Mobile phone mainboard processing patch device capable of uniformly smearing

Abstract

The utility model discloses a mobile phone mainboard processing patch device capable of uniformly smearing, which comprises a rack, a fixing frame and a conveying pipe, and is characterized in that the rack is arranged on the ground, and a conveying belt is arranged in the rack; a clamping mechanism is arranged above the fixing frame, the clamping mechanism comprises a first connecting frame, an adjusting wheel, a clamping plate and an anti-skid pad, and the first connecting frame is connected with the adjusting wheel in an engaged mode; and the conveying pipe is installed on the upper portion of the interior of the rack, a front-back moving mechanism is arranged on the outer side of the conveying pipe and comprises eccentric wheels, an adjusting rod, a supporting spring and a second connecting frame, the eccentric wheels are symmetrically distributed in the front-back direction, and the outer sides of the eccentric wheels are tightly attached to the conveying pipe and the adjusting rod. According to the mobile phone mainboard processing and pasting device capable of achieving uniform smearing, a mobile phone mainboard can be conveniently clamped, mainboard deviation during gluing and pasting is avoided, the accurate pasting position is guaranteed, the gluing range can be increased, uniform smearing can be achieved, and smearing dead corners are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone mainboard processing, in particular to a mobile phone mainboard processing patch device capable of evenly applying. Background Art

[0002] The mobile phone motherboard is the core component of the mobile phone for controlling and scheduling various components. When processing the mobile phone motherboard, a patch device is required to assemble electronic components on the motherboard. There are various patch devices for processing mobile phone motherboards on the market.

[0003] For example, the utility model with the authorization announcement number CN217470406U discloses a patch device for processing a smart phone motherboard, including a bottom plate, a column, a top plate, a conveyor belt, a mounting plate, an alignment plate, a proximity switch, a glue box, a micro-boosting pump, a material box, a first telescopic rod, a fixed plate, a glue cotton, a feed pipe, a solenoid valve and a vibration motor; in the utility model, by setting the first telescopic rod, the glue cotton, the proximity switch and the alignment plate, the conveyor belt conveys the mobile phone motherboard, and the alignment plate aligns the mobile phone motherboard, so that the mobile phone motherboard passes under the proximity switch, the glue cotton, the feed pipe and the pressure plate in sequence, and when the proximity switch senses that the mobile phone motherboard passes, the PLC controller controls the first telescopic rod to be powered on, and the first telescopic rod pushes the fixed plate and the glue cotton to move downward, and the glue is applied to the mobile phone motherboard through the glue cotton, and the glue cotton is used to apply the glue to ensure that the glue is applied evenly and the tightness of the heat sink is bonded;

[0004] However, the above technical solution still has some disadvantages, such as it is inconvenient to clamp the mobile phone motherboard, the motherboard is easy to shift when applying glue and patching, which affects the accuracy of the patch position, and the gluing range is small, the application is not uniform, and it is easy to produce application dead corners. Therefore, we propose a mobile phone motherboard processing patch device that can apply glue evenly, so as to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a mobile phone motherboard processing patch device that can be evenly coated, so as to solve the problem that the current mobile phone motherboard processing patch device proposed in the above background technology is not convenient for clamping the mobile phone motherboard, the motherboard is easily offset during glue coating and patching, which affects the accuracy of the patch position, and the glue coating range is small, the coating is not uniform, and dead angles are easily generated.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a mobile phone motherboard processing patch device capable of evenly applying, comprising:

[0007] A frame, the frame is placed on the ground, and a conveyor belt is installed inside the frame;

[0008] Also includes:

[0009] A fixing frame, wherein a clamping mechanism is arranged above the fixing frame, wherein the clamping mechanism comprises a first connecting frame, an adjusting wheel, a clamping plate and an anti-slip pad, and the first connecting frame and the adjusting wheel are meshingly connected;

[0010] The conveying pipe is installed on the upper part of the interior of the frame, and a forward and backward moving mechanism is arranged on the outer side of the conveying pipe, wherein the forward and backward moving mechanism includes an eccentric wheel, an adjusting rod, a supporting spring and a second connecting frame, the eccentric wheel is symmetrically distributed front and back, and the outer side of the eccentric wheel is tightly fitted with the conveying pipe and the adjusting rod.

[0011] Preferably, a fixing frame is fixed to the middle of both front and rear sides of the frame, and the upper internal slot of the fixing frame is connected to a first connecting frame, and the upper part of the fixing frame is rotatably connected to an adjusting wheel, and a first motor is installed above the adjusting wheel.

[0012] Preferably, a clamping plate is fixed to the outer end of the first connecting frame, and the longitudinal section of the clamping plate is a "T"-shaped structure, and an anti-slip pad is fixed to the lower inner side of the clamping plate.

[0013] Preferably, a bellows is installed at the lower end of the delivery pipe, and a rubber cotton is fixed to the lower end of the bellows.

[0014] Preferably, support frames are integrally provided on both the front and rear sides of the conveying pipe, and an eccentric wheel is rotatably connected above the support frame, and a second motor is installed above the eccentric wheel.

[0015] Preferably, the outer end of the support frame is slidably connected to an adjusting rod, and the cross-section of the adjusting rod is a "T"-shaped structure, a supporting spring is wound around the outer side of the adjusting rod, and a second connecting frame is welded to the outer end of the adjusting rod, and a rubber cotton is fixed at the bottom of the second connecting frame.

[0016] Compared with the prior art, the utility model has the following beneficial effects: the mobile phone mainboard processing patch device capable of evenly applying glue is convenient for clamping the mobile phone mainboard, avoiding the deviation of the mainboard during gluing and patching, ensuring the accurate position of the patch, and increasing the gluing range, which can be evenly applied to avoid dead angles;

[0017] 1. A first connecting frame, an adjusting wheel and a clamping plate are provided. The first connecting frame and the adjusting wheel are meshed and connected. The adjusting wheel rotates to drive the first connecting frame to slide, and the first connecting frame drives the clamping plate to move. The clamping plates are symmetrically distributed front and back, which is convenient for clamping the mobile phone motherboard, avoiding the motherboard from shifting during gluing and patching, and ensuring the accurate position of the patch;

[0018] 2. An eccentric wheel, an adjusting rod and a second connecting frame are provided. The adjusting rod is driven to move by the rotation of the eccentric wheel, and the adjusting rod drives the second connecting frame and the glue cotton to slide back and forth, which can increase the gluing range and evenly apply the glue to avoid dead corners;

[0019] 3. A support frame and a support spring are provided, and the support frame and the adjusting rod are slidably connected. The support spring wound around the outside of the adjusting rod enables the adjusting rod to move back and forth to ensure stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the front view structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the side cross-sectional structure of the clamping mechanism of the utility model;

[0022] Figure 3 This is a schematic diagram of the cross-sectional structure of the clamping mechanism of the utility model from top view;

[0023] Figure 4 This is a schematic diagram of the cross-sectional structure of the front-rear moving mechanism of the utility model from top view;

[0024] Figure 5 It is a schematic diagram of the side structure of the corrugated pipe and the rubber cotton of the utility model.

[0025] In the figure: 1. frame; 2. conveyor belt; 3. fixed frame; 4. first connecting frame; 5. adjusting wheel; 6. first motor; 7. clamping plate; 8. anti-skid pad; 9. conveying pipe; 10. bellows; 11. support frame; 12. eccentric wheel; 13. second motor; 14. adjusting rod; 15. supporting spring; 16. second connecting frame; 17. adhesive cotton. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-5 The utility model provides a technical solution: a mobile phone motherboard processing patch device capable of evenly applying, comprising: a frame 1, a conveyor belt 2, a fixing frame 3, a first connecting frame 4, an adjusting wheel 5, a first motor 6, a clamping plate 7, an anti-slip pad 8, a conveying pipe 9, a bellows 10, a supporting frame 11, an eccentric wheel 12, a second motor 13, an adjusting rod 14, a supporting spring 15, a second connecting frame 16 and a rubber cotton 17;

[0028] First, as attached Figure 1As shown in the figure, the mobile phone motherboard that needs to be patched is placed on the conveyor belt 2, and the conveyor belt 2 conveys the motherboard, and the conveyor belt 2 conveys the motherboard to the bottom of the adhesive cotton 17. The first connecting frame 4, the adjusting wheel 5, the clamping plate 7 and the anti-skid pad 8 are combined to form a clamping mechanism, and the clamping mechanism clamps and fixes the motherboard. The adhesive cotton 17 applies glue on the motherboard. The eccentric wheel 12, the adjusting rod 14, the supporting spring 15 and the second connecting frame 16 are combined to form a forward and backward moving mechanism to evenly apply the glue. The clamping mechanism is released, and the conveyor belt 2 conveys the motherboard to the bottom of the patch mechanism. The clamping mechanism on the right clamps the motherboard and patches the motherboard.

[0029] As attached Figure 1 , Attachment Figure 2 and attached Figure 3 As shown in the figure, the first motor 6 installed on the top of the fixing frame 3 is turned on, and the first motor 6 drives the adjusting wheel 5 installed on its output end to rotate on the fixing frame 3, and the adjusting wheel 5 drives the first connecting frame 4 meshed with its outer side to move, so that the first connecting frame 4 slides in the fixing frame 3 connected to the slot therewith, and the first connecting frame 4 drives the clamping plate 7 fixed therewith to move, and an anti-skid pad 8 is fixed to the lower inner side of the clamping plate 7, and the clamping plates 7 symmetrically distributed front and back clamp the main board, and an anti-skid pad 8 is fixed to the lower inner side of the clamping plate 7 to ensure the stability of clamping. Since the adjusting wheel 5 is a half gear, the adjusting wheel 5 can drive the first connecting frame 4 to reciprocate, thereby realizing uninterrupted clamping and releasing;

[0030] As attached Figure 1 , Attachment Figure 4 and attached Figure 5 As shown in, the second motor 13 is turned on, and the second motor 13 drives the eccentric wheel 12 installed at its output end to rotate on the support frame 11, and the eccentric wheel 12 pushes the adjusting rod 14 tightly fitted on its outer side, so that the adjusting rod 14 slides on the support frame 11 connected to its slot, and the eccentric wheels 12 on the front and rear sides of the conveying pipe 9 rotate at the same time, so that the front and rear adjusting rods 14 slide alternately back and forth, and the adjusting rod 14 drives the second connecting frame 16 fixed at its outer end to move back and forth, and the second connecting frame 16 drives the glue cotton 17 fixed below to move back and forth to ensure uniform coating, and when the eccentric wheel 12 pushes the adjusting rod 14 to slide, the adjusting rod 14 compresses the supporting spring 15 wrapped around its outer side, and when the eccentric wheel 12 continues to rotate, the elastic action of the supporting spring 15 pushes the adjusting rod 14 to reset, so that the adjusting rod 14 drives the second connecting frame 16 to reset, thereby ensuring the stability of movement.

[0031] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the records in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0032] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A mobile phone motherboard processing patch device capable of evenly coating, comprising: A frame (1), the frame (1) is placed on the ground, and a conveyor belt (2) is installed inside the frame (1); It is characterized by further comprising: A fixing frame (3), wherein a clamping mechanism is arranged above the fixing frame (3), wherein the clamping mechanism comprises a first connecting frame (4), an adjusting wheel (5), a clamping plate (7) and an anti-slip pad (8), and the first connecting frame (4) and the adjusting wheel (5) are meshingly connected; A conveying pipe (9), the conveying pipe (9) is installed on the upper part of the interior of the frame (1), and a forward and backward moving mechanism is arranged on the outer side of the conveying pipe (9), wherein the forward and backward moving mechanism comprises an eccentric wheel (12), an adjusting rod (14), a supporting spring (15) and a second connecting frame (16), the eccentric wheel (12) is symmetrically distributed front and back, and the outer side of the eccentric wheel (12) is tightly fitted with the conveying pipe (9) and the adjusting rod (14).

2. A mobile phone motherboard processing patch device capable of evenly coating according to claim 1, characterized in that: A fixing frame (3) is fixed at the middle of both the front and rear sides of the frame (1), and a first connecting frame (4) is connected to an internal slot above the fixing frame (3), and an adjusting wheel (5) is rotatably connected above the fixing frame (3), and a first motor (6) is installed above the adjusting wheel (5).

3. A mobile phone motherboard processing patch device capable of evenly coating according to claim 2, characterized in that: A clamping plate (7) is fixed to the outer end of the first connection frame (4), and the longitudinal section of the clamping plate (7) is in a "T"-shaped structure. An anti-slip pad (8) is fixed to the lower inner side of the clamping plate (7).

4. A mobile phone motherboard processing patch device capable of evenly coating according to claim 1, characterized in that: A corrugated pipe (10) is installed at the lower end of the delivery pipe (9), and a rubber cotton (17) is fixed at the lower end of the corrugated pipe (10).

5. The device for processing a mobile phone mainboard capable of evenly coating according to claim 1, characterized in that: Support frames (11) are integrally provided on both the front and rear sides of the conveying pipe (9), and an eccentric wheel (12) is rotatably connected above the support frame (11), and a second motor (13) is installed above the eccentric wheel (12).

6. A mobile phone motherboard processing patch device capable of evenly coating according to claim 5, characterized in that: The outer end of the support frame (11) is slidably connected to an adjustment rod (14), and the cross section of the adjustment rod (14) is in a "T"-shaped structure. A support spring (15) is wound around the outer side of the adjustment rod (14), and a second connection frame (16) is welded to the outer end of the adjustment rod (14), and a rubber cotton (17) is fixed below the second connection frame (16).

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