Heating device and silicon material processing equipment

Abstract

The embodiment of the utility model relates to the technical field of silicon material preparation, and particularly discloses a heating device and silicon material processing equipment, the heating device is applied to silicon material heating, and the heating device comprises a shell, a guide rail, a carrier and a heating assembly. A heating cavity is formed in the shell. And the guide rail is arranged in the heating cavity. The carrier is movably connected to the guide rail, and the carrier is used for bearing the silicon material. The heating assembly is installed on the shell, at least part of the heating assembly stretches into the heating cavity, and the heating assembly is used for heating the interior of the heating cavity. Through the structure, in the heating cavity, the carrier carries the material to move along the guide rail, so that the structure in the heating cavity is simple, the carrier is prevented from bumping, and the damage to the silicon material is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of silicon material preparation, and in particular to a heating device and silicon material processing equipment. Background Art

[0002] Silicon material is an important semiconductor material, with the chemical element symbol Si. Silicon used in the electronics industry should have high purity and excellent electrical and mechanical properties. Silicon is the most abundant element semiconductor in the earth's crust, with superior properties and relatively mature process technology, and has become the main raw material for solid-state electronic devices.

[0003] In the process of realizing the present application, the inventor found that: currently, a heating device is often required for the processing of silicon materials. In the current heating device, a stepping mechanism is often used to transport silicon materials and carriers containing silicon materials, but the stepping mechanism has a complex structure, which can easily cause the carrier to shake and damage the silicon materials, making it inconvenient to use. Utility Model Content

[0004] The embodiments of the present application provide a heating device and silicon material processing equipment, which can improve the current situation in which the stepping mechanism has a complex structure, is prone to cause carrier bumps, and thus damages the silicon material, and is inconvenient to use.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: a heating device is provided, which is applied to the heating of silicon material, and the heating device includes a shell, a guide rail, a carrier and a heating component. A heating chamber is arranged inside the shell. The guide rail is arranged in the heating chamber. The carrier is movably connected to the guide rail, and the carrier is used to carry the silicon material. The heating component is installed on the shell, and the heating component at least partially extends into the heating chamber, and the heating component is used to heat the inside of the heating chamber.

[0006] Optionally, the shell comprises an outer shell, an inner shell and a bottom plate, the outer shell is buckled outside the inner shell, the outer shell and the inner shell are respectively mounted on the bottom plate, and the bottom plate and the inner shell together enclose the heating chamber. The guide rail is mounted on the bottom plate, and the heating component passes through the inner shell from the outer shell and extends into the heating chamber.

[0007] Optionally, the inner shell is provided with a limiting portion facing the heating chamber, and a surface of the carrier facing away from the guide rail abuts against the limiting portion.

[0008] Optionally, the heating device further comprises a heat-insulating layer, and the heat-insulating layer is installed between the outer shell and the inner shell.

[0009] Optionally, the heating device further comprises a temperature sensor and a first sleeve, wherein the first sleeve passes through the outer shell and the inner shell and extends into the heating chamber, and the temperature sensor is mounted on the first sleeve.

[0010] Optionally, the heating device further comprises a second sleeve, the second sleeve passes through the outer shell and the inner shell and extends into the heating chamber, and the second sleeve is used for introducing an inert gas into the heating chamber.

[0011] Optionally, the outer shell is made of stainless steel; and / or the inner shell is made of a quartz plate; and / or the guide rail is made of quartz or polytetrafluoroethylene material.

[0012] Optionally, the heating assembly includes a plurality of heating tubes, and the plurality of heating tubes are sequentially spaced apart along the moving direction of the carrier.

[0013] Optionally, each of the heating tubes includes a heating portion and a heat insulating portion, the heat insulating portion is arranged away from the guide rail, and the heating portion is arranged toward the guide rail.

[0014] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a silicon material processing equipment, including the above heating device.

[0015] The beneficial effect of the embodiments of the present application is as follows: Different from the prior art, the embodiments of the present application provide a heating device for heating silicon materials, and the heating device includes a shell, a guide rail, a carrier and a heating component. A heating chamber is provided inside the shell. The guide rail is provided in the heating chamber. The carrier is movably connected to the guide rail, and the carrier is used to carry the silicon material. The heating component is mounted on the shell, and the heating component at least partially extends into the heating chamber, and the heating component is used to heat the inside of the heating chamber. Through the above structure, in the heating chamber, the carrier carries the material and moves along the guide rail, thereby making the structure inside the heating chamber simple, preventing the carrier from bumping, and reducing damage to the silicon material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.

[0017] Figure 1 is a partial three-dimensional diagram of a heating device provided in one embodiment of the present application;

[0018] Figure 2 is a plan view of a heating device provided in one embodiment of the present application;

[0019] Figure 3 One embodiment of the present application provides Figure 2B-side cross-sectional view;

[0020] Figure 4 One embodiment of the present application provides Figure 1 A-side cross-sectional view.

[0021] The reference numerals of the heating device 1000 are as follows:

[0022] case 100 Heating components 400 Heating chamber 110 Heating tube 410 shell 120 Heating unit 411 Inner shell 130 Insulation 412 Limiting part 131 Insulation layer 500 Base Plate 140 Temperature Sensor 600 guide 200 First casing 700 Vehicles 300 Second sleeve 800 DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0025] The embodiment of the present application provides a silicon material processing device, including a heating device 1000, the heating device 1000 is used to heat the silicon material. In some embodiments, a water quenching device is also included, and the heated silicon material leaves the heating device 1000 and enters the water quenching device.

[0026] For the aforementioned heating device 1000, please refer to Figure 1 to Figure 2. The heating device 1000 is applied to the heating of silicon material. The heating device 1000 includes a housing 100, a guide rail 200, a carrier 300 and a heating component 400. A heating chamber 110 is provided inside the housing 100. The guide rail 200 is provided in the heating chamber 110. The carrier 300 is movably connected to the guide rail 200, and the carrier 300 is used to carry silicon material. The heating component 400 is installed on the housing 100, and the heating component 400 at least partially extends into the heating chamber 110, and the heating component 400 is used to heat the inside of the heating chamber 110. The guide rail 200 is exposed in the heating chamber 110. It can be understood that the housing 100 is in the shape of a rectangular parallelepiped, and the heating chamber 110 is in the shape of a rectangular parallelepiped similar to the housing 100, and the guide rail 200 extends in the direction of the long side of the rectangular parallelepiped, so as to make full use of the internal space of the housing 100, increase the contact area between the heating device 1000 and the silicon material, and thus improve the heat exchange efficiency. The carrier 300 is configured as a carrier 300 with a wheel set, or a groove adapted to the guide rail 200 is provided at the bottom of the carrier 300, so that the carrier 300 can be mounted on the guide rail 200; in some other embodiments, the guide rail 200 can be provided with a wheel set and the carrier 300 can be mounted from the bottom of both sides of the carrier 300, so as to facilitate the transmission of the carrier 300. It is worth mentioning that the driving rod in the present application is set as a linear driving rod in order to match the structure of the shell 100, so that the carrier 300 can move smoothly and evenly during the movement. Compared with the jerky movement mode in the stepping mechanism, the shaking of the carrier 300 loaded with silicon material is reduced to reduce the wear of the silicon material by the carrier 300. Through the above structure, in the heating chamber 110, the carrier 300 carries the material and moves along the guide rail 200, so that the structure in the heating chamber 110 is simple, the carrier 300 is prevented from bumping, and the damage to the silicon material is reduced.

[0027] In an embodiment of the present application, please refer to the figure and combine with other attached drawings. The housing 100 includes an outer shell 120, an inner shell 130 and a bottom plate 140. The outer shell 120 is buckled outside the inner shell 130. The outer shell 120 and the inner shell 130 are respectively installed on the bottom plate 140. The bottom plate 140 and the inner shell 130 jointly enclose a heating cavity 110. The guide rail 200 is installed on the bottom plate 140. The heating component 400 penetrates through the outer shell 120 and the inner shell 130 and extends into the heating cavity 110. It can be understood that the inner shell 130 forms the heating cavity 110 to maintain the temperature inside the heating cavity 110. The outer shell 120 protects the inner shell 130, and by setting multiple layers of the housing 100, the heat loss of the heating device 1000 is reduced, thereby reducing the energy consumption of the heating device 1000 and saving energy. It can be understood that the heating component 400 penetrates through the outer shell 120, the inner shell 130 and the heating cavity 110, so that both ends of the heating component 400 are supported on the housing 100, making the heating component 400 installed stably and not easy to shake. It is worth mentioning that the bottom plate 140 is configured as a flat plate body, while the inner shell 130 and the outer shell 120 are both set in a "冂" shape and buckled on the bottom plate 140. The heating component 400 is located on the side of the heating cavity 110 far from the bottom plate 140. Thus, there is still part of the heating cavity 110, silicon material, carrier 300 and guide rail 200 between the bottom plate 140 and the heating component 400. Therefore, more heat is absorbed by the silicon material and the carrier 300 in this direction, fully improving the heat exchange efficiency and reducing the heat loss. Optionally, the inner shell 130 is made of quartz material to form a square quartz frame, while the outer shell 120 is a stainless steel frame made of stainless steel material, and the guide rail 200 is made of quartz or tetrafluoro material, so as to make full use of the physical properties of quartz with high heat resistance and high thermal conductivity, and quartz is not easy to undergo chemical reactions, thereby further improving the heating efficiency of the heating device 1000.

[0028] Further, please refer to the figure and combine with other attached drawings. The inner shell 130 is symmetrically protruded towards the heating cavity 110 to be provided with a limiting portion 131. One side of the carrier 300 facing away from the guide rail 200 abuts against the limiting portion 131, so that the limiting portion 131 and the bottom plate 140 jointly limit the movement of the carrier 300. It can be understood that the abutment of the carrier 300 against the limiting portion 131 is not an interference fit, but there is a gap, and it only needs to function to limit the movement of the carrier 300. The distance between the limiting portion 131 and the bottom plate 140 is D, and the distance between the top of the carrier 300 and the bottom plate 140 is D, <D - D; and the protruding distance of the limiting portion 131 is less than the distance between the two side walls of the heating cavity 110, so as to prevent the limiting portion 131 from affecting the thermal radiation of the heating component 400. Specifically, one side surface of the limiting portion 131 close to the bottom plate 140 is set as a vertically protruding plane, and the side surface facing away from the bottom plate 140 is set as an inclined plane, so that the waves of the thermal radiation of the heating component 400 will be reflected multiple times along the inclined plane wall, thereby increasing the temperature inside the heating cavity 110.

[0029] Further, please refer to the figure and combine it with other figures. The heating device 1000 also includes an insulation layer 500, which is installed between the outer shell 120 and the inner shell 130. Preferably, the insulation layer 500 includes a mullite insulation board. Mullite is a high-quality refractory material with a chemical formula of AlO·SiO, a colorless aluminum silicate mineral of the orthorhombic system, and a melting temperature of about ℃.

[0030] In the embodiment of the present application, please refer to the figure and combine with other drawings. The heating device 1000 also includes a temperature sensor 600 and a first sleeve 700. The first sleeve 700 penetrates the outer shell 120 and the inner shell 130 and extends into the heating chamber 110. The temperature sensor 600 is installed on the first sleeve 700. The temperature sensor 600 is used to measure the temperature of the silicon material on the carrier 300. Optionally, the temperature sensor 600 and the first sleeve 700 are arranged on the side of the limiter 131 close to the heating component 400, so as to prevent the temperature sensor 600 from being affected by the temperature of the carrier 300 when measuring the temperature of the silicon material, and further improve the measurement accuracy of the temperature sensor 600. Optionally, the material of the first sleeve 700 includes quartz.

[0031] In the embodiments of the present application, please refer to the figure and combine with other drawings. The heating device 1000 also includes a second sleeve 800, which passes through the outer shell 120 and the inner shell 130 and extends into the heating chamber 110. The second sleeve 800 is used to pass an inert gas into the heating chamber 110. It can be understood that by passing an inert gas into the heating chamber 110, the atmosphere in the heating chamber 110 is kept stable to prevent excessive oxidation of the silicon material. Optionally, the inert gas includes nitrogen, argon, etc. Optionally, the material of the second sleeve 800 includes quartz.

[0032] For the above-mentioned heating assembly 400, please refer to the figure and combine it with other figures. The heating assembly 400 includes a plurality of heating tubes 410, and the plurality of heating tubes 410 are arranged in sequence along the moving direction of the carrier 300. The extension direction of the heating tube 410 can be the top and / or side wall of the heating chamber 110. The heating tubes 410 are arranged at intervals, thereby increasing the heat source in the heating chamber 110, making the temperature distribution in the heating chamber 110 uniform, and improving the heating efficiency of the heating chamber 110 for the silicon material.

[0033] For the above-mentioned heating tube 410, please refer to the figure and combine it with other figures. Each heating tube 410 includes a heating portion 411 and a heat insulating portion 412. The heat insulating portion 412 is arranged away from the carrier 300, and the heating portion 411 is arranged toward the carrier 300. By adopting a semi-plated heating tube 410, it is ensured that the heat is concentrated on the heating portion 411, while the heat insulating portion 412 has lower heat, which further improves the heating efficiency of the heating tube 410, reduces the heat loss of heating the inner shell 130, and reduces the energy consumption of the heating device 1000.

[0034] In summary, the method of using the heating device 1000 is further described in combination with the above embodiments: first, the silicon material is loaded on the carrier 300, the carrier 300 is mounted on the guide rail 200, the driving rod pushes the carrier 300 to move into the heating chamber 110, the limit portion 131, the bottom plate 140 and the guide rail 200 jointly limit the movement of the carrier 300 in other directions, and multiple heating tubes 410 heat the silicon material. During the heating of the silicon material, the inert gas is continuously passed into the heating chamber 110 through the second sleeve 800, and the temperature sensor 600 in the first sleeve 700 measures the temperature of the silicon material. When the temperature of the silicon material reaches the standard temperature, it is considered that the heating is completed, and the driving rod continues to push the carrier 300 to leave the heating chamber 110.

[0035] In an embodiment of the present application, a heating device 1000 is provided for heating silicon material, and the heating device 1000 includes a housing 100, a guide rail 200, a carrier 300 and a heating component 400. A heating chamber 110 is provided inside the housing 100. The guide rail 200 is provided in the heating chamber 110. The carrier 300 is movably connected to the guide rail 200, and the carrier 300 is used to carry silicon material. The heating component 400 is mounted on the housing 100, and the heating component 400 at least partially extends into the heating chamber 110, and the heating component 400 is used to heat the inside of the heating chamber 110. Through the above structure, in the heating chamber 110, the carrier 300 carries the material and moves along the guide rail 200, so that the structure inside the heating chamber 110 is simple, the carrier 300 is prevented from bumping, and the damage to the silicon material is reduced.

[0036] Based on the same inventive concept, the present application also provides a silicon material processing device, which includes the above-mentioned heating device 1000. The structure and function of the heating device 1000 can be found in the above-mentioned embodiment, and will not be described in detail here.

[0037] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional limitations on the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the present application; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the present application.

Claims

1. A heating device, used for heating silicon material, characterized in that: include: A shell body, wherein a heating chamber is arranged inside; A guide rail is arranged in the heating chamber; A carrier, the carrier is movably connected to the guide rail, and the carrier is used to carry the silicon material; A heating component is installed on the shell, and at least a part of the heating component extends into the heating cavity. The heating component is used to heat the interior of the heating cavity.

2. The heating device according to claim 1, characterized in that The shell comprises an outer shell, an inner shell and a bottom plate, the outer shell is buckled outside the inner shell, the outer shell and the inner shell are respectively mounted on the bottom plate, and the bottom plate and the inner shell together enclose the heating chamber; The guide rail is installed on the bottom plate, and the heating component passes through the inner shell from the outer shell and extends into the heating cavity.

3. The heating device according to claim 2, characterized in that: The inner shell is provided with a limiting portion toward the heating chamber, and a surface of the carrier facing away from the guide rail abuts against the limiting portion.

4. The heating device according to claim 2, characterized in that: The heating device further comprises a heat-insulating layer, and the heat-insulating layer is installed between the outer shell and the inner shell.

5. The heating device according to claim 2, characterized in that: The heating device further comprises a temperature sensor and a first sleeve, wherein the first sleeve penetrates the outer shell and the inner shell and extends into the heating chamber, and the temperature sensor is mounted on the first sleeve.

6. The heating device according to claim 2, characterized in that: The heating device further comprises a second sleeve, which penetrates through the outer shell and the inner shell and extends into the heating chamber, and is used for introducing an inert gas into the heating chamber.

7. The heating device according to any one of claims 2 to 6, characterized in that: The outer shell is made of stainless steel; and / or The inner shell is made of a quartz plate; and / or The guide rail is made of quartz or polytetrafluoroethylene material.

8. The heating device according to any one of claims 1 to 6, characterized in that: The heating assembly includes a plurality of heating tubes, and the plurality of heating tubes are sequentially arranged at intervals along the moving direction of the carrier.

9. The heating device according to claim 8, characterized in that: Each of the heating tubes includes a heating portion and a heat insulating portion, wherein the heat insulating portion is arranged away from the carrier, and the heating portion is arranged toward the carrier.

10. A silicon material processing equipment, characterized in that: The heating device comprises a heating device as claimed in any one of claims 1 to 9.

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