Edge photoresist removing device

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and discloses an edge photoresist removing device which comprises a base, a fixed frame is fixedly mounted at the top end of the base, an opening is formed in the right side wall of the fixed frame, a rotating motor is mounted in the opening, a threaded rod is arranged on the left side of the rotating motor, and a translation block movably sleeves the outer wall of the threaded rod; according to the device, after a wafer is adjusted to be located between the two glue removing mechanisms, the rotating motors are controlled to drive the threaded columns to rotate, the lifting plate is driven to move downwards, the lifting plate is driven to move downwards, and then the wafer is adjusted to be located between the two glue removing mechanisms; the baffles on the two photoresist removing mechanisms are attached to the upper end and the lower end of the wafer respectively and located at the edge positions, the upper end and the lower end of the wafer can be shielded, and it is avoided that a photoresist solvent is sprayed to the upper side and the lower side of the wafer, and photoresist, not needing to be removed, on the surface of the wafer is dissolved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and more specifically, to an edge photoresist removal device. Background Art

[0002] Photoresist, as a high molecular polymer material with photosensitive chemical effects, is a medium for transferring ultraviolet exposure. In the production process of semiconductor equipment, photoresist is needed to protect the substrate surface from etching. In the process of using photoresist, a photoresist removal device is often needed to remove the photoresist from the side edges of semiconductor devices (such as wafers).

[0003] After searching the publication (announcement) number: CN218251939U, a device for removing edge photoresist is disclosed, including a translation mechanism, a softening chamber, a heating component and a nozzle. The translation mechanism includes a translation drive component and a translation member transmission-connected to the translation drive component. The thick part of the edge of the photoresist passing through the softening chamber is heated and softened by the heating component to reduce the hardness of the edge photoresist.

[0004] In actual use, the photoresist on the side edge of the wafer is dissolved by spraying photoresist solvent. This spraying method easily causes the photoresist solvent to be sprayed on the upper and lower sides of the wafer, causing the photoresist on the wafer surface that does not need to be removed to be dissolved.

[0005] In order to solve the above problems, the present application provides an edge photoresist removal device. Utility Model Content

[0006] The edge photoresist removal device provided in this application adopts the following technical solution:

[0007] The edge photoresist removal device comprises a base, a fixed frame is fixedly installed on the top of the base, an opening is provided on the right side wall of the fixed frame, and a rotating motor is installed in the opening, a threaded rod is provided on the left side of the rotating motor, a translation block is movably sleeved on the outer wall of the threaded rod, an adjustment mechanism is installed on the top of the translation block, a second rotating motor is installed on the right side of the base, and a vacuum suction cup is installed on the top of the second rotating motor.

[0008] The above technical solution facilitates translational adjustment of the position of the adjustment mechanism during use.

[0009] Furthermore, the adjustment mechanism includes a mounting block, a fixing plate is fixedly mounted on the mounting block, an adjusting rod is provided on the right side of the fixing plate, a locking screw is installed on the top of the fixing plate, a U-shaped frame is connected to the right side of the adjusting rod, a through hole is provided on the top plate of the U-shaped frame, and a rotating motor is provided in the through hole, a threaded column is connected to the bottom end of the rotating motor, a lifting plate is movably mounted on the outer wall of the threaded column, and a glue removal mechanism is installed on the lifting plate and the right side of the U-shaped frame.

[0010] The above technical solution makes it easy to adjust the position of the glue removal mechanism.

[0011] Furthermore, the glue removal mechanism includes a vertical plate, a T-shaped plate is installed on the right side of the vertical plate, a plurality of ball bearings are installed on the bottom end of the T-shaped plate, an additional plate is installed on the bottom end of the vertical plate, a groove is provided on the right side of the additional plate, and a rotating rod is rotatably installed in the groove, a baffle is provided on the outer wall of the rotating rod, the top end of the baffle is connected to the T-shaped plate by a plurality of springs, and a scraper is fixedly installed on the front end surface of the baffle.

[0012] The above technical solution makes it easy to remove the photoresist on the side of the wafer.

[0013] Furthermore, a hidden groove is provided on the right side of the additional plate, and a nozzle is installed in the hidden groove.

[0014] The above technical solution makes it easy to spray out the photoresist solvent and soften the photoresist.

[0015] Furthermore, a translation groove is provided on the right side of the fixing plate, and the diameter of the translation groove is the same as the diameter of the adjusting rod. A plurality of thread grooves are provided on the top of the adjusting rod, and the diameter of the thread grooves is the same as the diameter of the threaded column.

[0016] The above technical solution makes it easy to fix the adjusting rod at different positions for use.

[0017] Furthermore, a lifting slide groove is provided on the inner wall of the U-shaped groove on the U-shaped frame, and a slider is slidably installed in the lifting slide groove, and the right side of the slider is fixedly connected to the lifting plate.

[0018] The above technical solution ensures that the lifting plate can move vertically.

[0019] In summary, this application includes the following beneficial technical effects:

[0020] After adjusting the wafer to be between the two degumming mechanisms, the rotary motor is controlled to drive the threaded column to rotate, and drive the lifting plate to move downward, so that the baffles on the two degumming mechanisms are respectively attached to the upper and lower ends of the wafer and are at the edge position, which can provide shielding for the upper and lower ends of the wafer to prevent the photoresist solvent from being sprayed onto the upper and lower sides of the wafer, causing the photoresist on the wafer surface that does not need to be removed to be dissolved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of this application;

[0022] Figure 2 This is a schematic diagram of the structure of the regulating mechanism of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the glue removal mechanism of this application.

[0024] Description of the numbers in the figure:

[0025] 1. Base; 2. Fixed frame; 3. Rotating motor; 4. Threaded rod; 5. Translation block; 6. Adjustment mechanism; 7. Second rotating motor; 8. Vacuum suction cup; 9. Mounting block; 10. Fixed plate; 11. Adjustment rod; 12. Locking screw; 13. U-shaped frame; 14. Threaded column; 15. Lifting plate; 16. Glue removal mechanism; 17. Vertical plate; 18. T-shaped plate; 19. Ball bearing; 20. Additional plate; 21. Rotating rod; 22. Baffle; 23. Spring; 24. Nozzle; 25. Scraper; 26. Rotating motor. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0027] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. Example

[0029] The embodiment of the present application discloses an edge photoresist removal device, please refer to Figure 1 , including a base 1, a fixed frame 2 is fixedly installed on the top of the base 1, an opening is provided on the right side wall of the fixed frame 2, and a rotating motor 3 is installed in the opening, a threaded rod 4 is provided on the left side of the rotating motor 3, the left side of the threaded rod 4 is rotatably connected to the fixed frame 2, a translation block 5 is movably sleeved on the outer wall of the threaded rod 4, the width dimension of the translation block 5 is the same as the inner frame width dimension of the fixed frame 2, an adjusting mechanism 6 is installed on the top of the translation block 5, a second rotating motor 7 is installed on the right side of the base 1, and a vacuum suction cup 8 is installed on the top of the second rotating motor 7, the wafer is adsorbed by the vacuum suction cup 8, and the second rotating motor 7 rotates to drive the wafer to rotate.

[0030] See also Figure 2 The adjusting mechanism 6 includes a mounting block 9, which is fixedly mounted on the top of the translation block 5. A fixing plate 10 is fixedly mounted on the mounting block 9. An adjusting rod 11 is provided on the right side of the fixing plate 10. A locking screw 12 is installed on the top of the fixing plate 10. A U-shaped frame 13 is connected to the right side of the adjusting rod 11. A through hole is provided on the top plate of the U-shaped frame 13, and a rotating motor 26 is provided in the through hole. A threaded column 14 is connected to the bottom end of the rotating motor 26. A lifting plate 15 is movably mounted on the outer wall of the threaded column 14. A degumming mechanism 16 is installed on the right side of the lifting plate 15 and the U-shaped frame 13. The threaded column 14 is driven to rotate by the rotating motor 26, which drives the lifting plate 15 to move up and down, so as to adjust the position of the degumming mechanism 16 located on the lifting plate 15.

[0031] See also Figure 3The glue removal mechanism 16 includes a vertical plate 17, a T-shaped plate 18 is installed on the right side of the vertical plate 17, and a plurality of balls 19 are installed at the bottom end of the T-shaped plate 18. An additional plate 20 is installed at the bottom end of the vertical plate 17. A groove is provided on the right side of the additional plate 20, and a rotating rod 21 is rotatably installed in the groove. A baffle 22 is provided on the outer wall of the rotating rod 21. The top of the baffle 22 is connected to the T-shaped plate 18 by a plurality of springs 23. The baffle 22 is pushed to fit the wafer by the spring 23, so as to shield the upper and lower ends of the wafer. A scraper 25 is fixedly installed on the front end surface of the baffle 22, and the outer wall of the ball 19 is wrapped with rubber to avoid scratching the wafer.

[0032] See also Figure 3 A hidden groove is provided on the right side of the additional plate 20, and a nozzle 24 is installed in the hidden groove, and the nozzle 24 is located below the rotating rod 21. During actual use, the photoresist solvent storage tank is placed around the base 1, and a water pump is placed therein. The water pump is connected to the nozzle 24 through a hose, and the photoresist solvent is sprayed through the nozzle 24 to soften the photoresist on the side wall of the wafer.

[0033] See also Figure 2 A translation groove is provided on the right side of the fixing plate 10, and the diameter of the translation groove is the same as the diameter of the adjusting rod 11. A plurality of threaded grooves are provided on the top of the adjusting rod 11, and the diameter of the threaded grooves is the same as the diameter of the threaded column 14, which is convenient for fixing the adjusting rod 11 in different positions for use.

[0034] See also Figure 3 A lifting slide is provided on the inner wall of the U-shaped groove on the U-shaped frame 13, and a slider is slidably installed in the lifting slide, and the right side of the slider is fixedly connected to the lifting plate 15, so as to ensure that the lifting plate 15 can move vertically during use.

[0035] The implementation principle of this embodiment is as follows: when in use, first start the electrical appliances on the device through an external power supply, adsorb the center position of the wafer on the vacuum suction cup 8, control the rotating motor 3 to drive the threaded rod 4 to rotate, drive the translation block 5 to move, adjust the positions of the two degumming mechanisms 16, and adjust the wafer to be between the two degumming mechanisms 16, then control the rotating motor 26 to drive the threaded column 14 to rotate, drive the lifting plate 15 to move downward, so that the baffles 22 on the two degumming mechanisms 16 are respectively attached to the upper and lower ends of the wafer and are at the edge position, at this time, the scraper 25 is attached to the side wall of the wafer, and then the photoresist solvent is sprayed through the nozzle 24 to dissolve the photoresist on the side wall of the wafer, and the second rotating motor 7 is controlled to rotate to drive the wafer to rotate, at this time, the scraper 25 can scrape the photoresist on the side wall of the wafer.

[0036] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An edge photoresist removal device, comprising a base (1), characterized in that: A fixed frame (2) is fixedly mounted on the top of the base (1); an opening is provided on the right side wall of the fixed frame (2), and a rotating motor (3) is mounted in the opening; a threaded rod (4) is provided on the left side of the rotating motor (3); a translation block (5) is movably sleeved on the outer wall of the threaded rod (4); an adjusting mechanism (6) is mounted on the top of the translation block (5); a second rotating motor (7) is mounted on the right side of the base (1); and a vacuum suction cup (8) is mounted on the top of the second rotating motor (7).

2. The edge photoresist removal device according to claim 1, characterized in that: The adjustment mechanism (6) comprises a mounting block (9), a fixing plate (10) being fixedly mounted on the mounting block (9), an adjustment rod (11) being arranged on the right side of the fixing plate (10), a locking screw (12) being arranged on the top end of the fixing plate (10), a U-shaped frame (13) being connected to the right side of the adjustment rod (11), a through hole being arranged on the top plate of the U-shaped frame (13), a rotating motor (26) being arranged in the through hole, a threaded column (14) being connected to the bottom end of the rotating motor (26), a lifting plate (15) being movably sleeved on the outer wall of the threaded column (14), and a glue removal mechanism (16) being arranged on the right side of the lifting plate (15) and the U-shaped frame (13).

3. The edge photoresist removal device according to claim 2, characterized in that: The glue removal mechanism (16) comprises a vertical plate (17), a T-shaped plate (18) is installed on the right side of the vertical plate (17), a plurality of balls (19) are installed on the bottom end of the T-shaped plate (18), an additional plate (20) is installed on the bottom end of the vertical plate (17), a groove is provided on the right side of the additional plate (20), and a rotating rod (21) is rotatably installed in the groove, a baffle (22) is provided on the outer wall of the rotating rod (21), the top end of the baffle (22) is connected to the T-shaped plate (18) via a plurality of springs (23), and a scraper (25) is fixedly installed on the front end surface of the baffle (22).

4. The edge photoresist removal device according to claim 3, characterized in that: A hidden groove is provided on the right side of the additional plate (20), and a spray head (24) is installed in the hidden groove.

5. The edge photoresist removal device according to claim 2, characterized in that: A translation slot is provided on the right side of the fixing plate (10), and the diameter of the translation slot is the same as the diameter of the adjustment rod (11).

6. The edge photoresist removal device according to claim 2, characterized in that: The top end of the adjusting rod (11) is provided with a plurality of thread grooves, and the diameter of the thread grooves is the same as the diameter of the thread column (14).

7. The edge photoresist removal device according to claim 3, characterized in that: A lifting slide groove is provided on the inner wall of the U-shaped groove on the U-shaped frame (13), and a slider is slidably installed in the lifting slide groove, and the right side of the slider is fixedly connected to the lifting plate (15).

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