranged horizontally.
[0024] When the utility model is used, the chip 11 is placed in the vertically arranged card slot 2, so as to observe from the side whether the chip 11 is damaged. Then, by squeezing the rubber tube 6, the air in the tube is discharged through the exhaust pipe 5 and the through hole 4, forming a negative pressure state. At this time, the chip 11 is placed in the horizontally arranged observation slot 3, with the back of the chip 11 facing upward. Under the negative pressure state, the chip 11 is ensured to be adsorbed and fixed in the observation slot 3, which is convenient for the staff to observe. If the chip is found to be damaged during inspection and observation and does not meet the requirements, the chip is placed on the support plate 8 in the embedded groove 7 to distinguish it from other qualified chips.
Claims
1. A chip side and back inspection tool, comprising a base, characterized in that: The upper end of one side of the base (1) is provided with a plurality of slots (2) of different sizes, the upper end of the other side of the base (1) is provided with an observation slot (3), a plurality of through holes (4) are provided in the observation slot (3), the through holes (4) are connected to the rubber tube (6) through the exhaust pipe (5), an embedded groove (7) is provided in the base (1), and a support plate (8) is provided in the embedded groove (7).
2. A chip side and back inspection tool according to claim 1, characterized in that: A plurality of scale lines (9) of different heights are provided on one side of the base (1).
3. A chip side and back inspection tool according to claim 1, characterized in that: The base (1) is in the shape of a rectangular block structure.
4. A chip side and back inspection tool according to claim 1, characterized in that: A handle is provided on one side of the support plate (8).
5. A chip side and back inspection tool according to claim 1, characterized in that: The card slot (2) is arranged vertically, and the observation slot (3) is arranged horizontally.