Lead ring packaging shell and packaging device

Abstract

The utility model provides a lead ring packaging shell and a packaging device, which belong to the technical field of integrated circuit packaging, and comprise a plastic shell, a metal ring and a metal lead, the plastic shell is in the shape of a circular ring, and a communicating hole is arranged on the plastic shell; the metal rings are arranged on the upper surface and the lower surface of the plastic shell in an injection molding mode. The inner cavity of the metal ring is communicated with the communicating hole in the plastic shell to form a packaging cavity for packaging the chip; the metal leads are injection-molded in the plastic shell in an annular array; one end of the metal lead extends into the packaging cavity and is flush with the upper surface or the lower surface of the plastic shell; and the other end of the metal lead vertically extends upwards from the upper surface of the plastic shell, and / or vertically extends downwards from the lower surface of the plastic shell. The lead ring packaging shell provided by the utility model is simple to manufacture, low in operation requirement and low in manufacturing cost, and has the characteristics of better heat resistance, moisture resistance, sealing performance and reliability compared with a plastic encapsulation shell.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit packaging, and in particular relates to a lead ring packaging shell and a packaging device. Background Art

[0002] RP type housing, also called ceramic lead ring, is used to encapsulate the Dewar connector of the refrigerated infrared detector assembly. It is characterized by the upper and lower surfaces of the circular ceramic body welded with metal rings, and the ceramic surface outside the metal ring is welded with cylindrical leads arranged in a circular array, and the leads are perpendicular to the ceramic ring (see Figures 5 to 7 ).

[0003] For ceramic lead rings, traditional integrated circuit housings include ceramic housing packaging and plastic potting:

[0004] The ceramic shell is composed of an alumina ceramic shell, a metal lead, a metal sealing ring and a metal cover. The alumina ceramic shell, the metal lead and the metal sealing ring are welded together, and the metal cover is sealed to form an airtight package shell. The process flow of ceramic shell packaging:

[0005] (1) Alumina ceramic powder is made into green ceramic sheets through mixing and casting processes;

[0006] (2) Printing tungsten metallization paste on the green ceramic sheet by screen printing;

[0007] (3) Cut the raw porcelain pieces into individual raw porcelain pieces

[0008] (4) Sintering in a reducing atmosphere, sintering the green porcelain pieces into mature porcelain pieces, the sintering temperature is about 1600°C;

[0009] (5) Nickel plating of cooked porcelain;

[0010] (6) The metal lead and sealing ring are welded to the metallized area of ​​the porcelain piece. The welding temperature is about 800°C and the solder is a silver-copper alloy.

[0011] (7) Overall nickel and gold plating;

[0012] (8) The cavity of the ceramic shell is an airtight cavity. The integrated circuit chip is welded or bonded to the bottom surface of the cavity. Gold wires are bonded to the gold-plated area of ​​the chip and the metallized area in the cavity to interconnect the circuits. Finally, a metal cover is used to seal the cavity to make a complete integrated circuit device.

[0013] The process flow of plastic "potting" is as follows:

[0014] (1) The processed lead frame is gold plated first;

[0015] (2) Welding or bonding the chip to the lead frame, and bonding gold wires between the gold-plated area of ​​the chip and the surface of the lead frame to interconnect the circuits;

[0016] (3) Use a glue potting machine to pot the chip and lead frame with liquid epoxy resin, and then heat it to solidify the epoxy resin. All gaps will be filled, no cavities are allowed, and the inside of the device is solid. Epoxy resin is a thermosetting material that is liquid at room temperature. Heating causes cross-linking polymerization between molecular chains, turning it into a solid with no cavities inside.

[0017] The current production of ceramic packaging shells requires sintering in a reducing atmosphere, high-temperature welding, etc. The production process is complex and demanding, the production cost is high, and the price is expensive; although plastic potting has low cost and simpler process, it has poor heat resistance, sealing, moisture resistance, and reliability. Utility Model Content

[0018] The embodiments of the utility model provide a lead ring packaging shell and a packaging device, which are simple to manufacture, have low operation requirements, low manufacturing cost, and good heat dissipation, and solve the problems of complex ceramic packaging manufacturing process, high cost, and poor heat resistance, sealing, moisture resistance, and reliability of plastic potting shells.

[0019] In the first aspect, in order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a lead ring packaging shell, comprising:

[0020] The plastic shell is in the shape of a ring and is provided with a communicating hole;

[0021] A metal ring is injection molded on the upper surface and the lower surface of the plastic shell; the inner cavity of the metal ring is connected with the connecting hole on the plastic shell to form a packaging cavity for packaging the chip; and

[0022] The metal lead is injection molded in the plastic shell in a circular array; one end of the metal lead extends into the packaging cavity and is flush with the upper surface or the lower surface of the plastic shell; the other end of the metal lead extends vertically upward from the upper surface of the plastic shell, and / or extends vertically downward from the lower surface of the plastic shell.

[0023] In combination with the first aspect, in one feasible manner, the metal lead has an inner lead segment injection molded inside the plastic shell and an outer lead segment exposed outside the plastic shell, the inner lead segment is cylindrical or flat in shape, and the outer lead segment is cylindrical.

[0024] In combination with the first aspect, in one achievable manner, a first glue locking structure is provided on the inner cavity lead segment.

[0025] In combination with the first aspect, in one achievable manner, the first glue locking structure includes a first glue locking hole provided on the inner cavity lead segment for locking glue.

[0026] In combination with the first aspect, in one achievable manner, the first glue locking structure includes a first glue locking groove for locking glue symmetrically arranged on both sides of the inner cavity lead segment.

[0027] In combination with the first aspect, in one achievable manner, the first glue locking structure includes first glue locking protrusions symmetrically arranged on both sides of the inner cavity lead segment for locking glue.

[0028] In combination with the first aspect, in one achievable manner, a second glue locking structure is provided on the portion of the metal ring extending into the plastic shell.

[0029] In combination with the first aspect, in one achievable manner, the second glue locking structure includes any one or more combinations of a second glue locking hole, a second glue locking groove, and a second glue locking protrusion.

[0030] In combination with the first aspect, in one achievable manner, the material of the plastic shell is any one of LCP, LCP modified material, PPS, PS, and PBT high temperature resistant engineering plastics.

[0031] In a second aspect, an embodiment of the present utility model further provides a packaging device, including:

[0032] The lead ring package housing; and

[0033] The chip support is arranged in the packaging cavity of the plastic shell and supported on the plastic shell; the chip is arranged on the chip support and is directly connected to the metal lead extending into the packaging cavity through bonding wires.

[0034] Compared with the prior art, the lead ring packaging shell and packaging device provided by the utility model have the following beneficial effects: compared with the traditional ceramic lead ring, only the corresponding injection mold is needed to integrally injection-mold the metal lead, the metal ring and the plastic shell, so as to produce a packaging shell of a plastic product with the same size as the traditional ceramic lead ring shell and good performance, which is simple to produce, has low operation requirements and low production cost, reduces the price of the product, and the impact resistance and flexibility of the plastic material are also good; compared with the traditional plastic potting shell, the plastic shell has a packaging cavity, and the cavity is around the chip. After the cap is sealed, the packaging cavity will not be filled, and the cavity is still around the chip inside the device. The shell structure of the plastic potting is different from the shell structure of the ceramic package. The shell of the present application can be completely consistent with the internal structure and external structure of the ceramic lead ring; at the same time, compared with the plastic potting shell, the heat resistance, sealing, moisture resistance and reliability are better.

[0035] The lead ring packaging shell provided by the utility model can maintain a high degree of consistency in internal and external dimensions and shapes with those of traditional needle ceramic lead rings. In actual application, a lead ring packaging shell made of low-cost plastic material can be selected to replace a high-priced ceramic lead ring shell according to the actual use environment and performance requirements of the product. At the same time, the shell of the present application can also be selected to replace the plastic-sealed shell made of plastic potting, thereby reducing production costs while ensuring the performance and reliability of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the internal structure of a lead ring package housing provided by an embodiment of the utility model;

[0037] Figure 2 for Figure 1 A schematic diagram of a top view of a lead ring package housing is provided;

[0038] Figure 3 A schematic diagram of the structure of a metal lead provided by an embodiment of the utility model;

[0039] Figure 4 A schematic diagram of the structure of a metal ring provided in an embodiment of the utility model;

[0040] Figure 5 This is a schematic diagram of the back structure of a traditional ceramic lead ring;

[0041] Figure 6 It is a schematic diagram of the main structure of a traditional ceramic lead ring;

[0042] Figure 7 It is a schematic diagram of the top view structure of a traditional ceramic lead ring;

[0043] Description of reference numerals:

[0044] 1. Metal lead; 11. Inner lead segment; 111. First glue locking groove; 112. First glue locking hole; 113. First glue locking protrusion; 12. External lead segment; 2. Plastic shell; 21. Packaging cavity; 3. Metal ring; 31. Second glue locking structure; 4. Ceramic lead ring. DETAILED DESCRIPTION

[0045] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] Please also read Figures 1 to 4The lead ring packaging shell provided by the utility model is now described. The lead ring packaging shell includes a plastic shell 2, a metal ring 3 and a metal lead 1. The plastic shell 2 is in the shape of a circular ring and is provided with a connecting hole. The metal ring 3 is injection molded on the upper surface and the lower surface of the plastic shell 2. The inner cavity of the metal ring 3 is connected with the connecting hole on the plastic shell 2 to form a packaging cavity for packaging chips. The metal lead 1 is injection molded in the plastic shell 2 in a circular array. One end of the metal lead 1 extends into the packaging cavity 21 and is flush with the upper surface or the lower surface of the plastic shell 2. The other end of the metal lead 1 extends vertically upward from the upper surface of the plastic shell 2, and / or extends vertically downward from the lower surface of the plastic shell 2.

[0047] Compared with the prior art, the lead ring packaging shell provided by the utility model has the following beneficial effects: compared with the traditional ceramic lead ring 4, only the corresponding injection mold is needed to integrally injection-mold the metal lead 1, the metal ring 3 and the plastic shell 2, so as to produce a packaging shell of a plastic product with the same shell size as the traditional ceramic lead ring 4 and better performance, which is simple to produce, has low operation requirements, low production cost, reduces the price of the product, and the impact resistance and flexibility of the plastic material are also good; compared with the traditional plastic potting shell, the plastic shell 2 has a packaging cavity 21, and the cavity is around the chip. After the cap is sealed, the packaging cavity 21 will not be filled, and the cavity is still around the chip inside the device. The shell structure of the plastic potting is different from the shell structure of the ceramic package. The shell of the present application can be completely consistent with the internal structure and external structure of the ceramic lead ring 4; at the same time, compared with the plastic potting shell, the heat resistance, sealing, moisture resistance and reliability are better.

[0048] The lead ring packaging shell provided by the utility model can maintain a high degree of consistency in internal and external dimensions and shapes with those of the traditional needle ceramic lead ring 4. In actual application, a lead ring packaging shell made of a lower-cost plastic material can be selected to replace the high-priced ceramic lead ring 4 shell according to the actual use environment and performance requirements of the product. At the same time, the shell of the present application can also be selected to replace the plastic-sealed shell made of plastic potting, thereby reducing production costs while ensuring the performance and reliability of electronic products.

[0049] At the same time, since the plastic-potted shell is potted with liquid epoxy resin, the liquid epoxy resin is liquid at room temperature and is hygroscopic after curing, and has poor moisture resistance. This shell is prone to cracking, fissures, and explosions after being heated, has poor heat resistance, affects the sealing, and has poor performance reliability. The plastic lead ring packaging shell provided in the present application uses a plastic material that is solid at room temperature, has good heat resistance, sealing, moisture resistance and reliability, and when in use, a cost-effective packaging shell can be selected according to the environmental conditions of different occasions and the performance requirements of the device.

[0050] In some cases, the lead ring package housing of the present application can replace the housing of the traditional ceramic lead ring 4 and the housing of the plastic potting, and can meet the performance requirements.

[0051] The manufacturing process of the lead ring package shell provided by the utility model is as follows:

[0052] (1) The metal lead 1 and the metal ring 3 are machined and chemically treated on the surface to increase the bonding strength with the plastic; (2) The metal lead 1 and the metal ring 3 are placed in an injection mold and plastic is injected to form a plastic shell 2 that wraps the metal lead 1 and the metal ring 3. In other words, the metal lead 1, the metal ring 3 (upper and lower) and the plastic shell 2 are integrally injection molded. This manufacturing method is not only simple and convenient to manufacture, but the integral injection molding and the integral metal lead 1 not only increase the contact area between the metal lead 1 and the plastic shell 2, but also make the connection between the metal lead 1 and the plastic shell 2 tighter and more secure.

[0053] In some embodiments, Figures 1 to 3 As shown, the metal lead 1 has an inner lead segment 11 injected into the plastic housing 2 and an outer lead segment 12 exposed outside the plastic housing 2. The inner lead segment 11 is cylindrical or flat, and the outer lead segment 12 is cylindrical. Optionally, the inner lead segment 11 is a bent segment.

[0054] The lead ring packaging shell provided in this embodiment has the same structure as the traditional ceramic lead ring 4, the plastic shell 2 is a circular ring, the metal ring 3 is a circular ring, at least the metal lead 1 extending out of the plastic shell 2 is cylindrical, and the part of the metal lead 1 inside the plastic shell 2 can be cylindrical or flat due to the need to set a first glue locking structure.

[0055] Optionally, the metal lead 1 extends only from the upper surface or only from the lower surface of the plastic shell 2 ; the metal lead 1 extends from the upper and lower surfaces of the plastic shell 2 , and at this time, one end of the metal lead 1 extending into the packaging cavity 21 is flush with the same surface of the plastic shell 2 .

[0056] In some embodiments, Figure 1 and Figure 3 As shown, a first glue locking structure is provided on the inner cavity lead section 11 to increase the bonding force between the metal lead 1 and the plastic housing 2 .

[0057] In some embodiments, Figure 1 and Figure 3 As shown, the first glue locking structure includes a first glue locking hole 112 for glue locking, which is arranged on the inner cavity lead section 11. When the metal lead 1 and the plastic shell 2 are integrally injection molded, the first glue locking hole 112 can be filled with plastic liquid, thereby increasing the bonding force between the metal lead 1 and the plastic shell 2 and improving the firmness of the connection between the metal lead 1 and the plastic shell 2.

[0058] Optionally, the shape of the first glue locking hole 112 is a circle, an ellipse, or a polygon such as a triangle, a quadrilateral, or a pentagon. The number of the first glue locking holes 112 can be one, two, or more.

[0059] In some embodiments, Figure 1 and Figure 3 As shown, the first glue locking structure includes a first glue locking groove 111 for locking glue symmetrically arranged on both sides of the inner cavity lead segment 11. Similarly, the first glue locking groove 111 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and improve the firmness of the connection between the metal lead 1 and the plastic shell 2. Optionally, the shape of the first glue locking groove 111 is circular, elliptical, or a polygon such as a triangle, a quadrilateral, or a pentagon, wherein the quadrilateral is preferably a rectangle. Similarly, the number and setting position of the first glue locking groove 111 are not limited.

[0060] In some embodiments, Figure 1 and Figure 3 As shown, the first glue locking structure includes first glue locking protrusions 113 for locking glue, which are symmetrically arranged on both sides of the inner cavity lead segment 11. Similarly, the first glue locking protrusions 113 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and improve the firmness of the connection between the metal lead 1 and the plastic shell 22.

[0061] It should be noted that the first glue locking hole 112 , the first glue locking groove 111 and the first glue locking protrusion 113 do not affect the bonding of the bonding wire, or in other words, they should avoid the bonding position of the bonding wire.

[0062] Meanwhile, any one of the first glue locking hole 112 , the first glue locking groove 111 and the first glue locking protrusion 113 , or any two or all three of them can be provided on the metal lead 1 .

[0063] In some embodiments, Figure 1 and Figure 4 As shown, the portion of the metal ring 3 extending into the plastic housing 2 is provided with a second glue locking structure 31 to increase the bonding force between the metal ring 3 and the plastic.

[0064] In some embodiments, Figure 1 and Figure 4 As shown, the second glue locking structure 31 includes any one or more combinations of a second glue locking hole, a second glue locking groove and a second glue locking protrusion. The design concept of the second glue locking structure 31 is the same as that of the first glue locking structure, and will not be repeated here.

[0065] In some embodiments, Figure 1 and Figure 2As shown, the material of the plastic shell 2 is any one of LCP, LCP modified material, PPS, PS, PBT high temperature resistant engineering plastics. The plastic shell 2 provided by the utility model is made of plastic material, and the plastic is any one of high temperature resistant engineering plastics such as LCP (LIQUID CRYSTAL POLYMER), LCP modified material, PPS (polyphenylene sulfide), PS (polystyrene, abbreviated as PS), PBT (polybutylene terephthalate), etc., and the plastic contains more than 30% of glass fiber as filler.

[0066] The metal lead 1 and the metal ring 3 (two upper and lower ones) are made of any one of materials such as Kovar alloy, copper and copper alloy, aluminum and aluminum alloy.

[0067] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0068] Based on the same inventive concept, an embodiment of the present application also provides a packaging device, including: a lead ring packaging shell, a chip holder and a chip, the chip holder is arranged in the packaging cavity 21 of the plastic shell 2 and supported on the plastic shell 2; the chip is arranged on the chip holder and is directly connected to the metal lead 1 extending into the packaging cavity 21 through a bonding wire.

[0069] The packaging device provided by the utility model has the advantages of simple manufacturing, low operation requirements, low manufacturing cost, good heat resistance, moisture resistance and sealing properties, and meets the use requirements of the device.

[0070] The manufacturing process of packaged devices includes the following steps:

[0071] (1) Fabrication of metal lead 1 and metal ring 3:

[0072] The metal lead 1 and the metal ring 3 are processed by mechanical processing, and the surface is chemically treated to increase the bonding strength with the plastic;

[0073] (2) Production of plastic housing 2:

[0074] Make injection molds;

[0075] The metal lead 1 is placed in an injection mold, and plastic is injected to form a plastic shell 2 that wraps the metal lead 1 and the metal ring 3. The metal lead 1, the metal ring 3 and the plastic shell 2 are integrally injection molded.

[0076] After injection molding, the entire shell is plated with nickel and gold layers to form a finished shell.

[0077] The process of the lead ring package shell of the present application in the production of the refrigerated infrared detector is as follows:

[0078] (1) The metal rings 3 on the upper and lower sides of the plastic shell 2 are connected to the dewar. A chip holder is installed in the shell, and a chip is installed on the surface of the chip holder by soldering or gluing;

[0079] (2) The electrode of the chip is bonded to the gold-plated metal lead 1 surface by gold wire;

[0080] (3) The external metal lead 1 is connected or welded to the external circuit board;

[0081] (4) After inspection and testing, the complete device is manufactured.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wire ring package housing, characterized in that: include: The plastic shell (2) is in the shape of a ring and is provided with a communicating hole; A metal ring (3) is injection-molded on the upper surface and the lower surface of the plastic shell (2); the inner cavity of the metal ring (3) is connected to the connecting hole on the plastic shell (2) to form a packaging cavity (21) for packaging the chip; as well as The metal lead (1) is injection molded in the plastic shell (2) in a ring array; one end of the metal lead (1) extends into the packaging cavity (21) and is flush with the upper surface or the lower surface of the plastic shell (2); the other end of the metal lead (1) extends vertically upward from the upper surface of the plastic shell (2), and / or extends vertically downward from the lower surface of the plastic shell (2).

2. The wire ring package as claimed in claim 1, wherein: The metal lead (1) comprises an inner lead segment (11) injection-molded inside the plastic shell (2) and an outer lead segment (12) exposed outside the plastic shell (2); the inner lead segment (11) is cylindrical or flat in shape, and the outer lead segment (12) is cylindrical in shape.

3. The wire ring package as claimed in claim 2, wherein: The inner cavity lead wire segment (11) is provided with a first glue locking structure.

4. The wire ring package as claimed in claim 3, characterized in that: The first glue locking structure comprises a first glue locking hole (112) arranged on the inner cavity lead wire segment (11) for locking glue.

5. The wire ring package as claimed in claim 3, characterized in that: The first glue locking structure comprises first glue locking grooves (111) for locking glue and symmetrically arranged on both sides of the inner cavity lead segment (11).

6. The wire ring package as claimed in claim 3, characterized in that: The first glue locking structure comprises first glue locking protrusions (113) for glue locking and symmetrically arranged on both sides of the inner cavity lead segment (11).

7. The wire ring package as claimed in claim 1, wherein: The portion of the metal ring (3) extending into the plastic shell (2) is provided with a second glue locking structure (31).

8. The wire ring package as claimed in claim 7, wherein: The second glue locking structure (31) comprises any one or more combinations of a second glue locking hole, a second glue locking groove and a second glue locking protrusion.

9. The wire ring package as claimed in claim 1, wherein: The material of the plastic shell (2) is any one of LCP, LCP modified material, PPS, PS, and PBT high temperature resistant engineering plastics.

10. A packaging device, characterized in that: include: The wire ring package housing according to any one of claims 1 to 9; as well as A chip holder is arranged in a packaging cavity (21) of a plastic shell (2) and supported on the plastic shell (2); the chip is arranged on the chip holder and is directly connected to a metal lead (1) extending into the packaging cavity (21) via a bonding wire.

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