Integrated circuit feeding device

Abstract

The utility model relates to the technical field of integrated circuit feeding, in particular to an integrated circuit feeding device which comprises a device body, a tray platform is fixedly arranged on the device body, a bearing groove is formed in the center area of the tray platform, elastic buckles are arranged on the tray platform, and the elastic buckles are arranged on the two sides of the bearing groove. According to the utility model, tray input can be supported, the tray disc platform is easy to disassemble, and the tray disc platform can support wafer patch ring input after being converted with a wafer expanding machine module; the device is applied to a PCBA (Printed Circuit Board Assembly) packaging type, and the Mi28 can also realize a tray input function, so that the winding packaging requirements of various products are met, the switching process is simplified, and the operation is more convenient and quicker; the device not only supports Tray input, but also can be interchanged with a tape ring suite for use to realize automatic pick / place operation and an AOI (Automatic Optical Inspection) function, so that the dependence on manual inspection and emptying is greatly reduced, and the production efficiency and the product quality are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit loading, in particular to an integrated circuit loading device. Background Art

[0002] In the manufacturing process of integrated circuits, the loading device plays a vital role. However, for products with uneven surfaces, the traditional PR (Pick and Place) recognition system in tape ring mode often cannot accurately identify them, resulting in loading failure. Currently, the only option is to use the tray mode for loading. However, the Mi28 device only supports the tape ring mode, which limits its flexibility and efficiency in handling specific products. Utility Model Content

[0003] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit loading device.

[0004] The integrated circuit loading device comprises a device body, on which a tray platform is fixedly arranged, a bearing groove is provided in the central area of ​​the tray platform, and elastic buckles are provided on the tray platform, and the elastic buckles are arranged on both sides of the bearing groove.

[0005] As a further description of the above technical solution:

[0006] The tray platform is made of metal.

[0007] As a further description of the above technical solution:

[0008] The bearing groove is used for bearing a tray, and trays of different sizes can be placed on the bearing groove.

[0009] As a further description of the above technical solution:

[0010] The elastic buckle fixes the tray after the tray is placed to prevent the tray from loosening.

[0011] As a further description of the above technical solution:

[0012] The tray platform is detachable and can be converted with the wafer expander module, and after the conversion, it can support the wafer mounting ring input.

[0013] As a further description of the above technical solution:

[0014] The device is applied to PCBA packaging type and realizes the process conversion from tray to tape.

[0015] The utility model has the following beneficial effects:

[0016] (1) The utility model can support tray input, and the tray platform is easy to disassemble and convert with the wafer expansion machine module, and after conversion, it can support wafer bonding ring input;

[0017] (2) The utility model is applied to PCBA packaging type. The utility model enables Mi28 to also realize the function of tray input, thereby being compatible with the tape packaging requirements of various products, and simplifies the switching process, making the operation more convenient and quick;

[0018] (3) The utility model not only supports Tray input, but can also be used interchangeably with the tape ring kit to achieve automatic pick / place operation and AOI (automatic optical inspection) function, which greatly reduces the dependence on manual inspection and material placement, and improves production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of the integrated circuit loading device proposed by the utility model.

[0020] Legend:

[0021] 1. Device body; 2. Tray platform; 3. Load-bearing groove; 4. Elastic buckle. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Reference Figure 1 The utility model provides an embodiment: an integrated circuit loading device, including a device body 1, the device body 1 is the basic structure of the entire loading device, and it provides support and fixing points for other components. A tray platform 2 is fixedly arranged on the device body 1, and a bearing groove 3 is opened in the central area of ​​the tray platform 2. An elastic buckle 4 is opened on the tray platform 2, and the elastic buckle 4 is arranged on both sides of the bearing groove 3.

[0024] The tray platform 2 is made of metal and has a simple snap-on fixing design, which makes conversion easier and has a sensor check to prevent misplacing or wrong mode selection.

[0025] The device may be equipped with sensors for detecting whether the tray is correctly placed and whether the mode is correctly selected, which further reduces the possibility of human error.

[0026] The bearing groove 3 is used for bearing a tray, and trays of different sizes can be placed on the bearing groove 3 .

[0027] If the tray is loose, it will affect PR recognition and absorption. The elastic buckle 4 is designed with an elastic bayonet, which makes it easier to manually replace the tray. The elastic buckle 4 fixes the tray after the tray is placed to prevent the tray from loosening.

[0028] The tray platform 2 is detachable and can be converted with the wafer expander module. After the conversion, it can support the wafer mounting ring input.

[0029] The device is applied to PCBA packaging type, realizing the process conversion from tray to tape. The Mi28 device originally only supports the process from wafer patch ring to tape, and this device enables the Mi28 device to also realize the tray input function, thereby being compatible with the tape packaging requirements of various products, and simplifies the switching process, making the operation more convenient and quick.

[0030] Working principle: A tray platform 2 made of metal is fixed on the device body 1. This material ensures the stability and durability of the structure. A bearing groove 3 is designed in the central area of ​​the tray platform 2 for operators to place trays of different sizes.

[0031] The tray platform 2 is provided with elastic buckles 4, which are located on both sides of the bearing groove 3. After the operator places the tray into the groove, the elastic buckles 4 can fix the tray to prevent it from loosening during the loading process. Loose trays will affect PR recognition and absorption. Therefore, the elastic buckles 4 can ensure the accuracy of PR (Pick and Place) recognition and absorption;

[0032] The device may be equipped with sensors, through which it is possible to detect whether the tray is correctly placed and whether the mode is correctly selected, which further reduces the possibility of human error;

[0033] The utility model designs the tray platform 2 to be detachable, allowing for rapid conversion with the wafer expansion machine module, so that the device can support tape input when needed;

[0034] This device is mainly used for PCBA packaging types, realizing the process conversion from tray to tape, allowing the Mi28 equipment to handle a wider variety of products;

[0035] Although the trays are placed manually by the operator, the simplified design structure does not affect production efficiency even in high-density substrate units.

[0036] The device is designed with standard tray size to meet the needs of all products that need to be converted from tray to tape reel;

[0037] This device not only supports Tray input, but can also be used interchangeably with the wafer mounting ring kit to achieve automatic pick / place operation and AOI (automatic optical inspection) functions, which greatly reduces the reliance on manual inspection and material placement, and improves production efficiency and product quality.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit loading device, comprising a device body (1), characterized in that: A tray platform (2) is fixedly arranged on the device body (1), a bearing groove (3) is provided in the central area of ​​the tray platform (2), and elastic buckles (4) are provided on the tray platform (2), and the elastic buckles (4) are arranged on both sides of the bearing groove (3).

2. The integrated circuit loading device according to claim 1, characterized in that: The tray platform (2) is made of metal.

3. The integrated circuit loading device according to claim 2, characterized in that: The bearing groove (3) is used for bearing a tray, and trays of different sizes can be placed on the bearing groove (3).

4. The integrated circuit loading device according to claim 3, characterized in that: The elastic buckle (4) fixes the tray after the tray is placed to prevent the tray from loosening.

5. The integrated circuit loading device according to claim 4, characterized in that: The tray platform (2) is detachable and can be converted with the wafer expansion machine module, and after the conversion, it can support the input of the wafer patch ring.

6. The integrated circuit loading device according to claim 5, characterized in that: The device is applied to PCBA packaging type and realizes the process conversion from tray to tape.

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