Device for manually stripping blue film

Abstract

The utility model belongs to the field of semiconductor manufacturing, and provides a device for manually stripping a blue film, which is used after a wafer is subjected to a surface treatment part process after film pasting, and comprises a working platform, a ceramic plate, two limiting columns, an air pipe and a heating pad. The heating pad is arranged at the bottom of the working platform, and the air pipe is arranged on one side of the working platform. The wafer is placed on the working platform and the ceramic plate, the blue film on the surface of the wafer is removed by using an adhesive tape, and the wafer can be taken and placed from the hollow part of the platform. The heating function enables the blue film to be separated from the wafer more easily, and the fixed wafer is more convenient for personnel to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a device used for removing and peeling off a blue film after a blue film is attached to the surface of a silicon wafer and undergoes a surface treatment process. Background Art

[0002] Silicon wafers, also known as wafers, are made from silicon ingots. Millions of transistors can be etched on silicon wafers through a special process, and are widely used in the manufacture of integrated circuits. Part of the silicon wafer processing requires surface treatment processes.

[0003] In the surface treatment of silicon wafers, according to needs, you can choose to apply a film to the back of the wafer before performing some processes. Finally, the blue film on the surface needs to be removed. In the process of manually removing the blue film, the blue film and the wafer are tightly connected. If you directly use tape to stick to the blue film and then tear it off, the wafer may move with the tape and it is more laborious. Utility Model Content

[0004] In order to improve the above problems, the purpose of the utility model is to provide a device for manually peeling off the blue film, which is used after the wafer has undergone a surface treatment process after the film is attached. Through the device, when removing the blue film on the surface of the wafer, the wafer is fixed more firmly and is not easy to move with the tape, and the blue film is easier to peel off.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A device for manually peeling off blue film, the device includes: the device includes: a working platform, a ceramic plate, two limit columns, an air pipe and a heating pad. The ceramic plate and the two limit columns are on the working platform, the heating pad is at the bottom of the working platform, and the air pipe is on one side of the working platform. A working platform for placing wafers; the center of the working platform is hollowed out and a ceramic plate is fixedly placed; the ceramic plate has evenly distributed grooves, and the grooves have air holes connected to external negative pressure air; there is a heating pad under the ceramic plate, and the heating pad is powered by an external power supply to heat up; there is a limit device on the working platform; there is a part of the working platform near the ceramic plate that is hollowed out to facilitate personnel to take and place wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a structural schematic diagram of the utility model.

[0008] Description of Figure Numbers:

[0009] 1Working platform

[0010] 2 Ceramic Plates

[0011] 3 Limiting device

[0012] 4Hollow-out design of the working platform

[0013] 5 Grooves on the ceramic plate

[0014] 6. Holes in the groove for connecting to external negative pressure air

[0015] 7. Air pipe connecting the ceramic plate and external negative pressure air (can be controlled by a switch)

[0016] 8. Connect the power cord of the external power supply and the heating pad at the bottom of the ceramic plate (can be controlled by a switch) DETAILED DESCRIPTION

[0017] In the surface treatment of silicon wafers, a film can be attached to the surface of the wafer and then partially processed according to the needs. Finally, the blue film on the surface of the wafer needs to be removed. In the process of manually removing the blue film, the blue film and the wafer are closely connected. If the blue film is directly adhered to with tape and then removed, the wafer may move with the tape, and it is more laborious. In order to improve this problem, this device is designed.

[0018] The utility model is combined with actual process requirements to improve the difficulty of manually removing the blue film. The specific implementation of the utility model is described in detail below in conjunction with the accompanying drawings.

[0019] When manually removing the blue film, first turn on the power switch connecting the external power supply and the heating pad at the bottom of the ceramic disk. After the ceramic disk is heated to a certain degree, place the wafer to be torn off on the working platform 1 of the device, with the side with the blue film facing up, the edge of the wafer close to the limit device 3, and the wafer completely covered on the ceramic disk 2. Turn on the switch of the air pipe 7 connecting the external negative pressure air and the ceramic disk. At this time, the wafer will be adsorbed on the ceramic disk 2 and the working platform 1 and heated. At this time, use tape to stick the blue film on the surface of the wafer and perform the peeling action. Because the wafer is adsorbed on the ceramic disk 2 and the working platform 1, it will not move due to the pulling of the tape. The heating function reduces the viscosity of the blue film and makes it easier to peel off the blue film. After completing the blue film peeling action, the switch of the air pipe 7 connecting the external negative pressure air and the ceramic disk needs to be turned off. Reach your hand into the hollow 4 of the working platform, pick up the wafer, and complete the operation.

[0020] Place the wafer on the work platform and ceramic plate, and then use tape to remove the blue film on the wafer surface. The wafer can be taken in and out from the hollow part of the platform. The heating function makes it easier to separate the blue film from the wafer, and the fixed wafer is also more convenient for personnel to operate, thereby improving production efficiency.

Claims

1. A device for manually peeling off blue film, which is used for wafers after filming and undergoing surface treatment process, and is characterized by: The device comprises: a working platform, a ceramic plate, two limiting columns, an air pipe and a heating pad. The ceramic plate and the two limiting columns are on the working platform, the heating pad is at the bottom of the working platform, and the air pipe is on one side of the working platform.

2. A device for manually peeling off blue film as claimed in claim 1, characterized in that: The ceramic plate of the device is fixedly placed inside the platform, and its upper surface is at the same level as the platform. When the chip is placed on the platform and the ceramic plate, there will be no warping.

3. A device for manually peeling off blue film as claimed in claim 1, characterized in that: The upper surface of the ceramic plate of the device is provided with evenly distributed grooves, and the grooves are provided with air holes inside, so that when the chip is placed on the ceramic plate and the platform, the negative pressure air is turned on and the chip will be fixed on the ceramic plate and the platform.

4. A device for manually peeling off blue film as claimed in claim 1, characterized in that: The bottom of the ceramic plate of the device is provided with a heating pad, and the heating function is always turned on during operation. When a chip with a blue film is placed on the ceramic plate, the chip and the blue film are heated, and the blue film will be easier to peel off from the chip.

5. A device for manually peeling off blue film as claimed in claim 1, characterized in that: The working platform of the device is partially hollowed out to facilitate personnel to take and place chips.

6. A device for manually peeling off blue film as claimed in claim 1, characterized in that: There are erected limit columns on the working platform of the device. When the chip is placed on the platform and the ceramic disk, the edge of the chip is close to the limit columns, and the chip will be completely covered on the ceramic disk. The negative pressure fixation and heating function of the ceramic disk are then used to stick the blue film with tape and peel it off.

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