Tray structure for semiconductor equipment

Abstract

The utility model discloses a tray structure for semiconductor equipment, which comprises a three-point supporting structure, the three-point supporting structure comprises a three-point supporting base, three long rods respectively arranged on the three-point supporting base and plastic pins arranged at the tail ends of the long rods, the tray structure further comprises a wafer tray, the three-point supporting base is arranged at the bottom of the wafer tray, and the plastic pins are arranged on the three-point supporting base. The long rod and the plastic pin penetrate through the wafer tray, and the plastic pin protrudes out of the upper surface of the wafer tray; the three-point supporting base is provided with a plurality of supporting limiting pieces used for supporting the wafer tray. According to the utility model, the supporting and limiting piece is propped against the back of the wafer tray, so that the tail end of the long rod is limited by the wafer tray, and the effect that the tail end of the long rod is stable is achieved.

Description

Technical Field

[0001] The utility model relates to a tray structure for semiconductor equipment, belonging to the technical field of wafer stress testing. Background Art

[0002] Generally, the stress test function is based on the hardware of the film thickness test equipment. By adding a three-point support mechanical device to lift the wafer from the wafer tray to a certain height, the wafer is separated from the wafer surface, and then the deformation data of the wafer surface is detected to achieve the function of detecting wafer stress.

[0003] Due to the limited space near the mechanical structure of the wafer tray of the film thickness detection equipment and the high integration, the installation of this three-point support structure will use aluminum parts with a small cross-sectional area and a long length (hereinafter uniformly called long rods), and a plastic pin (a pin is a small metal column or small component fixed to an object, such as a pin, a thumbtack, a needle, etc.) is installed at the end of each long rod. The three plastic pins contact the wafer and lift the wafer; its mechanical structure is as follows Figure 1 As shown; due to the long rod structure, the end thereof is unstable. This instability will lead to instability in signal acquisition, thereby affecting the stability of the test and even causing distortion of the results. Therefore, there is an urgent need for a tray structure for semiconductor equipment that can keep the end of the long rod in a stable state to ensure the stability of the test. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the existing wafer tray will be equipped with a three-point support structure, and the three-point support structure will use a long aluminum rod with a small cross-sectional area and a long length, and a plastic pin will be installed at the end of the long rod to lift the wafer. However, the long rod mechanism often has an unstable end, which will bring about unstable signal acquisition, thereby affecting the stability of the test and even causing distorted results.

[0005] In order to solve the above technical problems, the utility model provides a tray structure for semiconductor equipment to improve the stability of the mechanical structure in a limited space.

[0006] In order to achieve the above technical objectives and the above technical effects, this application is implemented through the following technical solutions:

[0007] A tray structure for semiconductor equipment, comprising a three-point support structure, the three-point support structure comprising a three-point support base, three long rods arranged on the three-point support base, and plastic pins arranged at the ends of the long rods, and also comprising a wafer tray, the three-point support base is arranged at the bottom of the wafer tray, the long rods and the plastic pins are both passed through the wafer tray, and the top of the plastic pin protrudes from the upper surface of the wafer tray;

[0008] The three-point support base is provided with a plurality of support limiters for supporting the wafer tray.

[0009] Preferably, three support and limit members are provided corresponding to the long rod, and the support and limit members are provided on the inner side of the long rod.

[0010] Furthermore, the support limiter is detachably arranged on the three-point support base.

[0011] Furthermore, the support and limiting member is a limiting screw, and the three-point support base is provided with a plurality of threaded holes matched with the support and limiting member.

[0012] Preferably, a limiting protrusion is provided on the bottom surface of the wafer tray, and a limiting groove for embedding the three-point support base is formed on the limiting protrusion.

[0013] Furthermore, the limiting protrusion is a cylinder, and a positioning groove is coaxially opened at one end of the limiting protrusion away from the wafer tray. The three-point support base abuts against the positioning groove near the inner wall of the wafer tray, and a limiting gap is formed between the three-point support base and the bottom surface of the wafer tray.

[0014] Preferably, the supporting force of a single supporting limiter is greater than one third of the gravity of the wafer supported on the plastic pin.

[0015] The utility model provides a tray structure for semiconductor equipment, which has the following advantages:

[0016] 1. When the utility model is used, a plurality of support limiters for supporting the wafer tray are arranged on the three-point support base, so that the end of the long rod is limited by the wafer tray, thereby achieving the effect of stabilizing the end of the long rod.

[0017] 2. In the present invention, by ensuring that the supporting force of a single limiting support is greater than one-third of the gravity of the wafer supported on the plastic pin, it is possible to keep the limiting screw from coming off the back of the tray when the wafer is placed on the plastic pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the existing three-point support structure;

[0019] Figure 2 This is a schematic diagram of a three-point support structure equipped with a limited support member of the utility model;

[0020] Figure 3 This is a partial schematic diagram mainly showing the position relationship between the support limiter and the long rod of the utility model;

[0021] Figure 4The utility model mainly embodies an axial side schematic diagram of the overall structure of a tray structure for semiconductor equipment Figure 1 ;

[0022] Figure 5 The utility model mainly embodies an axial side schematic diagram of the overall structure of a tray structure for semiconductor equipment Figure 2 ;

[0023] Figure 6 This is a partial cross-sectional schematic diagram mainly showing the connection relationship between the wafer tray and the three-point support structure of the utility model;

[0024] In the figure:

[0025] 1-three-point support structure; 11-three-point support base; 12-long rod; 13-plastic pin; 2-wafer tray; 3-limiting protrusion; 4-positioning groove; 5-limiting groove; 6-limiting gap; 7-support limiter; 8-threaded hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present utility model, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technical personnel in the field without creative work are within the scope of protection of the present utility model.

[0027] Reference Figure 2-Figure 6 A tray structure for semiconductor equipment includes a three-point support structure 1 and a wafer tray 2. In this embodiment, the wafer tray 2 is circular, and the three-point support mechanism is installed on the back of the wafer tray 2 to lift and support the wafer in the wafer tray 2.

[0028] Reference Figure 2 and Figure 3 In a further embodiment, the three-point support structure 1 includes a three-point support base 11, a long rod 12 and a plastic pin 13. Three long rods 12 and three plastic pins 13 are correspondingly arranged. The three long rods 12 are respectively arranged at the ends of the three-point support base 11 and are fixed to the three-point support base 11 by welding. The plastic pin 13 is inserted and fixed on the end surface of the long rod 12 away from the three-point support base 11. In this embodiment, the insertion between the plastic pin 13 and the long rod 12 is connected by an interference fit, which ensures the stability of the plastic pin 13 during support. The long rod 12 and the plastic pin 13 are both passed through the bottom surface of the wafer tray 2, and the top of the plastic pin 13 protrudes from the upper surface of the wafer tray 2, thereby realizing the lifting support of the wafer in the wafer tray 2 through the plastic pin 13.

[0029] Reference Figure 5 and Figure 6 In a further embodiment, a limiting protrusion 3 is coaxially fixedly installed on the bottom surface of the wafer tray 2 by bolts. In this embodiment, the limiting protrusion 3 is preferably a cylinder, and a positioning groove 4 is coaxially opened at one end of the limiting protrusion 3 away from the wafer tray 2. The three-point support base 11 abuts against the inner wall of the positioning groove 4 on the side close to the wafer tray 2, thereby forming a limiting gap 6 between the three-point support base 11 and the bottom surface of the wafer tray 2. A plurality of limiting grooves 5 are also opened on the limiting protrusion 3, and the plurality of limiting grooves 5 are evenly spaced around the circumferential direction of the limiting protrusion 3. The three-point support base 11 is embedded in the limiting groove 5, and then the rotation of the three-point support base 11 in the positioning groove 4 is limited by the limiting groove 5, so that the three-point support structure 1 is more stable as a whole.

[0030] Reference Figure 4-Figure 6 A plurality of support limit members 7 for supporting the wafer tray 2 are detachably mounted on the three-point support base 11, and the support limit members 7 are located in the limit gap 6. In this embodiment, the support limit members 7 are preferably limit screws, and three support limit members 7 are correspondingly arranged with the long rod 12, and the support limit members 7 are installed on the side of the long rod 12 facing the axial direction of the limit protrusion 3. A threaded hole 8 compatible with the support limit member 7 is opened on the three-point support base 11 for installing and fixing the support limit member 7. When in use, the support limit member 7 is against the back of the wafer tray 2, so that the end of the long rod 12 is limited by the wafer tray 2, thereby achieving the effect of stabilizing the end of the long rod 12.

[0031] In a further embodiment, since the support and stopper 7 is pressed against the back of the wafer tray 2, the force of a single support and stopper 7 pressing against the back of the wafer tray 2 can be obtained by the following formula:

[0032] F>1 / 3MG

[0033] F: The force of the limit screw on the back of the wafer tray 2

[0034] M: normal wafer weight

[0035] G: Gravity acceleration

[0036] The force of the support limit member 7 against the back of the wafer tray 2 can be measured by the pressure applied by a pressure gauge to press the plastic pin 13 downward to separate the support limit member 7 from the back of the wafer tray 2; the F force is calculated in order to allow the limit screw to separate from the back of the wafer. In this process, how to control the magnitude of the force is the key. On the one hand, the magnitude of the F force is calculated so that the support limit member 7 can be separated from the back of the tray. On the other hand, it can be achieved that when the wafer is placed on the pin, the limit screw is kept from separating from the back of the tray. Therefore, when using the support limit member 7, it is necessary to ensure that the supporting force of a single support limit member 7 is greater than one-third of the gravity of the wafer supported on the plastic pin 13.

[0037] The utility model supports and limits the member 7 against the back of the wafer tray 2, so that the end of the long rod 12 is limited by the wafer tray 2, thereby achieving the effect of stabilizing the end of the long rod 12. At the same time, the pressure applied to make the support and limit member 7 separate from the back of the wafer tray 2 is measured in advance, so that the size of the force can be better controlled during the test process, and when the wafer is placed on the pin, the support and limit member 7 is kept from separating from the back of the tray, thereby ensuring the stability effect.

[0038] The above is only a preferred embodiment of the utility model, and is not any formal or substantial limitation of the utility model. It should be pointed out that ordinary technicians in this technical field can make some improvements and supplements without departing from the utility model, and these improvements and supplements should also be regarded as the protection scope of the utility model. Any technician familiar with this profession can make some changes, modifications and equivalent changes made by using the technical content disclosed above without departing from the spirit and scope of the utility model, which are all equivalent embodiments of the utility model; at the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments based on the essential technology of the utility model are still within the scope of the technical solution of the utility model.

Claims

1. A tray structure for semiconductor equipment, comprising a three-point support structure (1), the three-point support structure (1) comprising a three-point support base (11), three long rods (12) arranged on the three-point support base (11), and plastic pins (13) arranged at the ends of the long rods (12), characterized in that: It also includes a wafer tray (2), wherein the three-point support base (11) is arranged at the bottom of the wafer tray (2), the long rod (12) and the plastic pin (13) are both inserted through the wafer tray (2), and the top end of the plastic pin (13) protrudes from the upper surface of the wafer tray (2); The three-point support base (11) is provided with a plurality of support limiters (7) for supporting the wafer tray (2).

2. A tray structure for semiconductor equipment according to claim 1, characterized in that: Three of the support and limiter components (7) are arranged corresponding to the long rod (12), and the support and limiter components (7) are arranged on the inner side of the long rod (12).

3. A tray structure for semiconductor equipment according to claim 1 or 2, characterized in that: The support and limiting member (7) is detachably arranged on the three-point support base (11).

4. A tray structure for semiconductor equipment as claimed in claim 3, characterized in that: The support and limit member (7) is a limit screw, and the three-point support base (11) is provided with a plurality of threaded holes (8) that are compatible with the support and limit member (7).

5. A tray structure for semiconductor equipment as claimed in claim 1, characterized in that: The bottom surface of the wafer tray (2) is provided with a limiting protrusion (3), and the limiting protrusion (3) is provided with a limiting groove (5) in which the three-point support base (11) is embedded.

6. A tray structure for semiconductor equipment as claimed in claim 5, characterized in that: The limiting protrusion (3) is a cylinder, and a positioning groove (4) is coaxially provided at one end of the limiting protrusion (3) away from the wafer tray (2). The three-point support base (11) abuts against the positioning groove (4) near the inner wall of the wafer tray (2), and a limiting gap (6) is formed between the three-point support base (11) and the bottom surface of the wafer tray (2).

7. A tray structure for semiconductor equipment as claimed in claim 1, characterized in that: The supporting force of a single supporting limiter (7) is greater than one third of the weight of the wafer supported on the plastic pin (13).

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