Electronic component, working assembly and electronic equipment

Abstract

The utility model provides an electronic component, a working assembly and electronic equipment, the electronic component comprises a substrate, a chip module and a first rigid assembly, the chip module and the first rigid assembly are arranged on the same side of the substrate, and the first rigid assembly is of an annular structure surrounding the chip module. A first heat dissipation channel is formed between the first rigid assembly and the chip module, and the cross section of the first heat dissipation channel is at least partially increased in the heat dissipation direction. According to the technical scheme, the heat dissipation performance of the electronic component can be improved while warping is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit heat dissipation, and in particular to an electronic component, a working assembly and an electronic device. Background Art

[0002] With the development of artificial intelligence and big data technology, the computing power requirements for electronic devices are getting higher and higher. In order to meet the computing power requirements, multiple chips are usually arranged for parallel computing. However, as the number of chips increases, the demand for high thermal conductivity and high heat dissipation of the heat sink becomes greater. How to improve the heat dissipation capacity of the heat sink is a technical problem that needs to be solved urgently. Summary of the invention

[0003] The embodiments of the present application provide an electronic component, a working assembly and an electronic device to solve or alleviate one or more technical problems in the prior art.

[0004] An embodiment of the present application provides an electronic component, including a substrate, a chip module and a first rigid component arranged on the same side of the substrate, wherein the first rigid component is an annular structure surrounding the chip module, and a first heat dissipation channel is formed between the first rigid component and the chip module, and the cross-section of the first heat dissipation channel is at least partially increased along the heat dissipation direction.

[0005] In one implementation, the heat dissipation direction is a direction in which the chip module is away from the substrate.

[0006] In one embodiment, the first rigid component includes an inner wall facing the chip module, and a distance between the inner wall and the chip module at least partially increases along the heat dissipation direction.

[0007] In one embodiment, the inner wall includes a bottom connected to the substrate and a top facing away from the substrate, and the distance between the top of the inner wall and the chip module is greater than the distance between the bottom of the inner wall and the chip module.

[0008] In one embodiment, the distance between the inner wall and the chip module gradually increases along a direction away from the heat dissipation direction.

[0009] In one embodiment, the first rigid component includes an inner wall facing the chip module, and along the heat dissipation direction, the inner wall has an increased diameter at least in part.

[0010] In one embodiment, the inner wall includes a bottom connected to the substrate and a top facing away from the substrate, and a diameter of the top of the inner wall is larger than a diameter of the bottom of the inner wall.

[0011] In one embodiment, along the heat dissipation direction, the diameter of the inner wall gradually increases.

[0012] In one embodiment, the outer contour of the chip module does not change in size in the direction.

[0013] In one embodiment, the first rigid component includes an inner wall facing the chip module, the inner wall includes a top facing away from the substrate, and the top of the inner wall is an arc-shaped surface protruding away from the substrate.

[0014] In one embodiment, the first rigid component includes an inner wall facing the chip module and an outer wall facing away from the chip module, and in a direction parallel to the substrate, shapes of the outer wall and the inner wall of the first rigid component both match the outer contour of the chip module.

[0015] In one embodiment, in a direction parallel to the substrate, the outer contour of the chip module is a rectangle.

[0016] An embodiment of the present application provides a working assembly, including: a printed circuit board; and the electronic components described in any implementation manner of the embodiment of the present application, wherein the electronic components are arranged on the printed circuit board.

[0017] In one embodiment, the working assembly further includes a second rigid assembly, which is disposed on the same side of the printed circuit board as the electronic component, and the second rigid assembly is an annular structure surrounding the electronic component.

[0018] In one embodiment, a heat dissipation medium layer is provided on the surface of the second rigid component and / or the electronic component.

[0019] In one embodiment, a second heat dissipation channel is formed between the second rigid component and the electronic component, and a cross section of the second heat dissipation channel is at least partially increased along a heat dissipation direction.

[0020] An embodiment of the present application provides a working assembly, including a printed circuit board, and electronic components and a second rigid assembly disposed on the same side of the printed circuit board, wherein the second rigid assembly is an annular structure surrounding the electronic components.

[0021] In one embodiment, a second heat dissipation channel is formed between the second rigid component and the electronic component, and a cross section of the second heat dissipation channel is at least partially increased along a heat dissipation direction.

[0022] An electronic device according to an embodiment of the present application includes: a working component as described in any one of the embodiments of the present application, the working component including a printed circuit board and electronic components arranged on the printed circuit; a heat sink, the heat sink being arranged in a direction where the electronic components are away from the printed circuit board.

[0023] The technical solution of the embodiment of the present application can prevent warping of electronic components by setting a first annular rigid component on the substrate, and by forming a first heat dissipation channel between the first rigid component and the chip module so that the cross-section of at least a part of the area is increased along the heat dissipation direction, thereby improving the heat dissipation effect of the electronic components and reducing the power consumption of the electronic components.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0026] Figure 1 A schematic diagram showing the structure of working components in the related art;

[0027] Figure 2A and Figure 2B A schematic diagram showing the structure of working components in the related art;

[0028] Figure 3A and Figure 3B A schematic diagram showing the structure of an electronic component in one implementation of an embodiment of the present application is shown;

[0029] Figure 3C A schematic diagram showing the structure of an electronic component in one implementation of an embodiment of the present application is shown;

[0030] Figure 4A and Figure 4B A schematic diagram showing the structure of an electronic component in one implementation of an embodiment of the present application is shown;

[0031] Figure 5A and Figure 5B A schematic diagram showing the structure of an electronic component in one implementation of an embodiment of the present application is shown;

[0032] Figure 6 A schematic diagram showing the structure of an electronic component in one implementation of an embodiment of the present application is shown;

[0033] Figure 7 A schematic diagram showing the structure of a working component in one implementation of an embodiment of the present application;

[0034] Fig. 8A and Figure 8B A schematic diagram showing the structure of a working component in one implementation of an embodiment of the present application;

[0035] Fig.9A and Fig. 9B A schematic diagram showing the structure of working components in one implementation of an embodiment of the present application is shown.

[0036] Description of reference numerals:

[0037] 10: chip package; 11: substrate; 12: solder ball; 20: PCB board; 21: solder ball;

[0038] 30: chip package; 31: substrate; 33: chip module; 34: rigid ring;

[0039] 100: electronic components;

[0040] 110: substrate; 120: chip module; 130: first rigid component;

[0041] 150: first heat dissipation channel; 131: inner wall of the first rigid component;

[0042] 132: outer wall of the first rigid component;

[0043] 200: electronic components; 133: curved surface;

[0044] 1000: working component;

[0045] 1001: PCB board; 1002: electronic components; 1003: solder balls;

[0046] 1400: second rigid component; 1005: second heat dissipation channel;

[0047] 2000: Working components;

[0048] 2400: second rigid component; 2005: second heat dissipation channel. DETAILED DESCRIPTION

[0049] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0050] Application Scenario

[0051] With the development of semiconductor integrated circuit technology, the integration of chips is getting higher and higher, and advanced packaging processes are also gradually developing, such as Package on Package (POP) packaging process and Chip-on-Wafer-on-Substrate (CoWoS) packaging process. In advanced packaging processes, chip stacking packaging methods are often used, including vertical stacking and horizontal stacking, which usually lead to an increase in chip size. In addition, the application of chip flip-chip technology and the development of ultra-thin chips may cause chip warping or printed circuit board (PCB) warping.

[0052] For example, Figure 1 As shown, the chip package 10 includes a substrate 11 and a chip module (not shown) connected to the substrate 11, wherein the solder balls (or solder bumps) 12 on the substrate 11 are electrically connected to the solder balls 21 on the PCB board 20. Due to the warping of the chip package 10, some solder balls 12 and solder balls 21 will be poorly welded, forming an open circuit. It is understandable that if the PCB board 20 is warped, it will also cause the problem of poor welding. Therefore, if the chip warps or the PCB board warps, it may cause poor connection, affecting the reliability and yield of the product.

[0053] In one implementation, Figure 2A As shown, the chip package 30 includes a substrate 31 and a chip module 33 connected to the substrate 31 . A rigid ring 34 is provided around the periphery of the chip module 33 , so as to prevent the chip package 30 from warping. Figure 2A is a cross-sectional view of the chip package 30, Figure 2B is a top view of the chip package 30, as shown Figure 2B As shown, the rigid ring 34 may be configured to be rectangular so as to match the outer contour of the chip module 33 for ease of processing and production.

[0054] However, with the development of advanced packaging, the chip module 30 can be configured as a stack of multiple dies to achieve highly integrated and high-performance chip packaging, which means that the chip package 30 may bring high power and high power consumption, thereby emitting more heat. A fan is usually set above the chip package 30, but due to the presence of the rigid ring 34, differential eddy currents may be generated at the periphery of the chip module 30, resulting in the heat in the rigid ring 34 being unable to be quickly transferred to the outside of the rigid ring 34, thereby causing the problem of poor heat dissipation of the chip package 30.

[0055] The embodiment of the present application aims to provide an electronic component, by arranging a first rigid component on a substrate and configuring it into a ring structure surrounding a chip module, thereby preventing the electronic component from warping, and by forming a first heat dissipation channel between the first rigid component and the chip module so that the cross-section of at least a part of the area is increased along the heat dissipation direction, thereby reducing eddy currents in the first heat dissipation channel, and allowing the heat in the first heat dissipation channel to be quickly transferred to the periphery of the first rigid component, thereby improving the heat dissipation performance of the electronic component while avoiding warping and reducing the power consumption of the electronic component.

[0056] Furthermore, an embodiment of the present application can also provide a working component, including a PCB board and electronic components arranged on the PCB board. By setting a second rigid component on the PCB board and configuring the second rigid component as a ring structure surrounding the electronic components, warping of the PCB board can be avoided.

[0057] Exemplarily, the electronic components provided in the embodiments of the present application can be used in high-performance computing chips, sensor chips, micro-electro-mechanical systems (MEMS), optical communication chips, etc. It should be noted that the above application scenarios or application examples provided in the embodiments of the present application are for ease of understanding, and the embodiments of the present application do not specifically limit the application of electronic components, working components, and electronic devices.

[0058] The following is a detailed description of the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems with specific embodiments. The listed specific embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0059] Embodiment 1

[0060] Figure 3A A cross-sectional view of an electronic component 100 according to an embodiment of the present application is shown. Figure 3B FIG. 1 is a top view of an electronic component 100 according to an embodiment of the present application. Figure 3A and Figure 3B As shown, the electronic component 100 includes a substrate 110 , a chip module 120 and a first rigid component 130 , and the chip module 120 and the first rigid component 130 are disposed on the same side of the substrate 110 .

[0061] In one example, the substrate 110 can be used as a packaging substrate, and its materials include organic substrates, ceramic substrates, sapphire substrates, etc. Different applications and requirements may select different types of materials, which is not limited in the embodiments of the present application. The chip module 120 may include one or more bare chips, one or more bare chip modules, or a combination of bare chips and bare chip modules, which is not limited in the embodiments of the present application. Among them, the bare chip module may include multiple vertically stacked or horizontally stacked bare chips.

[0062] In another example, the chip module 120 can be packaged separately as a package body and then connected to the substrate 110, which is not limited in this embodiment of the present application.

[0063] It should be noted that in the embodiments of the present application, a chip is a small silicon wafer (or other semiconductor materials) on which multiple electronic components (such as transistors, capacitors, resistors, etc.) and circuit connections are integrated. These components and connections form a complex circuit that can perform various functions, thereby achieving tasks such as computing, storage, control, and signal processing. That is, a chip is a highly integrated electronic device. A die refers to an unpackaged, separate unit. In the chip manufacturing process, many identical dies are usually manufactured on a silicon wafer (or other materials), and each die contains a specific circuit design and function. After manufacturing, the dies will be separated and can be further packaged into chips or used for other applications.

[0064] The connection method between the chip module 120 and the substrate 110 is not limited in the embodiment of the present application. For example, a connection method of a controlled collapse chip connection bump (Controlled Collapse Chip Connection, referred to as C4 bump or C4 bump) can be adopted, or a connection method of an interposer can be adopted. Among them, the C4 bump is made by a bumping process, and the core process flow is metal deposition, and the most common metal deposition steps include the deposition of the underbump metallization layer (UBM) and the deposition of the bump itself. The deposition of the underbump metallization layer (UBM) is usually achieved by sputtering, electroless plating, plating, etc.; the deposition of the bump itself is usually achieved by electroplating, ball planting, and printing. There are many types of interposers, such as a redistribution layer (RDL) interposer, a bridge die interposer, or a silicon interposer, etc., which can be selected according to actual needs, and the embodiment of the present application does not limit this.

[0065] The height of the chip module 120 and the first rigid component 130 in the X direction, the thickness in the Y direction, and the spacing between the chip module 120 and the first rigid component 130 in the Y direction are not specifically limited in the present embodiment. For example, the height of the chip module 120 in the X direction is less than the height of the first rigid component 130 in the X direction. Figure 3A Alternatively, the height of the chip module 120 in the X direction is greater than the height of the first rigid component 130 in the X direction, as shown Figure 3C shown.

[0066] The material of the first rigid component 130 can be carbon tool steel and alloy tool steel with high hardness. The first rigid component 130 and the substrate 110 can be fixed by welding or gluing, which is not limited in the embodiment of the present application.

[0067] In the embodiment of the present application, by providing the first rigid component 130, the strength of the substrate 110 can be enhanced, thereby preventing the substrate 110 and the chip module 120 from warping. The first rigid component 130 is an annular structure surrounding the chip module 120, which can fully protect the chip module 120 and further prevent the substrate 110 and the chip module 120 from warping.

[0068] Furthermore, the first rigid component 130 is formed into a ring structure surrounding the chip module 120 , and a first heat dissipation channel 150 is formed between the first rigid component 130 and the chip module 120 .

[0069] In one example, the electronic component 100 may adopt an air-cooling method, and the first heat dissipation channel 150 may be used to provide a heat dissipation duct for air circulation, and the heat dissipation direction in the first heat dissipation channel 150 is the wind direction of the heat dissipation duct.

[0070] In another example, the electronic component 100 may adopt a liquid cooling method, and the first heat dissipation channel 150 may be used to provide a liquid cooling channel for the circulation of cooling liquid, and the heat dissipation direction in the first heat dissipation channel 150 is the flow direction of the liquid cooling channel.

[0071] It should be noted that the embodiment of the present application does not limit the heat dissipation method of the electronic component 100, the heat dissipation medium in the first heat dissipation channel 150, and the heat dissipation direction. For the sake of convenience, the embodiment of the present application takes the air cooling heat dissipation method as an example. Figure 3B The substrate 110 can be seen in the top view of the electronic component 300 shown.

[0072] In the embodiment of the present application, the cross section of at least a portion of the first heat dissipation channel 150 increases along the heat dissipation direction. The cross section of the first heat dissipation channel 150 is parallel to the substrate 110. For example, Figure 3A As shown, the cross-sectional direction is the Y direction, and the heat dissipation direction is the X direction, that is, the direction in which the chip 120 is away from the substrate 110. Figure 3B As shown, at the connection between the first rigid component 130 and the substrate 110 , a cross section of the first heat dissipation channel 150 is shown as a visible area of ​​the substrate 110 .

[0073] Among them, "the cross-section of at least part of the area of ​​the first heat dissipation channel 150 increases along the heat dissipation direction" can be understood as: among the multiple areas of the first heat dissipation channel 150, there are some areas whose cross-sectional area gradually increases along the heat dissipation direction, and there are also some areas whose cross-sectional area does not gradually increase along the heat dissipation direction. Alternatively, among the multiple areas of the first heat dissipation channel 150, there are a first area and a second area, wherein the first area is located upstream in the heat dissipation direction, and the second area is located downstream in the heat dissipation direction, and the first area and the second area together constitute the entire area of ​​the first heat dissipation channel 150, and may also together constitute part of the area of ​​the first heat dissipation channel 150, and further, the cross-sectional area of ​​the first area is smaller than the cross-sectional area of ​​the second area. Alternatively, the cross-sectional area of ​​each area of ​​the first heat dissipation channel 150 gradually increases along the heat dissipation direction.

[0074] It can be understood that, since the first heat dissipation channel 150 can be a groove-shaped groove surrounded by the substrate 110, the inner wall 131 of the first rigid component and the outside of the chip module 120, the factors affecting the cross-sectional area of ​​the first heat dissipation channel 150 mainly include the shape of the inner wall 131, the outer shape of the chip module 120 or the distance between the inner wall 131 and the chip module 120. In other words, by configuring the shape of the inner wall 131, the outer shape of the chip module 120 and / or the distance between the inner wall 131 and the chip module 120, the cross-sectional area of ​​the first heat dissipation channel 150 can be adjusted.

[0075] In the embodiment of the present application, by setting the cross-section of at least a portion of the first heat dissipation channel to increase along the heat dissipation direction, it is possible to prevent the electronic components from warping while reducing the risk of eddy currents forming in the heat dissipation medium (such as air or coolant) in the first heat dissipation channel, thereby improving the heat dissipation effect of the first heat dissipation channel on the chip module and reducing the power consumption of the chip module.

[0076] In one embodiment, the first rigid component 130 includes an inner wall 131 facing the chip module 120 and an outer wall 132 facing away from the chip module 120. In a direction parallel to the substrate 110, the shape of the outer wall 132 and the shape of the inner wall 131 of the first rigid component both match the outer contour of the chip module 120. For example, the outer contour of the chip module 120 is generally rectangular, so the shapes of the outer wall 132 and the inner wall 131 are also rectangular. Figure 3A and Figure 3BAs shown, the risk of eddy currents being formed in the heat dissipation medium in the first heat dissipation channel can be further reduced.

[0077] It should be noted that, in the embodiment of the present application, there may be a situation where the shape of the outer wall 132 of the first rigid component does not match the outer contour shape of the chip module 120. For example, in order to avoid electronic components located outside the outer wall 132 of the first rigid component, some grooves may be provided on the outer wall 132 of the first rigid component. In the embodiment of the present application, there may also be a situation where the shape of the inner wall 131 of the first rigid component does not match the outer contour shape of the chip module 120. For example, in order to avoid electronic components located between the inner wall 131 of the first rigid component and the chip module 120, some grooves may be provided on the inner wall 131 of the first rigid component.

[0078] In one embodiment, Figure 4A As shown, the first rigid component 130 includes an inner wall 131 facing the chip module 120, and the distance between the inner wall 131 and at least a portion of the chip module 120 (hereinafter referred to as the distance L) increases along the heat dissipation direction. The line segment to which the distance between the inner wall 131 and the chip module 120 belongs is parallel to the substrate 110.

[0079] For example: among the multiple regions of the first heat dissipation channel 150, there are some regions whose spacing L gradually increases along the heat dissipation direction, and there are also some regions whose spacing L does not gradually increase along the heat dissipation direction; or, among the multiple regions of the first heat dissipation channel 150, there are a first region and a second region, wherein the first region is located upstream in the heat dissipation direction, and the second region is located downstream in the heat dissipation direction, and the first region and the second region together constitute the entire region of the first heat dissipation channel 150, and may also together constitute a partial region of the first heat dissipation channel 150, and further, the spacing L of the first region is smaller than the spacing L of the second region; or, the spacing L of each region of the first heat dissipation channel 150 gradually increases along the heat dissipation direction.

[0080] In one example, the inner wall 131 includes a bottom connected to the substrate 110 and a top facing away from the substrate 110, and a distance L1 between the top of the inner wall 131 and the chip module 120 is greater than a distance L2 between the bottom of the inner wall 131 and the chip module 120. Figure 4B shown.

[0081] In another example, the distance L between the inner wall 131 and the chip module 120 gradually increases along the heat dissipation direction X. Figure 4A and Figure 4BAs shown. Among them, "gradually increase" should be understood as the changing trend of the spacing L, that is, along the heat dissipation direction X, the spacing L does not increase one by one, and the spacing L of several areas of the first heat dissipation channel is allowed to decrease along the heat dissipation direction X, as long as the spacing L along the heat dissipation direction X is generally increasing. For example: in order to avoid or set up other components, the spacing L of several areas of the first heat dissipation channel can be reduced along the heat dissipation direction X.

[0082] In an embodiment of the present application, by increasing the distance between the inner wall of the first rigid component and at least a portion of the chip module in the heat dissipation direction, it is possible to prevent the electronic components from warping while reducing the risk of eddy currents forming in the heat dissipation medium (such as air or coolant) in the first heat dissipation channel, thereby improving the heat dissipation effect of the first heat dissipation channel on the chip module.

[0083] In one embodiment, Figure 5A As shown, the first rigid component 130 includes an inner wall 131 facing the chip module 120 , and along the heat dissipation direction X, the diameter D of at least a portion of the inner wall 131 increases.

[0084] For example, the diameter D of some areas of the inner wall 131 gradually increases along the heat dissipation direction, and the diameter D of some areas of the inner wall 131 does not gradually increase. Alternatively, among the multiple areas of the first heat dissipation channel 150, there are a first area and a second area, wherein the first area is located upstream in the heat dissipation direction, and the second area is located downstream in the heat dissipation direction. The first area and the second area together constitute the entire area of ​​the first heat dissipation channel 150, and may also together constitute a part of the first heat dissipation channel 150. Further, the diameter D of the inner wall 131 in the first area is smaller than the diameter D of the inner wall 131 in the second area. Alternatively, the diameter D of each area of ​​the inner wall 131 gradually increases along the heat dissipation direction.

[0085] In this embodiment, the outer contour of the chip module 120 does not change in size in the X direction, and therefore, the diameter D of the inner wall 131 is proportional to the cross-sectional area of ​​the first heat dissipation channel 150 .

[0086] In one example, the inner wall 131 includes a bottom connected to the substrate 110 and a top away from the substrate 110, and the top diameter D1 of the inner wall 131 is larger than the bottom diameter D2 of the inner wall 131. Figure 5B shown.

[0087] In another example, the diameter D of the inner wall 131 gradually increases along the heat dissipation direction, such as Figure 5AAs shown. Among them, "gradually increase" should be understood as the change trend of the diameter D, that is, along the heat dissipation direction X, the diameter D does not increase one by one, and the diameter D of several places of the inner wall 131 is allowed to decrease along the heat dissipation direction X, as long as the diameter D shows an increasing trend along the heat dissipation direction X as a whole. For example: in order to avoid or set up other components, the diameter D of several areas of the inner wall 131 can be reduced along the heat dissipation direction X.

[0088] Exemplarily, in order to facilitate processing design, in a direction parallel to the substrate 110 , the diameters D of the inner walls 131 at the same plane are equal.

[0089] In an embodiment of the present application, by setting the inner wall diameter of the first rigid component to at least partially increase along the heat dissipation direction, it is possible to prevent the electronic components from warping while reducing the risk of eddy currents forming in the heat dissipation medium (such as air or coolant) in the first heat dissipation channel, thereby improving the heat dissipation effect of the first heat dissipation channel on the chip module.

[0090] Embodiment 2

[0091] Figure 6 FIG. 2 is a cross-sectional view of an electronic component 200 according to an embodiment of the present application. Figure 6 As shown, the electronic component 200 includes a substrate 110, a chip module 120 and a first rigid component 130, and the chip module 120 and the first rigid component 230 are arranged on the same side of the substrate 110. Different from the first embodiment, in this embodiment, the inner wall 131 of the first rigid component 130 includes a top facing away from the substrate 110, and the top of the inner wall 131 is a curved surface 133 protruding away from the substrate 110.

[0092] The arc surface 133 can further increase the inner wall diameter D (eg Figure 5A ) gradually increases along the heat dissipation direction, thereby further reducing the risk of eddy currents forming in the heat dissipation medium in the first heat dissipation channel, improving the heat dissipation effect of the chip module, and reducing the power consumption of the chip module.

[0093] Embodiment 3

[0094] Figure 7 A cross-sectional view of a working assembly 1000 according to an embodiment of the present application is shown. Figure 7 As shown, the working assembly 1000 includes a PCB board 1001 and electronic components 1002 , and the electronic components 1002 are arranged on the PCB board 1001 .

[0095] Electronic component 1002 can be any electronic component described in the above-mentioned application scenarios or embodiments, that is, electronic component 1002 can be electronic component 100, or electronic component 200, or other types of electronic components. The embodiments of the present application do not specifically limit the type and quantity of electronic component 1002.

[0096] The connection method between the electronic component 1002 and the PCB board 1001 is not limited in the embodiment of the present application. For example, the electronic component 1002 is connected to the PCB board 1001 through the solder ball 1003.

[0097] In one embodiment, Fig. 8A and Figure 8B As shown, the working assembly 1000 of the embodiment of the present application may further include a second rigid assembly 1400 , and the second rigid assembly 1400 and the electronic component 1002 are disposed on the same side of the printed circuit board.

[0098] The material of the second rigid component 1400 can be selected from carbon tool steel and alloy tool steel with high hardness, and the second rigid component 1400 and the PCB board 1001 can be fixed by welding or gluing, etc., which is not limited in the embodiment of the present application. Based on the shape, rigidity and setting method of the second rigid component 1400, the strength of the PCB board 1001 can be enhanced, thereby preventing the PCB board 1001 and the electronic components 1002 from warping.

[0099] The second rigid component 1400 is an annular structure surrounding the electronic component 1002, so that a second heat dissipation channel 1005 can be formed between the second rigid component 1400 and the electronic component 1002. In one example, the electronic component 100 can adopt an air-cooled heat dissipation method, and the second heat dissipation channel 1005 can be used to provide a heat dissipation duct for air circulation, and the heat dissipation direction in the second heat dissipation channel 1005 is the wind direction of the heat dissipation duct. In another example, the electronic component 100 can adopt a liquid-cooled heat dissipation method, and the second heat dissipation channel 1005 can be used to provide a liquid-cooled channel for coolant circulation, and the heat dissipation direction in the second heat dissipation channel 1005 is the flow direction of the liquid-cooled channel. It should be noted that the embodiment of the present application does not limit the heat dissipation method of the electronic component 1002, the heat dissipation medium in the second heat dissipation channel 1005, and the heat dissipation direction.

[0100] In one embodiment, a heat dissipation medium layer is provided on the surface of the second rigid component 1400 and / or the electronic component 1002. The material of the heat dissipation medium layer may be silicone grease or silicone gel, that is, the heat dissipation medium layer may be a silicone grease layer or a silicone gel layer, which is coated or attached to the surface of the second rigid component 1400 and / or the electronic component 1002, thereby further improving the heat dissipation effect.

[0101] Fig.9A A cross-sectional view of a working component 2000 according to an embodiment of the present application is shown. Fig. 9B FIG. 2 is a top view of a working assembly 2000 according to an embodiment of the present application. Fig.9A and Fig. 9B As shown, a second heat dissipation channel 2005 is formed between the second rigid component 2400 and the electronic component 1002. The cross section of the second heat dissipation channel 2005 is parallel to the PCB board 1001. The cross section of at least a part of the second heat dissipation channel 1001 is at least partially enlarged along the heat dissipation direction X.

[0102] Among them, similar to the first heat dissipation channel 150 of the first embodiment, "the cross section of at least part of the area of ​​the second heat dissipation channel 1001 is at least partially increased along the heat dissipation direction" can be understood as: among the multiple areas of the second heat dissipation channel 2005, there are some areas whose cross-sectional area gradually increases along the heat dissipation direction, and there are also some areas whose cross-sectional area does not gradually increase along the heat dissipation direction. Alternatively, among the multiple areas of the second heat dissipation channel 2005, there are a first area and a second area, wherein the first area is located upstream in the heat dissipation direction, and the second area is located downstream in the heat dissipation direction, and the first area and the second area together constitute the entire area of ​​the second heat dissipation channel 2005, and may also together constitute a part of the area of ​​the second heat dissipation channel 2005, and further, the cross-sectional area of ​​the first area is smaller than the cross-sectional area of ​​the second area. Alternatively, the cross-sectional area of ​​each area of ​​the second heat dissipation channel 2005 gradually increases along the heat dissipation direction.

[0103] Since the second heat dissipation channel 2005 may be in the shape of a groove surrounded by the PCB board 1001, the inner wall of the first rigid component and the outside of the electronic component 1002, the factors affecting the cross-sectional area of ​​the second heat dissipation channel 2005 mainly include the shape of the inner wall, the outer shape of the electronic component 1002 or the distance between the inner wall and the electronic component 1002. In other words, by configuring the shape of the inner wall, the outer shape of the electronic component 1002 and / or the distance between the inner wall and the electronic component 1002, the cross-sectional area of ​​the second heat dissipation channel 2005 can be adjusted.

[0104] In the embodiment of the present application, by setting the cross-section of the second heat dissipation channel to at least partially increase along the heat dissipation direction, it is possible to prevent the PCB board from warping while reducing the risk of eddy currents forming in the heat dissipation medium (such as air or coolant) in the second heat dissipation channel, thereby improving the heat dissipation effect of the second heat dissipation channel on electronic components.

[0105] Exemplarily, the second rigid component 2400 includes an inner wall of the second rigid component 2400 facing the electronic component 1002 and an outer wall away from the electronic component 1002. In a direction parallel to the PCB board 1001, the outer wall shape and the inner wall shape of the second rigid component 2400 both match the outer contour shape of the electronic component 1002. For example, the outer contour of the chip module 1002 is usually rectangular, so the shapes of the outer wall and the inner wall of the second rigid component 2400 are also rectangular. As a result, the risk of eddy currents being formed by the heat dissipation medium in the second heat dissipation channel can be further reduced, and the complexity of the production process can be reduced.

[0106] It should be noted that, in the embodiment of the present application, there may be a situation where the shape of the outer wall of the second rigid component 2400 does not match the outer contour shape of the electronic component 1002. For example, in order to avoid the electronic components located outside the outer wall of the second rigid component 2400, some grooves may be provided on the outer wall of the second rigid component 2400. In the embodiment of the present application, there may also be a situation where the shape of the inner wall of the second rigid component 2400 does not match the outer contour shape of the electronic component 1002. For example, in order to avoid the electronic components located between the inner wall of the second rigid component 2400 and the electronic component 1002, some grooves may be provided on the inner wall of the second rigid component 2400.

[0107] In one embodiment, the distance between the inner wall of the second rigid component 2400 and the electronic component 1002 in at least a portion of the area increases along the heat dissipation direction. The line segment to which the distance between the inner wall of the second rigid component 2400 and the electronic component 1002 belongs is parallel to the PCB board 1001.

[0108] For example, when the electronic component includes a first rigid component, the distance between the inner wall of the second rigid component 2400 and the electronic component 1002 may be the distance between the outer wall of the first rigid component and the inner wall of the second rigid component.

[0109] In one example, the inner wall of the second rigid component 2400 includes a bottom connected to the PCB board 1001 and a top facing away from the PCB board 1001, and the distance between the top of the inner wall of the second rigid component 2400 and the electronic component 1002 is greater than the distance between the bottom of the inner wall of the second rigid component 2400 and the electronic component 1002.

[0110] In another example, the distance between the inner wall of the second rigid component 2400 and the electronic component 1002 gradually increases along the heat dissipation direction X. Here, “gradually increases” should be understood as a changing trend of the distance component increasing.

[0111] In one embodiment, the inner wall diameter of at least a portion of the second rigid component 2400 increases along the heat dissipation direction X. In this embodiment, the outer contour of the electronic component 1002 does not change in size in the X direction, so the inner wall diameter of the second rigid component 2400 is proportional to the cross-sectional area of ​​the second heat dissipation channel 2005.

[0112] In one example, the inner wall of the second rigid component 2400 includes a bottom connected to the PCB board 1001 and a top facing away from the PCB board 1001 , and the top diameter of the inner wall of the second rigid component 2400 is larger than the bottom diameter of the inner wall of the second rigid component 2400 .

[0113] In another example, the diameter of the inner wall of the second rigid component 2400 gradually increases along the heat dissipation direction. Here, "gradually increase" should be understood as a trend of gradually increasing diameter.

[0114] For example, in order to facilitate processing design, in a direction parallel to the PCB board 1001 , the inner walls of the second rigid component 2400 have the same diameter at the same plane.

[0115] Exemplarily, the top of the inner wall of the second rigid component 2400 is an arc-shaped surface protruding away from the PCB board 1001, which further makes the inner wall diameter of the second rigid component 2400 gradually increase along the heat dissipation direction, thereby further reducing the risk of eddy currents forming in the heat dissipation medium in the second heat dissipation channel, improving the heat dissipation effect of electronic components, and reducing the power consumption of electronic components.

[0116] The embodiment of the present application provides an electronic device, including a working component and a radiator. The working component may be the working component in any of the above embodiments, and the radiator is arranged in a direction where the electronic components are away from the PCB board. For example, the radiator may be a fan, that is, the electronic components are cooled by air.

[0117] The other structures of the heat sink or the electronic device or the working assembly or the electronic components in the above-mentioned embodiments may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0118] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0119] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0120] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0121] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0122] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself.

[0123] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic component, characterized in that: It includes a substrate, a chip module and a first rigid component arranged on the same side of the substrate, wherein the first rigid component is an annular structure surrounding the chip module, a first heat dissipation channel is formed between the first rigid component and the chip module, and the cross-section of at least a part of the first heat dissipation channel increases along the heat dissipation direction.

2. The electronic component according to claim 1, characterized in that: The heat dissipation direction is the direction in which the chip module is away from the substrate.

3. The electronic component according to claim 1, characterized in that: The first rigid component includes an inner wall facing the chip module, the inner wall includes a bottom connected to the substrate and a top facing away from the substrate, and the distance between the top of the inner wall and the chip module is greater than the distance between the bottom of the inner wall and the chip module.

4. The electronic component according to claim 1, characterized in that: The first rigid component includes an inner wall facing the chip module, the inner wall includes a bottom connected to the substrate and a top facing away from the substrate, and the distance between the inner wall and the chip module gradually increases along the heat dissipation direction.

5. The electronic component according to claim 1, characterized in that: The first rigid component comprises an inner wall facing the chip module, and a diameter of at least a portion of the inner wall increases along the heat dissipation direction.

6. The electronic component according to claim 5, characterized in that: The inner wall comprises a bottom connected to the base plate and a top facing away from the base plate, and a diameter of the top of the inner wall is larger than a diameter of the bottom of the inner wall.

7. The electronic component according to claim 5, characterized in that: The diameter of the inner wall gradually increases along the heat dissipation direction.

8. The electronic component according to any one of claims 5 to 7, characterized in that: The outer contour of the chip module remains unchanged in the heat dissipation direction.

9. The electronic component according to claim 1, characterized in that: The first rigid component includes an inner wall facing the chip module, the inner wall includes a top facing away from the substrate, and the top of the inner wall is an arc-shaped surface protruding away from the substrate.

10. The electronic component according to claim 1, characterized in that: The first rigid component includes an inner wall facing the chip module and an outer wall facing away from the chip module. In a direction parallel to the substrate, shapes of the outer wall and the inner wall of the first rigid component match the outer contour of the chip module.

11. The electronic component according to claim 10, characterized in that: In a direction parallel to the substrate, the outer contour of the chip module is a rectangle.

12. A working component, characterized in that: include: Printed circuit boards; The electronic component according to any one of claims 1 to 11, wherein the electronic component is arranged on the printed circuit board.

13. The working assembly according to claim 12, characterized in that: It also includes a second rigid component, which is arranged on the same side of the printed circuit board as the electronic component, and the second rigid component is an annular structure surrounding the electronic component.

14. The working assembly according to claim 13, characterized in that: A heat dissipation medium layer is provided on the surface of the second rigid component and / or the electronic component.

15. The working assembly according to claim 13, characterized in that: A second heat dissipation channel is formed between the second rigid component and the electronic component, and a cross section of at least a portion of the second heat dissipation channel increases along the heat dissipation direction.

16. An electronic device, characterized in that: include: A working assembly as claimed in any one of claims 12 to 15, wherein the working assembly comprises a printed circuit board and electronic components arranged on the printed circuit board; A heat sink is arranged in a direction where the electronic components are away from the printed circuit board.

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