Capacitor

Abstract

The utility model discloses a capacitor capable of avoiding insufficient filling of heat-conducting glue on a cooling surface of an extraction electrode and ensuring cooling efficiency. The capacitor comprises a housing, a capacitor core, a filler, an extraction electrode and a bearing member. The shell is provided with an accommodating cavity; the capacitor core is arranged in the accommodating cavity; the containing cavity is filled with the filler. The extraction electrode is embedded in the filler, one end of the extraction electrode is electrically connected with the capacitor core, and the other end of the extraction electrode is exposed out of the filler; the bearing parts are arranged on the upper surface of the filler, and the bearing parts are distributed around the cooling surface of the extraction electrode under the overlook angle perpendicular to the cooling surface direction of the extraction electrode and are used for bearing the heat-conducting glue sliding off from the cooling surface when the heat-conducting glue is coated.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a capacitor capable of avoiding insufficient filling of heat-conducting glue. Background Art

[0002] With the rapid development of electronic power technology, metallized film capacitors are increasingly used in industrial control, new energy, automotive electronics, rail transit, power grid and other technical fields, and the requirements for capacitor product performance are also getting higher and higher.

[0003] The traditional film capacitor structure is generally composed of a capacitor core (including plates, dielectrics, and metal layers sprayed on the two end surfaces), lead electrodes (usually leads, solder tabs, or busbars), a package shell, and a filling resin (such as epoxy resin). With the increase in application requirements, the lead electrodes of capacitors need to be cooled in many products, and in order to ensure a better cooling effect, thermal conductive glue can be applied to the cooling surface of the lead electrodes. In actual operation, in order to ensure the coverage area of ​​the thermal conductive glue, an excess of thermal conductive glue is generally applied to the cooling surface of the lead electrode, and under the action of gravity, the excess thermal conductive glue will overflow and slide from the edge of the lead electrode. At the same time, due to the high drop between the lead electrode and the upper surface of the capacitor filler and the elasticity of the thermal conductive glue itself, the thermal conductive glue that has slipped off will pull the thermal conductive glue at the edge of the cooling surface to slide off the cooling surface, resulting in the contradictory phenomenon of "excessive thermal conductive glue is applied but ultimately leads to insufficient thermal conductive glue filling". Utility Model Content

[0004] The utility model aims to provide a capacitor, solve the problems existing in the prior art, avoid insufficient filling of heat-conducting glue on the cooling surface of the lead-out electrode, and ensure cooling efficiency.

[0005] In order to achieve the above purpose, the solution of the utility model is:

[0006] A capacitor comprises a shell, a capacitor core, a filler, an extraction electrode and a carrier; the shell is provided with a cavity; the capacitor core is arranged in the cavity; the filler is filled in the cavity; the extraction electrode is buried in the filler, one end of which is electrically connected to the capacitor core and the other end is exposed from the filler; the carrier is arranged on the upper surface of the filler, and in a top-down view perpendicular to the cooling surface direction of the extraction electrode, the carrier is distributed around the cooling surface of the extraction electrode, and is used to receive the thermal conductive adhesive that slides off the cooling surface when the thermal conductive adhesive is applied.

[0007] The carrier is made of plastic.

[0008] The carrier is provided with a hollow portion, and the hollow portion is located in a region of the carrier away from the cooling surface of the lead-out electrode.

[0009] The carrier is provided with a through hole for the lead-out electrode to pass through; the side wall of the lead-out electrode is gap-matched with the inner wall of the through hole.

[0010] The filler is epoxy resin.

[0011] After adopting the above technical solution, the utility model has the following technical effects:

[0012] The utility model arranges a carrier on the surface of the filler of the capacitor, which is distributed around the lead-out electrode in a top-down angle perpendicular to the cooling surface direction of the lead-out electrode. When the thermal conductive adhesive is applied, the thermal conductive adhesive that slides down from the cooling surface will fall onto the upper surface of the carrier instead of the upper surface of the filler, thereby reducing the drop when the thermal conductive adhesive slides down, and further reducing the pulling force generated by the thermal conductive adhesive of the sliding part on the thermal conductive adhesive on the cooling surface, avoiding the situation where the edge of the cooling surface is insufficiently filled with thermal conductive adhesive, and finally ensuring the coverage area of ​​the thermal conductive adhesive on the lead-out electrode, thereby improving the cooling efficiency of the capacitor product. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional diagram of a specific embodiment of the utility model;

[0014] Figure 2 A top view of a specific embodiment of the utility model;

[0015] Figure 3 for Figure 2 Sectional view in the AA direction;

[0016] Description of Figure Numbers:

[0017] 1-housing; 11-cavity; 2-capacitor core; 3-filler; 4-lead electrode; 41-cooling surface; 5-carrying member; 51-hollow portion; 52-perforation. DETAILED DESCRIPTION

[0018] In order to further explain the technical solution of the present utility model, the present utility model is described in detail below through specific embodiments.

[0019] refer to Figures 1 to 3 As shown, the utility model discloses a capacitor, comprising a housing 1, a capacitor core 2, a filler 3, an extraction electrode 4 and a carrier 5;

[0020] The housing 1 is provided with a cavity 11;

[0021] The capacitor core 2 is arranged in the cavity 11;

[0022] The filler 3 is filled into the cavity 11;

[0023] The lead electrode 4 is buried in the filler 3, one end of which is electrically connected to the capacitor core 2, and the other end is exposed from the filler 3 so as to be connected to an external electrical device;

[0024] The carrier 5 is arranged on the upper surface of the filler 3. In a top view perpendicular to the cooling surface 41 of the lead-out electrode 4, the carrier 5 is distributed around the cooling surface 41 of the lead-out electrode 4 and is used to receive the thermal conductive adhesive that slides off the cooling surface 41 when applying the thermal conductive adhesive.

[0025] The cooling surface 41 refers to the position where the lead electrode 4 in a conventional capacitor product needs to be coated with thermal conductive glue.

[0026] Through the above scheme, the utility model sets a carrier 5 on the surface of the filler 3 of the capacitor, which is distributed around the lead-out electrode 4 in a top-down view perpendicular to the cooling surface 41 of the lead-out electrode 4. When the thermal conductive adhesive is applied, the thermal conductive adhesive that slides down from the cooling surface 41 will fall to the upper surface of the carrier 5 instead of the upper surface of the filler 3, thereby reducing the drop when the thermal conductive adhesive slides down, and further reducing the pulling force of the thermal conductive adhesive on the cooling surface 41 generated by the sliding part of the thermal conductive adhesive, avoiding the situation where the edge of the cooling surface 41 is insufficiently filled with thermal conductive adhesive, and finally ensuring the coverage area of ​​the thermal conductive adhesive on the lead-out electrode 4, thereby improving the cooling efficiency of the capacitor product.

[0027] Specific embodiments of the present utility model are shown below.

[0028] The carrier 5 is made of plastic, which can reduce costs and is easy to process. It can be processed into different shapes according to capacitors of different designs.

[0029] The carrier 5 is provided with a hollow portion 51, which is located in a region of the carrier 5 away from the cooling surface 41 of the lead-out electrode 4, such as a distance of more than 1 cm from the edge of the cooling surface 41. Since the region does not carry thermal conductive glue, it has no effect and may even affect the heat dissipation of the filler 3. Hollowing it out can improve the heat dissipation performance of the capacitor. In some embodiments, the hollow portion 51 may be one or more through-hole structures.

[0030] According to different product designs, the carrier 5 can be an integral part or divided into multiple parts. When the carrier 5 is an integral part, a through hole 52 is provided on it for the lead-out electrode 4 to pass through; the side wall of the lead-out electrode 4 is gap-matched with the inner wall of the through hole 52.

[0031] The filler 3 is epoxy resin.

[0032] The above embodiments and drawings do not limit the product form and style of the present utility model. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present utility model.

Claims

1. A capacitor, characterized in that: It includes a housing, a capacitor core, a filler, a lead electrode and a carrier; The housing is provided with a cavity; The capacitor core is arranged in the cavity; The filler is filled in the cavity; The lead electrode is buried in the filler, one end of which is electrically connected to the capacitor core and the other end is exposed in the filler; The carrier is arranged on the upper surface of the filler. In a top-down view perpendicular to the cooling surface direction of the lead-out electrode, the carrier is distributed around the cooling surface of the lead-out electrode and is used to receive the thermal conductive adhesive that slides off the cooling surface when applying the thermal conductive adhesive.

2. The capacitor according to claim 1, wherein: The carrier is made of plastic.

3. The capacitor according to claim 1, wherein: The carrier is provided with a hollow portion, and the hollow portion is located in a region of the carrier away from the cooling surface of the lead-out electrode.

4. The capacitor according to claim 1, wherein: The carrier is provided with a through hole for the lead-out electrode to pass through; the side wall of the lead-out electrode is gap-matched with the inner wall of the through hole.

5. The capacitor according to claim 1, wherein: The filler is epoxy resin.

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