Vacuum platform and electronic product mounting equipment

Abstract

The utility model discloses a vacuum platform and electronic product mounting equipment, and relates to the technical field of chip mounting. The vacuum platform comprises a first body and a second body connected with the first body, the first body is provided with a vacuum adsorption area, the vacuum adsorption area is provided with a plurality of vacuum adsorption holes, and the plurality of vacuum adsorption holes are used for adsorbing a substrate to be mounted under the cooperation of vacuum adsorption equipment; the second body is provided with a suction nozzle containing area, and the suction nozzle containing area is used for containing a suction nozzle. The vacuum platform is simple in structure, capable of improving the chip mounting efficiency and high in practicability.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounting, in particular to a vacuum platform and electronic product mounting equipment. Background Art

[0002] With the rapid development of the semiconductor industry, the miniaturization of electronic products to meet the needs of users has become a development trend. The miniaturization of electronic products has made the thickness of the corresponding electronic product substrate thinner and thinner, and also made the substrate warping larger and larger. In view of this situation, a dedicated vacuum platform is usually used to vacuum adsorb the substrate during chip placement to improve the placement accuracy of the machine.

[0003] During chip mounting, different chips need to be replaced with different nozzles to meet the mounting requirements of chips of different sizes, which makes the mounting efficiency low and difficult to meet the requirements of efficient production. Therefore, how to solve the problem of low chip mounting efficiency is important and meaningful. Utility Model Content

[0004] The utility model aims to provide a vacuum platform and an electronic product mounting device, which have simple structures, can improve chip mounting efficiency, and have strong practicality.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In one aspect of the utility model, a vacuum platform is provided, which includes a first body and a second body connected to the first body, wherein a vacuum adsorption area is provided on the first body, the vacuum adsorption area has a plurality of vacuum adsorption holes, and the plurality of vacuum adsorption holes are used to adsorb the substrate to be mounted under the cooperation of the vacuum adsorption device; and a nozzle storage area is provided on the second body, and the nozzle storage area is used to accommodate the nozzle. The vacuum platform has a simple structure, can improve the chip mounting efficiency, and has strong practicality.

[0007] Optionally, the nozzle storage area has a plurality of storage holes, the plurality of storage holes are arranged at intervals, and at least two of the plurality of storage holes have different apertures, and the plurality of nozzles are accommodated in the plurality of storage holes in a one-to-one correspondence.

[0008] Optionally, the diameters of any two receiving holes are different.

[0009] Optionally, the nozzle storage area has a storage cavity, and the storage cavity is used to accommodate a plurality of nozzles.

[0010] Optionally, the depth of the storage cavity is greater than the height of the suction nozzle.

[0011] Optionally, the second body is detachably connected to the first body.

[0012] Optionally, the vacuum platform further comprises a third body connected to the first body, and a material throwing area is provided on the third body.

[0013] Optionally, the material throwing area, the suction nozzle receiving area and the vacuum adsorption area are arranged along the first direction, and the vacuum adsorption area is located between the material throwing area and the suction nozzle receiving area.

[0014] Optionally, the third body is detachably connected to the first body.

[0015] Another aspect of the present invention provides an electronic product mounting device, which includes the above-mentioned vacuum platform.

[0016] The beneficial effects of the utility model include:

[0017] The vacuum platform provided by the present application includes a first body and a second body connected to the first body. The first body is provided with a vacuum adsorption area, and the vacuum adsorption area has a plurality of vacuum adsorption holes, and the plurality of vacuum adsorption holes are used to adsorb the substrate to be mounted with the cooperation of the vacuum adsorption equipment; the second body is provided with a nozzle storage area, and the nozzle storage area is used to accommodate nozzles. The present application can perform vacuum adsorption on the substrate to be mounted by setting up a vacuum adsorption area, and can accommodate a variety of different types of nozzles by setting up a nozzle storage area. In this way, when the nozzle needs to be replaced, the user only needs to take and place the nozzle from the nozzle storage area. The vacuum platform of the present application has a simple structure, and the setting of the nozzle storage area facilitates the taking and placing of different types of nozzles, saves operation time, can improve chip mounting efficiency, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 One of the structural schematic diagrams of the vacuum platform provided in the embodiment of the utility model;

[0020] Figure 2 The second structural diagram of the vacuum platform provided by the embodiment of the utility model;

[0021] Figure 3 The third structural diagram of the vacuum platform provided by the embodiment of the utility model;

[0022] Figure 4 This is a fourth structural schematic diagram of the vacuum platform provided in an embodiment of the utility model.

[0023] Icon: 10-first body; 11-vacuum adsorption area; 111-vacuum adsorption hole; 20-second body; 21-nozzle storage area; 211-storage hole; 212-storage cavity; 30-third body; 31-throwing area; a-first direction; 200-nozzle. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Please refer to Figure 1 and Figure 2 The present embodiment provides a vacuum platform, which includes a first body 10 and a second body 20 connected to the first body 10. The first body 10 is provided with a vacuum adsorption area 11, and the vacuum adsorption area 11 has a plurality of vacuum adsorption holes 111, and the plurality of vacuum adsorption holes 111 are used to adsorb the substrate to be mounted under the cooperation of the vacuum adsorption device; the second body 20 is provided with a suction nozzle storage area 21, and the suction nozzle storage area 21 is used to accommodate suction nozzles 200. The vacuum platform has a simple structure, can improve chip mounting efficiency, and has strong practicality.

[0031] The above-mentioned first body 10 and second body 20 are connected to each other. In this embodiment, the structures of the first body 10 and the second body 20 are not limited in this application. Those skilled in the art can select suitable materials as needed. For example, the first body 10 and the second body 20 can both be made of metal materials.

[0032] The first body 10 is provided with a vacuum adsorption area 11 . When the substrate to be mounted is placed on the first body 10 , the vacuum adsorption area 11 is used to perform vacuum adsorption on the substrate to be mounted.

[0033] In this embodiment, the vacuum adsorption area 11 has a plurality of vacuum adsorption holes 111, such as Figure 2 As shown, the specific number of the plurality of vacuum adsorption holes 111 is not specifically limited in this application and can be set according to the size range of the substrate to be mounted.

[0034] When in use, the plurality of vacuum adsorption holes 111 can adsorb the substrate to be mounted on the first body 10 with the cooperation of the vacuum adsorption equipment.

[0035] In order to make the various positions of the substrate to be mounted to be subjected to uniform force during vacuum adsorption and avoid the phenomenon of warping of the periphery of the substrate to be mounted or bulging of a certain area, in this embodiment, the plurality of vacuum adsorption holes 111 are arranged in a matrix in the vacuum adsorption area 11, and the distances between two adjacent vacuum adsorption holes 111 are equal, such as Figure 2 shown.

[0036] The nozzle storage area 21 provided on the second body 20 is used to accommodate the nozzle 200. In this way, a plurality of nozzles 200 can be accommodated through the nozzle storage area 21. When in use, when different chips need to be replaced with different nozzles 200 to meet the mounting requirements of chips of different sizes, the nozzle 200 can be directly taken and placed from the nozzle storage area 21, which is convenient for user operation and can improve mounting efficiency.

[0037] The specific shape and area of ​​the nozzle storage area 21 are not limited in this application and can be determined according to the number and type of nozzles 200 required and the size of the nozzles 200 .

[0038] In summary, the vacuum platform provided by the present application includes a first body 10 and a second body 20 connected to the first body 10. The first body 10 is provided with a vacuum adsorption area 11, and the vacuum adsorption area 11 has a plurality of vacuum adsorption holes 111. The plurality of vacuum adsorption holes 111 are used to adsorb the substrate to be mounted with the cooperation of the vacuum adsorption device; the second body 20 is provided with a nozzle receiving area 21, and the nozzle receiving area 21 is used to accommodate the nozzle 200. The present application can vacuum adsorb the substrate to be mounted by setting the vacuum adsorption area 11, and can accommodate a variety of different types of nozzles 200 by setting the nozzle receiving area 21. In this way, when the nozzle 200 needs to be replaced, the user only needs to take and place the nozzle 200 from the nozzle receiving area 21. The vacuum platform of the present application has a simple structure, and the setting of the nozzle receiving area 21 facilitates the taking and placing of different types of nozzles 200, saves operation time, can improve chip mounting efficiency, and has strong practicality.

[0039] It should be noted that the nozzle storage area 21 may be in various forms. For example, in a first feasible implementation, optionally, Figures 1 to 3 The nozzle storage area 21 has a plurality of storage holes 211 , the plurality of storage holes 211 are arranged at intervals, and at least two of the plurality of storage holes 211 have different apertures, and the plurality of nozzles 200 are received in the plurality of storage holes 211 in a one-to-one correspondence.

[0040] That is to say, in this implementation, the nozzle storage area 21 has a plurality of storage holes 211 , and each storage hole 211 can be used to accommodate a nozzle 200 .

[0041] At least two of the plurality of receiving holes 211 have different apertures, so that the plurality of receiving holes 211 can accommodate at least two suction nozzles 200 of different specifications.

[0042] In order to facilitate users to more conveniently take and place nozzles 200 of different specifications, the aperture of each receiving hole 211 can be marked, that is, each receiving hole 211 can be marked on the second body 20, for example, it can be marked with numbers.

[0043] Optionally, the apertures of any two receiving holes 211 are different. That is, each receiving hole 211 receives one suction nozzle 200, and the apertures of the plurality of receiving holes 211 are different, so that the plurality of receiving holes 211 can receive a plurality of suction nozzles 200 of different specifications.

[0044] In addition, it should be noted that, in this implementation, the diameter of each receiving hole 211 can be set based on the nozzle 200 being embedded or clamped in the receiving hole 211. In other words, the outer periphery of the nozzle 200 is clamped with the inner wall of the receiving hole 211.

[0045] In addition, in order to prevent contamination of the suction part of the suction nozzle 200, when the outer periphery of the suction nozzle 200 is clamped on the inner wall of the storage hole 211, the suction part of the suction nozzle 200 may not contact the bottom wall of the storage hole 211 (that is, the suction part of the suction nozzle 200 is suspended in the storage hole 211 and does not contact the inner wall or bottom wall of the storage hole 211).

[0046] In a second feasible implementation, optionally, the nozzle storage area 21 has a plurality of storage holes 211 , the plurality of storage holes 211 are arranged at intervals, and the apertures of the plurality of storage holes 211 are different.

[0047] That is to say, in this implementation, the diameters of any two receiving holes 211 are different. In this way, each receiving hole 211 can accommodate a suction nozzle 200 of one specification.

[0048] It should be noted that, in this case, each storage hole 211 can be used to accommodate one suction nozzle 200, or can be used to accommodate multiple suction nozzles 200. When multiple suction nozzles 200 need to be accommodated, each storage hole 211 can store multiple suction nozzles 200 of the same specification in one storage hole 211, which is convenient for users to take and put.

[0049] In addition, in this implementation, a corresponding aperture mark may be provided at each receiving hole 211 as in the first implementation.

[0050] In a third possible implementation, optionally, as Figure 4 As shown, the nozzle storage area 21 has a storage cavity 212 , and the storage cavity 212 is used to accommodate a plurality of nozzles 200 .

[0051] That is to say, in this implementation, all the suction nozzles 200 can be accommodated in the receiving cavity 212 .

[0052] In order to prevent the suction nozzle 200 from falling out of the storage cavity 212 , optionally, the depth of the storage cavity 212 is greater than the height of the suction nozzle 200 .

[0053] In this embodiment, in order to facilitate cleaning or maintenance of the nozzle receiving area 21, the second body 20 is optionally detachably connected to the first body 10. In this way, for example, when the nozzle receiving area 21 is dirty, the second body 20 can be removed from the first body 10, and the nozzle receiving area 21 on the second body 20 can be cleaned.

[0054] like Figure 1 and Figure 2 Optionally, the vacuum platform further includes a third body 30 connected to the first body 10, and a material throwing area 31 is provided on the third body 30. The material throwing area 31 is used to collect unrecognizable mounted chips. In the present application, by connecting the third body 30 to the first body 10 and providing the material throwing area 31 on the third body 30, the chip throwing stroke of the vacuum machine can be shortened, thereby improving the mounting efficiency.

[0055] Optionally, the material throwing area 31, the nozzle receiving area 21 and the vacuum adsorption area 11 are arranged along the first direction a, and the vacuum adsorption area 11 is located between the material throwing area 31 and the nozzle receiving area 21. In this way, when in use, the material throwing area 31 can be close to the operator, and the nozzle receiving area 21 can be far away from the operator, so that the operator can easily handle the waste chips when throwing; and because the nozzle receiving area 21 is far away from the operator, it can also prevent the nozzle 200 from being contaminated.

[0056] In order to facilitate the processing of the discarded chips in the nozzle receiving area 21, the third body 30 is optionally detachably connected to the first body 10. In this way, the third body 30 can be removed from the first body 10, and the discarded chips in the throwing area 31 on the third body 30 can be processed.

[0057] Another aspect of the present invention provides an electronic product placement device, which includes the above-mentioned vacuum platform. Since the specific structure and technical effects of the above-mentioned vacuum platform have been elaborated and explained in detail above, this application will not repeat them here.

[0058] The above description is only an optional embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

[0059] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present utility model will not further describe various possible combinations.

Claims

1. A vacuum platform, characterized in that: It includes a first body and a second body connected to the first body, the first body is provided with a vacuum adsorption area, the vacuum adsorption area has a plurality of vacuum adsorption holes, and the plurality of vacuum adsorption holes are used to adsorb the substrate to be mounted with the cooperation of the vacuum adsorption equipment; the second body is provided with a suction nozzle storage area, and the suction nozzle storage area is used to accommodate the suction nozzle.

2. The vacuum platform according to claim 1, characterized in that: The nozzle storage area has a plurality of storage holes, the plurality of storage holes are arranged at intervals, and at least two of the plurality of storage holes have different apertures, and the plurality of nozzles are accommodated in the plurality of storage holes in a one-to-one correspondence.

3. The vacuum platform according to claim 2, characterized in that: The apertures of any two receiving holes are different.

4. The vacuum platform according to claim 1, characterized in that: The nozzle storage area has a storage cavity, and the storage cavity is used to accommodate a plurality of the nozzles.

5. The vacuum platform according to claim 4, characterized in that: The depth of the storage cavity is greater than the height of the suction nozzle.

6. The vacuum platform according to claim 1, characterized in that: The second body is detachably connected to the first body.

7. The vacuum platform according to any one of claims 1 to 6, characterized in that: The vacuum platform further comprises a third body connected to the first body, and a material throwing area is arranged on the third body.

8. The vacuum platform according to claim 7, characterized in that: The material throwing area, the nozzle receiving area and the vacuum adsorption area are arranged along a first direction, and the vacuum adsorption area is located between the material throwing area and the nozzle receiving area.

9. The vacuum platform according to claim 7, characterized in that: The third body is detachably connected to the first body.

10. An electronic product mounting device, characterized in that: A vacuum platform comprising any one of claims 1 to 9.

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