Adjustable high-pressure water jet cutter device for removing flash in semiconductor packaging

Abstract

The utility model belongs to the technical field of semiconductor packaging flash removing devices, and particularly relates to an adjustable high-pressure water jet cutter device for semiconductor packaging flash removing, which comprises a nozzle base and a baffle mounted on one side of the nozzle base. The nozzle assembly comprises two nozzle adjusting supports, a nozzle block detachably and movably connected between the two nozzle adjusting supports and a nozzle fixedly connected to the nozzle block, adjusting rails are arranged on the nozzle adjusting supports, and the nozzle block is movably connected into the adjusting rails. The nozzle is independently designed, the height position of the nozzle can be freely adjusted, the nozzle can adapt to excessive glue removal operation of products in more scenes, the cleaning effect is guaranteed, the use cost is reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging overflow removal devices, and in particular relates to an adjustable high-pressure water jet device for semiconductor packaging overflow removal. Background Art

[0002] After the product is plastic-sealed, a lot of overflow will be generated in the plastic-sealed body of the product. The overflow will affect the subsequent processes and needs to be removed. If the overflow is not removed cleanly or not removed at all, it will cause poor solderability of the product after electroplating. At present, the traditional high-pressure water jet device for removing overflow has a fixed nozzle position, and can only remove overflow at a fixed position, so there are the following defects: 1. All nozzles of the traditional high-pressure water jet device are in a fixed state, and the nozzle cannot be adjusted according to the product, and cannot completely correspond to the position where the overflow glue needs to be removed from the product, and the overflow glue removal effect is not good; 2. All nozzles of the traditional high-pressure water jet device are distributed and covered, and the number of nozzles is fixed. For narrow products, the nozzle cannot be reduced, which wastes water; 3. All nozzles of the traditional high-pressure water jet device are in a fixed state, and the special overflow generated by some special products cannot be effectively covered, resulting in the inability to effectively remove the overflow glue of the product; 4. In the traditional high-pressure water jet device, the synchronous wheel on the rear roller is synchronized with the steel belt, and there is a risk of pulling the steel belt, resulting in an increased probability of equipment failure; 5. In the traditional high-pressure water jet device, the rear roller rotates for a long time, the spare parts wear quickly, and the replacement frequency of spare parts is high, which increases the production cost of the product; 6. In the traditional high-pressure water jet device, the rear roller is synchronized with the steel belt, which is prone to slipping. The product slips on the roller, which will cause the plastic sealing body of the product to be scratched, resulting in abnormal product quality. Utility Model Content

[0003] In view of the above-mentioned deficiencies existing in the prior art, the utility model provides an adjustable high-pressure water jet device for removing overflow of semiconductor packaging, so as to solve the above-mentioned existing problems.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] An adjustable high-pressure water jet device for removing overflow from semiconductor packaging comprises a nozzle base and a baffle installed on one side of the nozzle base, wherein a plurality of nozzle assemblies are detachably connected to the nozzle base, wherein the nozzle assembly comprises two nozzle adjustment brackets, a nozzle block detachably and movably connected between the two nozzle adjustment brackets, and a nozzle fixedly connected to the nozzle block, wherein the nozzle adjustment brackets are each provided with an adjustment track, wherein the nozzle block is movably connected to the adjustment track, and a fixing bolt is cooperatively connected to the adjustment track.

[0006] Furthermore, a plurality of circular holes are formed on the baffle.

[0007] Compared with the prior art, the utility model has the following beneficial effects:

[0008] 1. The nozzle of the utility model adopts a separate design. Each nozzle is independent and its height position can be freely adjusted. According to the serious glue overflow of the product, the nozzle is fixedly set at the position where the glue overflow is serious, so as to ensure a better effect of removing the glue overflow of the product;

[0009] 2. The nozzle of the utility model adopts a separate design, and each nozzle can be controlled independently. For some narrow products, the unnecessary nozzles can be closed to reduce water consumption, thereby saving production costs;

[0010] 3. The nozzle of the utility model adopts a separate design. Each nozzle is independent and its height position can be freely adjusted. It can effectively cover the special overflow generated by some special products, ensuring a better effect of removing the overflow glue of special products;

[0011] 4. The utility model adopts a baffle design, which is different from the roller design. There is no rotating action, which reduces the wear of spare parts and reduces production costs;

[0012] 5. The utility model adopts a baffle design, which is different from the roller design. There is no rotating action, no slipping problem, and no scratches on the plastic sealing body of the product, which improves the quality of the product;

[0013] 6. The baffle of the utility model is not synchronized with the steel belt, so there is no risk of damaging the steel belt, which reduces the equipment failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of an adjustable high-pressure water jet device for removing overflow from semiconductor packaging according to the utility model;

[0015] Figure 2 It is a three-dimensional structural schematic diagram of a nozzle assembly in an embodiment of an adjustable high-pressure water jet device for removing overflow from a semiconductor package according to the utility model;

[0016] The reference numerals in the drawings of the specification include:

[0017] Nozzle base 1, baffle 2, nozzle assembly 3, nozzle adjustment bracket 4, nozzle block 5, nozzle 6, adjustment track 7, fixing bolt 8, round hole 9. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Among them, the drawings are only used for illustrative explanations, and they only represent schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0020] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0021] In the description of the present invention, unless otherwise clearly specified and limited, if the term "connection" or the like appears to indicate the connection relationship between components, the term should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] Example:

[0023] like Figure 1-Figure 2 As shown, the utility model is an adjustable high-pressure water jet device for removing overflow from semiconductor packaging, comprising a nozzle base 1 and a baffle 2 installed on one side of the nozzle base 1, a plurality of nozzle assemblies 3 are detachably connected to the nozzle base 1, the nozzle assembly 3 comprises two nozzle adjustment brackets 4, a nozzle block 5 detachably connected between the two nozzle adjustment brackets 4 and a nozzle 6 fixedly connected to the nozzle block 5, the nozzle adjustment brackets 4 are each provided with an adjustment track 7, the nozzle block 5 is movably connected to the adjustment track 7, the adjustment track 7 is cooperatively connected with a fixing bolt 8, and a plurality of circular holes 9 are provided on the baffle 2.

[0024] Baffle 2: Made of stainless steel, its function is to hold the product against the nozzle 6 when the nozzle 6 impacts the surface of the product at high pressure, so that the water pressure acts on the product to achieve the effect of removing the overflow glue, while ensuring that the product does not fall. Baffle 2 is a hollow structure with a long hole at the bottom for fixing to the equipment.

[0025] Nozzle base 1: Made of stainless steel, used for connecting and fixing the nozzle adjustment bracket 4.

[0026] Nozzle adjustment bracket 4: made of stainless steel, the bottom is fixed on the nozzle base 1, the upper part is connected to the nozzle block 5, the screws are locked, and the nozzle block 5 can move up and down and be adjusted to the required position.

[0027] Nozzle block 5: Made of stainless steel, it can slide up and down and is fixed on the nozzle adjustment bracket 4. One end of the nozzle block 5 is connected to the high-pressure pump using a high-pressure hose, and the other end is connected to the nozzle 6. The high-pressure water generated by the high-pressure pump is emitted through the nozzle block 5.

[0028] Nozzle 6: Standard part, common part in the market, high pressure water group sprays water through nozzle 6 to remove product overflow glue.

[0029] The above are only embodiments of the utility model. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field to which the utility model belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement the scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for the ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. An adjustable high-pressure water jet device for removing overflow from semiconductor packaging, characterized in that: It includes a nozzle base and a baffle installed on one side of the nozzle base. The nozzle base is detachably connected with a plurality of nozzle assemblies. The nozzle assembly includes two nozzle adjustment brackets, a nozzle block detachably connected between the two nozzle adjustment brackets, and a nozzle fixedly connected to the nozzle block. The nozzle adjustment brackets are each provided with an adjustment track. The nozzle block is movably connected to the adjustment track. The adjustment track is cooperatively connected with a fixing bolt.

2. The adjustable high-pressure water jet device for removing flash from semiconductor packaging as claimed in claim 1, characterized in that: The baffle is provided with a plurality of circular holes.

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