Radiator for semiconductor device

Abstract

A radiator for a semiconductor device relates to the technical field of semiconductor radiating devices and comprises a hollow shell, a partition plate is fixedly connected to the bottom of the shell, a refrigeration crystal is embedded in the partition plate, a cold guide plate is fixedly connected to the bottom of the partition plate, an alloy radiating plate is fixedly connected to the upper side of the partition plate, and a radiating mechanism is further arranged in the shell to accelerate the radiating efficiency of the alloy radiating plate. Side frames are fixedly connected to the left side and the right side of the shell, two sliding blocks are slidably connected to the interiors of the side frames, connecting rods are hinged to the sliding blocks, long-strip-shaped clamping jaws are hinged to the other ends of the two connecting rods on one side of the shell, and the clamping jaws on the left side and the right side are parallel; according to the radiator for the semiconductor device provided by the utility model, the bidirectional screw rod is driven to rotate through the adjusting cap, so that the sliding blocks on the bidirectional screw rod move in opposite directions, and the clamping jaws are further driven to move inwards, so that the distance between the clamping jaws is shortened, and the semiconductor radiator can be clamped on mobile phones with different models and sizes; and when the clamping claws are loosened, the clamping claws can be fastened on the mobile phone by shortening the distance between the clamping claws.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heat dissipation devices, and more specifically, to a heat sink used for semiconductor devices. Background Art

[0002] In the prior art, semiconductors are generally used to dissipate heat for electronic devices such as mobile phones and tablets. For example, the Chinese patent with the existing announcement number CN213426729U discloses a semiconductor mobile phone heat sink. The existing semiconductor heat sink is generally fixed on the mobile phone using a claw. However, due to the different sizes of mobile phones, the existing claw cannot fix mobile phones of different models, and the applicability is poor. Moreover, the claw has insufficient grip after being used for a long time and cannot be well fixed on the mobile phone. Therefore, in view of this situation, the utility model cleverly proposes a heat sink for semiconductor devices to solve the deficiencies in the above technical background. Utility Model Content

[0003] The utility model aims to solve the problems that the existing semiconductor radiator cannot be fixed on mobile phones of different models and has poor applicability; and the claws on the radiator have insufficient grip after being used for a period of time and are easily loosened when fixed on the mobile phone.

[0004] The utility model discloses a heat sink for semiconductor devices, and its purpose and efficacy are achieved by the following specific technical means: a heat sink for semiconductor devices, comprising a hollow shell, a partition fixedly connected to the bottom of the shell, a refrigeration crystal embedded in the partition, a cold conduction plate fixedly connected to the bottom of the partition, an alloy heat sink fixedly connected to the upper side of the partition, and a heat dissipation mechanism in the shell to accelerate the heat dissipation efficiency of the alloy heat sink; side frames are fixedly connected to the left and right sides of the shell, two sliders are slidably connected in the side frames, connecting rods are hinged on the sliders, the other ends of the two connecting rods on one side of the shell are hinged with long strip-shaped claws, and the claws on the left and right sides are parallel; a driving and moving mechanism for driving the two sliders to move relative to or away from each other is also provided in the side frames.

[0005] Furthermore, the material of the cooling plate is an aluminum plate or a copper plate.

[0006] Furthermore, the heat dissipation mechanism includes a fan, a dust screen is fixedly connected to the top of the shell, a motor is fixedly connected to the bottom of the dust screen, a fan is fixedly connected to the motor output shaft, a plurality of air guide holes are arranged on the side of the shell, and a plurality of heat dissipation fins are integrally connected to the upper side of the alloy heat dissipation plate in a circular distribution.

[0007] Furthermore, the heat dissipation fins are arc-shaped.

[0008] Furthermore, the driving and moving mechanism includes a bidirectional screw, which is rotatably connected in the side frames. The bidirectional screw has two threads in opposite directions, and the two sliders are respectively threadedly connected to different threads. An adjusting cap is also provided at one end of the bidirectional screw.

[0009] Furthermore, a sleeve is fixedly connected to the adjusting cap, and the sleeve is sleeved on the end of the bidirectional screw. A protrusion is integrally connected to the side of the bidirectional screw, and a corresponding groove is provided on the inner side of the sleeve; a limiting ring is provided on the inner side of the sleeve, and the outer side surface of the sleeve is set to be conical, and a conical hole matching it is provided at the corresponding position of the side frame. When the adjusting cap is pressed into the side frame, the sleeve and the hole on the side frame are transitionally matched.

[0010] Furthermore, a chamfer is provided on one side of the adjusting cap close to the side frame.

[0011] The beneficial effects of the utility model are as follows: the utility model provides a heat sink for semiconductor devices, which drives the bidirectional screw to rotate by adjusting the cap, so that the sliders thereon move toward each other, thereby driving the claws to move inward, thereby shortening the distance between the claws, so that the semiconductor heat sink can be clamped on mobile phones of different models and sizes; when the claws are loose, they can also be fastened to the mobile phone by shortening the distance between the claws. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a front sectional schematic diagram of the utility model.

[0013] Figure 2 It is a schematic cross-sectional view of the utility model when viewed from above.

[0014] Figure 3 For this utility model Figure 2 A magnified schematic diagram of center A.

[0015] Figure 4 It is a structural schematic diagram of the alloy heat sink of the utility model.

[0016] Figure 1-4 In: 1-shell, 101-air guide hole, 2-partition, 3-alloy heat sink, 301-heat sink fin, 4-refrigeration chip, 5-cold guide plate, 6-motor, 7-fan, 8-dust net, 9-side frame, 10-connecting rod, 11-claw, 12-adjusting cap, 121-bevel chamfer, 122-sleeve, 123-limiting ring, 124-groove, 13-bidirectional screw, 131-bump, 14-slider. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the utility model in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0018] like Figures 1 to 4 As shown: A heat sink for semiconductor devices, including a shell 1, the shell 1 is hollow and has a downward opening, a partition 2 is fixedly connected to the bottom of the shell 1, a cooling crystal 4 is embedded in the partition 2, and the cooling crystal 4 is a semiconductor cooling plate, also known as a thermoelectric cooling plate, with its hot end on the upper side and the cold end on the lower side; a cooling plate 5 is fixedly connected to the bottom of the partition 2, and the cooling plate 5 is used to expand the cooling area, and the material of the cooling plate 5 is an aluminum plate or a copper plate; an alloy heat sink 3 is fixedly connected to the upper side of the partition 2, and the alloy heat sink 3 is connected to the hot end of the cooling crystal 4 for heat dissipation at its hot end, and a heat dissipation mechanism is also provided in the shell 1 to accelerate the heat dissipation efficiency of the alloy heat sink 3; the left and right sides of the shell 1 are fixedly connected There is a side frame 9, and two sliders 14 are slidably connected in the side frame 9. Connecting rods 10 are hinged on the sliders 14. The other ends of the two connecting rods 10 on one side are hinged with claws 11. The claws 11 are long strips, and the claws 11, the two connecting rods 10 and the side frame 9 form a rectangular shape in the initial state; the side frame 9 is also provided with a driving movement mechanism for driving the two sliders 14 to move relative to or away from each other. The spacing between the left and right claws 11 is changed by moving the sliders 14 to adapt to different models of mobile phones; at the same time, since the spacing between the claws 11 can be changed, after the claws 11 are loosened, the spacing between the two claws 11 can be shortened to avoid the problem of the radiator loosening after long-term use.

[0019] Among them, Figure 1 As shown, the heat dissipation mechanism includes a fan 7, a dustproof net 8 is fixedly connected to the top of the shell 1, a motor 6 is fixedly connected to the bottom of the dustproof net 8, and a fan 7 is fixedly connected to the output shaft of the motor 6, and the fan 7 is a low-noise fan 7; a plurality of air guide holes 101 are provided on the side of the shell 1, and a plurality of heat dissipation fins 301 are integrally connected to the upper side of the alloy heat dissipation plate 3 in a circular distribution; the fan 7 rotates to inhale air flow from the dustproof net 8, flows through the heat dissipation fins 301 to take away the heat, and then flows out from the air guide holes 101 to complete the heat dissipation of the alloy heat dissipation plate 3.

[0020] Preferably, Figure 4 As shown, the heat dissipation fins 301 may be arc-shaped, which can increase the heat dissipation area and slow down the flow of air to improve the heat dissipation efficiency.

[0021] Among them, Figures 2 to 3 As shown, the driving mechanism includes a bidirectional screw 13, and the side frames 9 are rotatably connected with the bidirectional screw 13. The bidirectional screw 13 is provided with two threads in opposite directions, and the two sliders 14 are respectively threadedly connected to different threads. An adjusting cap 12 is also provided at one end of the bidirectional screw 13; the bidirectional screw 13 is driven to rotate by rotating the adjusting cap 12, and then the two sliders 14 thereon can be driven to move toward or away from each other; after moving, the side frame 9, the connecting rod 10 and the claw 11 form an isosceles trapezoid shape, and the two claws 11 always remain parallel, but the spacing changes, so that different models of mobile phones can be clamped and fixed.

[0022] Among them, Figures 2 to 3 As shown, a sleeve 122 is fixedly connected to the adjusting cap 12, and the sleeve 122 is sleeved on the end of the bidirectional screw 13. A convex block 131 is integrally provided on the side of the bidirectional screw 13, and a groove 124 corresponding to the same is provided on the inner side of the sleeve 122. The corresponding arrangement of the convex block 131 and the groove 124 makes it possible for the bidirectional screw 13 to rotate together when the adjusting cap 12 rotates. A limiting ring 123 is provided on the inner side of the side frame 9, and the limiting ring 123 can prevent the adjusting cap 12 from being directly pulled out from the end of the bidirectional screw 13; the outer side of the sleeve 122 is set to be conical, and a conical hole matching the same is provided on the corresponding position of the side frame 9. When the adjusting cap 12 is pressed into the side frame 9, the sleeve 122 transitionally cooperates with the hole on the side frame 9. At this time, the adjusting cap 12 is difficult to rotate easily, and the distance between the two claws 11 is prevented from changing; and the bidirectional screw 13 can be rotated smoothly by pulling out the adjusting cap 12.

[0023] Among them, Figure 3 As shown, a chamfer 121 is provided on one side of the adjusting cap 12 close to the side frame, so as to facilitate the removal of the adjusting cap 12 .

[0024] Working principle: After pulling out the adjusting cap 12, rotate it, which can drive the bidirectional screw 13 to rotate, so that the sliders 14 thereon move toward each other, and then drive the claws 11 to move inward, so as to shorten the distance between the claws 11, so that the semiconductor radiator can be clamped on mobile phones of different models and sizes; when the claws 11 are loose, they can also be tightened by shortening the distance between the claws 11; after adjusting the claws 11, press the adjusting cap 12 to prevent it from rotating easily, start the motor 6 to drive the fan 7 to rotate, and then the alloy heat sink 3 can be cooled, and at the same time, the cold end of the refrigeration chip cools and cools the heating part of the mobile phone; by adjusting the distance between the left and right claws 11 and the shell 1, the lateral position of the refrigeration chip on the back of the mobile phone can be changed, and then the heating part of the mobile phone can be cooled and dissipated more accurately.

Claims

1. A heat sink for a semiconductor device, comprising a hollow housing (1), characterized in that: A partition (2) is fixedly connected to the bottom of the shell (1), a refrigeration crystal (4) is embedded in the partition (2), and a cold guide plate (5) is fixedly connected to the bottom of the partition (2), an alloy heat sink (3) is fixedly connected to the upper side of the partition (2), and a heat dissipation mechanism is also provided in the shell (1) to accelerate the heat dissipation efficiency of the alloy heat sink (3); side frames (9) are fixedly connected to the left and right sides of the shell (1), two sliders (14) are slidably connected to the side frames (9), and connecting rods (10) are hinged on the sliders (14), and the other ends of the two connecting rods (10) on one side of the shell (1) are hinged with long strip-shaped claws (11), and the claws (11) on the left and right sides are parallel; the side frames (9) are also provided with a driving movement mechanism for driving the two sliders (14) to move relative to or away from each other.

2. A heat sink for a semiconductor device according to claim 1, characterized in that: The material of the cooling plate (5) is an aluminum plate or a copper plate.

3. A heat sink for a semiconductor device according to claim 1, characterized in that: The heat dissipation mechanism comprises a fan (7), a dust screen (8) is fixedly connected to the top of the housing (1), a motor (6) is fixedly connected to the bottom of the dust screen (8), a fan (7) is fixedly connected to the output shaft of the motor (6), a plurality of air guide holes (101) are provided on the side of the housing (1), and a plurality of heat dissipation fins (301) are integrally connected to the upper side of the alloy heat dissipation plate (3) in a circumferentially distributed manner.

4. A heat sink for a semiconductor device according to claim 3, characterized in that: The heat dissipation fins (301) are arc-shaped.

5. A heat sink for a semiconductor device according to claim 1, characterized in that: The driving mechanism comprises a bidirectional screw (13), the side frames (9) are rotatably connected with the bidirectional screw (13), the bidirectional screw (13) is provided with two threads in opposite directions, the two sliders (14) are respectively threadedly connected to different threads, and an adjusting cap (12) is further provided at one end of the bidirectional screw (13).

6. A heat sink for a semiconductor device according to claim 5, characterized in that: The adjusting cap (12) is fixedly connected with a sleeve (122), the sleeve (122) is sleeved on the end of the bidirectional screw (13), the side of the bidirectional screw (13) is integrally connected with a protrusion (131), and the inner side of the sleeve (122) is provided with a groove (124) corresponding thereto; the sleeve (122) is provided with a limit ring (123) at the inner side of the side frame (9), and the outer side surface of the sleeve (122) is set in a conical shape, and a conical hole matching therewith is provided at a corresponding position of the side frame (9); when the adjusting cap (122) is pressed into the side frame (9), the sleeve (122) and the hole on the side frame (9) are transitionally matched.

7. A heat sink for a semiconductor device according to claim 5, characterized in that: The adjusting cap (12) is provided with an oblique chamfer (121) on one side close to the side frame.

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