Wafer positioning and calibrating mechanism

By setting a rotating ring and a transparent seat in the wafer positioning calibration mechanism, the problem that the camera cannot photograph and identify the entire wafer in the prior art is solved, and accurate identification and cutting of the wafer angle and contour are achieved.

CN222581135UActive Publication Date: 2025-03-07NAMI SEMICON EQUIP (GUANGZHOU) CO LTD
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Patent Information

Application Number
CN202421023873.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-11
Publication Date
2025-03-07
Estimated Expiration
2034-05-11

AI Technical Summary

Technical Problem

In the prior art, the hollow aperture of the DD motor is small, which makes it impossible for the camera to photograph and identify the contour of the entire wafer, and thus cannot accurately rotate the wafer, affecting the cutting accuracy.

Method used

A wafer positioning calibration mechanism is designed. By setting a rotating ring and a transparent seat, the camera can photograph and identify the wafer on the transparent seat through the through hole and after perforation, and by increasing the aperture of the through hole and perforation, the camera can photograph the entire wafer.

Benefits of technology

Through this device, the camera can accurately identify the angle and profile of the wafer, greatly improving the accuracy of wafer cutting.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer positioning and calibrating mechanism, which comprises a positioning seat. A through hole is formed in the positioning seat in a penetrating manner; a rotating ring is rotationally arranged at the through hole; a through hole is formed in the rotating ring in a penetrating manner; a transparent seat is arranged at the through hole; the positioning seat is provided with a rotary driving piece and a linkage piece; the rotation driving piece drives the rotating ring to rotate through the linkage piece; the wafer positioning and calibrating mechanism further comprises a camera. And the camera is arranged at the bottom of the positioning seat. By arranging the rotating ring and the transparent seat, the camera can shoot and identify the wafer on the transparent seat after passing through the through hole and the through hole, so that the camera can shoot the whole wafer by increasing the aperture of the through hole and the aperture of the through hole, and the processing accuracy is greatly improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer positioning and calibration mechanism. Background Art

[0002] With the development of semiconductor technology, the demand for high-performance and highly integrated semiconductor chips is increasing, and the difficulty of chip production is also increasing. Semiconductor chips are usually deposited on a whole substrate wafer with integrated circuit component structure, then the wafer is cut, and finally the individual crystals obtained after cutting are packaged.

[0003] Therefore, the effect of wafer cutting has a great impact on the performance and economic benefits of chip packaging. When cutting the wafer, the wafer needs to be rotated to a predetermined angle so that the wafer can be accurately cut.

[0004] Before the wafer is rotated to a predetermined angle, it is necessary to cooperate with the camera to shoot and identify the current angle of the wafer. The traditional method is to use a DD motor, place the wafer on the output end at the top of the DD motor, and set the DD motor as a hollow structure. The camera is set at the bottom of the DD motor, and the camera shoots the wafer after passing through the hollow position of the DD motor; however, due to the limitation of the DD motor itself, the hollow aperture of the DD motor is small, which makes it impossible for the camera to shoot and identify the outline of the entire wafer, resulting in the wafer being unable to be rotated to the predetermined angle and unable to be accurately cut. Utility Model Content

[0005] The utility model aims to provide a wafer positioning and calibration mechanism in view of the above-mentioned deficiencies in the prior art.

[0006] The purpose of the utility model is achieved through the following technical solutions: a wafer positioning and calibration mechanism, comprising a positioning seat; the positioning seat is penetrated by a through hole; a rotating ring is rotatably arranged at the through hole; the rotating ring is penetrated by a through hole; a transparent seat is arranged at the through hole; the positioning seat is provided with a rotating driving member and a linkage member; the rotating driving member drives the rotating ring to rotate through the linkage member;

[0007] The wafer positioning and calibration mechanism also includes a camera; the camera is arranged at the bottom of the positioning seat.

[0008] The utility model is further configured that a bearing is provided between the through hole and the rotating ring; a first pressure ring is provided between the rotating ring and the bearing; and a second pressure ring is provided between the positioning seat and the bearing.

[0009] The utility model is further configured that the wafer positioning and calibration mechanism also includes a fixed ring; the fixed ring is arranged on the top of the rotating ring; the transparent seat is arranged on the fixed ring; and the transparent seat is arranged on the top of the through hole.

[0010] The utility model is further configured that the upper surface of the transparent seat is provided with a plurality of air grooves; and the fixing ring is provided with air ports communicated with the air grooves.

[0011] The utility model is further configured that a plurality of air grooves are arranged in concentric circles.

[0012] The utility model is further configured that the rotating driving member includes a driving motor arranged on a positioning seat; the linkage member includes a transmission wheel rotatably arranged on an output end of the driving motor and a synchronous belt arranged between the transmission wheel and an outer wall of a rotating ring.

[0013] The utility model is further configured that the linkage member also includes a tensioning wheel rotatably arranged on the positioning seat; the tensioning wheel is arranged between the rotating ring and the driving wheel; the tensioning wheel abuts against the synchronous belt.

[0014] The utility model is further configured that the wafer positioning and calibration mechanism also includes a base frame; the base frame is provided with a transverse shift seat; the base frame is provided with a transverse shift mechanism for driving the transverse shift seat to move transversely; the transverse shift seat is provided with a longitudinal shift seat; the transverse shift seat is provided with a longitudinal shift mechanism for driving the longitudinal shift seat to move longitudinally;

[0015] The positioning seat is arranged on the longitudinal displacement seat; the transverse displacement seat is penetrated by a first through hole; the longitudinal displacement seat is penetrated by a second through hole;

[0016] The camera is arranged on the bottom frame.

[0017] The utility model is further configured that the transverse movement mechanism includes a transverse movement rail arranged on the base frame, a transverse movement slider slidably arranged on the transverse movement rail, and a transverse movement driving member arranged on the base frame; the output end of the transverse movement driving member and the transverse movement slider are respectively connected to the transverse movement seat.

[0018] The utility model is further configured that the longitudinal movement mechanism includes a longitudinal movement slide rail arranged on the transverse movement seat, a longitudinal movement slider slidably arranged on the longitudinal movement slide rail, and a longitudinal movement driving member arranged on the transverse movement seat; the output end of the longitudinal movement driving member and the longitudinal movement slider are respectively connected to the longitudinal movement seat.

[0019] The beneficial effects of the utility model are as follows: by setting a rotating ring and a transparent seat, the utility model can enable the camera to photograph and identify the wafer on the transparent seat through the through hole and the perforation, and it is convenient to increase the aperture of the through hole and the aperture of the perforation so that the camera can photograph the entire wafer, thereby greatly increasing the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0021] Figure 1 It is a structural schematic diagram of the utility model;

[0022] Figure 2 It is a cross-sectional view of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the utility model after the positioning seat is hidden;

[0024] Figure 4 This is a schematic diagram of the structure of the utility model after the positioning seat and the transverse displacement seat are hidden;

[0025] Figure 5 This is a schematic diagram of the structure of the utility model after the transverse shifting seat and the bottom frame are hidden;

[0026] Figure 6 This is a schematic diagram of the structure of the utility model from another perspective after the transverse shifting seat and the bottom frame are hidden;

[0027] Figure 7 This is a cross-sectional view of the utility model after the transverse shift seat and the base frame are hidden;

[0028] Among them: 1. positioning seat; 11. through hole; 12. driving motor; 2. rotating ring; 21. through hole; 3. fixing ring; 31. air port; 4. transparent seat; 41. air groove; 5. camera; 6. bearing; 61. first pressure ring; 62. second pressure ring; 71. transmission wheel; 72. synchronous belt; 73. tensioning wheel; 8. base frame; 81. transverse seat; 82. first through hole; 83. transverse slide rail; 84. transverse slider; 85. transverse driving member; 9. longitudinal seat; 91. second through hole; 92. longitudinal slide rail; 93. longitudinal slider; 94. longitudinal driving member. DETAILED DESCRIPTION

[0029] The utility model is further described in conjunction with the following embodiments.

[0030] Depend on Figures 1 to 7 It can be seen that the wafer positioning and calibration mechanism described in this embodiment includes a positioning seat 1; the positioning seat 1 is penetrated by a through hole 11; a rotating ring 2 is rotatably provided at the through hole 11; the rotating ring 2 is penetrated by a through hole 21; a transparent seat 4 is provided at the through hole 21; the positioning seat 1 is provided with a rotating driving member and a linkage member; the rotating driving member drives the rotating ring 2 to rotate through the linkage member;

[0031] The wafer positioning and calibration mechanism further includes a camera 5 ; the camera 5 is disposed at the bottom of the positioning seat 1 .

[0032] Specifically, when the wafer positioning and calibration mechanism described in this embodiment is used, the wafer is placed on the top of the transparent seat 4, and then the positioning seat 1 is moved to the top of the camera 5, so that the camera 5, the through hole 11, the perforation 21 and the transparent seat 4 are arranged opposite each other. The camera 5 can take a photo to identify the outline of the wafer on the transparent seat 4, and according to the image taken and identified, the rotating drive member is controlled to drive the rotating ring 2 to rotate through the linkage member, so that the wafer is rotated to a preset angle, thereby accurately processing the wafer.

[0033] In this embodiment, by setting a rotating ring 2 and a transparent seat 4, the camera 5 can photograph and identify the wafer on the transparent seat 4 through the through hole 11 and the perforation 21. It is convenient to increase the aperture of the through hole 11 and the aperture of the perforation 21, so that the camera 5 can photograph the entire wafer, which greatly increases the accuracy of processing.

[0034] In the wafer positioning and calibration mechanism described in this embodiment, a bearing 6 is provided between the through hole 11 and the rotating ring 2 ; a first pressure ring 61 is provided between the rotating ring 2 and the bearing 6 ; and a second pressure ring 62 is provided between the positioning seat 1 and the bearing 6 .

[0035] Specifically, in this embodiment, a bearing 6 is provided between the inner wall of the through hole 11 and the outer wall of the rotating ring 2 so that the rotating ring 2 can rotate in the through hole 11. In addition, by providing a first pressure ring 61 and a second pressure ring 62, the stability between the through hole 11, the bearing 6 and the rotating ring 2 can be ensured.

[0036] The wafer positioning and calibration mechanism described in this embodiment further includes a fixed ring 3 ; the fixed ring 3 is arranged on the top of the rotating ring 2 ; the transparent seat 4 is arranged on the fixed ring 3 ; the transparent seat 4 is arranged on the top of the through hole 21 .

[0037] Specifically, in this embodiment, the fixed ring 3 is provided, and the fixed ring 3 can rotate along with the rotating ring 2 and can be easily assembled and disassembled from the rotating ring 2 , so that the transparent seat 4 can be replaced or repaired.

[0038] In the wafer positioning and calibration mechanism described in this embodiment, the upper surface of the transparent seat 4 is provided with a plurality of air grooves 41; the fixing ring 3 is provided with an air port 31 connected to the air grooves 41. Specifically, through the above arrangement, the transparent seat 4 can adsorb the wafer on the upper surface of the transparent seat 4.

[0039] In the wafer positioning and calibration mechanism described in this embodiment, a plurality of air grooves 41 are arranged in concentric circles. Specifically, the wafer can be stably adsorbed on the upper surface of the transparent seat 4 through the above arrangement.

[0040] The wafer positioning and calibration mechanism described in this embodiment, the rotating driving part includes a driving motor 12 arranged on the positioning seat 1; the linkage part includes a transmission wheel 71 rotatably arranged at the output end of the driving motor 12 and a synchronous belt 72 arranged between the transmission wheel 71 and the outer wall of the rotating ring 2.

[0041] Specifically, the driving motor 12 can rotate according to the image captured and recognized by the camera 5, thereby driving the rotating ring 2 to rotate through the synchronous belt 72, so that the wafer on the transparent seat 4 rotates to a predetermined angle.

[0042] In the wafer positioning and calibration mechanism described in this embodiment, the linkage member further includes a tensioning wheel 73 rotatably arranged on the positioning seat 1; the tensioning wheel 73 is arranged between the rotating ring 2 and the transmission wheel 71; the tensioning wheel 73 abuts against the synchronous belt 72. Specifically, the synchronous belt 72 can be in a tensioned state through the above arrangement.

[0043] The wafer positioning and calibration mechanism described in this embodiment also includes a base frame 8; the base frame 8 is provided with a transverse shift seat 81; the base frame 8 is provided with a transverse shift mechanism for driving the transverse shift seat 81 to move transversely; the transverse shift seat 81 is provided with a longitudinal shift seat 9; the transverse shift seat 81 is provided with a longitudinal shift mechanism for driving the longitudinal shift seat 9 to move longitudinally; the positioning seat 1 is provided on the longitudinal shift seat 9; the transverse shift seat 81 is penetrated by a first through hole 82; the longitudinal shift seat 9 is penetrated by a second through hole 91; the camera 5 is provided on the base frame 8.

[0044] Specifically, through the above-mentioned arrangement, the positioning seat 1 and the transparent seat 4 can be driven to move horizontally and vertically, thereby driving the wafer to be loaded and unloaded; when the horizontal movement mechanism drives the horizontal movement seat 81 to move horizontally, the first through hole 82 moves to the top of the camera 5, and at the same time the vertical movement mechanism drives the vertical movement seat 9 to move vertically, so that the second through hole 91 moves to the top of the first through hole 82. At this time, the camera 5, the first through hole 82, the second through hole 91, the through hole 11, the through hole 21 and the transparent seat 4 are arranged opposite to each other, so that the camera 5 can photograph and identify the wafer on the transparent seat 4.

[0045] The wafer positioning and calibration mechanism described in this embodiment comprises a transverse movement mechanism including a transverse movement rail 83 provided on the base frame 8, a transverse movement slider 84 slidably provided on the transverse movement rail 83, and a transverse movement driving member 85 provided on the base frame 8; the output end of the transverse movement driving member 85 and the transverse movement slider 84 are respectively connected to the transverse movement seat 81. The transverse movement driving member 85 can be a motor screw mechanism, a cylinder or a linear module, etc., which cooperates with the transverse movement rail 83 and the transverse movement slider 84 to drive the transverse movement seat 81 and the transparent seat 4 to move transversely.

[0046] The wafer positioning and calibration mechanism described in this embodiment includes a longitudinal movement mechanism including a longitudinal movement rail 92 provided on the transverse movement seat 81, a longitudinal movement slider 93 slidably provided on the longitudinal movement rail 92, and a longitudinal movement driving member 94 provided on the transverse movement seat 81; the output end of the longitudinal movement driving member 94 and the longitudinal movement slider 93 are respectively connected to the longitudinal movement seat 9. The longitudinal movement driving member 94 can be a motor screw mechanism, a cylinder or a linear module, etc., which cooperates with the longitudinal movement rail 92 and the longitudinal movement slider 93 to drive the longitudinal movement seat 9 and the transparent seat 4 to move longitudinally.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A wafer positioning and calibration mechanism, characterized in that: The invention comprises a positioning seat (1); the positioning seat (1) is provided with a through hole (11); a rotating ring (2) is rotatably provided at the through hole (11); a through hole (21) is provided at the rotating ring (2); a transparent seat (4) is provided at the through hole (21); the positioning seat (1) is provided with a rotating driving member and a linkage member; the rotating driving member drives the rotating ring (2) to rotate via the linkage member; The wafer positioning and calibration mechanism also includes a camera (5); the camera (5) is arranged at the bottom of the positioning seat (1).

2. A wafer positioning and calibration mechanism according to claim 1, characterized in that: A bearing (6) is provided between the through hole (11) and the rotating ring (2); a first pressure ring (61) is provided between the rotating ring (2) and the bearing (6); and a second pressure ring (62) is provided between the positioning seat (1) and the bearing (6).

3. The wafer positioning and calibration mechanism according to claim 1, characterized in that: The wafer positioning and calibration mechanism also includes a fixed ring (3); the fixed ring (3) is arranged on the top of the rotating ring (2); the transparent seat (4) is arranged on the fixed ring (3); the transparent seat (4) is arranged on the top of the through hole (21).

4. The wafer positioning and calibration mechanism according to claim 3, characterized in that: The upper surface of the transparent seat (4) is provided with a plurality of air grooves (41); and the fixing ring (3) is provided with an air port (31) communicating with the air grooves (41).

5. The wafer positioning and calibration mechanism according to claim 4, characterized in that: The plurality of air grooves (41) are arranged in concentric circles.

6. The wafer positioning and calibration mechanism according to claim 1, characterized in that: The rotating drive member comprises a driving motor (12) arranged on the positioning seat (1); the linkage member comprises a transmission wheel (71) rotatably arranged on the output end of the driving motor (12) and a synchronous belt (72) arranged between the transmission wheel (71) and the outer wall of the rotating ring (2).

7. The wafer positioning and calibration mechanism according to claim 6, characterized in that: The linkage member also includes a tensioning wheel (73) rotatably arranged on the positioning seat (1); the tensioning wheel (73) is arranged between the rotating ring (2) and the transmission wheel (71); the tensioning wheel (73) abuts against the synchronous belt (72).

8. The wafer positioning and calibration mechanism according to claim 1, characterized in that: The wafer positioning and calibration mechanism further comprises a base frame (8); the base frame (8) is provided with a transverse shift seat (81); the base frame (8) is provided with a transverse shift mechanism for driving the transverse shift seat (81) to move transversely; the transverse shift seat (81) is provided with a longitudinal shift seat (9); the transverse shift seat (81) is provided with a longitudinal shift mechanism for driving the longitudinal shift seat (9) to move longitudinally; The positioning seat (1) is arranged on the longitudinal displacement seat (9); the transverse displacement seat (81) is provided with a first through hole (82); the longitudinal displacement seat (9) is provided with a second through hole (91); The camera (5) is arranged on a bottom frame (8).

9. The wafer positioning and calibration mechanism according to claim 8, characterized in that: The transverse movement mechanism comprises a transverse movement rail (83) arranged on the base frame (8), a transverse movement slider (84) slidably arranged on the transverse movement rail (83), and a transverse movement driving member (85) arranged on the base frame (8); the output end of the transverse movement driving member (85) and the transverse movement slider (84) are respectively connected to the transverse movement seat (81).

10. The wafer positioning and calibration mechanism according to claim 8, characterized in that: The longitudinal movement mechanism comprises a longitudinal movement slide rail (92) arranged on the transverse movement seat (81), a longitudinal movement slider (93) slidably arranged on the longitudinal movement slide rail (92), and a longitudinal movement driving member (94) arranged on the transverse movement seat (81); the output end of the longitudinal movement driving member (94) and the longitudinal movement slider (93) are respectively connected to the longitudinal movement seat (9).