Telescopic multilayer soft substrate
By setting up the mounting boss and through slot holes on the flexible circuit board, combined with locking screws and conductive thimbles, the telescopic adjustment and electrical connection of the flexible circuit board are achieved, which solves the problem of fixing the size of the existing flexible circuit board, and improves the scope of application and practicality.
Patent Information
- Application Number
- CN202421262728.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The overall size of the existing flexible circuit board is fixed and cannot be adjusted as needed, which limits its scope of application.
A telescopic multi-layer soft substrate is designed. By setting up a mounting boss and through slot holes at the end of the soft substrate, positioning with locking screws, the fitting connection and telescopic adjustment of the soft substrate are realized, and electrical connection is achieved through conductive thimble and bar gold fingers.
The flexible substrate is expanded and adjusted to meet the needs of use in different situations, and the scope of application is improved through electrical connections, with strong applicability and good practicality.
Smart Images

Figure CN222564034U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of soft substrates, and in particular relates to a retractable multi-layer soft substrate. Background Art
[0002] Flexible circuit boards are widely used in various electronic products due to their advantages such as softness and bendability. For parts with complex structures, flexible circuit boards that can adapt to various structural requirements can be made to meet the usage requirements of electronic products in different situations. However, in actual application, the overall size of the flexible circuit board is fixed and cannot be adjusted as needed, which limits its scope of application to a certain extent. Therefore, designing a flexible circuit board that can be telescopically adjusted is a technical problem that technicians in this technical field need to solve. Utility Model Content
[0003] The utility model aims to provide a retractable multi-layer soft substrate which has a reasonable structure and is conducive to improving the scope of application.
[0004] The technical solution to achieve the purpose of the utility model is a retractable multi-layer soft substrate, including a first soft substrate and a second soft substrate, the ends of the first soft substrate and the second soft substrate are both fixed with mounting bosses, and the mounting bosses are provided with through slots;
[0005] The first flexible substrate is inserted into the insertion slot of the second flexible substrate, and the second flexible substrate is inserted into the insertion slot of the first flexible substrate;
[0006] A conductive ejector pin is arranged on the mounting boss of the first soft substrate;
[0007] The surface of the second flexible substrate is provided with strip-shaped gold fingers;
[0008] The conductive ejector pin abuts against the strip-shaped gold finger for electrical connection.
[0009] It is further preferred that: a locking screw is provided on the mounting boss;
[0010] When the first soft substrate and the second soft substrate are extended and retracted in the through slots, they are positioned by locking screws.
[0011] Further preferably, the first soft substrate includes a substrate, an isolation layer symmetrically fixed to symmetrical sides of the substrate by an adhesive layer, a signal layer fixed to an outer side of the isolation layer by an adhesive layer, and a covering layer fixed to an outer side of the signal layer by an adhesive layer.
[0012] More preferably, the second flexible substrate has the same structure as the second flexible substrate.
[0013] More preferably, the height of the through slot matches the thickness of the first soft substrate, and the width of the through slot matches the width of the first soft substrate.
[0014] Further preferably, the mounting boss is made of a polyimide material, and the mounting boss is fixed to the first soft substrate and the second soft substrate by laminating with an adhesive layer.
[0015] The utility model has positive effects: the structure of the utility model is reasonably arranged, and the adjacent soft substrates can be fitted together by installing the boss in conjunction with the through-grooved hole, and can be telescopically adjusted as needed, thereby meeting the use requirements of different situations, and the conductive ejector pins are arranged on the installing boss in conjunction with the strip-shaped gold fingers, so that the electrical connection of the two soft substrates can be achieved, which is beneficial to improving the scope of application, and has strong applicability and good practicality. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to make the content of the utility model easier to understand, the utility model is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein:
[0017] Figure 1 It is a structural schematic diagram of the utility model;
[0018] Figure 2 This is a schematic diagram of the specific structure of the first soft substrate in the utility model;
[0019] Figure 3 It is a schematic diagram of the specific structure of the second soft substrate in the utility model.
[0020] Reference numerals: first soft substrate 1 , substrate 11 , isolation layer 12 , signal layer 13 , coating layer 14 , second soft substrate 2 , mounting boss 3 , through-hole 4 , conductive ejector pin 5 , strip-shaped gold finger 6 , locking screw 7 . DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Example
[0023] See Figures 1 to 3As shown, a retractable multi-layer soft substrate includes a first soft substrate 1 and a second soft substrate 2, the ends of the first soft substrate and the second soft substrate are both fixed with mounting bosses 3, and the mounting bosses are provided with through slots 4; in this embodiment, the mounting bosses are made of polyimide material, and the mounting bosses are fixed to the first soft substrate and the second soft substrate by laminating with a glue layer. And in the actual application process, the second soft substrate has the same structure as the second soft substrate. The height of the through slot matches the thickness of the first soft substrate, and the width of the through slot matches the width of the first soft substrate. By setting the mounting boss to match the through slot, the first soft substrate and the second soft substrate can be connected in a fitting manner, and the through slot can be used to achieve telescopic adjustment, which is conducive to meeting the use requirements of different situations.
[0024] In the actual installation process, the first soft substrate is inserted into the insertion slot of the second soft substrate, and the second soft substrate is inserted into the insertion slot of the first soft substrate; and in order to improve the effectiveness of conduction, a conductive ejector pin 5 is provided on the mounting boss of the first soft substrate; in this embodiment, the conductive ejector pin is electrically connected to the circuit on the first soft substrate, and a strip-shaped gold finger 6 is arranged on the surface of the second soft substrate; the conductive ejector pin abuts against the strip-shaped gold finger for electrical connection. The conductive ejector pin is a structure of the prior art, which is simply applied, so it is not recorded in detail. At the same time, it is mainly used to achieve electrical connection. The strip-shaped gold finger is also a conventional structure of the prior art, which is simply applied, specifically a copper or silver gold finger, which is electrically connected to the conductive ejector pin.
[0025] In actual application, the mounting boss is provided with a locking screw 7; when the first and second soft substrates are extended and retracted in the slots, they are positioned by the locking screws. The above structure can ensure that the position after the extension and retraction adjustment is stable and reliable, which is conducive to improving the stability and reliability of use.
[0026] In actual application, the first soft substrate 1 includes a substrate 11, an isolation layer 12 symmetrically fixed to the symmetrical side of the substrate through a glue layer, a signal layer 13 fixed to the outer side of the isolation layer through a glue layer, and a coating layer 14 fixed to the outer side of the signal layer through a glue layer. Its mounting boss is fixed on the coating layer.
[0027] The utility model has positive effects: the structure of the utility model is reasonably arranged, and the adjacent soft substrates can be fitted together by installing the boss in conjunction with the through-grooved hole, and can be telescopically adjusted as needed, thereby meeting the use requirements of different situations, and the conductive ejector pins are arranged on the installing boss in conjunction with the strip-shaped gold fingers, so that the electrical connection of the two soft substrates can be achieved, which is beneficial to improving the scope of application, and has strong applicability and good practicality.
[0028] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification can also be directly processed according to existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.
[0029] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still belong to the protection scope of the present invention.
Claims
1. A retractable multi-layer soft substrate, comprising a first soft substrate and a second soft substrate, characterized in that: The ends of the first flexible substrate and the second flexible substrate are both fixed with mounting bosses, and the mounting bosses are provided with through slots; The first flexible substrate is inserted into the insertion slot of the second flexible substrate, and the second flexible substrate is inserted into the insertion slot of the first flexible substrate; A conductive ejector pin is arranged on the mounting boss of the first soft substrate; The surface of the second flexible substrate is provided with strip-shaped gold fingers; The conductive ejector pin abuts against the strip-shaped gold finger for electrical connection.
2. The retractable multi-layer flexible substrate according to claim 1, characterized in that: A locking screw is provided on the mounting boss; When the first soft substrate and the second soft substrate are extended and retracted in the through slots, they are positioned by locking screws.
3. The retractable multi-layer flexible substrate according to claim 2, characterized in that: The first soft substrate includes a substrate, an isolation layer symmetrically fixed to the symmetrical side of the substrate through an adhesive layer, a signal layer fixed to the outer side of the isolation layer through an adhesive layer, and a covering layer fixed to the outer side of the signal layer through an adhesive layer.
4. The retractable multi-layer flexible substrate according to claim 3, characterized in that: The second flexible substrate has the same structure as the second flexible substrate.
5. The retractable multi-layer flexible substrate according to claim 1, characterized in that: The height of the through slot matches the thickness of the first soft substrate, and the width of the through slot matches the width of the first soft substrate.
6. The retractable multi-layer flexible substrate according to claim 1, characterized in that: The mounting boss is made of a polyimide material, and the mounting boss is fixed on the first soft substrate and the second soft substrate by laminating with an adhesive layer.