Semiconductor processing equipment

Abstract

The utility model provides semiconductor processing equipment, which relates to the technical field of semiconductors and comprises a processing box and a semiconductor processing mechanism, the semiconductor processing mechanism is mounted on the inner side of the processing box, and a master control assembly is mounted in the middle of a pure oxygen supporting assembly. The hydraulic telescopic rod can carry the vacuum pump for height adjustment, so that in the using process, the semiconductor can be adjusted to the proper height only through the hydraulic telescopic rod, a better operation space is provided for subsequent oxidation operation, the vacuum chuck is sucked inwards through the vacuum pump, and therefore the semiconductor is tightly adsorbed, and the operation efficiency is improved. According to the semiconductor processing box, the situation that the position of a semiconductor deviates due to external reasons in the operation process can be effectively reduced, the overall stability is kept, the interior of the processing box can be sealed only by clamping the box body sealing plate into the sealing groove, and pollution caused by the external environment to the oxidation reaction in the processing box is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor processing device. Background Art

[0002] Semiconductor processing equipment refers to equipment used to produce, process, handle and test semiconductors during the semiconductor manufacturing process. These devices are an important part of the semiconductor industry. Their performance and efficiency directly affect the quality and output of semiconductors. Semiconductor processing equipment can be divided into front-end process equipment and back-end process equipment according to their uses and functions. Front-end process equipment is mainly responsible for wafer manufacturing, including oxidation, diffusion, photolithography, etching, thin film deposition and other equipment; back-end process equipment is mainly responsible for packaging and testing.

[0003] After searching, the patent number "CN214898337U" mentioned in the text that "the present application provides a semiconductor processing device. The semiconductor processing device includes a shell, a barrier structure and an air inlet device. The shell is provided with a first cavity and a second cavity. The barrier structure is arranged between the first cavity and the second cavity, and the barrier structure includes a first baffle and a second baffle, and the first baffle and the second baffle are spaced to form an air flow channel, and the air flow channel is used to block the heat in the second cavity from entering the first cavity; the barrier structure also includes a first opening and a second opening, and the first opening and the second opening are both connected to the air flow channel; the air inlet device is arranged on the top of the shell, and the air outlet direction of the air inlet device points to the first opening, which is used to blow air into the air flow channel; the first opening is used to allow the air flow generated by the air inlet device to enter the air flow channel. The second opening is used to discharge the airflow passing through the airflow channel. When in use, the semiconductor processing equipment of the present application uses the airflow channel formed by the first partition and the second partition to block the heat in the second cavity from entering the first cavity, thereby achieving stable temperature control of the first cavity and ensuring processing accuracy. However, during the processing of semiconductors, since the semiconductor needs to be oxidized first before subsequent operations such as engraving can be performed, and during the oxidation process, since oxidation is divided into pure oxidation and semi-oxidation, a high amount of heat will be generated inside during the pure oxidation process, thereby causing a chemical reaction between the semiconductor chip and oxygen. During this period, if the container undergoing the oxidation reaction is not monitored in real time, and the temperature is not reduced in time to reduce the oxygen content, it is easy to cause damage to the semiconductor.

[0004] Therefore, we provide a semiconductor processing device to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor processing device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the utility model provides the following technical solutions: a semiconductor processing device, comprising a processing box and a semiconductor processing mechanism, wherein the semiconductor processing mechanism is installed inside the processing box;

[0007] The semiconductor processing mechanism includes an impurity processing component, a semiconductor fixing component, a sealing component, a semiconductor heating component and a pure oxygen supporting component. The impurity processing component is arranged on the lower side of the processing box, the semiconductor fixing component is arranged in the middle of the impurity processing component, the sealing component is arranged on the front side of the processing box, the semiconductor heating components are arranged on the left and right sides of the processing box, and the pure oxygen supporting component is installed on the top of the processing box.

[0008] Preferably, the impurity processing component includes a supporting box body, a sewage recovery box, a filter screen and a sewage pump. The supporting box body is welded to the lower side of the processing box, the sewage recovery box is installed on the inner side of the supporting box body, the top of the sewage recovery box is installed with a filter screen, and the rear side of the sewage recovery box is installed with a sewage pump.

[0009] Preferably, the semiconductor fixing assembly comprises a hydraulic telescopic rod, a vacuum pump and a vacuum suction cup, a hydraulic telescopic rod is arranged in the middle of the sewage recovery tank, a vacuum pump is welded to the top of the hydraulic telescopic rod, and a vacuum suction cup is installed at the top of the vacuum pump.

[0010] Preferably, the vacuum suction cup is tightly fitted to the vacuum pump, and the vacuum suction cup is a weak-force suction cup.

[0011] Preferably, the sealing assembly includes a sealing groove and a box sealing plate, the front side of the processing box is equipped with a sealing groove, the inner groove of the sealing groove is connected to the box sealing plate, and the box sealing plate is tightly fitted to the sealing groove.

[0012] Preferably, the semiconductor heating assembly comprises a heating plate and an electric heater, a heating plate is welded on the inner side of the processing box, an electric heater is installed on the rear side of the heating plate, and the electric heater corresponds to the heating plate one by one.

[0013] Preferably, the pure oxygen support assembly includes an oxygen purity sensor, an oxygen supply pump, an oxygen supply pipe and a pure oxygen tank. The oxygen purity sensor is installed on the upper side of the processing box, the oxygen supply pump is arranged on the rear side of the oxygen purity sensor, the oxygen supply pipe is welded to the top end of the oxygen supply pump, and the pure oxygen tank is installed on the rear side of the processing box.

[0014] Preferably, a master control assembly is installed in the middle of the pure oxygen support assembly, and the master control assembly includes a processing control machine and a water mist nozzle. The processing control machine is arranged on the lower side of the oxygen supply pipe, and water mist nozzles are arranged on both sides of the oxygen purity sensor.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. Through the setting of the semiconductor processing mechanism, when it is needed, it is only necessary to generate high temperature for the heating plate through the electric heater, and the heating plate heats the processing box. Since the heating plates are heated by the left and right groups at the same time, the stability of the heating process can be guaranteed to avoid uneven heating, which will cause uneven heating of the semiconductor. The oxygen purity sensor measures the oxygen content in the processing box, and then the oxygen supply pump provides pure oxygen from the pure oxygen tank through the oxygen supply pipe according to the measurement of the oxygen purity sensor. This method can effectively reduce the occurrence of excessive or low oxygen content, thereby ensuring the smooth oxidation reaction.

[0017] 2. Through the setting of the semiconductor processing mechanism, when it is needed, the hydraulic telescopic rod can carry the vacuum pump for height adjustment. In this way, during use, the semiconductor can be adjusted to a suitable height only by the hydraulic telescopic rod, providing a better operating space for subsequent oxidation operations. The vacuum suction cup is sucked inward by the vacuum pump to allow the semiconductor to be tightly adsorbed, which can effectively reduce the position displacement of the semiconductor due to external reasons during operation and maintain overall stability. The box sealing plate can be inserted into the sealing groove to seal the processing box and reduce the pollution of the external environment to the oxidation reaction in the processing box. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall appearance structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the disassembled structure of the sealing component of the utility model;

[0020] Figure 3 This is a schematic diagram of the overall back structure of the utility model;

[0021] Figure 4 It is a schematic diagram of the overall front structure of the utility model.

[0022] Numbers in the figure: 1. Processing box; 2. Semiconductor processing mechanism; 21. Impurity treatment component; 211. Support box; 212. Sewage recovery box; 213. Filter; 214. Sewage pump; 22. Semiconductor fixing component; 221. Hydraulic telescopic rod; 222. Vacuum pump; 223. Vacuum suction cup; 23. Sealing component; 231. Sealing groove; 232. Box sealing plate; 24. Semiconductor heating component; 241. Heating plate; 242. Electric heater; 25. Pure oxygen support component; 251. Oxygen purity sensor; 252. Oxygen supply pump; 253. Oxygen supply pipe; 254. Pure oxygen tank; 3. Master control component; 31. Processing control machine; 32. Water mist nozzle. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1

[0025] See also Figure 1-4 As shown, the utility model provides a technical solution: a semiconductor processing device, comprising a processing box 1 and a semiconductor processing mechanism 2, wherein the semiconductor processing mechanism 2 is installed inside the processing box 1;

[0026] The semiconductor processing mechanism 2 includes an impurity treatment component 21, a semiconductor fixing component 22, a sealing component 23, a semiconductor heating component 24 and a pure oxygen support component 25. The impurity treatment component 21 is arranged on the lower side of the processing box 1, the semiconductor fixing component 22 is arranged in the middle of the impurity treatment component 21, the sealing component 23 is arranged on the front side of the processing box 1, the semiconductor heating components 24 are arranged on the left and right sides of the processing box 1, and the pure oxygen support component 25 is installed on the top of the processing box 1.

[0027] Furthermore, the impurity treatment component 21 includes a supporting box body 211, a sewage recovery box 212, a filter screen 213 and a sewage pump 214. The supporting box body 211 is welded to the lower side of the processing box 1, and the sewage recovery box 212 is installed on the inner side of the supporting box body 211. The top of the sewage recovery box 212 is installed with a filter screen 213, and the rear side of the sewage recovery box 212 is installed with a sewage pump 214. When it is needed, as the semiconductor is sprayed with water mist generated by the water mist nozzle 32, the cooling and dust removal process is carried out. The sewage will flow into the sewage recovery box 212 along the filter screen 213, and then be pumped out by the sewage pump 214. In this way, the semiconductor can be cooled and cleaned at the same time, which is convenient for subsequent removal and prevents deformation during manual grasping due to sudden opening.

[0028] Furthermore, the semiconductor fixing assembly 22 includes a hydraulic telescopic rod 221, a vacuum pump 222 and a vacuum suction cup 223. A hydraulic telescopic rod 221 is arranged in the middle of the sewage recovery tank 212. A vacuum pump 222 is welded to the top of the hydraulic telescopic rod 221. A vacuum suction cup 223 is installed on the top of the vacuum pump 222. When needed, the hydraulic telescopic rod 221 can carry the vacuum pump 222 for height adjustment. In this way, during use, the semiconductor can be adjusted to a suitable height by only using the hydraulic telescopic rod 221, thereby providing a better operating space for subsequent oxidation operations.

[0029] Furthermore, the vacuum suction cup 223 fits tightly with the vacuum pump 222. The vacuum suction cup 223 is a weak-force suction cup. When it is needed, the vacuum suction cup 223 only needs to be sucked inward by the vacuum pump 222, so that the semiconductor can be tightly adsorbed. This can effectively reduce the possibility of positional displacement of the semiconductor due to external reasons during operation and maintain overall stability.

[0030] Furthermore, the sealing assembly 23 includes a sealing groove 231 and a box sealing plate 232. The sealing groove 231 is installed on the front side of the processing box 1. The inner groove of the sealing groove 231 is connected to the box sealing plate 232. The box sealing plate 232 fits tightly with the sealing groove 231. When it is needed, the box sealing plate 232 only needs to be inserted into the sealing groove 231 to seal the processing box 1, thereby reducing the pollution of the external environment to the oxidation reaction in the processing box 1.

[0031] Furthermore, the semiconductor heating component 24 includes a heating plate 241 and an electric heater 242. The inner side of the processing box 1 is welded with a heating plate 241, and the rear side of the heating plate 241 is installed with an electric heater 242. The electric heater 242 corresponds to the heating plate 241 one by one. When it is needed, it is only necessary to generate high temperature for the heating plate 241 through the electric heater 242, and the heating plate 241 heats the processing box 1. Since the heating plate 241 is heated by the left and right groups at the same time, the stability of the heating process can be guaranteed to avoid uneven heating, which will cause uneven heating of the semiconductor.

[0032] Furthermore, the pure oxygen support assembly 25 includes an oxygen purity sensor 251, an oxygen supply pump 252, an oxygen supply pipe 253 and a pure oxygen tank 254. The oxygen purity sensor 251 is installed on the upper side of the processing box 1, and the oxygen supply pump 252 is arranged on the rear side of the oxygen purity sensor 251. The oxygen supply pipe 253 is welded to the top of the oxygen supply pump 252, and the pure oxygen tank 254 is installed on the rear side of the processing box 1. When it is needed, the oxygen purity sensor 251 measures the oxygen content in the processing box 1, and then the oxygen supply pump 252 provides pure oxygen from the pure oxygen tank 254 through the oxygen supply pipe 253 according to the measurement of the oxygen purity sensor 251. This method can effectively reduce the occurrence of excessively high or low oxygen content, thereby ensuring the smooth oxidation reaction.

[0033] Embodiment 2

[0034] See also Figure 1-4As shown, compared with Example 1, as another implementation of the utility model, a master control component 3 is installed in the middle of the pure oxygen support component 25, and the master control component 3 includes a processing control machine 31 and a water mist nozzle 32. The processing control machine 31 is arranged on the lower side of the oxygen supply pipe 253, and water mist nozzles 32 are arranged on the left and right sides of the oxygen purity sensor 251. After the oxidation is completed, the water mist nozzle 32 sprays fine water mist into the processing box 1, and the water mist will fall on the semiconductor, which can effectively reduce the temperature. In addition, since the water mist spray itself has a certain kinetic energy, the dust on the surface of the semiconductor can be cleaned before it is completely solidified.

[0035] Working principle: A semiconductor processing device is moved to the working position. When in use, the first step is to place the processing box 1 at the position where it needs to be used, and then place the semiconductor wafer on the vacuum suction cup 223. The vacuum pump 222 sucks the air inside the vacuum suction cup 223, and the vacuum suction cup 223 firmly adsorbs and fixes the semiconductor. Then the hydraulic telescopic rod 221 lifts the vacuum suction cup 223 to a suitable height. The second step is to insert the box sealing plate 232 into the sealing groove 231. The third step is that the oxygen purity sensor 251 senses the oxygen content inside the processing box 1, and the processing control machine 31 is used to control the oxygen purity. Perform data analysis, then control the oxygen supply pump 252 to extract an appropriate amount of oxygen from the pure oxygen tank 254 through the oxygen supply pipe 253 and input it into the processing box 1. At the same time, the electric heater 242 heats the heating plate 241, and the heating plate 241 heats and oxidizes the semiconductor. In the fourth step, after the oxidation is completed, the water mist nozzle 32 sprays fine water mist to cool and clean the semiconductor. The cleaned water passes through the filter net 213 and falls into the sewage recovery box 212 in the supporting box body 211. Finally, it is extracted by the sewage pump 214 for cleaning. In this way, the use process of a semiconductor processing equipment is completed.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor processing device, comprising a processing box (1) and a semiconductor processing mechanism (2), characterized in that: A semiconductor processing mechanism (2) is installed inside the processing box (1); The semiconductor processing mechanism (2) comprises an impurity treatment component (21), a semiconductor fixing component (22), a sealing component (23), a semiconductor heating component (24) and a pure oxygen support component (25); the impurity treatment component (21) is arranged on the lower side of the processing box (1); the semiconductor fixing component (22) is arranged in the middle of the impurity treatment component (21); the sealing component (23) is arranged on the front side of the processing box (1); the semiconductor heating components (24) are arranged on the left and right sides of the processing box (1); and the pure oxygen support component (25) is installed on the top of the processing box (1).

2. A semiconductor processing device according to claim 1, characterized in that: The impurity treatment component (21) comprises a supporting box body (211), a sewage recovery box (212), a filter screen (213) and a sewage pump (214); the supporting box body (211) is welded to the lower side of the processing box (1); the sewage recovery box (212) is installed on the inner side of the supporting box body (211); the filter screen (213) is installed on the top of the sewage recovery box (212); and the sewage pump (214) is installed on the rear side of the sewage recovery box (212).

3. A semiconductor processing device according to claim 2, characterized in that: The semiconductor fixing assembly (22) comprises a hydraulic telescopic rod (221), a vacuum pump (222) and a vacuum suction cup (223); the hydraulic telescopic rod (221) is arranged in the middle of the sewage recovery tank (212); the vacuum pump (222) is welded to the top end of the hydraulic telescopic rod (221); and the vacuum suction cup (223) is installed at the top end of the vacuum pump (222).

4. A semiconductor processing device according to claim 3, characterized in that: The vacuum suction cup (223) is tightly fitted to the vacuum pump (222), and the vacuum suction cup (223) is a weak-force suction cup.

5. The semiconductor processing equipment according to claim 1, characterized in that: The sealing assembly (23) comprises a sealing groove (231) and a box sealing plate (232); the sealing groove (231) is installed on the front side of the processing box (1); the inner groove of the sealing groove (231) is connected to the box sealing plate (232); the box sealing plate (232) and the sealing groove (231) are tightly fitted.

6. The semiconductor processing equipment according to claim 1, characterized in that: The semiconductor heating assembly (24) comprises a heating plate (241) and an electric heater (242); the inner side of the processing box (1) is welded with a heating plate (241); the rear side of the heating plate (241) is installed with an electric heater (242); and the electric heater (242) corresponds to the heating plate (241) in a one-to-one manner.

7. The semiconductor processing equipment according to claim 1, characterized in that: The pure oxygen support assembly (25) comprises an oxygen purity sensor (251), an oxygen supply pump (252), an oxygen delivery pipe (253) and a pure oxygen tank (254); the oxygen purity sensor (251) is installed on the upper side of the processing box (1); the oxygen supply pump (252) is arranged on the rear side of the oxygen purity sensor (251); the oxygen supply pipe (253) is welded to the top end of the oxygen supply pump (252); and the pure oxygen tank (254) is installed on the rear side of the processing box (1).

8. The semiconductor processing equipment according to claim 7, characterized in that: A master control assembly (3) is installed in the middle of the pure oxygen support assembly (25), and the master control assembly (3) includes a processing control machine (31) and a water mist nozzle (32). The processing control machine (31) is arranged on the lower side of the oxygen supply pipe (253), and water mist nozzles (32) are arranged on both sides of the oxygen purity sensor (251).

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