Foam packaging box of semiconductor wafer

Abstract

The utility model discloses a semiconductor wafer foam packing box which comprises a main shell, a cover shell is connected to the right side of the main shell in a clamped mode, L-shaped clamping rods are hinged to the two sides of the cover shell respectively, positioning pieces matched with the L-shaped clamping rods are installed on the two sides of the main shell respectively, and the positioning pieces are connected with the cover shell in a clamped mode. And clamping rings which are arranged at equal intervals are arranged in the main shell and the cover shell, and clamping grooves are formed in the clamping rings. According to the utility model, positioning of the L-shaped clamping rod is released by using the positioning piece, then the cover shell is taken down, at the moment, the wafers are sequentially and horizontally inserted into the clamping grooves of the clamping ring, the outer edges of the wafers are limited through the rubber limiting columns, then the cover shell is closed, the positioning piece is locked, and boxing is completed. And meanwhile, the upper and lower layers of foam clamping blocks position the wafer in the vertical direction, so that the omnibearing stable positioning effect on the wafer is realized, the transportation stability is better, and the device has the advantages of better fixing effect on the wafer, good transportation stability and high taking efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor element packaging, and more specifically to a foam packaging box for semiconductor wafers. Background Art

[0002] Wafer packaging boxes are mainly used to store wafers to prevent them from breaking during transportation. Wafer packaging boxes mainly include vertical wafer packaging boxes and can wafer packaging boxes. The advantages of vertical wafer packaging boxes are high cleanliness, low ions, and low gas release. They are used for vertical transportation and carrying of wafers, reducing the risk of wafer contamination. The advantages of can wafer packaging boxes are simple design, easy to clean and use, and at the same time ensure the safety of the product during transportation or storage, and minimize transportation costs by increasing packaging density.

[0003] For example, the utility model patent with application number 201921847143.0 discloses a protective and fixed wafer transport packaging box, including a box body and an upper cover body and a lower cover body threadedly connected to the upper and lower sides of the box body, the inner side of the box body is connected to a containing ring through a plurality of groups of rectangular reinforcing ribs, the upper and lower inner walls of the box body are provided with threaded portions, and the lower side of the upper cover body and the upper side of the lower cover body are provided with sealing grooves; the utility model has a simple structure, and the sealing performance of the device is improved through threaded sealing, thereby reducing the entry of outside air into the packaging box, thereby reducing the probability of the wafers in the packaging box being contaminated by the outside air; the two sides of the wafer can be squeezed and fixed by gaskets, so as to fix the wafer in the containing ring, and avoid collision damage caused by the swinging of the wafer in the containing ring; at the same time, when the device packages the wafer, the upper cover body, the lower cover body and the fixing assembly can be installed on both sides of the containing ring without a specific direction, thereby improving the packaging efficiency of the wafer and further improving the market competitiveness of the device.

[0004] However, the above-mentioned current wafer packaging box adopts a top and bottom cover design, which requires vertical operation when the wafer is taken and placed, and there will be a gap between the outer edge of the wafer and the packaging box body, resulting in reduced transportation stability. In addition, this design has low efficiency when the wafer enters the processing line, which is not conducive to production transportation. Utility Model Content

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide a foam packaging box for semiconductor wafers to solve the background technical problems.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A foam packaging box for semiconductor wafers, comprising a main shell, a cover shell being clamped on the right side of the main shell, L-shaped clamping rods being hinged on both sides of the cover shell, positioning pieces cooperating with the L-shaped clamping rods being installed on both sides of the main shell, equidistantly arranged clamping rings are provided inside the main shell and the cover shell, clamping grooves are provided inside the clamping rings, rubber limiting columns arranged equidistantly are fixedly connected inside the clamping grooves, foam clamping blocks arranged equidistantly are fixedly connected to the top and bottom surfaces inside the clamping grooves, and the clamping rings inside the main shell and the cover shell are distributed correspondingly.

[0008] As a further description of the above technical solution: both ends of the clamping ring inside the main shell are provided with parallel extension sections, and the extension sections are butted with both ends of the clamping ring inside the cover shell.

[0009] As a further description of the above technical solution: a positioning groove is provided on the right side of the main shell, and a docking block is provided on the left side of the cover shell, and the docking block is plugged into the interior of the positioning groove.

[0010] As a further description of the above technical solution: the positioning member includes a reciprocating card rod and a spring, the outer side of the reciprocating card rod is slidably connected to the interior of the main shell, one end of the reciprocating card rod is inserted into the interior of the main shell, the right end of the reciprocating card rod is clamped into the interior of the L-shaped card rod, and the left end of the reciprocating card rod extends outward to the outside of the main shell.

[0011] As a further description of the above technical solution: the center point of the full circle formed by the top view cross-section of the main shell and the cover shell is located inside the main shell.

[0012] As a further description of the above technical solution: a round bottom cover is fixedly connected to the bottom of the cover shell, and the outer side of the round bottom cover is snap-connected to the bottom of the main shell.

[0013] Compared with the prior art, the advantages of the present invention are:

[0014] This solution achieves an unequal proportion design through the main shell and the cover shell. While achieving side opening and closing for easy placement, it also limits the outer edge of the wafer through rubber limit columns to improve transportation stability, thereby achieving the advantages of better wafer fixation, good transportation stability, and high retrieval efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the top cross-sectional structure of the utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle part A;

[0017] Figure 3It is a schematic diagram of a partial top view cross-sectional structure of the utility model;

[0018] Figure 4 It is a schematic diagram of the side structure of the main shell of the utility model.

[0019] Description of the numbers in the figure:

[0020] 1. Main shell; 2. Cover shell; 21. Round bottom cover; 3. L-shaped clamping rod; 4. Clamping ring; 41. Extension section; 5. Clamping groove; 6. Rubber limit column; 7. Foam clamping block; 8. Positioning groove; 9. Docking block; 10. Positioning piece; 101. Reciprocating clamping rod; 102. Spring. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention;

[0022] See also Figures 1 to 4 In the utility model, a foam packaging box for semiconductor wafers includes a main shell 1, a cover shell 2 is clamped on the right side of the main shell 1, L-shaped clamping rods 3 are hinged on both sides of the cover shell 2, positioning members 10 that cooperate with the L-shaped clamping rods 3 are installed on both sides of the main shell 1, and equidistantly arranged clamping rings 4 are arranged inside the main shell 1 and the cover shell 2, and a clamping groove 5 is opened inside the clamping ring 4, and rubber limiting columns 6 arranged equidistantly are fixedly connected inside the clamping groove 5, and foam clamping blocks 7 arranged equidistantly are fixedly connected to the top and bottom surfaces inside the clamping groove 5, and the clamping rings 4 inside the main shell 1 and the cover shell 2 are correspondingly distributed.

[0023] In the present invention, the main shell 1 is combined with the cover shell 2 as the main body of the device. When in use, the positioning piece 10 is used to release the positioning of the L-shaped clamping rod 3, and then the cover shell 2 is removed. At this time, the round wafer is horizontally inserted into the inside of the clamping groove 5 of the clamping ring 4 in turn, and the outer edge of the wafer is limited by the rubber limiting column 6, and then the cover shell 2 is closed and the positioning piece 10 is locked to complete the box loading. At the same time, the upper and lower layers of foam clamping blocks 7 position the wafer in the vertical direction, so as to achieve an all-round stable positioning effect on the wafer, and the transportation stability is better, and the wafer can be taken out. When the cover shell 2 is opened, the wafer can be pulled out from the bottom of the main shell 1 by using a bottom supporting method, which is more suitable for wafer production equipment processing, thereby achieving the advantages of better wafer fixing effect, good transportation stability and high retrieval efficiency, and solving the problem of adopting a top and bottom cover design in the prior art, which requires vertical operation when taking and placing the wafer, and there will be a gap between the outer edge of the wafer and the packaging box body, resulting in reduced transportation stability. In addition, this design has low retrieval efficiency when the wafer enters the processing line, which is not conducive to production and transportation.

[0024] See also Figure 1, wherein: the two ends of the clamping ring 4 inside the main shell 1 are provided with parallel extension sections 41 , and the extension sections 41 are butted with the two ends of the clamping ring 4 inside the cover shell 2 .

[0025] In the utility model, the extended section 41 makes it easier to dock and guide the wafer into the slot 5 when taking or placing the wafer, and at the same time, most of the wafer is located inside the main housing 1, thereby increasing stability.

[0026] See also Figure 2 and Figure 3 , wherein: a positioning groove 8 is opened on the right side of the main shell 1, and a docking block 9 is arranged on the left side of the cover shell 2, and the docking block 9 is inserted into the interior of the positioning groove 8.

[0027] In the present invention, the positioning groove 8 cooperates with the docking block 9 to make the docking between the cover shell 2 and the main shell 1 more stable.

[0028] See also Figure 2 , wherein: the positioning member 10 includes a reciprocating card rod 101 and a spring 102, the outer side of the reciprocating card rod 101 is slidably connected to the inside of the main shell 1, one end of the reciprocating card rod 101 is inserted into the inside of the main shell 1, the right end of the reciprocating card rod 101 is clamped into the inside of the L-shaped card rod 3, and the left end of the reciprocating card rod 101 extends outward to the outside of the main shell 1.

[0029] In the utility model, the spring 102 is compressed by pushing the circular card rod 101 so that the L-shaped card rod 3 can be smoothly engaged with the edge position of the main shell 1, and then the elastic force of the spring 102 is used to push the circular card rod 101 to reset and engage the L-shaped card rod 3, so that its connection and positioning stability is better.

[0030] See also Figure 1 , wherein: the center point of the full circle formed by the top view cross-section of the main shell 1 and the cover shell 2 is located inside the main shell 1.

[0031] In the utility model, the center point of the whole circle formed by the top-view cross-section of the main shell 1 and the cover shell 2 is located inside the main shell 1, so that the overall placement position of the wafer is more biased towards the inside of the main shell 1. In this way, when the cover shell 2 is opened and closed, the wafer inside can be ensured to remain stable and avoid being taken out.

[0032] See also Figure 3 , wherein: a round bottom cover 21 is fixedly connected to the bottom of the cover shell 2, and the outer side of the round bottom cover 21 is snap-connected to the bottom of the main shell 1.

[0033] In the utility model, the bottom of the main shell 1 is in an open state when the cover shell 2 is opened by the round bottom cover 21, which is more conducive to the efficient removal of the round wafer and improves the efficiency.

[0034] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A foam packaging box for semiconductor wafers, comprising a main shell (1), characterized in that: The right side of the main shell (1) is clamped with a cover shell (2), and both sides of the cover shell (2) are hinged with L-shaped clamping rods (3), and both sides of the main shell (1) are installed with positioning parts (10) that cooperate with the L-shaped clamping rods (3). The main shell (1) and the cover shell (2) are both provided with equidistantly arranged clamping rings (4) inside, and a clamping groove (5) is opened inside the clamping ring (4), and the inside of the clamping groove (5) is fixedly connected with equidistantly arranged rubber limit columns (6), and the top and bottom surfaces of the inner side of the clamping groove (5) are fixedly connected with equidistantly arranged foam clamping blocks (7), and the clamping rings (4) inside the main shell (1) and the cover shell (2) are correspondingly distributed.

2. The foam packaging box for semiconductor wafers according to claim 1, characterized in that: The two ends of the clamping ring (4) inside the main shell (1) are provided with parallel extension sections (41), and the extension sections (41) are butted with the two ends of the clamping ring (4) inside the cover shell (2).

3. The foam packaging box for semiconductor wafers according to claim 1, characterized in that: A positioning groove (8) is provided on the right side of the main shell (1), and a docking block (9) is provided on the left side of the cover shell (2), wherein the docking block (9) is inserted into the interior of the positioning groove (8).

4. The foam packaging box for semiconductor wafers according to claim 1, characterized in that: The positioning member (10) comprises a reciprocating card rod (101) and a spring (102); the outer side of the reciprocating card rod (101) is slidably connected to the inside of the main shell (1); one end of the reciprocating card rod (101) is inserted into the inside of the main shell (1); the right end of the reciprocating card rod (101) is clamped into the inside of the L-shaped card rod (3); and the left end of the reciprocating card rod (101) extends outward to the outside of the main shell (1).

5. The foam packaging box for semiconductor wafers according to claim 1, characterized in that: The center point of the full circle formed by the top view cross-section of the main shell (1) and the cover shell (2) is located inside the main shell (1).

6. The foam packaging box for semiconductor wafers according to claim 1, characterized in that: A round bottom cover (21) is fixedly connected to the bottom of the cover shell (2), and the outer side of the round bottom cover (21) is clamped to the bottom of the main shell (1).

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