Integrally-encapsulated high-temperature-resistant and high-voltage-resistant electric imaging pole plate

Abstract

The utility model discloses an integral potting type high-temperature and high-voltage-resistant electric imaging polar plate, which comprises an integral potting data acquisition module used for acquiring stratum data for subsequent circuit processing, the module adopts a high-temperature and high-voltage-resistant potting medium integral potting mode, and a front placing plate, a button electrode and a wiring terminal are potted in the module. The plurality of button electrodes are installed on the front placing plate, one end of the wiring terminal is installed on the front placing plate, the other end of the wiring terminal outputs outwards, the button electrodes are used for collecting analog data of a stratum, and the front placing plate is used for converting the analog data collected by the button electrodes into digital quantity for later circuit processing; the electric imaging polar plate further comprises a bow reed, the inner part of the bow reed is hollow, and the hollow part is used for placing a front plate placing leading-out wire. According to the electric imaging polar plate, a filling and sealing mode structure is adopted, a corresponding sealing inserting needle inserting structure is not used, sealing links are reduced, the safety of an instrument is improved, miniaturization can be achieved, the construction requirement that the instrument penetrates through a drill rod is met, and the safety and the reliability of the instrument can be effectively improved by adopting the electric imaging polar plate.

Description

Technical Field

[0001] The utility model belongs to the technical field of petroleum logging instruments, in particular to an integrally encapsulated high-temperature and high-voltage resistant electric imaging electrode plate. Background Art

[0002] At present, my country is continuously increasing the development of shale gas in the southwest, especially in the Sichuan Basin, which is the largest geological structure unit in southwest my country and has rich shale gas resources. Most shale gas wells are horizontal wells. The main logging method used in horizontal wells, especially ultra-long horizontal wells (horizontal wells with a horizontal section length of more than 3,000 meters), is drill pipe logging. Drill pipe logging technology is of great significance to the exploration and development of horizontal wells. It can provide accurate underground rock formation information, help engineers better understand the geological structure, and thus formulate more effective development strategies.

[0003] The drill pipe logging technology has strict requirements on the outer diameter of the instrument. The plate of the electrical imaging instrument needs enough space to accommodate components such as measuring electrodes, connectors and front amplifier boards, so the outer diameter limit of the plate may be more stringent.

[0004] In order to realize the external dimensions of the electrical imaging plate and meet the high temperature and high pressure requirements of the logging instrument, the structural form of the small-sized plate and the layout of its internal data acquisition module are difficult problems that need to be solved urgently. Utility Model Content

[0005] The purpose of the utility model is to provide an integrally encapsulated high temperature and high voltage resistant electric imaging electrode plate in view of the problems existing in the above-mentioned prior art.

[0006] The technical solution to achieve the purpose of the utility model is: an integrally encapsulated high-temperature and high-pressure resistant electrical imaging plate, the electrical imaging plate includes an integrally encapsulated data acquisition module, which is used to collect formation data for subsequent circuit processing, the integrally encapsulated data acquisition module adopts an integral encapsulation mode of a high-temperature and high-pressure encapsulation medium, and is internally encapsulated with a front-end amplifier board, a button electrode and a wiring terminal, a plurality of the button electrodes are mounted on the front-end amplifier board, one end of the wiring terminal is mounted on the front-end amplifier board, and the other end is output to the outside, the button electrode is used to collect analog data of the formation, and the front-end amplifier board is used to convert the analog data collected by the button electrode into a digital quantity for subsequent circuit processing;

[0007] The electric imaging electrode plate also includes a bow spring sheet, the inner part of which is hollow, and the hollow part is used to place the lead wire of the front amplifier board;

[0008] When the electrical imaging electrode plate is assembled and used, the button electrode is in close contact with the well wall.

[0009] Furthermore, the electric imaging plate also includes a plate upper cover covering the integral potted data acquisition module to protect the module, and the plate upper cover is installed on the bow spring sheet.

[0010] Furthermore, two ends of the upper cover of the plate are arranged as inclined surfaces to be connected to the bow spring sheet.

[0011] Furthermore, the upper cover of the pole plate is welded with wear-resistant hard alloy.

[0012] Furthermore, the upper cover of the plate is connected and fixed to the bow spring sheet via a pressure plate.

[0013] Furthermore, a special-shaped groove is provided in the middle of the upper cover of the electrode plate, and the button electrode extends through the special-shaped groove to contact the formation.

[0014] Furthermore, the middle section of the bow spring piece is a plane section, and the two ends are arc sections, the arc sections provide a clamping force, and mounting holes are provided on the plane section, which are arranged correspondingly to the mounting holes on the upper cover of the plate.

[0015] Furthermore, the wiring terminal is connected to the housing through one of the connecting wires to serve as a ground wire of the integral potted data acquisition module.

[0016] Furthermore, a mounting hole connected to the ground wire of the integral potting data acquisition module is provided on the bow spring piece.

[0017] Furthermore, the hollow portion on the bow spring piece matches the size of the lead wire of the integral potting data acquisition module.

[0018] Compared with the prior art, the utility model has the following significant advantages:

[0019] (1) The utility model adopts the method of integral potting, and the potted acquisition module can directly achieve the purpose of high temperature and high pressure resistance, and can also meet the requirements of the plate shape. It is in direct contact with the formation mud, and the electrode buckle on the acquisition module collects the mud resistivity analog value. The thin-walled plate cover is used for protection, which solves the problem of miniaturization of the electric imaging plate and high temperature and high pressure resistance.

[0020] (2) The plate collection part adopts a potting mode structure, and the corresponding sealing pin plug-in structure is not used, which reduces the sealing links and increases the safety of the instrument. The plate can be miniaturized to meet the construction requirements of the instrument through the drill rod. The use of the integrally potted high-temperature and high-voltage resistant electrical imaging plate of the utility model effectively improves the safety and reliability of the instrument.

[0021] (3) Wear-resistant hard alloy is welded on the upper cover of the electrode plate to protect the electrode when the electrode plate rubs against the well wall.

[0022] (4) The upper cover of the plate is connected to the bow spring piece through an inclined surface, which can achieve effective buffering and improve the overall service life of the plate.

[0023] The utility model is described in further detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a front view of the structure of an integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate in one embodiment.

[0025] Figure 2 It is a top view of the structure of an integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate in one embodiment.

[0026] Figure 3 FIG. 1 is a schematic diagram of the structure of an integrated encapsulation data acquisition module in an embodiment, wherein Figure 3 (a) is the main view. Figure 3 (b) is a top view.

[0027] Description of reference numerals:

[0028] 1-bow spring, 2-plate upper cover, 3-integrated potting data acquisition module, 4-pressing block, 5-fixing screw, 301-button electrode, 302-front plate, 303-front plate lead wire, 304-potting medium DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0032] In addition, any technical features of the software program that may be implied in the utility model belong to the prior art in terms of the implementation of their functions. The essence of the solution is to propose and improve the composition and connection relationship of the hardware parts, and does not involve improvements to the software program itself.

[0033] In one embodiment, in combination Figures 1 to 3 The utility model provides an integrally encapsulated high temperature and high pressure resistant electric imaging plate, the electric imaging plate comprises an integrally encapsulated data acquisition module 3, which is used to collect formation data for subsequent circuit processing, the integrally encapsulated data acquisition module 3 adopts an integral encapsulation mode of a high temperature and high pressure resistant encapsulation medium 304, and is internally encapsulated with a front amplifier board 302, a button electrode 301 and a wiring terminal, a plurality of the button electrodes 301 are mounted on the front amplifier board 302, one end of the wiring terminal is mounted on the front amplifier board 302, and the other end is output externally, the button electrode 301 is used to collect analog data of the formation, and the front amplifier board 302 is used to convert the analog data collected by the button electrode 301 into digital quantities for subsequent circuit processing;

[0034] The electric imaging electrode plate also includes a bow spring piece 1, the inner part of the bow spring piece 1 is hollow, and the hollow part is used to place the lead wire 303 of the front amplifier board 302 (a group of signal wires are led out from the front end of the integral potting data acquisition module 3, and the signal wires are densely arranged in the hollow part of the bow spring piece 1 in the form of wire arrangement);

[0035] When the electrical imaging plate is assembled and used, the button electrode 301 is in close contact with the well wall, and the collected analog quantity is transmitted to the front amplifier board 302 for processing. The front amplifier board 302 transmits the processed digital quantity to the signal processing circuit. Through a series of related processing, an imaging map of the formation resistivity can be obtained.

[0036] The utility model integrates the button electrode, the front plate and the terminal block in an integral potting form, which can achieve the purpose of high voltage resistance and insulation of the electrode and the front plate. The corresponding sealing pin insertion structure can be omitted, which reduces the sealing link and increases the safety of the instrument. The plate can be miniaturized to meet the construction requirements of the instrument through the drill rod. The integral potting high temperature and high voltage resistant electric imaging plate of the utility model can effectively improve the safety and reliability of the instrument.

[0037] Furthermore, in one of the embodiments, the electric imaging plate also includes a plate upper cover 2 covering the integral potted data acquisition module 3 to protect the module, and the plate upper cover 2 is installed on the bow spring piece 1.

[0038] Preferably, in some embodiments, both ends of the plate upper cover 2 are configured as inclined surfaces connected to the bow spring piece 1 .

[0039] By adopting the solution of this embodiment, effective buffering can be achieved and the service life of the entire electrode plate can be increased.

[0040] Preferably, in some embodiments, the electrode plate is covered with wear-resistant hard alloy.

[0041] Furthermore, wear-resistant hard alloy is welded on the upper cover of the plate close to the electrode side.

[0042] By adopting the solution of this embodiment, it is possible to protect the electrode when the electrode plate rubs against the well wall.

[0043] Preferably, in some embodiments, the plate upper cover 2 is connected and fixed to the bow spring sheet 1 via a pressure plate 4 .

[0044] Here further, a pressing plate 4 is symmetrically provided at both ends of the plate upper cover 2.

[0045] Furthermore, in one of the embodiments, a special-shaped groove is opened in the middle of the upper cover 2 of the electrode plate, and the button electrode 301 extends through the special-shaped groove to contact the formation.

[0046] Here, the special-shaped groove can be replaced by but not limited to a waist-shaped groove.

[0047] Furthermore, in one of the embodiments, the middle section of the bow spring piece 1 is a plane section, and the two ends are arc sections, the arc sections provide a clamping force, and mounting holes are provided on the plane section, corresponding to the mounting holes on the upper cover 2 of the plate.

[0048] Furthermore, in one of the embodiments, the wiring terminal is connected to the housing through one of the connecting wires to serve as a ground wire of the integral potted data acquisition module 3 .

[0049] Furthermore, in one of the embodiments, a mounting hole connected to the ground wire of the integral potting data acquisition module 3 is provided on the bow spring piece 1 .

[0050] Furthermore, in one of the embodiments, the hollow portion on the bow spring piece matches the size of the lead wire of the integral potting data acquisition module.

[0051] It should be noted that the components that are fixedly connected in the present invention are connected by, but not limited to, screws 5 or bolts.

[0052] The utility model adopts an overall potting method, and the potted collection module can directly achieve the purpose of high temperature and high pressure resistance, directly contact with the formation mud, and the electrode buckle on the collection module collects the mud resistivity analog value, which is protected by a thin-walled plate cover, effectively solving the problem of miniaturization of the electric imaging plate and resistance to high temperature and high pressure.

[0053] The above shows and describes the basic principles, main features and advantages of the utility model. The technicians in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. An integrally encapsulated high temperature and high voltage resistant electric imaging plate, characterized in that: The electrical imaging plate includes an integral potting data acquisition module for collecting formation data for subsequent circuit processing. The integral potting data acquisition module adopts an integral potting mode of a high temperature and high pressure potting medium, and is internally potted with a front amplifier board, a button electrode and a wiring terminal. Several of the button electrodes are mounted on the front amplifier board, one end of the wiring terminal is mounted on the front amplifier board, and the other end is output externally. The button electrode is used to collect analog data of the formation, and the front amplifier board is used to convert the analog data collected by the button electrode into a digital quantity for subsequent circuit processing; The electric imaging electrode plate also includes a bow spring sheet, the inner part of which is hollow, and the hollow part is used to place the lead wire of the front amplifier board; When the electrical imaging electrode plate is assembled and used, the button electrode is in close contact with the well wall.

2. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 1, characterized in that: The electric imaging plate also includes a plate upper cover which covers the integral potted data acquisition module to protect the module, and the plate upper cover is installed on the bow spring sheet.

3. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: The two ends of the upper cover of the plate are arranged as inclined surfaces to be connected with the bow spring piece.

4. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: The pole plate is covered with wear-resistant hard alloy.

5. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: The upper cover of the pole plate is connected and fixed to the bow spring piece via a pressing plate.

6. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: A special-shaped groove is provided in the middle of the upper cover of the electrode plate, and the button electrode extends through the special-shaped groove to contact the formation.

7. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: The middle section of the bow spring piece is a plane section, and the two ends are arc sections, the arc sections provide a pressing force, and mounting holes are arranged on the plane section, which are arranged correspondingly to the mounting holes on the upper cover of the plate.

8. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 2, characterized in that: The wiring terminal is connected to the housing through one of the connecting wires and serves as the ground wire of the integral potting data acquisition module.

9. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 7, characterized in that: The bow spring piece is provided with a mounting hole connected to the ground wire of the integral potting data acquisition module.

10. The integrally encapsulated high temperature and high voltage resistant electrical imaging electrode plate according to claim 1, characterized in that: The hollow portion on the bow spring piece matches the size of the lead-out wire of the integral potting data acquisition module.

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