Film structure for simultaneously laminating multiple memory slots
By designing a membrane structure for DDR5 slots, including transparent protective film, PI tape and transparent release film, combined with the placement slot of the material tray, the problem of high price and low efficiency of plastic parts in the welding processing of DDR5 slots in the prior art is solved, and multiple slots are pasted simultaneously, improving efficiency and providing dustproof effect.
Patent Information
- Application Number
- CN202421321545.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-12
AI Technical Summary
During the welding process of DDR5 slots, the use of plastic parts in the prior art has problems of high prices and low efficiency, and the efficiency of single-person single-size patch cooperation is low.
A membrane structure for simultaneously bonding multiple memory slots, including patch assemblies and mating trays are provided. The patch assembly consists of a transparent protective film, PI tape and transparent release film. A placement slot is provided on the material tray for placing the DDR slot to achieve the simultaneous adhesion of multiple slots.
Through the setting of the material tray, the simple and quick pasting of PI tape is achieved, which ensures the accuracy of pasting, improves the efficiency of pasting, can achieve the shipment of the entire plate, and provides dustproof effect.
Smart Images
Figure CN222591889U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of connectors, in particular to a membrane structure used for simultaneously sticking to a plurality of memory slots. Background Art
[0002] At present, in the process of DDR5 slot welding, plastic parts are usually used when absorbing the DDR5 slot onto the PCB board. Plastic parts have the problems of high price and low efficiency. In order to improve efficiency and reduce costs, it is necessary to use the whole piece of mylar. At present, when sticking absorption and dust-proof mylar on the memory slot, it is a single-person single-strip sticking operation, which is inefficient. Therefore, a membrane structure for simultaneously sticking multiple memory slots is proposed. Utility Model Content
[0003] The purpose of the utility model is to provide a membrane structure for simultaneously attaching a plurality of memory slots, so as to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above object, the utility model provides the following technical solution: a membrane structure for simultaneously bonding multiple memory slots, comprising a patch component and a material tray used in conjunction with the patch component, wherein a placement groove is provided on the top of the material tray, and a DDR slot is placed inside the placement groove;
[0005] The patch assembly includes a transparent protective film, a PI tape and a transparent release film. Through holes are provided at both ends of the transparent protective film. The PI tape is arranged below the transparent protective film, and a transparent release film is arranged below the PI tape.
[0006] Preferably, four fixed columns are fixedly connected to the rear side of the above-mentioned material tray, a connecting shaft is rotatably connected between two of the fixed columns, a first plug column is fixedly connected to the outer side of the connecting shaft, both ends of the material tray are fixedly connected to fixed shafts, one end of the fixed shaft is fixedly connected to a guide rod, a fixed rod is movably sleeved on the outer side of the guide rod, a telescopic spring is movably sleeved on the outer side of the guide rod, a connecting column is rotatably connected between the two fixed rods, and a second plug column is fixedly connected to the outer side of the connecting column.
[0007] Preferably, one end of the telescopic spring is fixedly connected to one end of the fixed rod, and the other end of the telescopic spring is fixedly connected to the outer side of the guide rod.
[0008] Preferably, the first plug post and the second plug post are matched with the through hole.
[0009] Preferably, an L-shaped column is fixedly connected to the front side of the material tray, and one end of the L-shaped column is provided with a curved surface.
[0010] Preferably, the area of the transparent release film is larger than that of the transparent protective film, and the transparent protective film is attached to the outer side of the transparent release film.
[0011] Compared with the prior art, the utility model adopts the above technical solution and has the following technical effects:
[0012] The utility model can complete the pasting of PI tape simply and quickly through the setting of the material tray, and can ensure the accuracy of the pasting of PI tape; by completing the pasting of multiple products at one time, the efficiency of PI tape pasting is effectively improved, and the effect of whole tray shipment can be achieved, and the products pasted with PI tape have dust-proof effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 This is a schematic diagram of the material tray structure of the utility model;
[0015] Figure 2 This is a schematic diagram of the structure of the patch component of the utility model;
[0016] Figure 3 This is a schematic diagram of the structure of tearing off the transparent release film of the patch component of the utility model;
[0017] Figure 4 It is a schematic diagram of the patch assembly bonding structure of the utility model;
[0018] Figure 5 This is a schematic diagram of the structure of the utility model after the PI tape is pasted.
[0019] Explanation of the accompanying drawings: 1. material tray; 2. placement slot; 3. fixed column; 4. connecting shaft; 5. first plug column; 6. fixed shaft; 7. guide rod; 8. fixed rod; 9. telescopic spring; 10. connecting column; 11. second plug column; 12. L-shaped column; 13. DDR5 slot; 14. transparent protective film; 15. through hole; 16. PI tape; 17. glue-free area; 18. transparent release film. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.
[0022] Example
[0023] See also Figure 1-5 The utility model provides a technical solution: a membrane structure for simultaneously bonding multiple memory slots, including a patch component and a material tray 1 used in conjunction with the patch component, a placement slot 2 is provided on the top of the material tray 1, and by placing a DDR5 slot 13 in the placement slot 2 on the material tray 1, it is convenient to operate multiple products at one time, and a DDR5 slot 13 is placed inside the placement slot 2.
[0024] By setting up a patch component, multiple PI tapes 16 can be pasted at one time; the patch component includes a transparent protective film 14, a PI tape 16 and a transparent release film 18. Through holes 15 are provided at both ends of the transparent protective film 14. The PI tape 16 is arranged under the transparent protective film 14. The PI tape 16 has high temperature resistance and anti-static properties. It will not shrink or deform during the subsequent welding operation of the DDR5 slot 13 to prevent affecting subsequent operations. Anti-static can effectively protect other electronic components on the PCB board from static electricity attacks during subsequent processing; a transparent release film 18 is arranged under the PI tape 16. The area of the transparent release film 18 is larger than that of the transparent protective film 14. The transparent protective film 14 is attached to the outer side of the transparent release film 18.
[0025] In order to complete the pasting of PI tape 16 simply and quickly, and ensure the accuracy of pasting of PI tape 16, the pasting of multiple products is completed at one time, which effectively improves the efficiency of pasting of PI tape 16, and can achieve the effect of whole tray shipment, and the products pasted with PI tape 16 have dustproof effect;
[0026] Four fixed columns 3 are fixedly connected to the rear side of the material tray 1, a connecting shaft 4 is rotatably connected between the two fixed columns 3, a first plug column 5 is fixedly connected to the outer side of the connecting shaft 4, both ends of the material tray 1 are fixedly connected to fixed shafts 6, one end of the fixed shaft 6 is fixedly connected to a guide rod 7, a fixed rod 8 is movably sleeved on the outer side of the guide rod 7, a telescopic spring 9 is movably sleeved on the outer side of the guide rod 7, one end of the telescopic spring 9 is fixedly connected to one end of the fixed rod 8, and the other end of the telescopic spring 9 is fixedly connected to the outer side of the guide rod 7, under the action of the telescopic spring 9 force, the patch component can be made flatter; a connecting column 10 is rotatably connected between the two fixed rods 8, a second plug column 11 is fixedly connected to the outer side of the connecting column 10, an L-shaped column 12 is fixedly connected to the front side of the material tray 1, one end of the L-shaped column 12 is provided with an arc surface, the first plug column 5 and the second plug column 11 are matched with the through hole 15; the connecting column 10 is turned over so that the fixed rod 8 drives the guide The rod 7 rotates at one end of the fixed shaft 6, and the fixed rod 8 will move on the outside of the guide rod 7 under the action of the telescopic spring 9, and then the through hole 15 at one end of the transparent protective film 14 is sleeved on the first plug post 5, and the fixing rod 8 is driven to move on the outside of the guide rod 7 by pressing the connecting post 10. The telescopic spring 9 is in a compressed state, and then the through hole 15 at the other end of the transparent protective film 14 is sleeved on the outside of the second plug post 11. At this time, the transparent release film 18 can be torn off, and the PI tape 16 is exposed to the outside, and the connecting post 10 is pushed to flip it. During this process, the fixed rod 8 moves on the outside of the guide rod 7. When the connecting post 10 moves to the top of the L-shaped post 12, the position of the connecting post 10 can be fixed by the connecting post 10. At the same time, the PI tape 16 on the transparent protective film 14 moves to the top of the DDR5 slot 13. The transparent protective film 14 is pressed according to the position of the PI tape 16 to complete the pasting of the PI tape 16.
[0027] The working principle or structural principle is that the DDR5 slot 13 is placed in the placement slot 2 on the tray 1, and the connecting column 10 is flipped, so that the fixed rod 8 drives the guide rod 7 to rotate at one end of the fixed shaft 6. The fixed rod 8 will move on the outside of the guide rod 7 under the action of the telescopic spring 9, and the transparent release film 18 will be torn off, and the PI tape 16 will be exposed to the outside. Then, the through hole 15 at one end of the transparent protective film 14 is put on the first plug-in column 5, and the fixing rod 8 is driven to move on the outside of the guide rod 7 by pressing the connecting column 10. The telescopic spring 9 is in a compressed state, and then the through hole 15 at the other end of the transparent protective film 14 is put on the outside of the second plug-in column 11. Under the action of the telescopic spring 9, the patch component can be made flatter, and the connecting column 10 is pushed to flip it. During this process, the fixing rod 8 moves on the outside of the guide rod 7. When the connecting column 10 moves to the top of the L-shaped column 12, the position of the connecting column 10 can be fixed by the connecting column 10. At the same time, the PI tape 16 on the transparent protective film 14 moves to the top of the DDR5 slot 13. The transparent protective film 14 is pressed according to the position of the PI tape 16 to complete the pasting of the PI tape 16. After the pasting of the PI tape 16 is completed, the transparent protective film 14 can be torn off. The operation is simple and convenient, and the accuracy of the pasting of the PI tape 16 is effectively improved. By completing the pasting of multiple products at one time, the efficiency of the pasting of the PI tape 16 is effectively improved. At the same time, the effect of whole-reel shipping can be achieved, and the products pasted with the PI tape 16 have a dustproof effect.
[0028] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.
Claims
1. A membrane structure for simultaneously bonding multiple memory slots, comprising a patch component and a material tray (1) used in conjunction with the patch component, characterized in that: A placement slot (2) is provided on the top of the material tray (1), and a DDR5 slot (13) is placed inside the placement slot (2); The patch assembly comprises a transparent protective film (14), a PI tape (16) and a transparent release film (18); through holes (15) are provided at both ends of the transparent protective film (14); the PI tape (16) is arranged below the transparent protective film (14); and a transparent release film (18) is arranged below the PI tape (16).
2. The film structure for simultaneously attaching multiple memory slots according to claim 1, characterized in that: The rear side of the material tray (1) is fixedly connected with four fixed columns (3), a connecting shaft (4) is rotatably connected between two of the fixed columns (3), a first plug column (5) is fixedly connected to the outer side of the connecting shaft (4), both ends of the material tray (1) are fixedly connected with fixed shafts (6), one end of the fixed shaft (6) is fixedly connected with a guide rod (7), a fixed rod (8) is movably sleeved on the outer side of the guide rod (7), a telescopic spring (9) is movably sleeved on the outer side of the guide rod (7), a connecting column (10) is rotatably connected between the two fixed rods (8), and a second plug column (11) is fixedly connected to the outer side of the connecting column (10).
3. The film structure for simultaneously attaching a plurality of memory slots according to claim 2, characterized in that: One end of the telescopic spring (9) is fixedly connected to one end of the fixed rod (8), and the other end of the telescopic spring (9) is fixedly connected to the outer side of the guide rod (7).
4. The film structure for simultaneously attaching a plurality of memory slots according to claim 2, characterized in that: The first plug post (5) and the second plug post (11) both match the through hole (15).
5. The film structure for simultaneously attaching a plurality of memory slots according to claim 1, characterized in that: An L-shaped column (12) is fixedly connected to the front side of the material tray (1), and one end of the L-shaped column (12) is provided with a curved surface.
6. The film structure for simultaneously attaching a plurality of memory slots according to claim 2, characterized in that: The area of the transparent release film (18) is larger than the area of the transparent protective film (14), and the transparent protective film (14) is attached to the outer side of the transparent release film (18).