PCB (Printed Circuit Board) locally electroplated with thick gold

Abstract

The utility model relates to the technical field of PCBs, and discloses a PCB locally electroplated with thick gold, comprising an electroplated with thick gold PCB, the upper and lower ends of the electroplated with thick gold PCB are respectively sleeved with an upper protection frame and a lower protection frame, the contact surfaces of the inner side walls of the upper protection frame and the lower protection frame and the electroplated with thick gold PCB are respectively bonded with a flexible protection frame, and the flexible protection frames are respectively bonded with the upper protection frame and the lower protection frame. Pressing holes are formed in the four corners of the top of the upper protection frame, a dustproof breathable layer is detachably installed at the top of the upper protection frame through the pressing holes, the top pressing frame and the pressing nails at the four corners of the bottom of the top pressing frame, and the dustproof breathable layer can cover an opening in the top of the upper protection frame; the upper protection frame and the lower protection frame are respectively sleeved on the upper side and the lower side of the PCB locally electroplated with thick gold, and the dustproof ventilation layer capable of covering the top opening of the upper protection frame is detachably mounted at the top of the upper protection frame, so that the dustproof effect is good on the basis of not influencing heat dissipation, and the dustproof ventilation layer is tight and not prone to falling off. And an external object is prevented from contacting the thick-gold-plated PCB, so that a gold-plated part is prevented from being ground off.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a PCB board with partial thick gold electroplating. Background Art

[0002] During PCB manufacturing, some customers will require that the PCB board be partially plated with thick gold. The thick gold-plated area needs to undergo a gold wire bonding process. Usually, the gold wire bonding process requires a gold thickness of more than 3 microns, and the density of the gold layer must be good. To meet such requirements, the board needs to be electroplated in the gold cylinder for a long time. The existing partially electroplated thick gold PCB boards are generally installed in the fixed part of the shell through the screw holes punched on them.

[0003] After the existing partially electroplated thick gold PCB is installed, the back of the board is usually in contact with the shell, which is not easy to contact with external objects, while the gold-plated part on the top is leaking out and is easy to contact with other parts in the shell, thereby wearing out the gold-plated part of the PCB. Utility Model Content

[0004] The utility model aims to provide a partially electroplated thick gold PCB board. The partially electroplated thick gold PCB board disclosed by the utility model is respectively covered with an upper protection frame and a lower protection frame on the upper and lower sides, and a dustproof and breathable layer that can cover the top opening of the upper protection frame can be detachably installed on the top of the upper protection frame. On the basis of not affecting the heat dissipation, the dustproof effect is good, and the dustproof and breathable layer is tight to prevent foreign objects from contacting the electroplated thick gold PCB board and thereby grinding off the gold-plated part, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a partially thick gold plated PCB board, comprising a thick gold plated PCB board, wherein the upper and lower ends of the thick gold plated PCB board are respectively covered with an upper protection frame and a lower protection frame, and the contact surfaces of the inner side walls of the upper protection frame and the lower protection frame with the thick gold plated PCB board are bonded with flexible protection frames, and the top four corners of the upper protection frame are provided with pressing holes, and the top of the upper protection frame is detachably installed with a dustproof and breathable layer through the pressing holes, the top pressing frame and the pressing nails at the four corners of the bottom of the top pressing frame, and the dustproof and breathable layer can cover the top opening of the upper protection frame, and the middle parts of the four sides of the upper protection frame and the lower protection frame are fixedly installed with mounting ears.

[0006] Preferably, the dust-proof and breathable layer is organza.

[0007] Preferably, circular holes are provided at the four corners of the dustproof and breathable layer corresponding to the pressure holes on the top of the upper protection frame.

[0008] Preferably, the flexible protection frame is made of rubber.

[0009] Preferably, the flexible protection frame is made of silicone material.

[0010] Preferably, the upper protection frame and the lower protection frame both include side frames that can cover a thick gold-plated PCB board, and the ends of the side frames are integrally connected with end frames.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The utility model discloses a partially electroplated thick gold PCB board, the upper and lower sides of which are respectively covered with an upper protection frame and a lower protection frame, and the top of the upper protection frame is detachably provided with a dustproof and breathable layer which can cover the top opening of the upper protection frame. On the basis of not affecting heat dissipation, the dustproof effect is good, and the dustproof and breathable layer is tight, so as to prevent foreign objects from contacting the electroplated thick gold PCB board and thus grinding off the gold-plated part, and solves the problem that after the existing partially electroplated thick gold PCB board is installed, the back of the board is generally attached to the shell and is not easy to contact with foreign objects, while the gold-plated part on the top is leaked and is easy to contact with other parts in the shell, thereby grinding off the gold-plated part of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the explosion structure of the utility model;

[0014] Figure 2 for Figure 1 The structural diagram at A in the middle;

[0015] Figure 3 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 4 for Figure 3 Schematic diagram of the structure at B in the figure.

[0017] In the figure: 1. Electroplated thick gold PCB board; 2. Lower protection frame; 3. Upper protection frame; 4. Mounting ears; 5. Dust-proof and breathable layer; 6. Top pressure frame; 7. Pressure pins; 8. Round holes; 9. Side frame; 10. Flexible protection frame; 11. End frame; 12. Pressure holes. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-Figure 4A partially gold-plated PCB board shown in the figure comprises a gold-plated PCB board 1, wherein an upper protective frame 3 and a lower protective frame 2 are respectively sleeved on the upper and lower ends of the gold-plated PCB board 1, and a flexible protective frame 10 is bonded to the contact surface between the inner side walls of the upper protective frame 3 and the lower protective frame 2 and the gold-plated PCB board 1, and pressing holes 12 are provided at the four corners of the top of the upper protective frame 3, and a dust-proof and breathable layer 5 is detachably installed on the top of the upper protective frame 3 through the pressing holes 12, the top pressing frame 6 and the pressing pins 7 at the four corners of the bottom of the top pressing frame 6, and the dust-proof and breathable layer 5 can cover the top of the upper protective frame 3 At the opening, the upper protection frame 3 and the lower protection frame 2 are fixedly installed with mounting ears 4 in the middle of the four sides. The upper and lower sides of the partially thick gold electroplated PCB board 1 disclosed by the utility model are respectively covered with the upper protection frame 3 and the lower protection frame 2, and the top of the upper protection frame 3 is also detachably installed with a dustproof and breathable layer 5 that can cover the top opening of the upper protection frame 3. On the basis of not affecting the heat dissipation, the dustproof effect is good, and the dustproof and breathable layer 5 is tight to prevent foreign objects from contacting the thick gold electroplated PCB board 1, thereby grinding off the gold-plated part, and can well protect the gold-plated part of the thick gold electroplated PCB board 1.

[0020] Furthermore, the dustproof and breathable layer 5 is made of organza, which is dustproof and breathable; further, round holes 8 are provided at the four corners of the dustproof and breathable layer 5 corresponding to the pressure holes 12 on the top of the upper protection frame 3, which is convenient for installation; further, the flexible protection frame 10 is made of rubber material, which is soft and elastic, and prevents the upper protection frame 3 and the lower protection frame 2 from directly contacting the thick gold-plated PCB board 1, and prevents the thick gold-plated PCB board 1 from being worn; further, the flexible protection frame 10 is made of silicone material, which is soft and elastic, and prevents the upper protection frame 3 and the lower protection frame 2 from directly contacting the thick gold-plated PCB board 1, and prevents the thick gold-plated PCB board 1 from being worn; further, the upper protection frame 3 and the lower protection frame 2 both include side frames 9 that can cover the thick gold-plated PCB board 1, and the ends of the side frames 9 are integrally connected with end frames 11, which can protect the sides and four corners of the thick gold-plated PCB board 1.

[0021] In this solution, when in use, the upper and lower sides of the partially electroplated thick gold PCB board 1 disclosed by the utility model are respectively covered with an upper protection frame 3 and a lower protection frame 2, and the top of the upper protection frame 3 can also be detachably installed with a dustproof and breathable layer 5 that can cover the top opening of the upper protection frame 3. On the basis of not affecting the heat dissipation, the dustproof effect is good, and the dustproof and breathable layer 5 is tight to prevent foreign objects from contacting the electroplated thick gold PCB board 1 and thus grinding off the gold plating. The lower protection frame 2 is clamped on the lower part of the electroplated thick gold PCB board 1, and the upper protection frame 3 is clamped on the upper part of the electroplated thick gold PCB board 1. At this time, the upper protection frame 3 and the lower protection The mounting ears 4 on the frame 2 are aligned, and can be installed at the corresponding position in the shell by bolts, and the dust-proof breathable layer 5 is covered on the top of the upper protective frame 3, and the circular holes 8 at the four corners of the dust-proof breathable layer 5 are aligned with the pressing holes 12 at the four corners of the top of the upper protective frame 3, and the top pressing frame 6 is pressed against the dust-proof breathable layer 5 by the pressing nails 7 at the four corners of its bottom, and can be detachably installed on the top of the upper protective frame 3. Since the dust-proof breathable layer 5 is tight, it prevents foreign objects from directly contacting the top of the thick gold-plated PCB board 1 without affecting the heat dissipation, protects the gold-plated part of the thick gold-plated PCB board 1, and the dust-proof breathable layer 5 can also achieve a dust-proof effect.

[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A partially gold-plated PCB board, comprising a gold-plated PCB board (1), characterized in that: The upper and lower ends of the thick gold-plated PCB (1) are respectively covered with an upper protection frame (3) and a lower protection frame (2); the inner side walls of the upper protection frame (3) and the lower protection frame (2) are bonded with a flexible protection frame (10) at the contact surface with the thick gold-plated PCB (1); the top four corners of the upper protection frame (3) are provided with pressing holes (12); the top of the upper protection frame (3) is detachably installed with a dustproof and breathable layer (5) through the pressing holes (12), the top pressing frame (6) and the pressing pins (7) at the four corners of the bottom of the top pressing frame (6); the dustproof and breathable layer (5) can cover the top opening of the upper protection frame (3); the middle parts of the four sides of the upper protection frame (3) and the lower protection frame (2) are fixedly installed with mounting ears (4).

2. A partially thick gold plated PCB board according to claim 1, characterized in that: The dustproof and breathable layer (5) is organza.

3. A partially thick gold plated PCB board according to claim 2, characterized in that: Circular holes (8) are provided at the four corners of the dustproof and breathable layer (5) corresponding to the top pressure holes (12) of the upper protection frame (3).

4. A partially thick gold plated PCB board according to claim 1, characterized in that: The flexible protection frame (10) is made of rubber material.

5. The partially thick gold plated PCB according to claim 1, characterized in that: The flexible protection frame (10) is made of silicone material.

6. The partially thick gold plated PCB according to claim 1, characterized in that: The upper protection frame (3) and the lower protection frame (2) both include side frames (9) that can sheath a thick gold-plated PCB board (1), and the ends of the side frames (9) are integrally connected with end frames (11).

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