Film-removing spraying disc structure of circuit board

Abstract

The utility model provides a circuit board defilming spray tray structure, which comprises a clamp and two spray trays symmetrically arranged on two sides of the clamp by taking the clamp as a center, a circuit board is loaded on the clamp and moves in a vertical state between the two spray trays through a conveying mechanism, each spray tray comprises a plurality of spray pipes uniformly distributed along the conveying direction of the clamp, and the spray pipes are arranged on the clamp. The spray pipes are vertically arranged, a plurality of uniformly distributed nozzles are arranged along the vertical direction, the spray pipes are parallel to the circuit board on the clamp, the nozzles and the spray pipes are obliquely arranged, and the inclination directions of the nozzles on the adjacent spray pipes are staggered. According to the utility model, the film is removed by adopting a vertical film removing mode, and the nozzles are obliquely arranged and do not vertically spray on the circuit board, so that an etching resistance agent layer at a dead angle position or a position with smaller line width and line distance of the circuit board can be completely removed, slag inclusion is avoided, and the film is ensured to be clean and thorough.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a film removal spray plate structure of a circuit board. Background Art

[0002] The production of circuit boards usually adopts the process of substrate dry film → exposure → development → etching → film removal. Among them, film removal is one of the core processes of the circuit board wet process. Its working principle is to use strong alkaline solution to remove the etching resist layer protecting the copper surface at 50℃-60℃ to reveal the circuit pattern. The chemical reaction between the chemical solution and the exposed anti-corrosion layer on the PCB board causes it to fall off.

[0003] The traditional film removal device adopts horizontal film removal, which has some problems: when spraying the solution, due to the influence of the gravity of the solution, the exchange speed of the solution on the upper and lower surfaces of the circuit board is different, which leads to uneven film removal on the upper and lower surfaces and poor film removal effect; and due to the large area of ​​the substrate, it is easy to leave film residues, resulting in low film removal efficiency and incomplete cleaning of film residues; the horizontal film removal device generally uses a roller group to drive the circuit board to move, which is easy to produce indentations on the board surface and cause circuit defects. When producing ultra-fine circuits, it will cause circuit short circuits or open circuits, and the roller group has a large shielding area, resulting in uneven film removal.

[0004] In addition, with the development of the PCB industry, the impedance requirements of various conductors are getting higher and higher, which inevitably requires stricter control of the conductor width. The nozzle of the current film removal device generally sprays the solution vertically to the circuit board, which will cause the dead corners of the circuit board or the positions with small line width and line spacing to be not cleaned thoroughly, resulting in the problem of slag inclusion. Utility Model Content

[0005] The utility model aims to provide a film removal spray plate structure for a circuit board, so as to overcome the shortcomings in the prior art.

[0006] In order to solve the above technical problems, the technical solution of the utility model is: a spray plate structure for removing film from a circuit board, comprising a clamp and two spray plates symmetrically arranged on both sides of the clamp with the clamp as the center, the clamp is loaded with a circuit board, and is moved in a vertical state between the two spray plates through a conveying mechanism, the spray plate comprises a plurality of nozzles evenly arranged along the conveying direction of the clamp, the nozzle is vertically arranged, and a plurality of evenly arranged nozzles are provided along the vertical direction, the nozzle is arranged parallel to the circuit board on the clamp, the nozzle is inclined to the nozzle, that is, the nozzle does not spray vertically on the circuit board; and the inclination directions of the nozzles on adjacent nozzles are staggered, that is, the nozzles of one nozzle are all inclined upward, and the nozzles on another adjacent nozzle are all inclined downward at the same inclination angle.

[0007] Furthermore, in the above-mentioned circuit board film removal spray plate structure, the spray angle of the nozzle (the angle between the central axis of the nozzle and the horizontal direction) is 10-20°, that is, the angle between the nozzle and the nozzle is 70-80°.

[0008] Furthermore, in the above-mentioned circuit board film removal spray plate structure, the nozzles on adjacent spray pipes are staggered in the vertical direction.

[0009] Furthermore, in the above-mentioned circuit board film removal spray plate structure, the spray plate also includes a diverter pipe, a liquid inlet is provided at the bottom of the diverter pipe, the liquid inlet is connected to the medicine water tank through a water inlet pipeline, and a plurality of the spray pipes are fixed above the diverter pipe.

[0010] Furthermore, in the above-mentioned circuit board film removal spray plate structure, a quick-release joint is provided at the bottom of the spray pipe, and is connected to a flow channel provided inside the diverter pipe through the quick-release joint.

[0011] Furthermore, in the above-mentioned circuit board defilming spray plate structure, the spray plate also includes a support plate, which is arranged parallel to the diverter pipe and is used to support the upper end of the spray pipe. The spray plate is installed on the defilming equipment through the diverter pipe and the support plate.

[0012] Furthermore, in the above-mentioned circuit board film removal spray plate structure, the support plate is provided with a through hole corresponding to the nozzle, and the top of the nozzle is provided with a plug, which is inserted into the through hole and extends above the support plate.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the utility model adopts a vertical film removal method to remove the film, which can solve the problem of uneven and incomplete film removal in horizontal film removal, and the nozzle is tilted and does not spray vertically on the circuit board, which can cleanly remove the etching resist layer in the dead corners of the circuit board or positions with small line width and line spacing, avoid slag inclusion, and ensure clean and thorough film removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a structural schematic diagram of the film removal spray plate structure of the circuit board of the utility model;

[0016] Figure 2 It is a schematic diagram of two spray plates of the spray plate structure for removing film from circuit boards of the utility model;

[0017] Figure 3 It is a front view of the spray plate of the film removal spray plate structure of the circuit board of the utility model;

[0018] Figure 4 A side view of a spray plate of the spray plate structure for removing film from a circuit board according to the utility model;

[0019] In the figure: 1, clamp; 2, spray plate; 21, spray pipe; 22, nozzle; 23, diverter pipe; 231, liquid inlet; 24, support plate; 25, quick-release connector; 26, plug. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Example 1

[0022] like Figure 1-4 As shown, a spray plate structure for removing film from a circuit board comprises a fixture 1 and two spray plates 2 symmetrically arranged on both sides of the fixture 1 with the fixture 1 as the center, the fixture 1 is loaded with a circuit board and moves in a vertical state between the two spray plates 2 through a conveying mechanism (not shown in the figure), the spray plate 2 comprises a plurality of spray pipes 21 evenly arranged along the conveying direction of the fixture 1, the spray pipes 21 are vertically arranged, and a plurality of evenly arranged nozzles 22 are arranged along the vertical direction, the spray pipes 21 are arranged parallel to the circuit board on the fixture 1, the nozzles 22 are inclined to the nozzles 21, that is, the nozzles 22 do not spray vertically onto the circuit board; and the inclination directions of the nozzles 22 on adjacent nozzles 21 are staggered, that is, the nozzles 22 of one nozzle 21 are all inclined upward, and the nozzles 22 on adjacent nozzles 21 are all inclined downward at the same inclination angle; through this arrangement, the spraying is in the shape of two vertically staggered fans, the spraying range is wider, and the etching resist layer at the dead corner position or the position with small line width and line spacing of the circuit board is further ensured to be completely removed. The utility model adopts a vertical film stripping method to remove the film, which can solve the problem of uneven and incomplete film stripping in horizontal film stripping. The nozzle is tilted and does not spray vertically on the circuit board. The etching resist layer in the dead corner of the circuit board or the position with small line width and line spacing can be cleanly removed to avoid slag inclusion and ensure clean and thorough film stripping.

[0023] like Figure 4 As shown, the spray angle A of the nozzle 22 (the angle between the central axis of the nozzle and the horizontal direction) is 10-20°, that is, the angle B between the nozzle and the nozzle is 70-80°.

[0024] like Figure 1-3 As shown, the nozzles 22 on adjacent nozzles 21 are staggered in the vertical direction, and the liquid medicine sprayed from the nozzles 22 is fan-shaped, fully covering the circuit board on the fixture 1.

[0025] Example 2

[0026] Based on the structure of Example 1, Figure 2-4 As shown, the spray plate 2 further includes a shunt pipe 23, a liquid inlet 231 is provided at the bottom of the shunt pipe 23, and the liquid inlet 231 is connected to a medicine water tank (not shown) through a water inlet pipeline, and a plurality of the spray pipes 21 are fixed above the shunt pipe 23. A quick-release joint 25 is provided at the bottom of the spray pipe 21, and is connected to a flow channel provided inside the shunt pipe 23 through the quick-release joint 25. The medicine water flow rate and spray pressure of a spray plate 2 are controlled by the shunt pipe 23.

[0027] In addition, if Figure 2-4 As shown, the spray plate 2 also includes a support plate 24, which is arranged above the shunt pipe 23 in parallel and is used to support the upper end of the nozzle 21 to improve the stability of the spray plate 2. The spray plate 2 is installed on the film removal device through the shunt pipe 23 and the support plate 24; the support plate 24 is provided with a through hole corresponding to the nozzle 21, and a plug 26 is provided on the top of the nozzle 21. The plug 26 is inserted into the through hole and extends above the support plate 24. The nozzle 21 is quickly installed through the quick-release joint 25 and the plug 26, and the structure is simple and the installation is easy.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0029] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A spray plate structure for removing film from a circuit board, characterized in that: It includes a fixture and two spray plates symmetrically arranged on both sides of the fixture with the fixture as the center. The fixture is loaded with a circuit board and moves in a vertical state between the two spray plates through a conveying mechanism. The spray plate includes a plurality of nozzles evenly arranged along the conveying direction of the fixture. The nozzles are vertically arranged and have a plurality of evenly arranged nozzles along the vertical direction. The nozzles are arranged parallel to the circuit board on the fixture, and the nozzles are inclined relative to the nozzles, and the inclination directions of the nozzles on adjacent nozzles are staggered.

2. The film removal spray plate structure for circuit boards according to claim 1, characterized in that: The spray angle of the nozzle is 10-20°.

3. The film removal spray plate structure for circuit boards according to claim 1, characterized in that: The nozzles on adjacent nozzles are staggered in the vertical direction.

4. The film removal spray plate structure for circuit boards according to claim 1, characterized in that: The spray plate also includes a shunt pipe, a liquid inlet is provided at the bottom of the shunt pipe, the liquid inlet is connected to the medicine water tank through a water inlet pipeline, and a plurality of the spray pipes are fixed above the shunt pipe.

5. The film removal spray plate structure for circuit boards according to claim 4, characterized in that: A quick-release joint is provided at the bottom of the nozzle, and is communicated with a flow channel arranged inside the diverter pipe through the quick-release joint.

6. The film removal spray plate structure for circuit boards according to claim 4, characterized in that: The spray plate also includes a support plate, which is arranged parallel to the shunt pipe and is used to support the upper end of the spray pipe. The spray plate is installed on the film removal equipment through the shunt pipe and the support plate.

7. The film removal spray plate structure for circuit boards according to claim 6, characterized in that: The support plate is provided with a through hole corresponding to the nozzle, and the top of the nozzle is provided with a plug, which is inserted into the through hole and extends above the support plate.

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