LED integrated light source
By distributing the flip chip, substrate and control chip in the upper, middle and lower layers in the LED light source, the problem of large size of the existing LED light source is solved, and an ultra-small size LED light source is realized, meeting the needs of small size applications.
Patent Information
- Application Number
- CN202421211761.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing LED light sources are large in size, which is difficult to meet users' needs for small-sized light sources.
A LED integrated light source is designed to form an ultra-small size LED light source by distributing flip chips, substrates and control chips in the upper, middle and lower layers. The specific implementation method is to connect the bottom pad of the substrate to the top pad of the control chip, and the top pad of the substrate to the flip chip.
An ultra-small size LED light source is realized, meeting the needs of micro-size applications.
Smart Images
Figure CN222602949U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED light sources, in particular to an LED integrated light source. Background Art
[0002] In the prior art, LED light sources are gradually developing towards small-size packaging. Therefore, how to provide ultra-small-size LED light sources has become a problem that needs to be solved urgently. Utility Model Content
[0003] In view of the above technical problems, the utility model provides an LED integrated light source to solve the problem that the LED light source in the prior art is too large to meet the user's demand for a small-sized light source.
[0004] In a first aspect, the utility model provides an LED integrated light source, comprising: a substrate, a control chip and a flip chip, wherein the bottom pad of the substrate is connected to the top pad of the control chip; the top pad of the substrate is welded to the flip chip.
[0005] Optionally, the top pad of the control chip includes: a first channel pad, a second channel pad, a third channel pad, and a positive power pad of the control chip.
[0006] Optionally, the bottom pads of the control chip include: a first signal input pad, a second signal input pad, a signal output pad, a ground pad and a power pad for connecting to an external circuit.
[0007] Optionally, the bottom pad of the substrate includes: a first channel pad, a second channel pad, a third channel pad, and a positive power pad of the substrate; the first channel pad of the substrate is connected to the first channel pad of the control chip, the second channel pad of the substrate is connected to the second channel pad of the control chip, the third channel pad of the substrate is connected to the third channel pad of the control chip, and the positive power pad of the substrate is connected to the positive power pad of the control chip.
[0008] Optionally, the top pads of the substrate include: a first positive electrode pad, a first negative electrode pad, a second positive electrode pad, a second negative electrode pad, a third positive electrode pad and a third negative electrode pad.
[0009] Optionally, the flip chip includes: a first chip positive electrode, a first chip negative electrode, a second chip positive electrode, a second chip negative electrode, a third chip positive electrode, and a third chip negative electrode;
[0010] The positive electrode of the first chip is connected to the first positive electrode pad, and the negative electrode of the first chip is connected to the first negative electrode pad; the positive electrode of the second chip is connected to the second positive electrode pad, and the negative electrode of the second chip is connected to the second negative electrode pad; the positive electrode of the third chip is connected to the third positive electrode pad, and the negative electrode of the third chip is connected to the third negative electrode pad.
[0011] Optionally, a first protective layer is disposed outside the control chip, and the first protective layer is provided with openings exposing the first signal input pad, the second signal input pad, the signal output pad, the ground pad and the power pad.
[0012] Optionally, a second protective layer is provided on the outside of the flip chip to transmit light to the first chip light-emitting surface, the second chip light-emitting surface, and the third chip light-emitting surface of the flip chip.
[0013] Optionally, the first protective layer is obtained by using an LED packaging mold top process or a dam dispensing process.
[0014] Optionally, the second protective layer is obtained by using an LED packaging mold top process or a dam dispensing process.
[0015] The LED integrated light source of the utility model distributes the flip chip, substrate and control chip in the upper, middle and lower layers, so that the bottom pad of the substrate is connected with the top pad of the control chip; the top pad of the substrate is welded to the flip chip, thereby forming an ultra-small LED light source, which is conducive to the development of LED light sources towards micro-sized applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a structural diagram of an LED integrated light source provided in one embodiment of the utility model;
[0017] Figure 2a It is a top pad structure diagram of a control chip provided in other embodiments of the utility model;
[0018] Figure 2b It is a bottom pad structure diagram of the control chip provided in other embodiments of the utility model;
[0019] Figure 3 It is an external circuit diagram of the bottom pad connection of the control chip provided in other embodiments of the utility model;
[0020] Figure 4a It is a bottom pad structure diagram of a substrate provided in other embodiments of the utility model;
[0021] Figure 4b It is a top pad structure diagram of a substrate provided in other embodiments of the utility model;
[0022] Figure 5a It is a back structural diagram of a flip chip in other embodiments of the utility model;
[0023] Figure 5b It is a front structural diagram of a flip chip in other embodiments of the utility model;
[0024] Figure 6 This is a diagram of the protective layer structure of the LED integrated light source provided in other embodiments of the utility model; the symbols are explained as follows:
[0025] 100, substrate; 200, control chip; 300, flip chip; 1, first channel pad of control chip; 2, second channel pad of control chip; 3, third channel pad of control chip; 4, positive power pad of control chip; 5, first signal input pad; 6, signal output pad; 7, ground pad; 8, power pad; 9, second signal input pad; 10, first channel pad of substrate; 11, second channel pad of substrate; 12, third channel pad of substrate; 13, positive power pad of substrate ; 14. The first positive electrode pad; 15. The first negative electrode pad; 16. The second positive electrode pad; 17. The second negative electrode pad; 18. The third positive electrode pad; 19. The third negative electrode pad; 20. The positive electrode of the first chip; 21. The negative electrode of the first chip; 22. The positive electrode of the second chip; 23. The negative electrode of the second chip; 24. The positive electrode of the third chip; 25. The negative electrode of the third chip; 26. The light-emitting surface of the first chip; 27. The light-emitting surface of the second chip; 28. The light-emitting surface of the third chip; 29. The first protective layer; 30. The second protective layer; 31. The opening. DETAILED DESCRIPTION
[0026] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.
[0027] It should be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to implement the embodiments and illustrate the best mode for implementing the embodiments. After reading the following description in light of the accompanying drawings, those skilled in the art will understand the concepts of the present disclosure and will recognize applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of the present disclosure and the appended claims.
[0028] It should also be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element without departing from the scope of the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more related listed items.
[0029] It should also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.
[0030] It should also be understood that the terms "upper", "lower", "left", "right", "front", "back", "bottom", "middle", "middle", "top", etc. may be used herein to describe various elements, and the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore these elements should not be limited by these terms.
[0031] These terms are only used to distinguish one element from another element. For example, a first element can be referred to as an "upper" element, and similarly, a second element can be referred to as an "upper" element according to the relative orientation of these elements without departing from the scope of the present disclosure.
[0032] It is further understood that the terms “comprises,” “includes,” “including” and / or “comprising” when used herein specify the presence of stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.
[0033] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will be further understood that the terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.
[0034] In one embodiment, a method is provided as follows Figure 1 The LED integrated light source shown includes: a substrate 100, a control chip 200 and a flip chip 300, wherein the bottom pad of the substrate 100 is connected to the top pad of the control chip 200; and the top pad of the substrate 100 is welded to the flip chip 300.
[0035] When the LED integrated light source is mass-produced, the corresponding flip chip 300 is welded at the corresponding position on the top of the board with several substrates 100, and the corresponding control chip 200 is welded at the corresponding position on the bottom of the board. After forming a three-layer structure, the control chip and the flip chip are protected by the top mold glue or the dam glue dispensing process of the LED packaging mold, and then cut into uniform Figure 1 The LED integrated light source shown.
[0036] The LED integrated light source of this embodiment is formed by distributing the flip chip, substrate, and control chip in the upper, middle, and lower layers, so that the bottom pad of the substrate is connected to the top pad of the control chip; the top pad of the substrate is welded to the flip chip, thereby forming an ultra-small LED light source.
[0037] In other embodiments, the top pad of the control chip includes: a first channel pad 1, a second channel pad 2, a third channel pad 3, and a positive power pad 4 of the control chip 200, such as Figure 2a shown.
[0038] Among them, the first channel pad 1, the second channel pad 2, the third channel pad 3, and the positive power pad 4 are respectively used to connect to a plurality of bottom pads of the substrate.
[0039] In other embodiments, the bottom pads of the control chip include: a first signal input pad 5, a second signal input pad 9, a signal output pad 6, a ground pad 7 and a power pad 8 for connecting to an external circuit. Figure 2b shown.
[0040] Among them, the bottom pad of the control chip is used to connect external circuits such as Figure 3 As shown in the figure, a typical application circuit of an LED light source is shown, wherein LED1, LED2 and LED3 can be the LED integrated light source in any of the above embodiments. And the corresponding pads at the DI pins of LED1, LED2 and LED3 are Figure 2b The first signal input pad 5 in the DO pin is Figure 2b The signal output pad 6 in the GND pin corresponds to Figure 2b The ground pad 7 in the BI pin is Figure 2b The second signal input pad 9 in the VDD pin corresponds to the pad Figure 2b The power supply pad 8 in.
[0041] In other embodiments, Figure 4aAs shown, the bottom pads of the substrate 100 include: a first channel pad 10, a second channel pad 11, a third channel pad 12, and a positive power pad 13 of the substrate; the first channel pad 10 of the substrate 100 is connected to the first channel pad 1 of the control chip 200, the second channel pad 11 of the substrate 100 is connected to the second channel pad 2 of the control chip 200, the third channel pad 12 of the substrate 100 is connected to the third channel pad 3 of the control chip 200, and the positive power pad 13 of the substrate 100 is connected to the positive power pad 4 of the control chip 200.
[0042] Among them, the first channel pad 10, the second channel pad 11, and the third channel pad 12 are arranged horizontally at equal intervals on the substrate 100, and the three pads have the same size; the positive power pad 13 is arranged at the bottom edge of the substrate 100, and the size of the positive power pad 13 is larger than the size of the first channel pad 10, the second channel pad 11, and the third channel pad 12.
[0043] In other embodiments, Figure 4b As shown, the top pad of the substrate 100 includes: a first positive pad 14, a first negative pad 15, a second positive pad 16, a second negative pad 17, a third positive pad 18 and a third negative pad 19. The first positive pad 14, the second positive pad 16 and the third positive pad 18 are connected to the positive pad 13 of the power supply of the substrate 100, the first negative pad 15 is connected to the first channel pad 10 of the substrate 100, the second negative pad 17 is connected to the second channel pad 11 of the substrate 100, and the third negative pad 19 is connected to the third channel pad 12 of the substrate 100.
[0044] Among them, the first positive electrode pad 14, the second positive electrode pad 16, and the third positive electrode pad 18 are arranged horizontally at equal intervals at one end of the top of the substrate 100, and the first negative electrode pad 15, the second negative electrode pad 17, and the third negative electrode pad 19 are arranged horizontally at equal intervals at the other end of the top of the substrate 100, and the sizes of the six pads are preferably equal.
[0045] The substrate of this embodiment serves as an intermediate layer, and corresponding pads are arranged on the top and the bottom respectively, so as to achieve the purpose of connecting with the upper flip chip and the lower control chip respectively, which is conducive to the ultra-small size integration of the light source.
[0046] In other embodiments, Figure 5aAs shown, the back structure of the flip chip includes: a first chip positive electrode 20, a first chip negative electrode 21, a second chip positive electrode 22, a second chip negative electrode 23, a third chip positive electrode 24, and a third chip negative electrode 25. The first chip positive electrode 20 is connected to the first positive electrode pad 14 of the substrate 100, and the first chip negative electrode 21 is connected to the first negative electrode pad 15 of the substrate 100; the second chip positive electrode 22 is connected to the second positive electrode pad 16 of the substrate 100, and the second chip negative electrode 23 is connected to the second negative electrode pad 17 of the substrate 100; the third chip positive electrode 24 is connected to the third positive electrode pad 18 of the substrate 100, and the third chip negative electrode 25 is connected to the third negative electrode pad 19 of the substrate 100.
[0047] like Figure 5b As shown, the front structure of the flip chip includes: a first chip light emitting surface 26 , a second chip light emitting surface 27 and a third chip light emitting surface 28 .
[0048] In other embodiments, Figure 6 As shown, a first protective layer 29 is provided outside the control chip, and the first protective layer is provided with five openings 31 of the same size for respectively exposing the first signal input pad 5, the second signal input pad 9, the signal output pad 6, the ground pad 7 and the power pad 8 of the control chip.
[0049] In other embodiments, Figure 6 As shown, a second protective layer 30 is provided on the outside of the flip chip. The second protective layer is a transparent protective layer or a translucent protective layer (such as a protective layer formed by a misty colloid) and is used to transmit light to the first chip light-emitting surface 26, the second chip light-emitting surface 27, and the third chip light-emitting surface 28 of the flip chip.
[0050] In other embodiments, the first protective layer 29 is obtained by using an LED encapsulation mold top process or a dam glue dispensing process. In other embodiments, the second protective layer 30 can also be obtained by using an LED encapsulation mold top process or a dam glue dispensing process. Among them, the LED encapsulation mold top process and the dam glue dispensing process are both existing processes for LED light source encapsulation, and will not be described in detail in this embodiment.
[0051] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention.
Claims
1. An LED integrated light source, characterized in that: include: A substrate, a control chip and a flip chip, wherein the bottom pad of the substrate is connected to the top pad of the control chip; and the top pad of the substrate is welded to the flip chip.
2. The LED integrated light source according to claim 1, characterized in that: The top pads of the control chip include: a first channel pad, a second channel pad, a third channel pad, and a positive power pad of the control chip.
3. The LED integrated light source according to claim 2, characterized in that: The bottom pads of the control chip include: a first signal input pad, a second signal input pad, a signal output pad, a ground pad and a power pad for connecting to an external circuit.
4. The LED integrated light source according to claim 2, characterized in that: The bottom pads of the substrate include: a first channel pad, a second channel pad, a third channel pad, and a positive power pad of the substrate; the first channel pad of the substrate is connected to the first channel pad of the control chip, the second channel pad of the substrate is connected to the second channel pad of the control chip, the third channel pad of the substrate is connected to the third channel pad of the control chip, and the positive power pad of the substrate is connected to the positive power pad of the control chip.
5. The LED integrated light source according to claim 4, characterized in that: The top pads of the substrate include: a first positive electrode pad, a first negative electrode pad, a second positive electrode pad, a second negative electrode pad, a third positive electrode pad and a third negative electrode pad.
6. The LED integrated light source according to claim 5, characterized in that: The flip chip comprises: a first chip positive electrode, a first chip negative electrode, a second chip positive electrode, a second chip negative electrode, a third chip positive electrode, and a third chip negative electrode; The positive electrode of the first chip is connected to the first positive electrode pad, and the negative electrode of the first chip is connected to the first negative electrode pad; the positive electrode of the second chip is connected to the second positive electrode pad, and the negative electrode of the second chip is connected to the second negative electrode pad; the positive electrode of the third chip is connected to the third positive electrode pad, and the negative electrode of the third chip is connected to the third negative electrode pad.
7. The LED integrated light source according to claim 3, characterized in that: A first protective layer is disposed outside the control chip, and the first protective layer is provided with openings exposing the first signal input pad, the second signal input pad, the signal output pad, the ground pad, and the power pad.
8. The LED integrated light source according to claim 6, characterized in that: A second protective layer is disposed outside the flip chip to transmit light to the first chip light-emitting surface, the second chip light-emitting surface, and the third chip light-emitting surface of the flip chip.
9. The LED integrated light source according to claim 7, characterized in that: The first protective layer is obtained by using an LED packaging mold top process or a dam dispensing process.
10. The LED integrated light source according to claim 8, characterized in that: The second protective layer is obtained by using an LED packaging mold top process or a dam dispensing process.