Wafer cutting and film expanding platform device of KGD sorting machine

Abstract

The utility model discloses a KGD sorting machine wafer cutting and film expanding platform device which comprises a base and a working table, a wafer film expanding platform is arranged between the base and the working table, a lifting mechanism and a rotating mechanism are arranged on the base, an iron ring fixing mechanism is arranged at the lower end of the working table, a plurality of precise lead screws are arranged on the wafer film expanding platform, and the precise lead screws are arranged on the working table. Rotary auxiliary gears are arranged at the lower ends of the precise lead screws, and lifting auxiliary gears are arranged at the lower ends of the rotary auxiliary gears. The automatic film expanding device has the beneficial effects that the integrated operation of automatic positioning and automatic film expanding of the cut wafer is realized, the operation steps are saved, the uncertain factors generated in the circulation process of the traditional method are avoided, the production efficiency is improved, and the wafer positioning precision and the film expanding precision are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a KGD sorting machine wafer cutting film expansion platform device. Background Art

[0002] During the chip production process, the process from wafer to chip needs to go through the dicing process. The width of the chip dicing tool is generally only tens of microns, and the width of the dicing road is only a few hundred microns. If the wafer that has been diced is directly taken out, it will cause the chip to collapse, break or stick. Therefore, the chip needs to undergo a film expansion action before being taken out. That is, the distance between the chips on the diced wafer is expanded from hundreds of microns to millimeter level to ensure that the chip will not collapse, break or stick in the process of taking out.

[0003] The existing production process is to first place the cut wafers on a semi-automatic film expanding machine for wafer film expansion, and then place them in the material box of the sorting machine for sorting. Two operation steps are required to complete the sorting, which is inefficient. In addition, the existing semi-automatic film expanding machine has poor film expansion accuracy and inaccurate positioning. There are also various uncertainties when transferring the material box, resulting in product NG. Utility Model Content

[0004] The utility model aims to provide a KGD sorting machine wafer cutting and film expansion platform device to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a KGD sorting machine cutting wafer film expansion platform device, comprising a base and a workbench, a wafer film expansion platform is arranged between the base and the workbench, a lifting mechanism and a rotating mechanism are arranged on the base, an iron ring fixing mechanism is arranged at the lower end of the workbench, a plurality of precision screws are arranged on the wafer film expansion platform, a plurality of rotation auxiliary gears are arranged at the lower ends of the plurality of precision screws, and a lifting auxiliary gear is arranged at the lower end of the rotation auxiliary gear.

[0007] Furthermore, the workbench includes a film expansion limiting ring, and an upper pressing plate and a lower pressing plate are respectively provided at the upper and lower ends of the film expansion limiting ring, and the upper pressing plate and the lower pressing plate are connected by the iron ring fixing mechanism.

[0008] Furthermore, the lower end of the wafer expansion platform is engaged with the base, and a plurality of auxiliary wheels are provided at the lower end of the wafer expansion platform, and the auxiliary wheels and the rotating auxiliary gears are spaced apart from each other.

[0009] Furthermore, the lifting mechanism includes a first drive motor and a lifting drive gear, and the lifting drive gear is meshingly connected with the lifting auxiliary gear.

[0010] Furthermore, the rotating mechanism includes a second driving motor and a rotating driving gear, and the rotating driving gear is meshingly connected with the rotating auxiliary gear.

[0011] Furthermore, the iron ring fixing mechanism comprises a rotating shaft, two iron rings are fixedly arranged on the rotating shaft, and a rotating motor is arranged at one end of the rotating shaft.

[0012] Furthermore, the upper ends of the plurality of precision screw rods are connected to the workbench.

[0013] Beneficial effects: A KGD sorting machine wafer cutting and film expansion platform device realizes the integrated operation of automatic positioning and automatic film expansion of the wafer after cutting, saves operation steps, avoids the uncertainty factors generated by traditional methods in the circulation process, improves production efficiency, and improves wafer positioning accuracy and film expansion accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is an exploded schematic diagram of the overall structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the overall structure of the utility model from another angle;

[0017] Figure 4 It is a schematic diagram of the structure of the iron ring fixing mechanism of the utility model.

[0018] Reference numerals

[0019] 1-base, 2-workbench, 21-film expansion limiting ring, 22-upper pressure plate, 23-lower pressure plate, 3-wafer film expansion platform, 4-lifting mechanism, 41-first drive motor, 42-lifting drive gear, 5-rotation mechanism, 51-second drive motor, 52-rotation drive gear, 6-precision screw, 7-rotation auxiliary gear, 8-lifting auxiliary gear, 9-iron ring fixing mechanism, 91-rotation shaft, 92-iron ring, 93-rotation motor, 10-auxiliary wheel. DETAILED DESCRIPTION

[0020] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0021] Example

[0022] like Figure 1-4As shown, a KGD sorting machine cutting wafer film expansion platform device includes a base 1 and a workbench 2, a wafer film expansion platform 3 is arranged between the base 1 and the workbench 2, a lifting mechanism 4 and a rotating mechanism 5 are arranged on the base 1, an iron ring fixing mechanism 9 is arranged at the lower end of the workbench 2, a plurality of precision screws 6 are arranged on the wafer film expansion platform 3, a rotation auxiliary gear 7 is arranged at the lower end of the plurality of precision screws 6, and a lifting auxiliary gear 8 is arranged at the lower end of the rotation auxiliary gear 7.

[0023] In embodiment one, the workbench 2 includes a film expansion limit ring 21, and an upper pressure plate 22 and a lower pressure plate 23 are respectively provided at the upper and lower ends of the film expansion limit ring 21. The upper pressure plate 23 includes two mirror-set pressure plates, and the upper pressure plate 22 and the lower pressure plate 23 are connected by an iron ring fixing mechanism 9. The upper pressure plate 22 and the lower pressure plate 23 are provided with positioning grooves on one side close to the iron ring fixing mechanism 9. The iron ring fixing mechanism 9 includes a rotating shaft 91, and two iron rings 92 are fixedly provided on the rotating shaft 91. A rotating motor 93 is provided at one end of the rotating shaft 91. The rotating motor 93 drives the rotating shaft 91 and the two iron rings 92 to rotate upward 90 degrees. The two iron rings 92 are inserted into the positioning grooves of the workbench 2 to fix the film expansion limit ring 21 between the upper pressure plate 22 and the lower pressure plate 23.

[0024] In the second embodiment, the wafer expansion platform 3 and the workbench 2 are connected by a precision screw 6. A plurality of auxiliary wheels 10 are also provided at the lower end of the wafer expansion platform 3. The auxiliary wheels 10 and the rotating auxiliary gear 7 are spaced apart from each other. The lifting mechanism 4 includes a first driving motor 41 and a lifting driving gear 42. The lifting driving gear 42 is meshingly connected with the lifting auxiliary gear 8. The first driving motor 41 rotates the lifting driving gear 42 to drive the lifting auxiliary gear 8 to rotate along the precision screw 6, so that the workbench 2 moves up and down. The rotating mechanism 5 includes a second driving motor 51 and a rotating driving gear 52. The rotating driving gear 52 is meshingly connected with the rotating auxiliary gear 7. The second driving motor 51 rotates the rotating driving gear 52 to drive the rotating auxiliary gear 7 to rotate, so that the wafer expansion platform and the workbench 2 rotate together to the desired angle.

[0025] The operation steps are as follows:

[0026] This device is installed above the film expansion lifting mechanism. When in use, the two iron rings 92 at the lower end of the workbench 2 are automatically pulled into the workbench 2, and the rotating shaft is driven by the rotating motor 93 to flip 90 degrees, so that the two iron rings 92 are fixed in the workbench 2, and the film expansion limit ring 21 is clamped. Then, the workbench 2 is automatically positioned according to the visual inspection mechanism license plate of the equipment, and the rotating auxiliary gear 7 is driven by the rotating mechanism 5 to rotate to the required angle. After positioning is completed, the lifting auxiliary gear 8 is driven to rotate by the lifting mechanism 4, driving the multiple precision screws 6 on the workbench 2 to rotate synchronously, so that the workbench 2 slowly descends to the set height, and cooperates with the wafer film expansion platform 3 to complete the film expansion action.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the utility model content within the protection scope of the utility model.

Claims

1. A KGD sorting machine wafer cutting and film expansion platform device, comprising a base (1) and a workbench (2), characterized in that: A wafer film expansion platform (3) is provided between the base (1) and the workbench (2); a lifting mechanism (4) and a rotating mechanism (5) are provided on the base (1); an iron ring fixing mechanism (9) is provided at the lower end of the workbench (2); a plurality of precision screws (6) are provided on the wafer film expansion platform (3); a rotating auxiliary gear (7) is provided at the lower end of the plurality of precision screws (6); and a lifting auxiliary gear (8) is provided at the lower end of the rotating auxiliary gear (7).

2. A KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The workbench (2) comprises a film expansion limiting ring (21), and an upper pressing plate (22) and a lower pressing plate (23) are respectively provided at the upper and lower ends of the film expansion limiting ring (21), and the upper pressing plate (22) and the lower pressing plate (23) are connected via the iron ring fixing mechanism (9).

3. A KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The lower end of the wafer expansion platform (3) is mutually clamped with the base (1), and a plurality of auxiliary wheels (10) are also provided at the lower end of the wafer expansion platform (3), and the auxiliary wheels (10) and the rotating auxiliary gears (7) are mutually spaced.

4. A KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The lifting mechanism (4) comprises a first drive motor (41) and a lifting drive gear (42), and the lifting drive gear (42) is meshingly connected with the lifting auxiliary gear (8).

5. The KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The rotating mechanism (5) comprises a second driving motor (51) and a rotating driving gear (52), and the rotating driving gear (52) is meshedly connected with the rotating auxiliary gear (7).

6. A KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The iron ring fixing mechanism (9) comprises a rotating shaft (91), two iron rings (92) are fixedly arranged on the rotating shaft (91), and a rotating motor (93) is arranged at one end of the rotating shaft (91).

7. The KGD sorting machine wafer cutting and film expansion platform device according to claim 1, characterized in that: The upper ends of the plurality of precision screw rods (6) are all connected to the workbench (2).

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