Lightweight fin-shaped radiator used in weight-sensitive electronic equipment

Abstract

The utility model relates to the technical field of radiators, in particular to a light fin-shaped radiator used in weight-sensitive electronic equipment, which comprises a light radiator acting on elements needing temperature control in the weight-sensitive electronic equipment. The light radiator comprises a low-density structural framework and a high-thermal-conductivity film material wound on the low-density structural framework, the high-thermal-conductivity film material is wound along the low-density structural framework to form a fixing part and a radiating part, and the radiating part is supported by the low-density structural framework to form a fin-imitating structure similar to a radiating fin structure; the light radiator with the high heat dissipation effect can be manufactured, and when the light radiator is applied to weight-sensitive electronic products such as unmanned aerial vehicles, low-altitude flight equipment, handheld electronic terminals and intelligent wearable equipment, the weight of the electronic products can be greatly reduced, and meanwhile components, needing temperature control, of the electronic products can be efficiently cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a lightweight fin-shaped radiator used in weight-sensitive electronic equipment. Background Art

[0002] Electronic products such as drones, low-altitude flying equipment, handheld electronic devices, and smart wearable devices are sensitive to weight. As their functions become more and more powerful, their heat dissipation problems become more serious. At present, in order to control the temperature of the chip, a heat dissipation method of fan plus metal heat sink is generally adopted. Although the thermal conductivity of metal is high, its high density will directly increase the weight of the equipment. Therefore, for such products, there is a clear demand for lightweight heat sinks. At present, in the field of drones, graphene or graphene composite layers are generally used to achieve the purpose of heat dissipation for the setting of lightweight heat sinks. For example, the drone circuit control board with graphene-like composite heat dissipation film described in the utility model patent authorization announcement number CN207657295U has a back side of the drone circuit control board body connected to the graphene-like heat dissipation film by thermal conductive insulating glue. Composite heat dissipation film, thermally conductive insulating adhesive is made by mixing adhesive, hexagonal boron nitride and ceramic powder, has good thermal conductivity and excellent insulation performance, and is resistant to high temperature, not easy to detach at high temperature, can transfer heat to the graphene-like composite heat dissipation film well, and serves the purpose of insulation; another example is a drone circuit control board with artificial graphite high conductivity film and its manufacturing method described in the utility model patent application publication number CN107889341A, which uses a composite method to make a drone circuit control board with artificial graphite high conductivity film, and the six surfaces of the artificial graphite film are coated with a thermal conductive layer, and the thermal conductive layer is wrapped around the artificial graphite film to form a "dumpling" structure. The artificial graphite film has a high thermal conductivity of 1500 to 2500 W / (m·K) in the horizontal direction, which can quickly and evenly disperse the heat. However, the above patent technical solutions all stay at the two-dimensional expansion level of heat through high thermal conductivity film, and cannot create a larger heat exchange area, and the utilization efficiency of space is low. Utility Model Content

[0003] The utility model aims to overcome the above-mentioned shortcomings and provide a technical solution that can solve the above-mentioned problems.

[0004] A lightweight fin-shaped heat sink for weight-sensitive electronic devices, including a lightweight heat sink acting on a temperature-controlled element in the weight-sensitive electronic device, the lightweight heat sink including a low-density structural skeleton and a high-thermal-conductivity film material wound on the low-density structural skeleton, the high-thermal-conductivity film material is wound along the low-density structural skeleton to form a fixed portion and a heat dissipation portion, wherein the heat dissipation portion is supported by the low-density structural skeleton to form a simulated fin structure similar to a heat dissipation fin structure;

[0005] The low-density structural skeleton includes a substrate part and a plurality of sheet parts located on the substrate part. The part where the high thermal conductivity film material is wound around the substrate part is the fixing part, and the part where the high thermal conductivity film material is wound around the sheet part is the heat dissipation part.

[0006] Preferably, the low-density structural skeleton is made of compressed foam material, plastic material or porous metal material.

[0007] Preferably, the high thermal conductivity film material is made of graphite, graphene, copper foil, aluminum foil or boron nitride material.

[0008] Preferably, an adhesive layer is provided between the low-density structural skeleton and the high thermal conductivity film material, and the low-density structural skeleton and the high thermal conductivity film material are bonded and fixed via the adhesive layer.

[0009] Preferably, a protective layer is covered and laminated on the outer surface of the high thermal conductivity film material.

[0010] Preferably, the adhesive layer includes pressure-sensitive adhesive or composite adhesive, the protective layer is black PI single-sided adhesive, transparent PI single-sided adhesive or transparent PE single-sided adhesive, the composite adhesive includes a basic double-sided adhesive bonded to the high thermal conductivity film material and a hot melt adhesive bonded to the basic double-sided adhesive, and the high thermal conductivity film material is bonded to the low-density structural skeleton by the hot melt adhesive.

[0011] Preferably, a thermally conductive adhesive is adhered to one side of the high thermally conductive film material corresponding to the fixing portion through a protective layer, and the thermally conductive adhesive is used to attach the lightweight heat sink to a component that requires temperature control.

[0012] Preferably, a metal foil double-sided tape is also adhered to one side of the high thermal conductivity material corresponding to the end of the heat dissipation part through a protective layer, and the metal foil double-sided tape is used to fix the heat dissipation part.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] A lightweight fin-shaped heat sink for weight-sensitive electronic devices is provided, ultra-low-density foam, plastic, porous aluminum, etc. are used as structural support frames, and ultra-high thermal conductivity thin film materials such as graphite and graphene are used as thermal expansion surfaces. Through the structure coated on the frame proposed by the utility model, a low-density composite heat sink is finally made; in this design, the density of materials such as foam and plastic is much lower than that of metal, and the thermal conductivity of thin film materials such as graphite and graphene is much higher than that of metal, and very thin graphite / graphene can be attached to the low-density structural frame to achieve efficient heat dissipation and ultra-low density; thereby, a lightweight heat sink with a high heat dissipation effect can be made, and the application of this lightweight heat sink in weight-sensitive electronic products such as drones, low-altitude flying equipment, handheld electronic terminals, and smart wearable devices will greatly reduce their weight while efficiently dissipating the heat of components of electronic products that need to control temperature.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is a schematic diagram of the laminated structure using composite glue in the utility model;

[0018] Figure 2 It is a schematic diagram of the laminated structure using pressure-sensitive adhesive in the utility model;

[0019] Figure 3 It is a schematic diagram of the structure in which the high thermal conductivity film composite material is closely attached to the wall surface of the mold in the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the compressed foam in the utility model being placed in a mold;

[0021] Figure 5 It is a schematic diagram of the structure of sealing the edge of the high thermal conductivity film composite material in the mold in the utility model;

[0022] Figure 6 It is a structural schematic diagram of a finished lightweight radiator of the utility model.

[0023] The reference numerals and names in the figures are as follows:

[0024] A low-density structural skeleton 10 , a substrate portion 11 , a sheet portion 12 , a high thermal conductivity film material 20 , an adhesive layer 30 , a basic double-sided adhesive 31 , a hot melt adhesive 32 , a protective layer 40 , a thermal conductive adhesive 41 , a metal foil double-sided adhesive 50 , and a mold 60 . DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-6In an embodiment of the utility model, a lightweight fin-shaped heat sink for weight-sensitive electronic devices includes a lightweight heat sink that acts on a temperature control element in a weight-sensitive electronic device. The lightweight heat sink includes a low-density structural skeleton 10 and a high thermal conductivity film material 20 wound on the low-density structural skeleton 10. The high thermal conductivity film material 20 is wound along the low-density structural skeleton 10 to form a fixed portion 21 and a heat dissipation portion 22, wherein the heat dissipation portion 22 is supported by the low-density structural skeleton 10 to form a simulated fin structure similar to a heat dissipation fin structure; specifically, the low-density structural skeleton 10 is made of compressed foam material, plastic material or porous metal material, wherein the porous structure setting can reduce the weight of the low-density structural skeleton 10; the high thermal conductivity film material The material 20 is made of graphite, graphene, copper foil, aluminum foil or boron nitride; an adhesive layer 30 is arranged between the low-density structural skeleton 10 and the high thermal conductivity film material 20, and the low-density structural skeleton 10 and the high thermal conductivity film material 20 are bonded and fixed by the adhesive layer 30, and the outer surface of the high thermal conductivity film material 20 is covered and bonded with a protective layer 40; the adhesive layer 30 includes a pressure-sensitive adhesive or a composite adhesive, and the protective layer 40 is a black PI single-sided adhesive, a transparent PI single-sided adhesive or a transparent PE single-sided adhesive. The pressure-sensitive adhesive is preferably a PET double-sided adhesive. The composite adhesive includes a basic double-sided adhesive 31 bonded to the high thermal conductivity film material 20 and a hot melt adhesive 32 bonded to the basic double-sided adhesive 31. The high thermal conductivity film material 20 is bonded to the low-density structural skeleton 10 through the hot melt adhesive 32.

[0027] The utility model provides a lightweight fin-shaped heat sink for weight-sensitive electronic devices, using ultra-low-density foam, plastic, porous aluminum, etc. as a structural support skeleton, and ultra-high thermal conductivity film materials such as graphite and graphene as a heat expansion surface, which are coated on the skeleton through the process proposed by the utility model to finally form a low-density composite heat sink; in this design, the density of materials such as foam and plastic is much lower than that of metal, and the thermal conductivity of film materials such as graphite and graphene is much higher than that of metal, and very thin graphite / graphene can be attached to the low-density structural skeleton 10 to achieve efficient heat dissipation and ultra-low density; thereby, a lightweight heat sink that makes high thermal conductivity materials lighter and has a higher heat dissipation effect can be achieved, and weight-sensitive electronic products such as drones, low-altitude flight equipment, head-mounted equipment, etc. use this lightweight heat sink, which will be able to reduce their weight to the greatest extent while efficiently dissipating the heat of the heating elements of the electronic products.

[0028] See also Figure 1-6 , the structure of the lightweight heat sink is further defined, a low-density structural skeleton 10 is provided, including a substrate portion 11 and a plurality of sheet portions 12 located on the substrate portion 11, a portion of the high thermal conductivity film material 20 wound around the substrate portion 11 is a fixing portion 21, and a portion of the high thermal conductivity film material 20 wound around the sheet portion 12 is a heat dissipation portion 22;

[0029] A thermally conductive adhesive 41 is also adhered to the side of the fixed part 21 of the high thermal conductivity film material 20 through a protective layer 40. The thermally conductive adhesive 41 is used to be attached to the heating element. A metal foil double-sided adhesive 50 is also adhered to the side of the end of the heat dissipation part of the high thermal conductivity material through a protective layer 40. The metal foil double-sided adhesive 50 can be a copper foil or aluminum foil double-sided adhesive. The metal foil double-sided adhesive 50 is used to fix the heat dissipation part 22.

[0030] See also Figure 1-6 In order to more clearly illustrate the technical solution of the utility model, the technical solution of the utility model will be described in more detail from the manufacturing process of the lightweight radiator:

[0031] Specifically, a graphene film material is used as the high thermal conductivity film material 20, and a compressed foam is used as the low-density structural skeleton 10, and a lightweight heat sink is manufactured through a lightweight heat sink processing process, including the following steps:

[0032] Step 1, prepare materials, list the BOM list according to usage requirements, and divide all materials into specified widths according to the BOM list;

[0033] Step 2: Laminating: using a roll-to-roll laminating machine, laminating the adhesive layer 30 and the protective layer 40 on the front and back surfaces of the graphene film material, respectively, and rolling up the laminated high thermal conductivity film composite material;

[0034] Step 3, molding, the laminated high thermal conductivity film composite material is fixed and molded with a mold 60, the two sides of the mold 60 are through structures, the mold 60 is provided with a plurality of sheet grooves corresponding to the sheet part 12 and a receiving groove corresponding to the substrate part 11 on the sheet groove, wherein the high thermal conductivity film composite material is close to the wall of the sheet groove and the receiving groove, and both ends or one end of the high thermal conductivity film composite material extends out of the mold 60, and the extended end extends along the wall of the receiving groove and is in a pre-sealed state. After the compressed foam is placed, the extended end is attached to the substrate part 11 for edge sealing; if the adhesive layer 30 uses hot melt adhesive 32, the front mold is covered after the edge sealing, and the hot melt adhesive 32 is sent into the heating chamber for hot-melt bonding to the main compressed foam, and the lightweight heat dissipation material is formed after cooling;

[0035] Step 4, back glue, place the lightweight heat dissipation material on the workbench, adhere a layer of thermal conductive adhesive 41 to the side of the graphene film material corresponding to the fixed part 21, adhere a layer of metal foil double-sided adhesive 50 to the side of the high thermal conductivity material corresponding to the end of the heat dissipation part, and adhere a thermal conductive adhesive 41 to the side of the graphene film material corresponding to the fixed part 21 through the protective layer 40. The thermal conductive adhesive 41 is used to be attached to the heating element, and a metal foil double-sided adhesive 50 is also adhered to the side of the high thermal conductivity material corresponding to the end of the heat dissipation part through the protective layer 40. The metal foil double-sided adhesive 50 is used to fix the heat dissipation part 22 to make a lightweight heat sink.

[0036] Step 5, cutting, cutting the lightweight radiator preliminary product into a specified shape according to usage requirements to make a finished lightweight radiator.

[0037] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A lightweight fin-shaped heat sink for weight-sensitive electronic devices, comprising a lightweight heat sink for weight-sensitive electronic devices that require temperature control, characterized in that: The lightweight heat sink comprises a low-density structural frame and a high thermal conductivity film material wound on the low-density structural frame, wherein the high thermal conductivity film material is wound along the low-density structural frame to form a fixed portion and a heat dissipation portion, wherein the heat dissipation portion is supported by the low-density structural frame to form a simulated fin structure similar to a heat dissipation fin structure; The low-density structural skeleton includes a substrate part and a plurality of sheet parts located on the substrate part. The part where the high thermal conductivity film material is wound around the substrate part is the fixing part, and the part where the high thermal conductivity film material is wound around the sheet part is the heat dissipation part.

2. A lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: The low-density structural skeleton is made of compressed foam material, plastic material or porous metal material.

3. A lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: The high thermal conductivity film material is made of graphite, graphene, copper foil, aluminum foil or boron nitride material.

4. A lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: An adhesive layer is arranged between the low-density structural skeleton and the high-thermal-conductivity film material, and the low-density structural skeleton and the high-thermal-conductivity film material are bonded and fixed through the adhesive layer.

5. The lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: The outer surface of the high thermal conductivity film material is covered with a protective layer.

6. A lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 4, characterized in that: The adhesive layer includes pressure-sensitive adhesive or composite adhesive, the protective layer is black PI single-sided adhesive, transparent PI single-sided adhesive or transparent PE single-sided adhesive, the composite adhesive includes basic double-sided adhesive bonded to the high thermal conductivity film material and hot melt adhesive bonded to the basic double-sided adhesive, and the high thermal conductivity film material is bonded to the low-density structural skeleton through hot melt adhesive.

7. A lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: A thermal conductive adhesive is also adhered to one side of the fixing portion corresponding to the high thermal conductive film material through a protective layer. The thermal conductive adhesive is used to attach the lightweight heat sink to a component that needs temperature control.

8. The lightweight fin-shaped heat sink for weight-sensitive electronic equipment according to claim 1, characterized in that: A metal foil double-sided tape is also attached to one side of the end of the high thermal conductivity material corresponding to the heat dissipation part through a protective layer, and the metal foil double-sided tape is used to fix the heat dissipation part.

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