Anti-collision TOP type LED lamp bead

Abstract

The utility model relates to the technical field of LED packaging, and discloses an anti-collision TOP type LED lamp bead, which comprises an LED light-emitting chip, a light-emitting diode chip, a light-emitting diode chip and a light-emitting diode chip, the substrate is used for fixedly mounting the LED light-emitting chip; the LED bracket is arranged on the substrate, and the LED luminous chip is arranged at the bottom of the LED bracket; the LED support is arranged on the substrate, the pins are arranged on the back face of the LED support and connected with the substrate, the pins are bent inwards to form bent parts, concave areas are formed on the outer surfaces of the bent parts, the pins are fixed to a PCB through curing paste, and the concave areas are filled with the curing paste. According to the anti-collision TOP type LED lamp bead, the binding force between the LED lamp bead and the PCB can be increased, and the problem that an LED display module is prone to falling off when being frequently used outdoors is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a collision-resistant TOP-type LED lamp bead. Background Art

[0002] LED display screens are made up of PCB modules, and the front of the PCB module is made up of lamp beads. With the widespread application of display technology and the country's policy support for commercial displays, LED displays will be used in more and more occasions, so the application of LED display devices, which are key components of the display screen, has become more important. Especially when outdoor display rental product modules are frequently used, the combination of LED and PCB board is very important. LED display modules will inevitably be bumped during frequent use, causing the lamp beads to fall off, or the lamp beads themselves are not firm when they are pasted, and they are easy to fall off during subsequent use, resulting in the lack of brightness of a single pixel of the LED module, affecting the display effect.

[0003] The existing TOP type LED devices use TOP stamping injection molding brackets as brackets. The brackets are divided into two sides, the front side is made of plastic and stamped metal parts as the functional area of ​​the lamp bead. The plastic part is formed into a bowl by injection molding to protect the functional area. The back side is composed of plastic and pins. The front functional area uses silver glue or insulating glue to fix the chip in the functional area, and then the bonding wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The bracket is sealed with glue through the glue dispensing process, and then the material is blanked into RGB three-primary color lamp beads. The current lamp bead structure has a smooth plane pin. When the LED lamp bead is mounted, the pin has a limited area to eat tin, which makes the LED lamp bead not so firm after mounting, and the thrust of the lamp bead is often relatively low. Summary of the invention

[0004] The technical problem to be solved by the utility model is to provide a TOP-type LED lamp bead that is anti-collision, increase the bonding strength between the LED lamp bead and the PCB board, and solve the problem that the LED display module is easy to fall when frequently used outdoors.

[0005] In order to solve the above technical problems, the utility model provides a collision-proof TOP-type LED lamp bead, comprising:

[0006] LED light-emitting chip;

[0007] A substrate for fixing and mounting LED light-emitting chips;

[0008] An LED bracket is arranged on the substrate, and the LED light emitting chip is arranged at the bottom of the LED bracket;

[0009] A pin is arranged on the back of the LED bracket and connected to the substrate. The pin is bent inward to form a bent portion. The outer surface of the bent portion forms a plurality of recessed areas. The pin is fixed to the PCB board by a curing paste, and the curing paste fills the recessed areas.

[0010] As an improvement of the above solution, the recessed area at least includes a first recessed area and a second recessed area, and the first recessed area and the second recessed area are different in size and shape.

[0011] As an improvement of the above solution, the inner wall of the recessed area is further provided with a plurality of sub-recessed areas.

[0012] As an improvement of the above solution, the pin includes a first pin segment extending outward from the top of the substrate and a second pin segment bent inward from the bottom of the substrate, the first pin segment has a step portion, and the recessed area is provided in the second pin segment.

[0013] As an improvement of the above solution, the LED bracket is a bowl-shaped bracket, and a common anode and a cathode connected to the pins are also provided at the bottom. The two ends of the LED light-emitting chip are respectively connected to the common anode and cathode through bonding wires, and are connected to the PCB board through the pins.

[0014] As an improvement of the above solution, the substrate is a metal layer;

[0015] As an improvement of the above solution, the curing paste is solder paste;

[0016] As an improvement of the above solution, the LED bracket is a PPA bracket.

[0017] As an improvement of the above solution, the LED light-emitting chip is fixedly mounted on the substrate through a bonding adhesive layer.

[0018] As an improvement of the above solution, the interior of the LED bracket is filled with packaging glue for sealing and protecting the LED light-emitting chip.

[0019] The implementation of this utility model has the following beneficial effects:

[0020] In the utility model, a recessed area is formed on the outer surface of the bent portion of the pin, and curing paste is filled in the recessed area, so that the pin has higher mechanical anchoring when being cured and bonded on the PCB board, and the contact area between the curing paste and the pin is increased. When the lamp bead is re-mounted, the firm and seamless welding area formed between the pin and the curing paste can be increased, and the bonding force between the LED lamp bead and the PCB board is increased, so that the LED lamp bead is not prone to lack of light or falling off, the anti-collision performance of the LED lamp bead is enhanced, and the possibility of frequent outdoor use is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 : The working diagram of the LED lamp bead patch in the utility model;

[0022] Figure 2 : A schematic diagram of the structure of the side of the LED lamp bead in the utility model;

[0023] Figure 3 : A schematic diagram of the structure of the back side of the LED lamp bead in the utility model;

[0024] Figure 4 :In the utility model Figure 2 A partial enlarged view of the pin part;

[0025] Figure 5 : A schematic diagram of the top view of the LED lamp bead in the utility model;

[0026] Reference numerals:

[0027] 1-LED light-emitting chip; 2-substrate; 3-LED bracket; 4-pin; 41-first pin segment; 42-second pin segment; 5-recessed area; 51-first recessed area; 52-second recessed area; 53-sub-recessed area; 6-curing paste; 7-PCB board; 8-bonding wire; 9-solidifying glue layer; 10-packaging glue. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model is further described in detail with specific embodiments below.

[0029] To solve the above problems, please refer to Figures 1 to 4 The first aspect of the utility model provides a collision-proof TOP-type LED lamp bead, comprising:

[0030] LED light emitting chip 1;

[0031] A substrate 2 for fixing and mounting the LED light emitting chip 1;

[0032] An LED bracket 3 is arranged on the substrate 2, and an LED light emitting chip 1 is arranged at the bottom of the LED bracket 3;

[0033] A pin 4 is arranged on the back of the LED bracket 3 and connected to the substrate 2. The pin 4 is bent inward to form a bent portion, and a plurality of recessed areas 5 are formed on the outer surface of the bent portion. The pin 4 is fixed on the PCB board 7 by a curing paste 6, and the curing paste 6 fills the recessed areas 5.

[0034] In the utility model, a plurality of recessed areas 5 are formed on the outer surface of the bent portion of the pin, and the recessed areas 5 are filled with curing paste 6 and cured on the PCB board 7, so that the pin 4 and the PCB board 7 have a higher mechanical anchoring property, and the contact area between the curing paste 6 and the pin 4 is increased. When the lamp bead is re-mounted, the firm and seamless welding area formed between the pin 4 and the curing paste 6 can be increased, thereby increasing the bonding force between the LED lamp bead and the PCB board 7, making it less likely for the LED lamp bead to fail to light up or fall off, thereby enhancing the anti-collision performance of the LED lamp bead and extending its service life under frequent outdoor use.

[0035] Preferably, the substrate 2 is a metal layer, and the metal includes but is not limited to high heat dissipation materials such as Al and Cu, and the metal layer can be formed by metal stamping.

[0036] See also Figure 2 and Figure 3 The pin 4 includes a first pin segment 41 extending outward from the top of the substrate 2 and a second pin segment 42 bent inward from the bottom of the substrate 2. The first pin segment 41 has a step portion, and the recessed area 5 is provided in the second pin segment 42. The step portion is a single step shape. The structure of the pin 4 is designed to lengthen the path for external humid air, impurities, etc. to enter the interior of the bracket bowl, thereby increasing the air tightness of the bracket. In some embodiments, the pin 4 is made of metal, and can be the same metal as the substrate 2.

[0037] See also Figure 4 , the recessed area 5 at least includes a first recessed area 51 and a second recessed area 52, the first recessed area 51 and the second recessed area 52 can cooperate with each other, while increasing the contact area between the pin 4 and the curing paste 6, the bonding strength of the TOP type LED lamp bead on the PCB board 7 is fixedly enhanced, and the anti-collision performance of the TOP type LED lamp bead is better improved. The size and shape of the first recessed area 51 and the second recessed area 52 are different, and the size of the first recessed area 51 can be larger than the size of the second recessed area 52, or the size of the second recessed area 52 can be larger than the size of the first recessed area 51. The structure of the recessed area 5 can be a regular sawtooth roughening shape, such as a triangle, a semicircle, etc., or an irregular roughening shape. More preferably, the structure of the recessed area 5 is an irregular groove shape. When the LED lamp bead is fixed on the PCB board 7, the curing paste 6 enters the recessed area 5 of the groove structure and fills the groove part. After curing, the recessed area 5 and the curing paste 6 are equivalent to forming a rivet structure, which can further increase the bonding between the lamp bead and the PCB board 7.

[0038] Furthermore, the inner wall of the recessed area 5 is also provided with a plurality of sub-recessed areas 53. The setting of the plurality of sub-recessed areas 53 can further expand the contact area between the first recessed area 51 or the second recessed area 52 and the curing paste 6, which helps to further increase the bonding force between the pin 4 and the PCB board 7, and improve the anti-collision performance of the TOP type LED lamp bead.

[0039] The concave area 5 in the present invention is a concave structure obtained by stamping roughening. The stamping roughening can realize the quality control of the roughened surface, forming a concave area 5 with a specific shape and specific roughness, and has high production efficiency, simple operation, and reduced material consumption. Of course, other roughening methods can also be used for roughening, such as sandblasting, tumbling, chemical roughening, sandpaper polishing, etc.

[0040] In some embodiments, the curing paste 6 is solder paste, which is beneficial to improving the welding quality and improving the performance and stability of the TOP type LED display device. Of course, the curing paste 6 can also be other curing pastes commonly used in the art.

[0041] In some embodiments, the LED bracket 3 is a bowl-shaped bracket, and the material of the LED bracket 3 is a plastic material. More preferably, the LED bracket 3 is a PPA bracket. The PPA bracket formed by stamping and injection molding has high strength, good support when used as a bracket, and excellent heat resistance, making PPA particularly suitable for applications that require high-temperature welding processes, such as electronic connectors for surface mount technology (SMT). The PPA bracket can be specifically prepared by stamping and injection molding.

[0042] See also Figure 5 The bottom of the bowl is provided with an LED light-emitting chip 1, which can be a single-color LED light-emitting chip or a multi-color LED light-emitting chip. The LED light-emitting chip 1 is fixedly mounted on the substrate 2 through a solid crystal adhesive layer 9, and the solid crystal adhesive layer 9 includes a silver-type conductive solid crystal adhesive layer, an insulating solid crystal adhesive layer, an epoxy solid crystal adhesive layer, a silicone solid crystal adhesive layer, etc. The interior of the LED bracket 3 is filled with a packaging glue 10 for sealing and protecting the LED light-emitting chip 1, which encapsulates the LED light-emitting chip 1 to protect the LED light-emitting chip 1 from moisture, dust, chemicals, etc. in the external environment, and at the same time, the electrodes and leads in the LED light-emitting chip 1 are sealed and covered to ensure the reliability of the electrical connection, thereby extending the service life of the LED.

[0043] The bottom of the LED bracket 3 is also provided with a common anode and a cathode (not shown in the figure) connected to the pins 4. The two ends of the LED light-emitting chip 1 are respectively connected to the common anode and cathode through bonding wires 10, and are connected to the PCB board 7 through the pins 4. The number of pins 4 corresponds to the number of common anodes and cathodes, and adjacent pins 4 can be separated by insulating glue to avoid mutual interference. In some embodiments, the LED light-emitting chip 1 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The red light-emitting chip is connected to the common anode and the red cathode through the bonding wire 10; the green light-emitting chip is connected to the common anode and the green cathode through the bonding wire 10; the blue light-emitting chip is connected to the common anode and the blue cathode through the bonding wire 10.

[0044] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope covered by the present invention.

Claims

1. A bump-proof TOP-type LED lamp bead, characterized in that: include: LED light-emitting chip; A substrate for fixing and mounting LED light-emitting chips; An LED bracket is arranged on the substrate, and the LED light emitting chip is arranged at the bottom of the LED bracket; A pin is arranged on the back of the LED bracket and connected to the substrate. The pin is bent inward to form a bent portion. The outer surface of the bent portion forms a plurality of recessed areas. The pin is fixed to the PCB board by a curing paste, and the curing paste fills the recessed areas.

2. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The recessed area at least includes a first recessed area and a second recessed area, and the first recessed area and the second recessed area are different in size and shape.

3. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The inner wall of the recessed area is also provided with a plurality of sub-recessed areas.

4. The anti-collision TOP type LED lamp bead according to claim 1, characterized in that: The pin includes a first pin segment extending outward from the top of the substrate and a second pin segment bent inward from the bottom of the substrate, the first pin segment has a step portion, and the recessed area is provided in the second pin segment.

5. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The LED bracket is a bowl-shaped bracket, and a common anode and a cathode connected to the pins are also provided at the bottom thereof. The two ends of the LED light-emitting chip are respectively connected to the common anode and the cathode through bonding wires, and are connected to the PCB board through the pins.

6. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The substrate is a metal layer.

7. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The LED bracket is a PPA bracket.

8. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The curing paste is solder paste.

9. The anti-collision TOP type LED lamp bead as claimed in claim 1, characterized in that: The LED light emitting chip is fixedly mounted on the substrate through a solid crystal adhesive layer.

10. The anti-collision TOP type LED lamp bead according to claim 1, characterized in that: The interior of the LED bracket is filled with packaging glue for sealing and protecting the LED light-emitting chip.

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