LED light source plate heat dissipation device

Abstract

The utility model discloses an LED light source plate heat dissipation device, which relates to the technical field of LED light source plates, and comprises an LED light source plate, the surface of the LED light source plate is provided with heat conduction paste, the surface of the heat conduction paste far away from the LED light source plate is provided with a heat conduction plate, and both sides of the heat conduction plate are provided with uniform temperature plates. The LED light source plate comprises a substrate, a plurality of LED light sources fixed to the substrate and a protective cover connected with the substrate in a sealed mode. The heat dissipation substrate and the flexible circuit board are adopted to serve as a surface mounting LED light source carrier, only heat conduction paste is arranged between the LED light source and the heat conduction plate, insulation layer blocking is avoided, heat generated by an LED chip can be transmitted to the heat dissipation substrate, the heat dissipation effect is good, the LED reliability is good, and the service life of the LED lamp can be prolonged; contact heat dissipation can be conducted on the left side and the right side of the LED light source plate, incomplete heat dissipation caused by the fact that high-temperature heat is dissipated from the two sides after long-time use is prevented, meanwhile, the heat dissipation area can be effectively increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED light source boards, and in particular to a heat dissipation device for an LED light source board. Background Art

[0002] In existing LED applications, most LED chips are fixed on PCB boards. Thermal grease or silicone rubber thermal conductive sheet is often used as a thermal conductive medium between the LED chip and the heat sink, so that the heat generated by the LED chip when working is transferred to the heat sink through these thermal conductive media. The thermal conductivity of thermal grease or thermal conductive sheet is very low, usually less than 5W / MK. On the other hand, in order to pursue heat dissipation, the electrical safety performance will be reduced, resulting in a large temperature difference between the LED chip and the heat sink, at least greater than 15°, which puts strict requirements on the ambient temperature of the LED chip, greatly limiting the application of LED light sources. As a result, many LED light sources have early light decay due to poor thermal conductivity, which makes many advantages of LED light sources unable to be brought into play, but instead has many negative effects, seriously hindering the promotion and application of LED light sources. What's more, the heat sink is enlarged several times to obtain a lower temperature difference, which brings high costs, is not conducive to the development of LED light sources, and causes great waste.

[0003] In the prior art, a Chinese patent document with a publication number of CN202125895U is proposed to solve the above technical problems. The technical solution disclosed in the patent document is as follows: a PCB board heat dissipation device for LED light sources, comprising a heat sink, a PCB board fitted with the heat sink, and a single or multiple LED chips arranged on the PCB board, wherein the contact surface between the heat sink and the PCB board is an arc surface, and the heat sink is provided with slots for the PCB board at both ends of the contact surface. The utility model also discloses a method for implementing a PCB board heat dissipation device for LED light sources, and the use of the utility model greatly improves the thermal conductivity between the LED chip and the heat sink.

[0004] In order to solve the problem that LED light sources experience early light decay due to poor thermal conductivity, which makes many advantages of LED light sources unable to be brought into play, the existing technology uses a heat sink to fit the PCB board for processing. However, the heat dissipation speed of a single set of heat sinks is slow, which leads to the problem of unclear heat dissipation during high-frequency and long-term use. Utility Model Content

[0005] The purpose of the utility model is to provide a heat dissipation device for an LED light source board to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] A heat dissipation device for an LED light source board comprises an LED light source board, wherein a thermal conductive paste is arranged on the surface of the LED light source board, a thermal conductive plate is arranged on the surface of the thermal conductive paste away from the LED light source board, and temperature balancing plates are arranged on both sides of the thermal conductive plate.

[0008] The further improvement of the technical solution of the utility model is that: the LED light source board includes a substrate, a plurality of LED light sources fixed on the substrate, and a protective cover sealed and connected to the substrate;

[0009] The protective cover includes a protective substrate and a protective shell protruding from the protective substrate; the protective substrate is sealed and fitted with the substrate; the protective shell and the substrate form a sealed cavity; the LED light source is located in the sealed cavity; the sealed cavity is evacuated and then filled with an inert gas, and a sealed protective cover is directly provided on the LED light source board to isolate the LED light source on the LED light source board from the outside air, thereby reducing chemical reactions such as oxidation reaction or sulfurization reaction of the LED light source, thereby greatly extending the working life of the LED light source; the sealed cavity of the LED light source board is filled with inert gas, further preventing the LED light source from chemically reacting with the outside air or substances, thereby further enhancing the protective performance of the LED light source and extending the working life of the LED light source to a greater extent.

[0010] A further improvement of the technical solution of the utility model is that the thermal conductive paste includes a thermally conductive silicone composition containing aluminum particles as a thermally conductive filler. By setting the thermal conductive paste, heat transfer can be carried out and because it has a certain viscosity, it is convenient to install the heat conductive plate and the temperature equalizing plate, thereby improving the stability of the installation.

[0011] A further improvement of the technical solution of the utility model is that: the heat conducting plate comprises a laminated plate of a metal substrate, a heat conducting insulating layer and a copper foil, a barrier layer such as a nickel plating layer or other stable metal plating layer is added on the electrode foil (such as a copper foil) of the heat conducting substrate, and a heat dissipation substrate plus a flexible circuit board are used as a surface mounted LED light source carrier, only thermal conductive paste is present between the LED light source and the heat conducting plate, and no insulating layer is provided to block the heat. The heat generated by the LED chip can be transferred to the heat dissipation substrate, so that the heat dissipation effect is good, the LED reliability is good, and its service life can be extended.

[0012] A further improvement of the technical solution of the utility model is that the temperature equalizing plate is adhered to the left and right sides of the heat conducting plate by means of thermal conductive paste. By installing the temperature equalizing plate on the left and right sides of the heat conducting plate, contact heat dissipation can be achieved on the left and right sides of the LED light source board, thereby preventing high-temperature heat from being dissipated from both sides due to long-term use and resulting in incomplete heat dissipation. At the same time, the heat dissipation area can be effectively increased, thereby improving the heat dissipation efficiency.

[0013] A further improvement of the technical solution of the utility model is that the lengths of the heat conducting plate and the temperature averaging plate can be produced according to the length of the LED light source board, and can also be spliced ​​by welding and bonding. By producing the corresponding heat conducting plate and the temperature averaging plate according to the specific length of the LED light source board, the assembly connection can be made closer and more beautiful, and protruding edges that affect use and uneven cutting that affects the appearance of the product can be prevented. At the same time, the splicing arrangement can prevent special circumstances, such as when the LED light source board is too long, by extending its length to effectively dissipate heat and cool down.

[0014] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0015] The utility model provides a heat dissipation device for an LED light source board. By arranging a thermal conductive paste, heat transfer can be performed and at the same time, due to its certain viscosity, the installation of a thermal conductive plate and a temperature equalizing plate is facilitated, thereby improving the stability of the installation.

[0016] The utility model provides a heat dissipation device for an LED light source board. A heat dissipation substrate and a flexible circuit board are used as surface mounted LED light source carriers. There is only heat conductive paste between the LED light source and the heat conductive plate without an insulating layer blocking it. The heat generated by the LED chip can be transferred to the heat dissipation substrate. The heat dissipation effect is good, the LED reliability is good, and its service life can be extended.

[0017] The utility model provides a heat dissipation device for an LED light source board. By installing temperature equalizing plates on the left and right sides of a heat conducting plate, contact heat dissipation can be performed on the left and right sides of the LED light source board to prevent high-temperature heat from being dissipated from both sides due to long-term use, resulting in incomplete heat dissipation. At the same time, the heat dissipation area can be effectively increased, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model;

[0019] Figure 2 It is a schematic diagram of the left end structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the thermal conductive paste of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the heat conducting plate and the temperature balancing plate of the utility model;

[0022] Figure 5 It is a schematic diagram of the bonding installation structure of the utility model.

[0023] In the figure: 1. LED light source board; 2. Thermal paste; 3. Thermal conductive plate; 4. Temperature balancing board; 11. Base plate; 12. LED light source; 13. Protective cover. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below in conjunction with the embodiments: Example

[0025] The utility model provides a heat dissipation device for an LED light source board, comprising an LED light source board 1, wherein the LED light source board 1 comprises a substrate 11, a plurality of LED light sources 12 fixed on the substrate, and a protective cover 13 sealed and connected to the substrate; the protective cover 13 comprises a protective substrate and a protective shell protruding from the protective substrate; the protective substrate is sealed and fitted with the substrate 11; the protective shell and the substrate 11 form a sealed cavity; the LED light source 12 is located in the sealed cavity; the sealed cavity is evacuated and then filled with an inert gas, a thermal conductive paste 2 is arranged on the surface of the LED light source board 1, a thermal conductive plate 3 is arranged on the surface of the thermal conductive paste 2 away from the LED light source board 1, and temperature averaging plates 4 are arranged on both sides of the thermal conductive plate, by arranging the thermal conductive plate 3 and the temperature averaging plates 4, the three sides of the LED light source board 1 can be wrapped, so that the thermal conductive paste 2 can be cooperated to effectively dissipate heat, thereby improving the efficiency of heat dissipation and increasing the area that can be dissipated. Example

[0026] On the basis of Example 1, the utility model provides a technical solution: preferably, the thermally conductive paste 2 includes a thermally conductive silicone composition containing aluminum particles as a thermally conductive filler. By setting the thermally conductive paste 2, heat transfer can be performed and it can be convenient to install the thermally conductive plate 3 and the temperature equalizing plate 4 because of its certain viscosity, thereby improving the stability of the installation. The thermally conductive plate 3 includes a laminated plate of a metal substrate, a thermally conductive insulating layer and a copper foil. A barrier layer, such as a nickel plating layer or other stable metal plating layer, is added to the electrode foil of the thermally conductive substrate (such as a copper foil). By using a heat dissipation substrate plus a flexible circuit board as a surface mounted LED light source carrier, there is only thermally conductive paste between the LED light source 12 and the thermally conductive plate, and there is no insulating layer to block it. The heat generated by the LED chip can be transferred to the heat dissipation substrate, the heat dissipation effect is good, the LED reliability is good, and its service life can be extended. The temperature equalizing plate 4 is adhered to the left and right sides of the heat conducting plate 3 by the thermal paste 2. By installing the temperature equalizing plate 4 on the left and right sides of the heat conducting plate 3, the left and right sides of the LED light source board 1 can be contacted for heat dissipation, thereby preventing high-temperature heat from being dissipated from both sides due to long-term use and causing incomplete heat dissipation. At the same time, it can effectively increase the heat dissipation area and improve the heat dissipation efficiency. The lengths of the heat conducting plate 3 and the temperature equalizing plate 4 can be produced according to the length of the LED light source board 1, and can also be spliced ​​by welding and bonding. By producing the corresponding heat conducting plate 3 and the temperature equalizing plate 4 according to the specific length of the LED light source board 1, the assembly connection can be made closer and more beautiful, and the protruding edges that affect the use and the uneven cutting that affects the appearance of the product can be prevented. At the same time, the splicing arrangement can prevent that in special circumstances, such as when the LED light source board 1 is too long, its length can be extended to effectively dissipate heat and cool down.

[0027] The following is a detailed description of the working principle of the LED light source board heat dissipation device.

[0028] like Figure 1-5 As shown, when the heat dissipation device is in use, the thermal paste 2 is adhered to the LED light source board 1, the thermal conductive plate 3 is adhered to the surface of the thermal paste 2, and the temperature averaging plate 4 is installed on the left and right sides. When the LED light source board 1 is in use, the heat energy generated by its operation is transferred to the thermal conductive plate 3 and the temperature averaging plate 4 through the thermal paste 2, and the two sets of heat dissipation effectively improve the heat dissipation efficiency.

[0029] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A LED light source board heat dissipation device, comprising an LED light source board (1), characterized in that: A thermal conductive paste (2) is provided on the surface of the LED light source board (1), a thermal conductive plate (3) is provided on the surface of the thermal conductive paste (2) away from the LED light source board (1), and temperature balancing plates (4) are provided on both sides of the thermal conductive plate.

2. The LED light source board heat dissipation device according to claim 1, characterized in that: The LED light source board (1) comprises a substrate (11), a plurality of LED light sources (12) fixed on the substrate, and a protective cover (13) sealed to the substrate; The protective cover (13) comprises a protective substrate and a protective shell protruding from the protective substrate; the protective substrate and the substrate (11) are sealed and fitted; the protective shell and the substrate (11) form a sealed cavity; the LED light source (12) is located in the sealed cavity; and the sealed cavity is evacuated and then filled with an inert gas.

3. The LED light source board heat dissipation device according to claim 1, characterized in that: The thermally conductive paste (2) comprises a thermally conductive silicone composition containing aluminum particles as a thermally conductive filler.

4. The LED light source board heat dissipation device according to claim 1, characterized in that: The heat conducting plate (3) comprises a laminated plate of a metal base material, a heat conducting insulating layer and a copper foil.

5. The LED light source board heat dissipation device according to claim 4, characterized in that: The temperature equalizing plate (4) is adhered to the left and right sides of the heat conducting plate (3) by means of the heat conducting paste (2).

6. The LED light source board heat dissipation device according to claim 5, characterized in that: The lengths of the heat conducting plate (3) and the temperature balancing plate (4) can be produced according to the length of the LED light source plate (1), and can also be spliced ​​together by welding and bonding.

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