Chip fixing device for chip processing equipment

Abstract

The utility model discloses a chip fixing device for chip processing equipment, which structurally comprises an insulating plate, a limit frame, a bearing block, a base and a connecting block, the insulating plate falls into the internal area of the limit frame and is overlapped with the limit frame, the lower end of the limit frame is vertically and fixedly connected with the bearing block, the center of the base is overlapped with the bearing block, and the connecting block is arranged on the base. The connecting blocks are welded to the left side and the right side of the base. After the insulating plate is further improved, the bearing performance of the insulating plate can be improved according to the mutual overlapping of the adsorption plate and the parallel blocks, the chip embedding stability is improved by polishing the contact layer, and the vertical plates on the left side and the right side can be manually controlled by an operator through the through cavities, so that after the chip processing is finished, the chip embedding stability is improved, and the chip embedding efficiency is improved. And an operator pulls the through groove of the vertical plate to manually drive the chip to be separated from the interior of the limiting frame, so that the effect of quickly taking out the chip in an energy-saving manner is achieved, and the taking-out convenience after the chip is processed is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a chip fixing device for chip processing equipment. Background Art

[0002] Chip, also known as integrated circuit, is a tiny sheet of silicon-based material with electronic components such as transistors, resistors, capacitors, etc. It is a basic component of electronic equipment and is used to perform specific electronic functions. Therefore, when chip processing equipment processes the chip, it is necessary to fix the chip body through a fixing device to ensure that there is no deviation when the electronic components are mounted on the chip surface, ensuring the stable production effect of the chip and improving the stability of chip production;

[0003] However, the existing fixing device still has the following defects: since the current fixing device is usually in an embedded state, after the edge of the chip is completely covered, it is very easy to be difficult to remove the chip after processing, which will reduce the efficiency of removing the chip after processing. Utility Model Content

[0004] In view of the above problems, the utility model provides a chip fixing device for chip processing equipment.

[0005] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: a chip fixing device for chip processing equipment, whose structure includes: an insulating plate, a limit frame, a load-bearing block, a base, and a connecting block. The insulating plate falls into the internal area of ​​the limit frame and overlaps with each other, the lower end of the limit frame is vertically fixedly connected to the load-bearing block, the center of the base overlaps with the load-bearing block, and the connecting block is welded to the left and right sides of the base.

[0006] Furthermore, the insulating plate is provided with a through groove, a vertical plate, an adsorption plate, a parallel block, and a contact layer. The through groove runs through the upper and middle part of the vertical plate. The vertical plate is embedded in the center parts of the left and right sides of the adsorption plate and the parallel block. The adsorption plate and the parallel block overlap with each other, and the contact layer and the upper end of the parallel block are an integrated structure.

[0007] Furthermore, the adsorption plate is provided with an adaptor groove, an overlapping layer, a plate body, an interpenetrating block and a positioning block. The adaptor groove runs through the center of the overlapping layer. The plate body and the overlapping layer are an integrated structure. The interpenetrating block is welded to the upper corner of the plate body. The positioning block is embedded and fixed in the lower center of the plate body through the adaptor groove.

[0008] Furthermore, the limit frame is provided with a solid block, a frame body, a through cavity, a vertical rail, and a protective wall. The solid block is welded to the lower edge of the frame body, the through cavity runs through the center of the frame body, the vertical rail is arranged on the left and right sides of the interior of the frame body through the through cavity, and the protective wall is an integrated structure with the inner wall of the frame and communicates with the through cavity.

[0009] Furthermore, the through groove is rectangular in shape and the inner wall is finely polished, the vertical plate is provided on both sides of the adsorption plate and the parallel block, and the contact layer is finely polished.

[0010] Furthermore, the adapting groove is in a square shape and is opened in a vertical direction, the overlapping layer is in a polished flat state, the insertion block is provided at each of the four corners of the upper end of the plate body, and the positioning block is in a square solid shape.

[0011] Furthermore, the frame is in a square shape, the left and right sides of the through cavity are in communication with the vertical rails, and the surface of the protective wall carries a rubber sheet. Beneficial Effects

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. After the utility model is further improved through the insulating plate, it can improve its own bearing performance based on the overlap of the adsorption plate and the parallel block, and then use the polished contact layer to improve the stability of chip embedding. Then the vertical plates on the left and right sides can use the through cavity to allow operators to manually control, so that after the chip processing is completed, the operator can pull the through groove of the vertical plate to manually drive the chip out of the limit frame, so as to achieve the effect of energy-saving and fast chip removal, and improve the convenience of removing the chip after processing.

[0014] 2. After the utility model is further improved through the adsorption plate, the four interlaced blocks on the upper end of the plate body can be embedded in the four corners of the lower end of the parallel block, thereby improving the overlapping stability of the adsorption plate and the parallel block. At the same time, the positioning block at the center of the lower end of the plate body can be embedded in the center of the load-bearing block, so that the insulating plate can be vertically embedded in a precise position after the chip is taken out, avoiding the inability to reassemble and use the insulating plate after taking out.

[0015] 3. After the utility model is further improved through the limit frame, the vertical plates of the parallel block and the adsorption plate can be vertically embedded through the vertical cavity and the vertical rail of the frame, so as to improve the mutual parallel effect of the two after assembly and prevent the occurrence of tilting and jamming. Subsequently, the protective wall inside the frame can improve the protection of the chip edge by carrying a rubber sheet, thereby avoiding leakage caused by static electricity during chip production, thereby improving the stability of the chip during production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model is a schematic structural diagram of a chip fixing device for chip processing equipment.

[0017] Figure 2 The utility model is a three-dimensional structural schematic diagram of an improved insulating plate.

[0018] Figure 3 The utility model is a three-dimensional structural schematic diagram of an improved adsorption plate.

[0019] Figure 4 The utility model is a three-dimensional structural schematic diagram of an improved limiting frame.

[0020] In the figure: insulating plate-1, limiting frame-2, load-bearing block-3, base-4, connecting block-5, through groove-11, vertical plate-12, adsorption plate-13, parallel block-14, contact layer-15, adaptation groove-131, overlapping layer-132, plate body-133, interlaced block-134, positioning block-135, solid block-21, frame body-22, through cavity-23, vertical rail-24, protective wall-25. DETAILED DESCRIPTION

[0021] The technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. Example

[0023] like Figure 1-Figure 4 As shown, the utility model provides a chip fixing device for chip processing equipment.

[0024] See also Figure 1The utility model provides a chip fixing device for chip processing equipment, comprising: an insulating plate 1, a limiting frame 2, a bearing block 3, a base 4, and a connecting block 5. The insulating plate 1 falls into the inner area of ​​the limiting frame 2 and overlaps with each other. The lower end of the limiting frame 2 is vertically fixedly connected with the bearing block 3. The center of the base 4 overlaps with the bearing block 3. The connecting block 5 is welded to the left and right sides of the base 4.

[0025] See also Figure 2 The utility model provides a chip fixing device for chip processing equipment, comprising: the insulating plate 1 is provided with a through slot 11, a vertical plate 12, an adsorption plate 13, a parallel block 14, and a contact layer 15, the through slot 11 runs through the middle and upper part of the vertical plate 12, the vertical plate 12 is embedded in the center of the left and right sides of the adsorption plate 13 and the parallel block 14, the adsorption plate 13 and the parallel block 14 overlap each other, and the contact layer 15 and the upper end of the parallel block 14 are an integrated structure; the through slot 11 is rectangular in shape and the inner wall is finely polished, the vertical plate 12 is provided with one on each side of the adsorption plate 13 and the parallel block 14, and the contact layer 15 is finely polished;

[0026] The through groove 11 can expand the contact area with the operator's hand through its rectangular shape, and can prevent scratches caused by pulling according to the fine polishing shape. The vertical plate 12 can achieve the effect of parallel upward pulling by being located on the left and right sides of the adsorption plate 13 and the parallel block 14 to prevent tilting and jamming caused by unilateral pulling. The contact layer 15 can prevent scratches caused by the bottom of the chip being placed therein through its fine polishing shape.

[0027] See also Figure 3 The utility model provides a chip fixing device for chip processing equipment, comprising: the adsorption plate 13 is provided with an adapting groove 131, an overlapping layer 132, a plate body 133, an interpenetrating block 134, and a positioning block 135, the adapting groove 131 runs through the center of the overlapping layer 132, the plate body 133 and the overlapping layer 132 are an integrated structure, the interpenetrating block 134 is welded to the upper corner of the plate body 133, and the positioning block 135 is embedded and fixed to the lower center of the plate body 133 through the adapting groove 131; the adapting groove 131 is square in shape and is opened in a vertical direction, the overlapping layer 132 is in a polished flat shape, the interpenetrating block 134 is provided with one at each of the four corners of the upper end of the plate body 133, and the positioning block 135 is in a square solid shape;

[0028] The adapting groove 131 can match the shape of the positioning block 135 through the square shape, the overlapping layer 132 can improve the overlapping accuracy of the plate body 133 and the component through the flattening shape, and the four insertion blocks 134 can ensure the firmness of the plate body 133 and the component after overlapping.

[0029] See also Figure 4 The utility model provides a chip fixing device for chip processing equipment, comprising: the limit frame 2 is provided with a solid block 21, a frame body 22, a through cavity 23, a vertical rail 24, and a protective wall 25, the solid block 21 is welded to the lower edge of the frame body 22, the through cavity 23 runs through the center of the frame body 22, the vertical rail 24 is arranged on the left and right sides of the interior of the frame body 22 through the through cavity 23, the protective wall 25 and the inner wall of the frame body 22 are an integrated structure and communicate with the through cavity 23; the frame body 22 is a square shape, the left and right sides of the through cavity 23 are in communication with the vertical rail 24, and the surface of the protective wall 25 carries a rubber sheet;

[0030] The frame 22 can match the shape of the component through its square shape, the through cavity 23 can improve the convenience of embedding the component into the vertical rail 24 by being connected with the vertical rail 24, and the protective wall 25 can protect the chip edge through the rubber sheet and avoid the diffusion of static electricity generated during chip production.

[0031] The working principle of the utility model is described as follows:

[0032] First: the base 4 of the chip fixing device for chip processing equipment can be installed in the processing equipment through the connecting block 5, and then the load-bearing block 3 on the base 4 can determine the position of the limit frame 2, and at the same time, the insulating plate 1 inside the limit frame 2 will be arranged in a parallel orientation, so that when the chip is processed, the chip can be embedded in the limit frame 2 in a vertical orientation to achieve the effect of parallel bonding with the insulating plate 1. Therefore, after the chip position is determined, the processing equipment can install the electronic components one by one on the surface, so that the effect of chip positioning processing can be achieved;

[0033] Second: the lower end of the parallel block 14 of the insulating plate 1 can be overlapped with each other through the adsorption plate 13 to improve its own bearing performance, and then according to the adsorption characteristics of the adsorption plate 13, the stability of the overlap with the surface of the load-bearing block 3 can be improved, so as to prevent the position deviation caused by the chip processing, and ensure that the chip can be processed at the origin. Then, the contact layer 15 at the upper end of the parallel block 14 can achieve the protection effect of the bottom of the chip through the fine polishing form. Finally, after the chip processing is completed, the parallel block 14 and the vertical plates 12 on the left and right sides of the adsorption plate 13 can be manually pulled out by the operator through the through groove 11, so as to achieve the effect of pulling out the entire insulating plate 1, thereby improving the efficiency of removing the processed chips, avoiding the difficulty of removing the chips due to the depth of the limit frame 2 after the chip processing is completed. At the same time, the vertical plate 12 and the through groove 11 are arranged on the left and right sides of the inner wall of the limit frame 2, so that it will not affect the normal process of chip processing by the processing equipment. At the same time, according to the number of two groups, parallel removal can be achieved to prevent tilting and jamming caused by unidirectional pulling;

[0034] Third: the plate body 133 of the adsorption plate 13 can be fixedly connected with the four interlaced blocks 134 through the corners of the overlapping layer 132, so that the four interlaced blocks 134 can improve the accurate assembly of the plate body 133 and the lower end of the parallel block 14, and then the adapter groove 131 in the center of the plate body 133 allows the solid positioning block 135 to be embedded, so that after the chip is taken out, the insulating plate 1 can be embedded in the limit frame 2 again in a vertical direction, so that the positioning block 135 in the center of the plate body 133 can be embedded in the center of the load-bearing block 3, thereby achieving a mutually matching effect, preventing the insulating plate 1 from being frequently disassembled and assembled, resulting in a position error that cannot be used again;

[0035] Fourth: the frame 22 of the limit frame 2 can be vertically inserted and fixed to the surface of the load-bearing block 3 through the solid block 21 at the lower end, and then the through cavity 23 of the frame 22 can allow the insulating board 1 to be vertically embedded, so that the vertical plate 12 of the insulating board 1 can slide in contact with the vertical rail 24, so that the insulating board 1 can have a stable vertical movement effect to prevent the situation of being pulled and tilted and unable to move. Then, the protective wall 25 inside the frame 22 can contact the edge of the chip by carrying a rubber sheet, so that the chip can be protected by the insulating properties of the protective wall 25 during processing to avoid chip damage caused by static electricity during operation of the processing equipment, thereby further improving the safety factor of chip processing.

[0036] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the utility model is limited by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model. Any reference numerals in the claims should not be regarded as limiting the claims involved.

Claims

1. A chip fixing device for chip processing equipment, the structure of which comprises: An insulating plate (1), a limiting frame (2), a load-bearing block (3), a base (4), and a connecting block (5), characterized in that: the insulating plate (1) falls into the inner area of ​​the limiting frame (2) and overlaps with each other, the lower end of the limiting frame (2) is vertically fixedly connected to the load-bearing block (3), the center of the base (4) overlaps with the load-bearing block (3), and the connecting block (5) is welded to the left and right sides of the base (4); The insulating plate (1) is provided with a through groove (11), a vertical plate (12), an adsorption plate (13), a parallel block (14), and a contact layer (15); the through groove (11) penetrates the middle and upper part of the vertical plate (12); the vertical plate (12) is embedded in the center parts of the left and right sides of the adsorption plate (13) and the parallel block (14); the adsorption plate (13) and the parallel block (14) overlap each other; and the contact layer (15) and the upper end of the parallel block (14) are an integrated structure.

2. The chip fixing device for chip processing equipment according to claim 1, characterized in that: The adsorption plate (13) is provided with an adapting groove (131), an overlapping layer (132), a plate body (133), an insertion block (134), and a positioning block (135); the adapting groove (131) penetrates the central part of the overlapping layer (132); the plate body (133) and the overlapping layer (132) are an integrated structure; the insertion block (134) is welded to the upper corner of the plate body (133); and the positioning block (135) is embedded and fixed to the lower central part of the plate body (133) through the adapting groove (131).

3. The chip fixing device for chip processing equipment according to claim 1, characterized in that: The limiting frame (2) is provided with a solid block (21), a frame body (22), a through cavity (23), a vertical rail (24), and a protective wall (25); the solid block (21) is welded to the lower edge of the frame body (22); the through cavity (23) runs through the center of the frame body (22); the vertical rail (24) is arranged on the left and right sides of the interior of the frame body (22) through the through cavity (23); and the protective wall (25) is an integrated structure with the inner wall of the frame body (22) and communicates with the through cavity (23).

4. The chip fixing device for chip processing equipment according to claim 1, characterized in that: The through groove (11) is rectangular in shape and its inner wall is finely polished; the vertical plate (12) is provided on each of the left and right sides of the adsorption plate (13) and the parallel block (14); and the contact layer (15) is finely polished.

5. The chip fixing device for chip processing equipment according to claim 2, characterized in that: The adapting groove (131) is in a square shape and is opened in a vertical direction, the overlapping layer (132) is in a flattened shape, one insertion block (134) is provided at each of the four corners of the upper end of the plate body (133), and the positioning block (135) is in a square solid shape.

6. The chip fixing device for chip processing equipment according to claim 3, characterized in that: The frame (22) is in a square shape, the left and right sides of the through cavity (23) are in communication with the vertical rail (24), and the surface of the protective wall (25) carries a rubber sheet.

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