Multi-layer printed PCB capable of rapidly dissipating heat

Abstract

The utility model provides a multilayer printed circuit board (PCB) capable of fast heat dissipation, which relates to the technical field of multilayer circuit boards, and comprises a heat exchange siphon, the heat exchange siphon comprises a heat absorption section, transformation sections and a heat dissipation section, the heat absorption section is located inside a first circuit board and a second circuit board, the transformation sections are fixedly installed at the two ends of the heat absorption section, and the heat dissipation section is located inside the first circuit board and the second circuit board. A heat dissipation section is fixedly installed at one end of the transformation section, and a low-temperature plate is attached to the surface of the heat dissipation section. Compared with the prior art, the circuit board has the advantages that the plurality of siphon pipelines of which the internal sizes change regularly are arranged in the circuit board, heat in the circuit board is conveyed to the outside for rapid heat dissipation by utilizing the internal size change of the siphon pipelines, and gas in the siphon pipelines can keep circulating flow in the cold and hot change process; and carrying of heat in the circuit board is accelerated, the heat in the circuit board can be effectively and rapidly dissipated, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer printed circuit board PCB capable of rapidly dissipating heat. Background Art

[0002] PCB circuit board is the support body of electronic components and the carrier of electrical connection of electronic components. Because it is made by electronic printing technology, it is called "printed" circuit board and is widely used in various electronic products, such as smart lamps, computers, mobile phones, etc.

[0003] CN202122221875.2 introduces a multi-layer printed PCB circuit board that can quickly dissipate heat. By setting a heat dissipation structure, electronic components generate heat energy, part of which is transferred to the substrate through the top plate, and the heat energy is transferred to the air through the first and second heat-conducting strips inside the first groove and the second groove, and heat is exchanged with the normal temperature air in the air, thereby cooling and dissipating the PCB circuit board, effectively improving the heat dissipation effect of the PCB circuit board, and increasing the service life of the PCB circuit board. However, the heat dissipation efficiency of the circuit board in the process of heat dissipation is low due to the heat conduction of the heat-conducting structure, which is not convenient for quickly dissipating the heat inside the circuit board. Utility Model Content

[0004] Therefore, the purpose of the present invention is to provide a multi-layer printed circuit board (PCB) capable of rapid heat dissipation, so as to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0005] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a multi-layer printed circuit board (PCB) capable of rapid heat dissipation, comprising a substrate, a first circuit board is fixedly mounted on the top of the substrate, a second circuit board is fixedly mounted on the top of the first circuit board, a top plate is fixedly mounted on the top of the second circuit board, a plurality of heat exchange siphons are arranged on one side of the first circuit board and the second circuit board, the heat exchange siphons comprise a heat absorption section, a voltage transformation section and a heat dissipation section, the heat absorption section is located inside the first circuit board and the second circuit board, voltage transformation sections are fixedly mounted on both ends of the heat absorption section, a heat dissipation section is fixedly mounted on one end of the voltage transformation section, and a low-temperature panel is bonded to the surface of the heat dissipation section.

[0006] Preferably, any of the above schemes is provided with support rods at four corners of the top of the base plate, and the base plate is fixedly installed by the support rods and the top plate.

[0007] The above technical solution is adopted: the base plate and the top plate are connected by supporting rods, so that there is a certain strength between the base plate and the top plate, and the circuit boards inside the two are safely protected.

[0008] Preferably, any of the above schemes is that a connecting column is provided at the top of the first circuit board, and the first circuit board is fixedly installed with the second circuit board through the connecting column.

[0009] By adopting the above technical solution, the first circuit board and the second circuit board are connected and supported by connecting columns, so that the first circuit board and the second circuit board are connected into a whole, which is convenient for the overall disassembly and assembly of the first circuit board and the second circuit board.

[0010] Preferably, any of the above schemes has one end of the base plate and the top plate having a mounting groove adapted to the heat exchange siphon, and the heat dissipation section is located inside the mounting groove.

[0011] The above technical solution is adopted: the heat dissipation section of the heat exchange siphon is arranged inside the base plate and the top plate, so that the base plate and the top plate cover the heat dissipation section to form a certain protective effect.

[0012] Preferably, any of the above schemes is that the heat absorption section is located between the first circuit board and the second circuit board, and a heat absorption cavity with a coaxial diameter is provided inside the heat absorption section.

[0013] The above technical solution is adopted: the cold air inside the heat absorption cavity inside the heat absorption section is used to absorb the heat emitted by the first circuit board and the second circuit board, and the cold air expands after absorbing the heat and flows toward the transformer section.

[0014] Preferably, any of the above schemes is that a variable-diameter air guide cavity is provided inside the voltage transformation section, and a variable-diameter heat dissipation cavity is provided inside the heat dissipation section.

[0015] The above technical solution is adopted: the gas after absorbing heat expands and enters the air guide cavity inside the transformer section, enters from the large opening of the air guide cavity, is discharged from the small opening, and enters the heat dissipation cavity from the small opening. In this process, the gas volume decreases, the air pressure increases, and the gas entering the heat dissipation cavity flows along the heat dissipation cavity. During the flow, the internal heat is lost, and the gas flows to the heat absorption section under the action of pressure. The gas volume increases when entering the heat absorption section, and the air pressure decreases. After the gas absorbs heat, it circulates again to continuously absorb and release heat.

[0016] Preferably, any of the above solutions is that the cryopanel is fixedly mounted on one end of the base plate and the top plate, and a groove matching the heat dissipation section is provided inside the cryopanel.

[0017] The above technical solution is adopted: the heat conduction of the low temperature plate is used to absorb heat from the gas inside the heat dissipation section, thereby accelerating the heat loss inside the heat dissipation section and facilitating the heat dissipation inside the circuit board.

[0018] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0019] 1. Several siphon pipes with regularly changing internal dimensions are arranged inside the circuit board. The changes in the internal dimensions of the siphon pipes are used to transport the heat inside the circuit board to the outside for rapid heat dissipation. The gas inside the siphon pipes can maintain a circulating flow during the process of hot and cold changes, which speeds up the transportation of heat inside the circuit board, can effectively dissipate the heat inside the circuit board quickly, and improve the efficiency of heat dissipation.

[0020] 2. A low-temperature structural plate is set on the outer surface of the circuit board for heat conduction, so as to quickly conduct the heat inside the siphon pipe and further improve the heat dissipation efficiency.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 It is a structural schematic diagram according to an embodiment of the utility model;

[0024] Figure 2 It is a front view structural schematic diagram according to an embodiment of the utility model;

[0025] Figure 3 is a schematic cross-sectional structure diagram of a first circuit board according to an embodiment of the utility model;

[0026] Figure 4 It is a schematic diagram of the cross-sectional structure of a heat exchange siphon according to an embodiment of the utility model;

[0027] Among them: 1-substrate, 2-first circuit board, 3-second circuit board, 4-top plate, 5-heat exchange siphon, 51-heat absorption section, 52-voltage transformation section, 53-heat dissipation section, 6-low temperature plate, 7-support rod, 8-connecting column, 9-installation groove, 10-heat absorption cavity, 11-air guide cavity, 12-heat dissipation cavity. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0029] like Figure 1-4As shown, a multilayer printed circuit board capable of rapid heat dissipation according to an embodiment of the utility model comprises a substrate 1, a first circuit board 2 is fixedly mounted on the top of the substrate 1, a second circuit board 3 is fixedly mounted on the top of the first circuit board 2, a top plate 4 is fixedly mounted on the top of the second circuit board 3, a plurality of heat exchange siphons 5 are arranged on one side of the first circuit board 2 and the second circuit board 3, the heat exchange siphon 5 comprises a heat absorption section 51, a voltage transformation section 52 and a heat dissipation section 53, the heat absorption section 51 is located inside the first circuit board 2 and the second circuit board 3, voltage transformation sections 52 are fixedly mounted on both ends of the heat absorption section 51, a heat dissipation section 53 is fixedly mounted on one end of the voltage transformation section 52, and a low temperature panel 6 is bonded to the surface of the heat dissipation section 53.

[0030] Preferably, any of the above solutions is that support rods 7 are provided at the four corners of the top of the base plate 1 , and the base plate 1 is fixedly installed by the support rods 7 and the top plate 4 .

[0031] The above technical solution is adopted: the base plate 1 and the top plate 4 are connected by the support rod 7, so that the base plate 1 and the top plate 4 have a certain strength, and the circuit boards inside the two are safely protected.

[0032] Preferably, any of the above solutions is that a connection column 8 is provided at the top of the first circuit board 2 , and the first circuit board 2 is fixedly installed with the second circuit board 3 via the connection column 8 .

[0033] The above technical solution is adopted: the first circuit board 2 and the second circuit board 3 are connected and supported by the connecting column 8, so that the first circuit board 2 and the second circuit board 3 are connected into a whole, which is convenient for the first circuit board 2 and the second circuit board 3 to be disassembled and assembled as a whole.

[0034] Preferably, any of the above solutions has one end of the base plate 1 and the top plate 4 opening a mounting groove 9 adapted to the heat exchange siphon 5 , and the heat dissipation section 53 is located inside the mounting groove 9 .

[0035] The above technical solution is adopted: the heat dissipation section 53 of the heat exchange siphon 5 is arranged inside the base plate 1 and the top plate 4, so that the base plate 1 and the top plate 4 cover the heat dissipation section 53 to form a certain protective effect.

[0036] Preferably, any of the above schemes is that the heat absorption section 51 is located between the first circuit board 2 and the second circuit board 3 , and a heat absorption cavity 10 with a coaxial diameter is provided inside the heat absorption section 51 .

[0037] The above technical solution is adopted: the cold air inside the heat absorption cavity 10 inside the heat absorption section 51 is used to absorb the heat emitted by the first circuit board 2 and the second circuit board 3. After absorbing the heat, the cold air expands and flows toward the transformer section 52.

[0038] Preferably, any of the above schemes has an air guide cavity 11 with a variable diameter opened inside the voltage transformation section 52 , and a heat dissipation cavity 12 with a variable diameter opened inside the heat dissipation section 53 .

[0039] The above technical solution is adopted: the gas after absorbing heat expands and enters the air guide cavity 11 inside the transformer section 52, enters from the large opening of the air guide cavity 11, is discharged from the small opening, and enters the heat dissipation cavity 12 from the small opening. In this process, the gas volume decreases, the air pressure increases, and the gas entering the heat dissipation cavity 12 flows along the heat dissipation cavity 12. During the flow, the internal heat is lost, and the gas flows to the heat absorption section 51 under the action of pressure. The gas volume increases when entering the heat absorption section 51, and the air pressure decreases. After the gas absorbs heat, it circulates again to continuously absorb and release heat.

[0040] Preferably, any of the above solutions is that the cryopanel 6 is fixedly mounted on one end of the base plate 1 and the top plate 4 , and a groove matching the heat dissipation section 53 is provided inside the cryopanel 6 .

[0041] The above technical solution is adopted: the heat conduction of the cryopanel 6 is used to absorb heat from the gas inside the heat dissipation section 53, so as to accelerate the heat loss inside the heat dissipation section 53 and facilitate the heat dissipation inside the circuit board.

[0042] The utility model discloses a multi-layer printed circuit board capable of rapid heat dissipation, and its working principle is as follows:

[0043] The heat absorption section 51 absorbs heat into the heat absorption chamber 10. After the gas absorbs heat, the gas pressure increases and flows toward the low pressure direction. When it enters the pressure transformation section 52, the gas volume decreases and the gas pressure further increases. When it enters the heat dissipation chamber 12 inside the heat dissipation section 53, the gas volume decreases again, the gas heat is lost, and the temperature decreases. After the high-pressure gas flows into the heat absorption chamber 10 inside the heat absorption section 51, the gas volume increases and the gas pressure decreases.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] 1. Several siphon pipes with regularly changing internal dimensions are arranged inside the circuit board. The changes in the internal dimensions of the siphon pipes are used to transport the heat inside the circuit board to the outside for rapid heat dissipation. The gas inside the siphon pipes can maintain a circulating flow during the process of hot and cold changes, which speeds up the transportation of heat inside the circuit board, can effectively dissipate the heat inside the circuit board quickly, and improve the efficiency of heat dissipation.

[0046] 2. A low-temperature structural plate is set on the outer surface of the circuit board for heat conduction, so as to quickly conduct the heat inside the siphon pipe and further improve the heat dissipation efficiency.

Claims

1. A multi-layer printed circuit board capable of rapid heat dissipation, comprising a substrate (1), a first circuit board (2) being fixedly mounted on the top of the substrate (1), a second circuit board (3) being fixedly mounted on the top of the first circuit board (2), and a top plate (4) being fixedly mounted on the top of the second circuit board (3), characterized in that: A plurality of heat exchange siphon tubes (5) are provided on one side of the first circuit board (2) and the second circuit board (3); the heat exchange siphon tubes (5) comprise a heat absorption section (51), a voltage transformation section (52) and a heat dissipation section (53); the heat absorption section (51) is located inside the first circuit board (2) and the second circuit board (3); the voltage transformation section (52) is fixedly mounted at both ends of the heat absorption section (51); the heat dissipation section (53) is fixedly mounted at one end of the voltage transformation section (52); and a low temperature panel (6) is bonded to the surface of the heat dissipation section (53).

2. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 1, characterized in that: Support rods (7) are arranged at the four corners of the top end of the base plate (1), and the base plate (1) is fixedly installed via the support rods (7) and the top plate (4).

3. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 2, characterized in that: A connecting column (8) is provided at the top end of the first circuit board (2), and the first circuit board (2) is fixedly mounted to the second circuit board (3) via the connecting column (8).

4. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 3, characterized in that: One end of the base plate (1) and the top plate (4) is provided with a mounting groove (9) adapted to the heat exchange siphon tube (5), and the heat dissipation section (53) is located inside the mounting groove (9).

5. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 4, characterized in that: The heat absorption section (51) is located between the first circuit board (2) and the second circuit board (3), and a heat absorption cavity (10) with a coaxial diameter is provided inside the heat absorption section (51).

6. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 5, characterized in that: The voltage transformation section (52) is provided with a variable diameter air guide cavity (11) inside, and the heat dissipation section (53) is provided with a variable diameter heat dissipation cavity (12) inside.

7. A multi-layer printed circuit board capable of rapid heat dissipation as claimed in claim 6, characterized in that: The cryopanel (6) is fixedly mounted on the base plate (1) and one end of the top plate (4), and a groove matching the heat dissipation section (53) is provided inside the cryopanel (6).

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