High-power phase-change uniform-temperature water-cooling plate

Abstract

The utility model discloses a high-power phase-change uniform-temperature water-cooling plate, which relates to the technical field of heat dissipation of electronic products and comprises a water-cooling plate main body, a water-cooling cavity is reserved at the upper part of the water-cooling plate main body, a uniform-temperature cavity is reserved at the lower part of the water-cooling plate main body, and a plurality of support capillary structures are fixed in the uniform-temperature cavity. The supporting capillary structure comprises a supporting column and a sintering capillary body, a phase change working medium is further injected into the temperature equalizing cavity, and a plurality of heat dissipation exchange teeth are fixedly connected into the water cooling cavity. According to the high-power phase-change temperature-equalizing water-cooling plate, the purpose of equalizing temperature and quickly diffusing heat is achieved by utilizing phase change of a circulating working medium in the temperature-equalizing layer from a liquid state to a gas state to quickly absorb heat and then transferring the heat to the water-cooling layer through the water plate main body, and the temperature-equalizing layer transfers heat from the phase change and the gas state, so that the heat transfer coefficient is up to 10000 W / m.K; the transverse heat transfer of the uniform temperature layer is improved by 25 times compared with that of the conventional water cooling plate, so that the effective water cooling heat exchange area of the phase change uniform temperature water cooling plate can be 25 times larger than that of the conventional water cooling plate. And heat exchange is better carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a high-power phase-change temperature-averaging water cooling plate. Background Art

[0002] With the rapid development of information network technology, the extensive application of big data, cloud computing, and artificial intelligence, especially while enjoying the speed and convenience brought by 5G networks, the demand for heat dissipation of electronic components is also increasing day by day. Traditional conventional radiators can no longer meet the heat dissipation needs of high-power and high-integration chips. With the recent popularity and application of liquid cooling concepts, many high-power chips use water cooling plates for heat dissipation, but they are unable to do so for chips with relatively high heat flux density. The effective exchange area of ​​conventional water cooling plates is generally no more than 3 times the contact area between the chip and the water cooling plate. Due to the material limitations of the water cooling plate, the thermal conductivity of the best copper water cooling plate is only 400W / mK at most, and water itself is a poor conductor of heat. The other lateral areas of the water cooling plate are extremely limited in terms of chip heat dissipation. Therefore, if the chip area is relatively small and the power is high, conventional water cooling plates also have their bottlenecks. Therefore, even today when liquid cooling is widely popular, there are still many chips that cannot be successfully launched on the market due to the pain point of excessive local heat density;

[0003] Therefore, it is urgent to develop a water cooling plate that can solve the above-mentioned problems for high-power and small-contact-area chips. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a high-power phase-change temperature-averaging water cooling plate, which solves the problems raised by the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a high-power phase-change temperature-averaging water-cooling plate, comprising a water-cooling plate body,

[0006] The upper part of the water-cooling plate body is reserved for a water-cooling cavity, and the lower part is reserved for a temperature-averaging cavity;

[0007] The bottom end of the water-cooled plate body is fixedly connected with a lower cover plate, and a plurality of supporting capillary structures are fixed inside the temperature-averaging chamber, wherein the supporting capillary structures include supporting columns connected between the water-cooled plate body and the lower cover plate, and sintered capillaries fixed outside the supporting columns, and a phase change working medium is also injected into the temperature-averaging chamber;

[0008] An upper cover plate is fixedly connected to the top of the water-cooling plate body, and a plurality of heat dissipation exchange teeth are fixedly connected to the inside of the water-cooling cavity.

[0009] Furthermore, the temperature-averaging cavity and the water-cooling cavity can be blocked respectively by the lower cover plate and the upper cover plate.

[0010] Furthermore, the interior of the temperature-averaging chamber is in a vacuum state.

[0011] Furthermore, one side of the water-cooling plate body is connected to a water inlet joint, and the other side is connected to a water outlet joint, and both the water inlet joint and the water outlet joint are connected to the water cooling cavity.

[0012] Furthermore, two ends of the support column protrude from the sintered capillary.

[0013] Furthermore, the water cooling plate body is made of copper or aluminum with high thermal conductivity.

[0014] The utility model provides a high-power phase-change temperature-averaging water cooling plate. Compared with the prior art, it has the following beneficial effects:

[0015] The high-power phase-change temperature-averaging water-cooling plate uses the phase change of the circulating working fluid in the temperature-averaging layer from liquid to gas to quickly absorb heat and then transfer it to the water-cooling layer through the water plate body to achieve the purpose of temperature uniformity and quickly diffuse the heat. Because the temperature-averaging layer is heat-transferring by phase change and gaseous state, the heat transfer coefficient is as high as 10000W / mK, which increases the lateral heat transfer of the temperature-averaging layer by 25 times compared with conventional water-cooling plates. Therefore, the effective water-cooling heat exchange area of ​​the phase-change temperature-averaging water-cooling plate can be 25 times larger than that of conventional water-cooling plates. Better heat exchange. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the disassembly of the utility model;

[0017] Figure 2 This is a structural schematic diagram of the water cooling plate main body in the utility model from the first perspective;

[0018] Figure 3 This is a structural schematic diagram of the water cooling plate body in the utility model from a second viewing angle;

[0019] Figure 4 It is a schematic diagram of the assembly of the utility model;

[0020] Figure 5 It is a half-section view of the utility model after assembly.

[0021] In the figure: 1. Water-cooled plate body; 11. Water-cooled chamber; 12. Temperature-averaging chamber; 13. Water inlet joint; 14. Water outlet joint; 2. Heat-generating device; 3. Support capillary structure; 31. Support column; 32. Sintered capillary; 4. Phase change medium; 5. Lower cover; 6. Heat dissipation exchange teeth; 7. Upper cover. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-5 The utility model provides a technical solution: a high-power phase-change temperature-averaging water-cooling plate, comprising a water-cooling plate body 1, the water-cooling plate body 1 is made of copper or aluminum with high thermal conductivity, so that heat dissipation is faster, a water-cooling cavity 11 is reserved on the upper part of the water-cooling plate body 1, and a temperature-averaging cavity 12 is reserved on the lower part, and the interior of the temperature-averaging cavity 12 is in a vacuum state (using the principle that the boiling point of the liquid is reduced under low air pressure, by evacuating the air inside the cavity of the temperature-averaging layer, the internal air pressure is reduced, so that the heat transfer medium boils The point is lowered, so that the heat transfer medium can be started under relatively low temperature conditions, and the efficiency of the water-cooled plate temperature-averaging layer is improved. The bottom end of the water-cooled plate body 1 is fixedly connected with a lower cover plate 5, and the top end of the water-cooled plate body 1 is fixedly connected with an upper cover plate 7. The lower cover plate 5 and the upper cover plate 7 can be used to block the temperature-averaging cavity 12 and the water-cooling cavity 11 respectively. One side of the water-cooled plate body 1 is connected to a water inlet joint 13, and the other side is connected to a water outlet joint 14. The water inlet joint 13 and the water outlet joint 14 are both connected to the water-cooling cavity 11.

[0024] Specifically, a plurality of supporting capillary structures 3 are fixed inside the temperature-averaging chamber 12, and the supporting capillary structures 3 include a supporting column 31 connected between the water-cooling plate body 1 and the lower cover plate 5, and a sintered capillary body 32 fixed to the outside of the supporting column 31, and both ends of the supporting column 31 protrude from the sintered capillary body 32. A phase change medium 4 is also injected into the temperature-averaging chamber 12 (through the phase change heat absorption and heat release principle between the liquid and gas phases of the heat transfer medium, to achieve the purpose of rapid heat conduction), and a plurality of heat dissipation exchange teeth 6 are fixedly connected inside the water-cooling chamber 11;

[0025] The water cooling plate combines the two heat dissipation modes of phase change heat transfer and liquid cooling, fully utilizing and combining the high efficiency of water cooling heat exchange and the rapidity of phase change heat transfer, overcoming the pain points of conventional water cooling.

[0026] When manufacturing the water-cooled plate, the lower half of the water-cooled plate body 1 is first hollowed out to form a uniform temperature chamber 12, and then the lower cover plate 5 and the water-cooled plate body 1 are welded into a whole by high-temperature brazing or diffusion welding. A support column 31 is provided inside to play a supporting role. The sintered capillary 32 can be formed by sintering a woven mesh or a powder structure. The phase change medium 4 is mainly transported to the heating zone in the uniform temperature chamber 12. The phase change medium 4 is welded into a whole in the uniform temperature chamber 12, and after ensuring good sealing, the uniform temperature chamber 12 is first evacuated, and then a proper amount of refrigerant (i.e., phase change medium 4) is poured into the inside. Conventional options include water, fluorine-containing system (HCFC), etc., which mainly circulates inside the uniform temperature chamber 12, absorbs heat in the heating zone of the uniform temperature chamber 12, changes into a gaseous state, diffuses to the cooling surface, releases heat, condenses into water, and returns to the heating zone under the capillary force of the sintered capillary 32 to continue to participate in the circulation;

[0027] Then the upper half of the water-cooling plate body 1 is hollowed out to form a water-cooling chamber, and then the upper cover plate 7 is welded on. There are heat dissipation exchange teeth 6 inside. The heat dissipation exchange teeth 6 can be processed by tooth scraping or by sheet metal stamping. Finally, the water inlet joint 13 and the water outlet joint 14 are welded or processed to complete the production of the water-cooling plate.

[0028] When the water-cooled plate is in use, the entire water-cooled plate is installed on a support body. During installation, the bottom surface of the lower cover plate 5 needs to be in close contact with the heat generating device 2 (i.e., the heat source. Conventional heat sources are usually high-power devices such as CPU, GPU, IGBT, etc.). In this way, the heat generated by the heat generating device 2 can be quickly transferred to the lower cover plate 5, and then the heat is transferred to the phase change medium 4 in the temperature-averaging chamber 12 through heat conduction. After being heated, the phase change medium 4 changes from liquid to vapor and rises in the temperature-averaging chamber 12 until it contacts the water-cooled plate body 1 (i.e., the top of the temperature-averaging chamber 12). The heat is then transferred to the water-cooled chamber 11 through the water-cooled plate body 1, and then to the heat dissipation exchange teeth 6. Cold water circulates in the water-cooled chamber 11 through the water inlet joint 13 and the water outlet joint 14. After the cold water contacts the heat dissipation exchange teeth 6, the heat is taken away.

Claims

1. A high-power phase-change temperature-averaging water-cooling plate, comprising a water-cooling plate body (1), characterized in that: The upper part of the water-cooling plate body (1) is reserved for a water-cooling chamber (11), and the lower part is reserved for a temperature-averaging chamber (12); The bottom end of the water-cooling plate body (1) is fixedly connected to a lower cover plate (5), a plurality of supporting capillary structures (3) are fixed inside the temperature-averaging chamber (12), the supporting capillary structures (3) comprising a supporting column (31) connected between the water-cooling plate body (1) and the lower cover plate (5), and a sintered capillary body (32) fixed outside the supporting column (31), and a phase change working medium (4) is also injected into the temperature-averaging chamber (12); An upper cover plate (7) is fixedly connected to the top of the water cooling plate body (1), and a plurality of heat dissipation exchange teeth (6) are fixedly connected to the interior of the water cooling cavity (11).

2. A high-power phase-change temperature-averaging water cooling plate according to claim 1, characterized in that: The lower cover plate (5) and the upper cover plate (7) can respectively seal the temperature-averaging chamber (12) and the water-cooling chamber (11).

3. A high-power phase-change temperature-averaging water cooling plate according to claim 1, characterized in that: The interior of the temperature-averaging chamber (12) is in a vacuum state.

4. A high-power phase-change temperature-averaging water cooling plate according to claim 1, characterized in that: One side of the water cooling plate body (1) is connected to a water inlet joint (13), and the other side is connected to a water outlet joint (14); the water inlet joint (13) and the water outlet joint (14) are both in communication with the water cooling chamber (11).

5. The high-power phase-change temperature-averaging water cooling plate according to claim 1, characterized in that: Both ends of the support column (31) protrude from the sintered capillary (32).

6. A high-power phase-change temperature-averaging water cooling plate according to claim 1, characterized in that: The water cooling plate body (1) is made of copper or aluminum with high thermal conductivity.

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