LED lamp bead with heat dissipation structure

Abstract

The LED lamp bead with the heat dissipation structure comprises a substrate, a light-transmitting cover is arranged at the upper end of the substrate, a chip clamping groove is formed in the surface of the upper end of the substrate, a chip is arranged on the chip clamping groove, positive and negative pins are symmetrically connected to the two sides of the lower end of the chip, pin inserting grooves are symmetrically formed in the two sides of the lower end of the chip clamping groove, and the upper end of the chip clamping groove is provided with a heat dissipation structure. The pins are inserted into the pin slots in a penetrating manner; a cylindrical heat conduction groove communicated with the chip clamping groove is formed in the lower end of the chip clamping groove, a heat conduction column is arranged in the cylindrical heat conduction groove, the lower end of the heat conduction column is of a hollow structure, and a plurality of threaded connectors are evenly formed in the outer wall of the heat conduction column; a plurality of annular heat dissipation grooves are uniformly formed in the middle of the side surface of the substrate; according to the LED lamp, the heat conduction column and the heat dissipation pipe are adopted, the heat dissipation area is increased, the heat dissipation efficiency is guaranteed, airflow circulation is achieved in the LED lamp beads, heat accumulation is prevented from affecting heat dissipation, the heat dissipation efficiency is further improved, and the LED lamp is simple in structure and convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp beads, in particular to an LED lamp bead with a heat dissipation structure. Background Art

[0002] LED lamp beads are widely used in many production fields such as lighting, LED large-screen displays, traffic lights, decorations, computers, electronic toys and gifts, switches, telephones, advertising, and urban lighting projects.

[0003] LED lamp beads will generate heat when in use. The temperature rise will affect the luminous intensity and service life of the LED lamp beads. Existing LED lamp beads use heat-conducting metal to contact with air to dissipate heat. However, the contact area between the existing heat-conducting metal and the air is insufficient, and the heat dissipation efficiency is poor. Therefore, the utility model proposes an LED lamp bead with a heat dissipation structure to solve the above-mentioned problems. Utility Model Content

[0004] The purpose of the utility model is to provide an LED lamp bead with a heat dissipation structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an LED lamp bead with a heat dissipation structure, comprising a substrate, a light-transmitting cover is provided on the upper end of the substrate, a chip slot is provided on the upper end surface of the substrate, a chip is provided on the chip slot, positive and negative pins are symmetrically connected on both sides of the lower end of the chip, pin slots are symmetrically provided on both sides of the lower end of the chip slot, and the pins are inserted through the pin slots;

[0006] The lower end of the chip card slot is provided with a cylindrical heat-conducting groove connected to the chip card slot, a heat-conducting column is provided in the cylindrical heat-conducting groove, the lower end of the heat-conducting column is a hollow structure, and a plurality of threaded interfaces are evenly provided on the outer wall of the heat-conducting column;

[0007] A plurality of annular heat dissipation grooves are evenly arranged in the middle of the side surface of the substrate, and the heat dissipation grooves are connected with the cylindrical heat conduction grooves. Heat dissipation pipes are inserted in the heat dissipation grooves, and the other ends of the heat dissipation pipes are threadedly connected with the threaded interfaces on the heat conduction columns.

[0008] Preferably, annular grooves are provided on both sides of the upper end of the substrate, the lower end of the light-transmitting cover is inserted into the annular grooves, and adhesive is provided in the annular grooves.

[0009] Preferably, the chip is connected to the bottom of the chip slot by adhesive.

[0010] Preferably, a sealing ring is provided between the lower end of the pin slot and the pin.

[0011] Preferably, the upper end of the heat-conducting column is arranged in contact with the bottom of the chip.

[0012] Compared with the prior art, the beneficial effects of the utility model are: the utility model adopts heat-conducting columns and heat pipes to increase the heat dissipation area and ensure heat dissipation efficiency, and realizes air flow inside the LED lamp beads to avoid heat accumulation affecting heat dissipation, thereby further improving the heat dissipation efficiency. The utility model is simple to assemble and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;

[0015] Figure 3 For this utility model Figure 1 Schematic diagram of the cross-sectional structure along the AA direction;

[0016] Figure 4 It is a schematic cross-sectional structure diagram of the substrate of the utility model;

[0017] Figure 5 It is a schematic diagram of the cross-sectional structure of the heat-conducting column of the utility model.

[0018] In the figure: 1. substrate; 11. chip slot; 12. ring slot; 13. pin slot; 14. cylindrical heat conduction slot; 15. heat dissipation slot; 2. light-transmitting cover; 3. chip; 31. pin; 4. heat conduction column; 41. threaded interface; 5. heat pipe; 6. sealing ring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-5 The utility model provides a technical solution: an LED lamp bead with a heat dissipation structure, comprising a substrate 1, a light-transmitting cover 2 is arranged on the upper end of the substrate 1, a chip card slot 11 is arranged on the upper end surface of the substrate 1, a chip 3 is arranged on the chip card slot 11, positive and negative pins 31 are symmetrically connected on both sides of the lower end of the chip 3, pin slots 13 are symmetrically arranged on both sides of the lower end of the chip card slot 11, and the pins 31 are inserted through the pin slots 13;

[0021] The lower end of the chip card slot 11 is provided with a cylindrical heat-conducting groove 14 connected to the chip card slot 11, and a heat-conducting column 4 is provided in the cylindrical heat-conducting groove 14. The lower end of the heat-conducting column 4 is a hollow structure, and a plurality of threaded interfaces 41 are evenly provided on the outer wall of the heat-conducting column 4;

[0022] A plurality of annular heat dissipation grooves 15 are evenly arranged in the middle of the side surface of the substrate 1. The heat dissipation grooves 15 are connected to the cylindrical heat conduction grooves 14. Heat dissipation pipes 5 are inserted into the heat dissipation grooves 15. The other end of the heat dissipation pipe 5 is threadedly connected to the threaded interface 41 on the heat conduction column 4.

[0023] Furthermore, annular grooves 12 are provided on both sides of the upper end of the substrate 1, and the lower end of the light-transmitting cover 2 is inserted into the annular grooves 12. Adhesive is provided in the annular grooves 12. The light-transmitting cover 2 is made of tempered glass, which is effectively pressure-resistant and explosion-proof.

[0024] Furthermore, the chip 3 is connected to the bottom of the chip slot 11 by adhesive, which effectively fixes the chip 3 and increases stability.

[0025] Furthermore, a sealing ring 6 is provided between the lower end of the pin slot 13 and the pin 31. The sealing ring 6 prevents water from entering the light-transmitting cover 2, thereby protecting the chip 3 for safe use.

[0026] Furthermore, the upper end of the heat-conducting column 4 is arranged in contact with the bottom of the chip 3. The heat generated by the chip 3 is effectively conducted and then dissipated through a plurality of heat dissipation pipes 5, and the heat dissipation pipes 5 are not in contact with the substrate 1, thereby increasing the contact area with the air for heat dissipation.

[0027] Specifically, when the utility model is used, during installation, the heat-conducting column 4 is first inserted into the cylindrical heat-conducting groove 14, and the side heat dissipation grooves 15 of the substrate 1 are all inserted into the heat dissipation pipe 5, and the other end of the heat dissipation pipe 5 is threadedly connected to the threaded interface 41 on the heat-conducting column 4, and then the pin 31 of the chip 3 is inserted into the corresponding pin slot 13 for installation, and the bottom of the chip 3 is connected to the inner wall of the pin slot 13 with glue, and then the light-transmitting cover 2 is installed; the heat generated by the LED lamp bead is conducted to each heat dissipation pipe 5 through the heat-conducting column 4, and each heat dissipation pipe 5 is connected to the bottom of the heat-conducting column 4, and multiple heat dissipation pipes 5 increase the contact area with the air, thereby improving the heat dissipation efficiency, and air flow is formed between the heat dissipation pipe 5 and the heat-conducting column 4, thereby further improving the heat dissipation efficiency and avoiding insufficient heat dissipation.

[0028] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0030] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An LED lamp bead with a heat dissipation structure, comprising a substrate (1), a light-transmitting cover (2) being provided at the upper end of the substrate (1), a chip card slot (11) being provided at the upper end surface of the substrate (1), a chip (3) being provided on the chip card slot (11), characterized in that: The lower end of the chip (3) is symmetrically connected to positive and negative pins (31), and the lower end of the chip card slot (11) is symmetrically provided with pin slots (13), and the pins (31) are inserted through the pin slots (13); A cylindrical heat-conducting groove (14) communicating with the chip card slot (11) is provided at the lower end of the chip card slot (11); a heat-conducting column (4) is provided in the cylindrical heat-conducting groove (14); the lower end of the heat-conducting column (4) is a hollow structure, and a plurality of threaded interfaces (41) are evenly provided on the outer wall of the heat-conducting column (4); A plurality of annular heat dissipation grooves (15) are evenly arranged in the middle of the side surface of the substrate (1), the heat dissipation grooves (15) are connected to the cylindrical heat conduction grooves (14), and heat dissipation pipes (5) are inserted into the heat dissipation grooves (15), and the other ends of the heat dissipation pipes (5) are threadedly connected to the threaded interfaces (41) on the heat conduction columns (4).

2. The LED lamp bead with a heat dissipation structure according to claim 1, characterized in that: Annular grooves (12) are provided on both sides of the upper end of the base plate (1), the lower end of the light-transmitting cover (2) is inserted into the annular groove (12), and adhesive is provided in the annular groove (12).

3. The LED lamp bead with a heat dissipation structure according to claim 1, characterized in that: A sealing ring (6) is provided between the lower end of the pin slot (13) and the pin (31).

4. The LED lamp bead with a heat dissipation structure according to claim 1, characterized in that: The upper end of the heat-conducting column (4) is arranged in contact with the bottom of the chip (3).

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