Vacuum nano-silver sintering pressurizing device

Abstract

The utility model relates to a vacuum nano-silver sintering pressurizing device which comprises a welding carrier plate, a pressing block and a power assembly, the welding carrier plate is provided with a positioning groove, and the pressing block is arranged on the welding carrier plate and covers the positioning groove; the power assembly comprises a pressing rod abutting against the top end of the pressing block and two supporting seats connected to the two ends of the welding carrier plate correspondingly, supporting through holes are formed in the supporting seats, the two ends of the pressing rod extend into the supporting through holes correspondingly, a driving piece is arranged in one supporting through hole, and a driving piece is arranged in the other supporting through hole; and the driving piece is configured to be capable of driving one end of the pressing rod to move downwards. According to the vacuum nano-silver sintering pressurizing device, pressurizing operation can be achieved through the simple power assembly, it can be guaranteed that pressure acting on chips in the positioning grooves is even, the device is of a pure mechanical structure, complex structures such as pipelines and switches do not need to be additionally arranged, cost can be effectively controlled, and occupied space is small.

Description

Technical Field

[0001] The utility model relates to the technical field of sintering and pressurizing, in particular to a vacuum nano silver sintering and pressurizing device. Background Art

[0002] Low-temperature sintering of nanosilver solder paste is a technology that connects nanosilver at a temperature lower than its metal melting point to form a metal sintered body. This technology is usually used to sinter the chip and copper plate during IGBT module manufacturing. If a certain pressure is applied to the chip during sintering, the sintering efficiency will be greatly improved. At present, a hot press with a hydraulic system is usually used to achieve pressurized sintering of the chip. For example, the patent with publication number CN215826010U and the name "A Memory Card Processing Hot Press" discloses the use of a lifting hydraulic cylinder with a guide column and a hot pressing block structure to pressurize the memory card. The hot press includes a hydraulic structure and pipelines, which not only takes up a large space and has high cost, but also its guide column is prone to deformation in a high temperature environment, which in turn affects its guiding accuracy and makes the pressure uneven. Utility Model Content

[0003] The purpose of the utility model is to provide a vacuum nano-silver sintering pressurizing device, which can solve the technical problems mentioned in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a vacuum nano-silver sintering pressurizing device, comprising a welding carrier, a pressing block and a power assembly, wherein the welding carrier is provided with a positioning groove, the pressing block is placed on the welding carrier and covers the positioning groove; the power assembly comprises a pressing rod abutting against the top of the pressing block, and two supporting seats respectively connected to the two ends of the welding carrier, the supporting seat is provided with a supporting through hole, the two ends of the pressing rod are respectively extended into the supporting through holes, a driving member is provided in one of the supporting through holes, and the driving member is constructed to be able to drive one end of the pressing rod downward.

[0005] As a preferred solution, a positioning pin is provided in the other supporting through hole along the height direction, and an opening groove is provided at one end of the corresponding pressure rod. The positioning pin is arranged in the opening groove to ensure that the position of the pressure rod at this end does not shift.

[0006] As a preferred solution, the driving member includes a cam and a driving shaft arranged in an eccentric through hole of the cam, the cam abuts against one end of the pressure rod, and the driving shaft passes through a corresponding supporting seat.

[0007] As a preferred solution, a guide key is provided in the section of the drive shaft corresponding to the cam, and the cam is provided with a keyway matched with the guide key to ensure the rotation consistency of the drive shaft and the cam.

[0008] As a preferred embodiment, the pressure rod includes two pressure plates set at an angle, and two connecting ends respectively connected to the two ends of the two pressure plates. The intersection of the pressure plates is constructed as a horizontal force end, and the force end abuts against the pressure block. This arrangement can minimize the contact area between the pressure rod and the pressure block to ensure uniform pressure.

[0009] As a preferred solution, the connecting end, the pressure plate and the force-carrying end are integrally formed and connected to ensure the stability of the pressure rod.

[0010] As a preferred solution, the positioning grooves are arranged in a plurality of groups, and the positioning grooves are evenly distributed with the force-applying end of the pressure rod as the center, so as to ensure that the pressure exerted on the chip is uniform.

[0011] As a preferred solution, the positioning grooves are arranged as a group, and the positioning grooves correspond to the positions of the force-applying ends of the pressure rods.

[0012] Compared with the prior art, the utility model has the following beneficial effects: the vacuum nanosilver sintering pressurizing device provided by the utility model can realize pressurizing operation by simply setting a power component, and by setting the special shape of the pressure rod so that it is in line contact with the pressure block, reducing its contact area, and avoiding the situation where the pressure on each chip is uneven, and the positioning grooves are all set around the force end to ensure that the pressure acting on the chips in each positioning groove is uniform. The device is a purely mechanical structure, without the need to add complex structures such as pipelines and switches, can effectively control costs, and occupies a small space. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of the vacuum nano-silver sintering pressurizing device in the embodiment of the utility model;

[0014] Figure 2 This is a front view of the vacuum nanosilver sintering pressurizing device in the embodiment of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the pressure rod in the embodiment of the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the first support seat in the embodiment of the utility model;

[0017] Figure 5 A cross-sectional view of a driving member in an embodiment of the utility model;

[0018] Figure 6 It is a structural schematic diagram of a welding carrier plate in an embodiment of the utility model.

[0019] The meaning of each number in the figure is:

[0020] 1. Welding carrier plate; 11. Positioning groove; 2. Press block; 3. Press rod; 31. Press plate; 32. Connecting end; 33. Force end; 34. Opening groove; 4. Support seat; 41. First support seat; 42. Second support seat; 411. Mounting through hole; 5. Support through hole; 51. First support through hole; 52. Second support through hole; 6. Driving member; 61. Cam; 611. Keyway; 63. Driving shaft; 631. Guide key; 7. Positioning pin. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] The present embodiment discloses a vacuum nano-silver sintering pressurizing device, which is used in the manufacturing process of an IGBT module to pressurize a chip and a copper plate covered with nano-silver solder paste to improve the sintering efficiency.

[0024] See also Figure 1 , Figure 2 The vacuum nanosilver sintering pressurizing device comprises a welding carrier plate 1 for carrying the part to be sintered, a pressing block 2 pressed on the welding carrier plate 1, and a power component for applying pressure to the pressing block 2. The pressure applied by the power component is transmitted to the part to be sintered through the pressing block 2.

[0025] Combination Figure 6 A positioning groove 11 matching the shape of the copper plate is provided at the center of the welding carrier 1, and the copper plate and chip to be sintered are placed in the positioning groove 11.

[0026] There is one pressing block 2, which is placed above the welding carrier 1 and covers all the positioning grooves 11. In this embodiment, the shape of the pressing block 2 is preferably a rectangular body consistent with the shape of the positioning groove 11, and other shapes can also be used as needed.

[0027] See again Figure 1 The power assembly includes a pressure rod 3 abutting against the top of the pressure block 2, and the two ends of the pressure rod 3 are connected through two support seats 4 respectively fixedly connected to the two ends of the welding carrier plate 1. The two support seats 4 are respectively distributed on both sides of the pressure block 2, and the two support seats 4 are respectively provided with support through holes 5, and the two ends of the pressure rod 3 extend into the support through holes 5. A driving member 6 is also connected to the support through hole 5 of one of the support seats 4, and the driving member 6 is configured to apply pressure to one end of the pressure rod 3 to drive it downward; a positioning pin 7 is provided in the support through hole 5 of the other support seat 4, and the positioning pin 7 is connected to the other end of the pressure rod 3 to ensure that the position of the pressure rod 3 at this end does not deviate to prevent the pressure from deviating.

[0028] For the convenience of distinction, the two support seats 4 are defined as a first support seat 41 and a second support seat 42, respectively. The first support seat 41 is provided with a first support through hole 51, and the second support seat 42 is provided with a second support through hole 52. Figure 4 , Figure 5 , the driving member 6 in the first supporting through hole 51 includes a cam 61 and a driving shaft 63 for driving the cam 61 to rotate, and one end of the pressure rod 3 abuts against the bottom end of the cam 61. In this embodiment, an eccentric through hole is provided at the center of the cam 61, and the driving shaft 63 passes through the eccentric through hole. Correspondingly, the first supporting seat 41 is provided with a mounting through hole 411 for passing the driving shaft 63. The cam 61 can be driven to rotate by twisting the driving shaft 63 by external force, thereby pressing down one end of the pressure rod 3. In order to ensure the rotation consistency of the driving shaft 63 and the cam 61, in this embodiment, the driving shaft 63 is provided with two relatively arranged guide keys 631 in the section corresponding to the cam 61, and the cam 61 is provided with a keyway 611 adapted to the guide key 631.

[0029] like Figure 1 As shown, a positioning pin 7 is fixedly provided in the second supporting through hole 52 along the height direction, and an end of the pressure rod 3 extending into the supporting through hole 5 is provided with an opening groove 34, and the spacing of the opening groove 34 matches the outer diameter of the positioning pin 7. The positioning pin 7 is arranged in the opening groove 34, and the position of this end of the pressure rod 3 is jointly limited by the positioning pin 7 and the second supporting through hole 52 to prevent it from being offset.

[0030] Because the driving force acts on one end of the pressure rod 3, in order to ensure uniform pressure in this state, in this embodiment, the pressure rod 3 acts on the center of the pressure block 2, and the pressure rod 3 and the top of the pressure block 2 are in line contact. Figure 3Specifically, the pressure rod 3 is further structured to include two pressure plates 31 arranged at an angle, and two connecting ends 32 respectively connected to both ends of the two pressure plates 31, and the intersection of the two pressure plates 31 is configured as a horizontally arranged force end 33, which abuts against the pressure block 2 and acts on the center of the pressure block 2, and the two connecting ends 32 are arranged horizontally and extend into the two supporting through holes 5 respectively. To ensure the stability of the pressure rod 3, the connecting end 32, the pressure plate 31 and the force end 33 are all integrally formed and connected.

[0031] When the driving force acts on one end of the pressure rod 3, the end is pressed down, and the movement of the other end of the pressure rod 3 is limited, so that the force end 33 is pressed down and acts on the pressure block 2. When the positioning grooves 11 on the welding machine carrier are arranged in multiple groups, in order to ensure uniform pressure on the chip, the positioning grooves 11 should be evenly distributed with the force end 33 of the pressure rod 3 as the center. The positioning grooves 11 can also be arranged in one group, which corresponds to the position of the force end 33.

[0032] In actual application, the drive shaft 63 is rotated by using a wrench or a handle to make the pressure rod 3 generate pressure to act on the pressing block 2, and then the entire device is transferred to a vacuum reflow furnace for sintering.

[0033] The vacuum nanosilver sintering pressurizing device provided in this embodiment can realize pressurizing operation by simply setting a power component, and by reducing the contact area between the pressing rod 3 and the pressing block 2, and arranging the positioning grooves 11 around the force end 33, it is ensured that the pressure acting on the chips in each positioning groove 11 is uniform. This device is a purely mechanical structure, does not need to add complex structures such as pipelines and switches, can effectively control costs, and occupies a small space.

[0034] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A vacuum nano-silver sintering pressurizing device, characterized in that: include: A welding carrier plate (1), wherein the welding carrier plate (1) is provided with a positioning groove (11); A pressing block (2), the pressing block (2) being placed on the welding carrier plate (1) and covering the positioning groove (11); The power assembly comprises a pressure rod (3) abutting against the top end of the pressure block (2), and two support seats (4) respectively connected to the two ends of the welding carrier plate (1), wherein the support seats (4) are provided with support through holes (5), and the two ends of the pressure rod (3) respectively extend into the support through holes (5), wherein a driving member (6) is provided in one of the support through holes (5), and the driving member (6) is constructed to be able to drive one end of the pressure rod (3) downward.

2. The vacuum nanosilver sintering pressurizing device according to claim 1, characterized in that: A positioning pin (7) is arranged in the other supporting through hole (5) along the height direction, and an opening groove (34) is arranged at one end of the corresponding pressure rod (3), and the positioning pin (7) is arranged in the opening groove (34).

3. The vacuum nanosilver sintering pressurizing device according to claim 1, characterized in that: The driving member (6) comprises a cam (61) and a driving shaft (63) arranged in an eccentric through hole of the cam (61); the cam (61) abuts against one end of the pressure rod (3); and the driving shaft (63) passes through a corresponding supporting seat (4).

4. The vacuum nanosilver sintering pressurizing device according to claim 3, characterized in that: The driving shaft (63) is provided with a guide key (631) in a section corresponding to the cam (61), and the cam (61) is provided with a keyway (611) adapted to the guide key (631).

5. The vacuum nanosilver sintering pressurizing device according to claim 1, characterized in that: The pressure rod (3) comprises two pressure plates (31) arranged at an angle, and two connecting ends (32) respectively connected to the two ends of the two pressure plates (31); the intersection of the pressure plates (31) is configured as a horizontal force end (33), and the force end (33) abuts against the pressure block (2).

6. The vacuum nanosilver sintering pressurizing device according to claim 5, characterized in that: The connecting end (32), the pressing plate (31) and the force-applying end (33) are integrally formed and connected.

7. The vacuum nanosilver sintering pressurizing device according to claim 5, characterized in that: The positioning grooves (11) are arranged in a plurality of groups, and the positioning grooves (11) are evenly distributed with the force-applying end (33) of the pressure rod (3) as the center.

8. The vacuum nanosilver sintering pressurizing device according to claim 5, characterized in that: The positioning grooves (11) are arranged as a group, and the positioning grooves (11) correspond to the positions of the force-applying ends (33) of the pressure rods (3).

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