Automatic bonding mechanism

By designing an automatic bonding mechanism, the clamp, plane moving mechanism and docking movement mechanism are used to achieve accurate butt and tighten the workpiece, solving the problems of part position deviation and manual operating accuracy deviation during the bonding process, and achieving high-precision and automated bonding production.

CN222596500UActive Publication Date: 2025-03-11SHANGHAI UNITED IMAGING HEALTHCARE
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Patent Information

Application Number
CN202420794590.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-16
Publication Date
2025-03-11
Estimated Expiration
2034-04-16

AI Technical Summary

Technical Problem

During the bonding process, due to the weak connection force before the adhesive cures, the part position deviation will be caused, which will cause the dimensional deviation after bonding, and manual operation will occupy human resources and the accuracy deviation will be large.

Method used

An automatic bonding mechanism is designed, including a fixture, a planar moving mechanism, a docking moving mechanism and a jaw. By controlling the jaw and a docking moving mechanism, precise butt and tightening of the first workpiece and the second workpiece is achieved to ensure bonding accuracy.

Benefits of technology

High-precision docking of the first workpiece and the second workpiece is achieved, which reduces the deviation of manual operation and improves the degree of automation of bonding, and is suitable for automated, continuous and mass production.

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Abstract

The utility model relates to an automatic bonding mechanism. The automatic bonding mechanism comprises a clamp used for limiting the pose of a first workpiece and used for limiting the pose of a second workpiece, so that the second workpiece is stacked on the first workpiece in the first direction; a first moving end of the planar motion mechanism can move along a surface perpendicular to the first direction relative to the clamp; the butt joint movement mechanism is connected to the first moving end, and a second moving end of the butt joint movement mechanism can move in the first direction relative to the first moving end; and the clamping jaw is connected to the second moving end and used for taking and placing the first workpiece and / or the second workpiece. The automatic bonding mechanism can complete the butt joint of the first workpiece and the second workpiece to obtain a bonded part, and can ensure the alignment precision.
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Description

Technical Field

[0001] The present disclosure relates to the technical field of processing jigs, and in particular to an automatic bonding mechanism. Background Art

[0002] Bonding is a common process that can fix two parts into one.

[0003] During the bonding process, the two parts may have positional deviations relative to each other due to the weak connection force of the adhesive before curing, which will cause dimensional deviations after bonding. If the adhesive cures slowly, the risk of positional deviation is greater.

[0004] The bonding process is often done manually, which takes up a lot of human resources and has a high risk of bonding accuracy deviation. Utility Model Content

[0005] Based on this, it is necessary to provide an automatic bonding mechanism to address the risk issues of manual bonding.

[0006] The disclosed embodiment provides an automatic bonding mechanism for docking a first workpiece and a second workpiece, the automatic bonding mechanism comprising: a fixture, the fixture is used to define the posture of the first workpiece and to define the posture of the second workpiece, so that the second workpiece is stacked on the first workpiece along a first direction; a planar motion mechanism, the first movable end of the planar motion mechanism can move relative to the fixture along a surface perpendicular to the first direction; a docking motion mechanism, connected to the first movable end, the second movable end of the docking motion mechanism can move relative to the first movable end along the first direction; and a clamp, connected to the second movable end, for picking up and placing the first workpiece and / or for picking up and placing the second workpiece.

[0007] The automatic bonding mechanism provided in the embodiment of the present disclosure can place the first workpiece and the second workpiece in the fixture by using the controlled clamping jaws; in addition, the first workpiece and the second workpiece can be pressed tightly by the docking motion mechanism. The automatic bonding mechanism can complete the docking of the first workpiece and the second workpiece to obtain a bonded part, and can ensure the alignment accuracy. In addition, the automatic bonding mechanism helps to realize automated production, continuous production, and batch production.

[0008] In some embodiments, the planar motion mechanism includes a first module and a second module, the first module is used to drive the second module to move along a second direction perpendicular to the first direction, and the second module is used to drive the first moving end to move along a third direction.

[0009] With such arrangement, the planar motion mechanism has a simple structure, can meet a sufficient travel range of the first moving end, and can position the first moving end within a vertical plane in the first direction.

[0010] In some embodiments, the automatic bonding mechanism further includes a guide rail, which is spaced apart from the first module along the third direction to support the second module, and the second module is slidably connected to the guide rail along the second direction; the docking motion mechanism is located between the first module and the guide rail.

[0011] With such arrangement, the planar motion mechanism can operate stably and help ensure the reliable operation of the docking motion mechanism.

[0012] In some embodiments, the first module includes a first servo motor for driving the second module to move, and the second module includes a second servo motor for driving the first mobile end to move; the docking motion mechanism includes a third servo motor for driving the second mobile end to move.

[0013] Such arrangement can accurately control the moving position of the second moving end relative to the clamp. The automatic bonding mechanism can realize electrical control.

[0014] In some embodiments, the clamping jaws are air clamps; and the clamping direction of the clamping jaws is along the second direction.

[0015] With such arrangement, the clamping jaws react quickly and clamp reliably. In addition, the clamping direction of the clamping jaws is conducive to positioning the first component and the second component on the fixture.

[0016] In some embodiments, the clamping jaw includes a palm body and a plurality of groups of claw fingers, each group of claw fingers being adapted to be detachably connected to the palm body.

[0017] With such an arrangement, the style of the clamping jaws can be switched, and the automatic bonding mechanism can adapt to different types of products, has good compatibility, and can be used for flexible production.

[0018] In some embodiments, the fixture includes a first positioning portion and a second positioning portion, the first positioning portion is used to define the position and posture of the first workpiece, and the second positioning portion is used to define the position and posture of the second workpiece.

[0019] With this arrangement, the fixture can be reliably adapted to the product. In addition, the fixture can be more flexibly adapted to the workpiece, which is beneficial for the automatic bonding mechanism to be compatible with different types of products.

[0020] In some embodiments, the first positioning portion includes a positioning pin; the second positioning portion includes a first positioning block, a fourth servo motor, a second positioning block and a fifth servo motor, the first slider driven by the fourth servo motor is arranged opposite to the first positioning block, the second slider driven by the fifth servo motor is arranged opposite to the second positioning block, and the driving direction of the fourth servo motor intersects with the driving direction of the fifth servo motor.

[0021] With such arrangement, the positioning pin facilitates accurate positioning of the first component, while the fourth servo motor and the fifth servo motor can more flexibly adapt to the second component and ensure the positioning accuracy of the second component.

[0022] In some embodiments, the automatic bonding mechanism further includes a pressing block, the clamping jaw is used to take and place the pressing block, and the clamping jaw is used to press against the pressing block along the first direction.

[0023] With such an arrangement, the clamping block can be used to maintain pressure to ensure reliable bonding between the first component and the second component; the clamping block can be cyclically operated using the clamping jaws, and the clamping jaws can be used to achieve reliable and controlled initial pressure application to ensure accurate and reliable docking between the first component and the second component, which is beneficial to ensuring that the quality of the resulting bonded component is good.

[0024] Exemplarily, the automatic bonding mechanism further includes a buffer portion, which is used to positionally place the pressing block; the travel of the first moving end of the planar motion mechanism passes through the buffer portion and the clamp.

[0025] Such an arrangement can facilitate the reciprocating use of the clamping block, facilitate the realization of automated operation, the stroke of the clamping jaws can be reliably repeated, and the center of gravity of the clamping block can be accurately positioned, thereby facilitating the smooth clamping of the second element and the first element.

[0026] In some embodiments, the weight of the compression block is between 30 g and 300 g.

[0027] With such arrangement, the automatic bonding mechanism is suitable for the bonding process of the flexible circuit board and the copper block, and the pressing effect is conducive to the curing of the adhesive while ensuring the shape and size of the bonded parts.

[0028] In some embodiments, the automatic bonding mechanism further includes a mounting plate, and the clamp and the planar motion mechanism are respectively connected to the mounting plate and are respectively located on an upper side of the mounting plate along the first direction.

[0029] With such arrangement, the fixture and the planar motion mechanism are relatively positioned, and the assembly is reliable; it is also beneficial to improve the manipulation accuracy of the first workpiece and the second workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the automatic bonding mechanism of the embodiment of the present disclosure;

[0031] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0032] Figure 3 It is a schematic exploded view of the automatic bonding mechanism according to an embodiment of the present disclosure.

[0033] Description of reference numerals: 1, fixture; 110, first positioning portion; 120, second positioning portion; 121, first positioning block; 122, second positioning block; 123, fifth servo motor; 124, fourth servo motor; 130, cache portion;

[0034] 2. Planar motion mechanism; 201. Mounting plate; 202. First moving end; 203. Bracket; 204. Third moving end; 205. Adapter plate; 3. Docking motion mechanism; 301. Second moving end; 4. Clamping claw; 401. Palm; 402. Claw finger; 5. First module; 6. Second module; 7. Guide rail; 8. Pressing block; 9. Third module; 100. Automatic bonding mechanism; 200. Adhesive member. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present disclosure more obvious and understandable, the specific implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure. However, the embodiments of the present disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the embodiments of the present disclosure, so the embodiments of the present disclosure are not limited by the specific examples of the embodiments disclosed below.

[0036] In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "perpendicular", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present disclosure.

[0037] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0038] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. Exemplarily, the first mobile terminal may also be referred to as the second mobile terminal, and the second mobile terminal may also be referred to as the first mobile terminal. In the description of the embodiments of the present disclosure, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the embodiments of the present disclosure, unless otherwise clearly specified and limited, the terms "connected", "connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a flexible connection, or a rigid connection along at least one direction; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or directly connected with the presence of an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. The terms "installed", "set", "fixed", etc. can be broadly understood as connection. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0040] See also Figure 1 , Figure 1 The automatic bonding mechanism of the embodiment of the present disclosure is shown. In the exemplary embodiment, the automatic bonding mechanism 100 includes a clamp 1 , a planar motion mechanism 2 , a docking motion mechanism 3 , and a clamping claw 4 .

[0041] Combination Figure 2 and Figure 3 As shown, the automatic bonding mechanism 100 is used to manufacture a bonding member 200. The bonding member 200 includes a first element and a second element (not shown), and the first element and the second element are bonded together.

[0042] The fixture 1 is used to define the posture of the first workpiece and to define the posture of the second workpiece. By controlling the installation sequence or installation method, the second workpiece can be stacked on the first workpiece along the first direction. The first direction is parallel to the Z-axis direction, and then the second workpiece is on the first workpiece. The top surface of the first component along the Z-axis direction is used to bond to the bottom surface of the second component.

[0043] In some embodiments, the fixture 1 includes a first positioning portion 110 and a second positioning portion 120. The first positioning portion 110 is used to define the posture of the first workpiece. The second positioning portion 120 is located on one side of the first positioning portion 110 along the first direction, and the second positioning portion 120 is used to define the posture of the second workpiece. The first positioning portion 110 is located on the lower side of the second positioning portion 120 along the Z-axis direction, and the second positioning portion 120 is located on the upper side of the first positioning portion 110 along the Z-axis direction. Exemplarily, the positioning portion of the fixture 1 may include staggered portions. The key positioning portion of the second positioning portion 120 is higher than the key positioning portion of the first positioning portion 110, which is used to ensure that the second element is stacked on the first element along the Z-axis direction.

[0044] The first positioning portion 110 can define the position of the first element on the XY plane, and the second positioning portion 120 can define the position of the second element on the XY plane. The first element and the second element are accurately positioned along the XY plane.

[0045] The first moving end 202 of the planar motion mechanism 2 can move relative to the fixture 1 along a plane perpendicular to the first direction. The motion trajectory of the first moving end 202 is not necessarily limited to a plane parallel to the XY plane, but its projection along the Z-axis direction at least passes through the fixture 1. In some embodiments, the first moving end 202 of the planar motion mechanism 2 is located on the side of the second positioning portion 120 facing away from the first positioning portion 110 along the first direction. The first moving end 202 of the planar motion mechanism 2 is located on the upper side of the fixture 1 along the Z-axis direction.

[0046] The docking motion mechanism 3 is connected to the first moving end 202. The second moving end 301 of the docking motion mechanism 3 can move along the first direction relative to the first moving end 202. Exemplarily, the second moving end 301 moves in a controlled manner and can approach the clamp 1 or move away from the clamp 1. The second moving end 301 is located on the upper side of the clamp 1.

[0047] The clamp 4 is connected to the second moving end 301. Exemplarily, the clamp 4 is used to pick up and place the first workpiece. Exemplarily, the clamp 4 is used to pick up and place the second workpiece. Based on the action of the planar motion mechanism 2 and the docking motion mechanism 3, the clamp 4 can first pick up and place the first workpiece, and then pick up and place the second workpiece.

[0048] In an exemplary embodiment, the automatic bonding mechanism 100 of the embodiment of the present disclosure may be used in conjunction with a glue coating mechanism (not shown), and the two are used to form a bonding production line.

[0049] In an exemplary embodiment, the automatic bonding mechanism 100 has a material taking position and a material discharging position. For example, along the X-axis direction, the material taking position and the material discharging position are located on both sides of the fixture 1. The material taking position may include a first material taking area for placing the first component and a second material taking area for placing the second component. At least one of the first component and the second component has been coated with adhesive when the material taking position is used.

[0050] When the automatic bonding mechanism 100 provided in the embodiment of the present disclosure is working, the planar motion mechanism 2 drives the docking motion mechanism 3, and the docking motion mechanism 3 drives the clamp 4. The first component can be picked up by the clamp 4 first, and then the first component is accurately placed on the fixture 1; when the clamp 4 releases the first component, the first component can be positioned by the first positioning portion. Move the clamp 4 to pick up the second component, and then accurately place the second component on the fixture 1, and the second component is located on the first component. The second positioning portion can limit the position of the second component to ensure that it is aligned with the first component. For example, the docking motion mechanism 3 can be used to drive the clamp 4 to press the second component so that the adhesive between the second component and the first component is tightly attached to the surface of the component, which is conducive to ensuring the bonding effect.

[0051] The automatic bonding mechanism 100 provided in the embodiment of the present disclosure can automatically complete the docking of the first workpiece and the second workpiece to obtain the bonded member 200, and can ensure the alignment accuracy. In addition, the automatic bonding mechanism helps to realize automated production, continuous production, and batch production.

[0052] In some embodiments, the fixture 1 may include a positioning pin. The first workpiece and the second workpiece may include positioning holes adapted to the positioning pin, respectively. Exemplarily, the fixture 1 may include a clamping plate, and the positioning edges of the first workpiece and the second workpiece are respectively adapted to be clamped by the clamping plate. Exemplarily, the fixture 1 may be used to position the first workpiece; the first workpiece may be able to position the second workpiece.

[0053] like Figure 1 As shown, the automatic bonding mechanism 100 includes a mounting plate 201 and a bracket 203. The fixture 1 can be fixed to the mounting plate 201. The bracket 203 is fixed to the mounting plate 201 and is used to carry the planar motion mechanism 2. The planar motion mechanism 2 is connected to the fixture 1 through the bracket 203 and is located at a position higher than the fixture 1 along the Z-axis direction, so that there is enough operating space at the fixture 1.

[0054] In some embodiments, the planar motion mechanism 2 includes a first module 5 and a second module 6. The first module 5 is connected to the fixture 1 and is used to drive the second module 6 to move along the second direction. The second direction is parallel to the Y-axis direction and perpendicular to the first direction. The second module 6 is used to drive the first mobile end 202 to move along the third direction, and the third direction is parallel to the X-axis direction. The structure of the planar motion mechanism 2 is simple. The first module 5 and the second module 6 can satisfy the movement of the first mobile end 202 in the XY plane, and can position the first mobile end 202 in the vertical plane of the first direction. The first mobile end 202 can have a roughly rectangular travel range.

[0055] Exemplarily, the second module 6 is located on the upper side of the first module 5 . The first moving end 202 is located on one side of the second module 6 along the Y-axis direction; the docking motion mechanism 3 is also located on this side of the second module 6 .

[0056] In other embodiments, the planar motion mechanism may include a rotation mechanism to achieve curved motion of the first moving end.

[0057] In some embodiments, the automatic bonding mechanism 100 further includes a guide rail 7. The second module 6 is slidably connected to the guide rail 7 along the Y-axis direction. The guide rail 7 and the first module 5 are spaced apart along the X-axis direction to support the second module 6, and the two can be supported at both ends of the slide rail of the second module 6. The docking motion mechanism 3 is located between the first module 5 and the guide rail 7. The planar motion mechanism 2 can operate stably, the first moving end 202 moves smoothly, and the docking motion mechanism 3 can work reliably.

[0058] The guide rail 7 can be connected to the mounting plate 201 through the bracket 203. The mounting plate 201 is used to provide a stable and reliable assembly basis to ensure the position relationship of each component in space.

[0059] In some other embodiments, the driving direction of the first module is along the X-axis direction, and the driving direction of the second module is along the Y-axis direction.

[0060] Exemplarily, the first module 5 includes a first servo motor for driving the second module 6 to move. The first module 5 also includes a first slide rail. The second module 6 is slidably connected to the first slide rail along the Y-axis direction. The planar motion mechanism 2 includes a third moving end 204. The first servo motor is used to drive the third moving end 204 to move along the first slide rail. The second module 6 is connected to the third moving end 204.

[0061] The second module 6 includes a second servo motor for driving the first moving end 202 to move. The slide rail of the second module 6 is a second slide rail. The second servo motor is used to drive the first moving end 202 to move along the second slide rail. The first servo motor and the second servo motor can accurately control the movement position of the first moving end 202 relative to the clamp 1. The docking motion mechanism 3 is slidably connected to the second slide rail through the first moving end 202, and then the position of the clamp 4 in the XY plane can also be accurately controlled by the planar motion mechanism 2.

[0062] The docking motion mechanism 3 includes a third servo motor for driving the second moving end 301 to move. Exemplarily, the docking motion mechanism 3 includes a third module 9. The third module 9 includes the third servo motor and a third slide rail. The third servo motor drives the second moving end 301 and then drives the clamping claw 4 to move along the third slide rail. The automatic bonding mechanism 100 can realize electrified control.

[0063] Each servo motor can realize power output and transmission through gears, synchronous belts, etc. For example, the first module 5, the second module 6 or the third module 9 can also drive the corresponding mobile end to move through other drivers such as permanent magnet synchronous motors.

[0064] The automatic bonding mechanism 100 further includes an adapter plate 205, through which the second module 6 is slidably connected to the guide rail 7. Exemplarily, the first mobile end 202, the second mobile end 301 and the third mobile end 204 are sequentially configured as a first adapter plate, a second adapter plate and a third adapter plate. The adapter plate 205 can be referred to as a fourth adapter plate.

[0065] In other embodiments, the position of the first movable end 202 relative to the clamp 1 may also be arranged in other ways, and then the shape design of the docking motion mechanism 3 is used to ensure that the clamp 4 can correspond to the position of the clamp 1.

[0066] refer to Figure 3 , exemplarily, the first positioning portion 110 includes positioning pins. The first positioning portion 110 may include four positioning pins in an array, and the positioning pins extend along the Z-axis direction. The first element has a positioning hole matched with the positioning pin, and the positioning pin facilitates accurate positioning of the first element.

[0067] Exemplarily, the second positioning portion 120 includes a first positioning block 121 and a fourth servo motor 124. The first slider driven by the fourth servo motor 124 is arranged opposite to the first positioning block 121. After the clamp 4 puts down the second element, the fourth servo motor 124 can be used to press the second element tightly against the side of the first positioning block 121, and the position of the second element along the third direction, for example, can be accurately positioned. The first slider and the first positioning block 121 clamp the second element.

[0068] The second positioning portion 120 may further include a second positioning block 122 and a fifth servo motor 123. The second slider driven by the fifth servo motor 123 is arranged opposite to the second positioning block 122. The driving direction of the fifth servo motor 123 intersects with the driving direction of the fourth servo motor 124. The fourth servo motor 124 and the fifth servo motor 123 can stably and reliably clamp the second component.

[0069] When the automatic bonding mechanism 100 is applied to different types of adhesive members 200, it is not necessary to replace the fixture 1. The fixture 1 can flexibly adapt to the second element and ensure the positioning accuracy of the second element. Exemplarily, the first positioning block 121 or the second positioning block 122 is adjustably connected to the first positioning portion 110. The second positioning portion 120 can be simply adjusted to make the fixture 1 adapt to different adhesive members 200.

[0070] In some embodiments, the clamping jaw 4 is an air clamping jaw. The pneumatically driven clamping jaw 4 has a fast response and reliable clamping. The first component and the second component can be positioned and placed on the fixture 1 by the clamping jaw 4. The clamping direction of the clamping jaw 4 can be along the X-axis direction. The clamping direction of the clamping jaw 4 is parallel to the driving direction of the fourth servo motor 124, which facilitates the positioning of the second component by the fixture 1.

[0071] In some embodiments, the gripper 4 includes a palm 401 and a plurality of groups of gripper fingers 402. Exemplarily, each group of gripper fingers 402 is used to be detachably connected to the palm 401. Figure 2 and Figure 3 As shown, when the clamp 4 is in working state, the palm 401 can be installed with a group of two claw fingers 402. The style of the clamp 4 can be switched by replacing the claw fingers 402. The automatic bonding mechanism 100 can adapt to different types of products, has good compatibility, and can be used for flexible production. For example, different groups of claw fingers 402 can be respectively set at different positions of the clamp 4, and the corresponding group of claw fingers 402 is used to clamp the first component or the second component.

[0072] The palm body 401 can be configured as a cylinder, and the claw fingers 402 are connected to the output gas rod. The two claw fingers 402 clamp the first component or the second component along the X-axis direction.

[0073] In some embodiments, the automatic bonding mechanism 100 also includes a clamping block 8. The clamping jaws 4 are used to take and place the clamping block 8. During operation, after the clamping jaws 4 put down the second component, the planar motion mechanism 2 and the docking motion mechanism 3 are used to drive the clamping jaws 4 to move and then clamp the clamping block 8, and then drive the clamping block 8 to move to the second component, and the clamping jaws 4 can be released to put down the clamping block 8. Exemplarily, the clamping jaws 4 are used to push against the clamping block 8 along a first direction to squeeze the second component toward the first component. The clamping block 8 is used to maintain pressure to ensure reliable bonding between the first component and the second component. After the pressure holding time, the clamping jaws 4 are used to clamp and pick up the clamping block 8, and the clamping jaws 4 are moved and the clamping block 8 is put down for the next bonding use.

[0074] The automatic bonding mechanism 100 can cyclically operate the pressing block 8 by means of the clamping jaws 4 and implement reliable and controlled initial pressure application by means of the clamping jaws 4 to ensure accurate and reliable docking of the first component and the second component, thereby facilitating the quality of the resulting bonded component 200 .

[0075] In some embodiments, the automatic bonding mechanism 100 further includes a buffer 130. The buffer 130 is used to positionally place the pressing block 8. The travel of the first moving end 202 of the planar motion mechanism 2 passes through the buffer 130 and the clamp 1. The travel of the clamp 4 can be reliably repeated, which can facilitate the reciprocating use of the pressing block 8, facilitate the realization of automated operation, and facilitate the accurate positioning of the center of gravity of the pressing block 8, which is then conducive to the stable compression of the second element and the first element.

[0076] The buffer section 130 can be arranged on the mounting plate 201, and the remaining components of the automatic bonding mechanism 100 can also be arranged on the upper side of the mounting plate 201 along the Z-axis direction. The buffer section 130 can be arranged on one side of the fixture 1 along the Y-axis direction, and the stroke of the clamping jaw 4 for taking and placing the buffer section 130 is different from the stroke of taking and placing the first component or the second component, so that the working space of the automatic bonding mechanism 100 is effectively utilized.

[0077] In some embodiments, the weight of the pressing block 8 is 30 g to 300 g, such as 50 g, 100 g, 150 g, 200 g, or 250 g. The automatic bonding mechanism 100 is suitable for the bonding process of the flexible circuit board and the copper block. The pressing effect is conducive to the curing of the adhesive while ensuring the shape and size of the adhesive member 200. The copper block is the first element, and the flexible circuit board is the second element. Exemplarily, the pressing block 8 covers the second element.

[0078] Exemplarily, the mounting plate 201 may be provided with a plurality of clamps 1 and a plurality of pressing blocks 8 .

[0079] In an exemplary embodiment, the tolerance between the locating pin and the locating hole of the first element is 0.005 mm. The second element is assembled with the second positioning portion 120 and has a relative tolerance of 0.05 mm. Exemplarily, the horizontality tolerance of the pressing block 8 after pressing the second element is 0.025 mm. The automatic bonding mechanism 100 can achieve a bonding process with high matching degree and high positioning accuracy.

[0080] The technical features of the embodiments disclosed above can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above disclosed embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of patent protection of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the scope of patent protection required by the utility model. Therefore, the scope of patent protection of the utility model shall be based on the attached claims.

Claims

1. An automatic bonding mechanism, for bonding a first workpiece and a second workpiece, characterized in that: The automatic bonding mechanism (100) comprises: A fixture (1), the fixture (1) being used to define the position and posture of the first workpiece and to define the position and posture of the second workpiece, so that the second workpiece is stacked on the first workpiece along a first direction; A planar motion mechanism (2), wherein a first moving end (202) of the planar motion mechanism (2) is capable of moving relative to the clamp (1) along a surface perpendicular to the first direction; a docking motion mechanism (3) connected to the first moving end (202), wherein the second moving end (301) of the docking motion mechanism (3) is capable of moving along the first direction relative to the first moving end (202); and A clamping jaw (4) is connected to the second movable end (301) and is used for picking up and placing the first workpiece and / or for picking up and placing the second workpiece.

2. The automatic bonding mechanism according to claim 1, characterized in that: The planar motion mechanism (2) comprises a first module (5) and a second module (6); the first module (5) is used to drive the second module (6) to move along a second direction, the second direction being perpendicular to the first direction; and the second module (6) is used to drive the first moving end (202) to move along a third direction.

3. The automatic bonding mechanism according to claim 2, characterized in that: It also comprises a guide rail (7), wherein the guide rail (7) and the first module (5) are arranged at intervals along the third direction to support the second module (6), and the second module (6) is slidably connected to the guide rail (7) along the second direction; The docking motion mechanism (3) is located between the first module (5) and the guide rail (7).

4. The automatic bonding mechanism according to claim 2, characterized in that: The first module (5) comprises a first servo motor for driving the second module (6) to move, and the second module (6) comprises a second servo motor for driving the first movable end (202) to move; and the docking motion mechanism (3) comprises a third servo motor for driving the second movable end (301) to move.

5. The automatic bonding mechanism according to claim 2, characterized in that: The clamping jaw (4) is an air clamping jaw; the clamping direction of the clamping jaw (4) is along the second direction.

6. The automatic bonding mechanism according to claim 1, characterized in that: The clamping jaw (4) comprises a palm body (401) and a plurality of groups of claw fingers (402), and each group of claw fingers (402) is used to be detachably connected to the palm body (401).

7. The automatic bonding mechanism according to claim 1, characterized in that: The clamp (1) comprises a first positioning portion (110) and a second positioning portion (120), wherein the first positioning portion (110) is used to define the position and posture of the first workpiece, and the second positioning portion (120) is used to define the position and posture of the second workpiece.

8. The automatic bonding mechanism according to claim 7, characterized in that: The first positioning portion (110) comprises a positioning pin; The second positioning portion (120) comprises a first positioning block (121), a fourth servo motor (124), a second positioning block (122) and a fifth servo motor (123); a first sliding block driven by the fourth servo motor (124) is arranged opposite to the first positioning block (121); a second sliding block driven by the fifth servo motor (123) is arranged opposite to the second positioning block (122); and a driving direction of the fourth servo motor (124) intersects with a driving direction of the fifth servo motor (123).

9. The automatic bonding mechanism according to claim 1, characterized in that: It also includes a pressing block (8) and a buffer portion (130), wherein the buffer portion (130) is used to positionally place the pressing block (8); The travel of the first moving end (202) of the planar motion mechanism (2) passes through the buffer portion (130) and the clamp (1); The clamping jaw (4) is used for taking and placing the pressing block (8), and the clamping jaw (4) is used for pressing against the pressing block (8) along the first direction.

10. The automatic bonding mechanism according to any one of claims 1 to 9, characterized in that: It also comprises a mounting plate (201), the clamp (1) and the planar motion mechanism (2) being respectively connected to the mounting plate (201) and respectively located on the upper side of the mounting plate (201) along the first direction.