Temperature adjusting device and semiconductor process equipment

By designing a temperature adjustment device in semiconductor process equipment and adjusting the temperature of the pipeline structure using detection devices and heating components, the problem of uncontrollable pipeline temperature in the prior art is solved, and more stable and flexible process operations are achieved.

CN222617625UActive Publication Date: 2025-03-14BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202420334044.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-22
Publication Date
2025-03-14
Estimated Expiration
2034-02-22

AI Technical Summary

Technical Problem

In the prior art, the insulation heating structure in semiconductor process equipment is fixed, resulting in uncontrollable pipeline temperature, affecting the stability of water vapor temperature, and thus affecting the normal progress of the process.

Method used

A temperature regulation device is designed, including an insulating structure, a heating assembly and a detection device. By detecting the temperature of the pipeline structure, controlling the heating power of the heating assembly, and adjusting the temperature of the pipeline structure.

Benefits of technology

Effective control of the temperature of the pipeline structure is achieved, the problems of melting the seal ring or gasket and the water vapor temperature are avoided, and the stability and flexibility of the process are improved.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides a temperature adjusting device and semiconductor process equipment. The temperature adjusting device comprises a heat preservation structure and a temperature adjusting structure, wherein the heat preservation structure is used for being arranged on a pipeline structure between the reaction chamber and the ignition chamber in a sleeving mode; the heating assembly is arranged in the heat preservation structure and used for heating the pipeline structure; and the detection device is used for detecting the temperature of the pipeline structure so as to control the heating power of the heating assembly according to the temperature of the pipeline structure. According to the temperature adjusting device, the detection device is arranged on the basis of an original heat preservation structure, temperature feedback of the pipeline structure can be achieved through the detection device, and therefore the heating power of the heating assembly can be controlled according to the temperature of the pipeline structure, and the heating amount of the heating assembly on the pipeline structure is adjusted; and the temperature of water vapor in the pipeline structure is adjusted.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a temperature regulating device and semiconductor process equipment. Background Art

[0002] In the semiconductor vertical furnace wet oxygen process, water vapor is generated by the combustion of hydrogen and oxygen in the ignition chamber. Figure 1 As shown, after the water vapor is generated, it enters the reaction chamber 4 through the ignition chamber 1, the air intake transition pipe 2 and the reaction chamber air intake pipe 3 to react. The ignition chamber 1, the air intake transition pipe 2 and the reaction chamber air intake pipe 3 are connected by a flange 5 and a flange clamp 6.

[0003] In order to prevent water vapor from being cooled and liquefied in the pipeline, thereby causing adverse effects on the chamber reaction, the solution in the prior art is to add a heating belt 7 to the air intake transition pipe 2, set a first insulation sleeve 8 on the end pipeline of the ignition chamber 1, and add a second insulation sleeve 9 at the connection between the two flange clamps 6.

[0004] The air intake transition pipe 2 is a connecting hub between the ignition chamber 1 and the reaction chamber 4 , and the heating belt 7 on the air intake transition pipe 2 is used to provide a heat source and protection for the air intake transition pipe 2 .

[0005] The flange clamp 6 on the ignition chamber 1 side is used to connect the ignition chamber 1 with the inlet transition pipe 2, and the corresponding second insulation sleeve 9 is installed on the outside of the flange clamp 6 to prevent the high-temperature gas from contacting the external cold spot and generating condensed water. Similarly, the flange clamp 6 on the reaction chamber 4 side is used to connect the reaction chamber inlet pipe 3 and the inlet transition pipe 2, and the corresponding second insulation sleeve 9 is installed on the outside of the flange clamp 6 to prevent the gas from being cooled and liquefied.

[0006] like Figure 2 As shown, flange 5 is a key component connected to the air intake path, and contains a sealing ring 5a to prevent gas leakage and a flange gasket 5b to prevent clamping damage. If the gas temperature in the pipeline is higher than the heat-resistant temperature of the sealing ring 5a and the flange gasket 5b, it is easy to cause the sealing effect and the protective effect to fail. However, the existing heat-insulating heating structure, whether it is the heating belt 7 or the heat-insulating sleeve, their heating or heat-insulating effect is fixed, but the temperature of the water vapor in the pipeline is not constant. It will be affected by the combustion of hydrogen and oxygen, resulting in the water vapor temperature being high and low. This leads to the water vapor exceeding the heat-resistant temperature of the sealing ring 5a and the flange gasket 5b when the water vapor temperature is high due to the effects of heating and heat preservation, making the sealing effect and the protective effect of the two invalid. When the water vapor temperature is low, it cannot be guaranteed that the water vapor meets the corresponding temperature when entering the reaction chamber, affecting the normal process. Utility Model Content

[0007] The utility model aims to at least solve the problem in the prior art that the heat preservation and heating effects of the heat preservation and heating structure are fixed, resulting in uncontrollable pipeline temperature, and proposes a temperature regulating device and semiconductor process equipment.

[0008] To achieve the purpose of the utility model, a temperature regulating device is disclosed, which is used for the pipeline structure between the reaction chamber and the ignition chamber. The temperature regulating device includes: a heat-insulating structure, which is used to be sleeved on the pipeline structure between the reaction chamber and the ignition chamber; a heating component, which is arranged inside the heat-insulating structure and is used to heat the pipeline structure; and a detection device, which is used to detect the temperature of the pipeline structure to control the heating power of the heating component according to the temperature of the pipeline structure.

[0009] Optionally, the insulation structure includes: an insulation sleeve, which is used to be installed on the flange assembly of the pipeline structure, and an insulation cavity for accommodating the flange assembly is arranged inside the insulation sleeve; the heating assembly includes: a first heating assembly, which is arranged between the inner wall and the outer wall of the insulation sleeve; and the detection device is arranged in the insulation cavity.

[0010] Optionally, the insulation cover comprises: two insulation covers, which are movably connected to each other, and the insulation cover has an insulation state and an avoidance state; in the insulation state of the insulation cover, the two insulation covers are buckled together to enclose the insulation cavity; in the avoidance state of the insulation cover, the two insulation covers are away from each other.

[0011] Optionally, the insulation cover includes: a first insulation wall, which is perpendicular to the first direction; a second insulation wall, which is parallel to the first insulation wall, and the first insulation wall and the second insulation wall are arranged opposite to each other in the first direction; a third insulation wall, which is respectively connected to the first insulation wall and the second insulation wall, and the first insulation wall, the second insulation wall and the third insulation wall form the insulation cover.

[0012] Optionally, the insulation sleeve has a first end and a second end arranged opposite to each other in the first direction; a first avoidance hole connected to the insulation cavity is provided on the end wall of the first end of the insulation sleeve; a second avoidance hole connected to the insulation cavity is provided on the end wall of the second end of the insulation sleeve; the first avoidance hole and the second avoidance hole are used for passing through a pipe connected to the flange of the flange assembly in the pipeline structure.

[0013] Optionally, a first avoidance groove is provided on the first insulation wall; a second avoidance groove is provided on the second insulation wall; in the insulation state of the insulation cover, the two first insulation walls on the insulation covers form the end wall of the first end of the insulation cover, and the two first avoidance grooves form the first avoidance hole; the two second insulation walls on the insulation covers form the end wall of the second end of the insulation cover, and the two second avoidance grooves form the second avoidance hole.

[0014] Optionally, the first heating component includes: a first heating wire, buried inside the third insulation wall along the first direction; the first heating wire has a first heating segment, a second heating segment and a third heating segment along the first direction; the setting density of the second heating segment is less than the setting density of the first heating segment, and / or the setting density of the second heating segment is less than the setting density of the third heating segment.

[0015] Optionally, the first heating component also includes: second heating wires, which are respectively buried inside the first insulation wall and the second insulation wall along a second direction, and the first direction intersects with the second direction; and the setting density of the first heating wires is less than the setting density of the second heating wires.

[0016] Optionally, the insulation sleeve has a first insulation layer and a second insulation layer arranged in sequence from the inside to the outside, the first heating component is arranged in the first insulation layer, and the insulation material setting density of the first insulation layer is less than the insulation material setting density of the second insulation layer.

[0017] Optionally, the insulation structure includes: an insulation sleeve, which is used to be sleeved on a pipe connected to the flange of the flange assembly in the pipeline structure, and the detection device is arranged on the inner wall of the insulation sleeve; the heating assembly also includes: a second heating assembly, which is arranged between the inner wall and the outer wall of the insulation sleeve.

[0018] Optionally, the thermal insulation sleeve has a third thermal insulation layer, the second heating assembly is arranged in the third thermal insulation layer, and the thermal insulation material setting density of the third thermal insulation layer is less than the thermal insulation material setting density of the second thermal insulation layer.

[0019] Optionally, the second heating assembly includes: a third heating wire, which is arranged between the inner wall and the outer wall of the thermal insulation sleeve, and the third heating wire is located inside the thermal insulation sleeve, and the setting density of the third heating wire is less than the minimum setting density of the first heating wire.

[0020] According to the second aspect of the utility model, a semiconductor process equipment is also disclosed, including: a reaction chamber; an ignition chamber; a pipeline structure, wherein the reaction chamber and the ignition chamber are connected through the pipeline structure; the above-mentioned temperature regulating device is arranged on the pipeline structure and is used to regulate the temperature of the pipeline structure.

[0021] The temperature regulating device of the utility model is provided with a detection device on the basis of the original heat preservation structure, and the temperature feedback of the pipeline structure can be realized through the detection device, so that the heating power of the heating component can be controlled according to the temperature of the pipeline structure, and the heating amount of the heating component to the pipeline structure can be adjusted, thereby adjusting the temperature of the water vapor inside the pipeline structure. Compared with the prior art, the pipeline temperature can be effectively controlled, and the water vapor temperature can be prevented from being too low while preventing the sealing ring or gasket from melting, and the adjustment method is more flexible and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of semiconductor process equipment in the prior art;

[0023] Figure 2 It is a structural schematic diagram of a flange assembly in the prior art;

[0024] Figure 3 This is a schematic diagram of the structure of the temperature regulating device of the first embodiment of the utility model;

[0025] Figure 4 This is a schematic structural diagram of the heat preservation sleeve of the temperature regulating device of the first embodiment of the utility model;

[0026] Figure 5 for Figure 4 AA-direction cross-section of the middle insulation sleeve;

[0027] Figure 6 This is a schematic structural diagram of the thermal insulation sleeve of the temperature regulating device of the first embodiment of the utility model;

[0028] Figure 7 It is an assembly diagram of the thermal insulation sleeve of the temperature regulating device of the first embodiment of the utility model;

[0029] Figure 8 This is a schematic structural diagram of a semiconductor process equipment according to Embodiment 1 of the present utility model;

[0030] List of reference numerals:

[0031] 10. thermal insulation structure; 11. thermal insulation sleeve; 111. thermal insulation cover; 1111. first thermal insulation wall;

[0032] 1112, second insulation wall; 1113, third insulation wall; 112, first insulation layer; 113, second insulation layer; 114, connecting belt; 12, insulation sleeve; 121, third insulation layer; 20, heating component; 21, first heating wire; 211, first heating section; 212, second heating section; 213, third heating section; 22, second heating wire; 23, third heating wire; 30, detection device; 40, insulation chamber; 51, first avoidance hole; 51a, first avoidance groove; 52, second avoidance hole; 52a, second avoidance groove; 100, reaction chamber; 200, ignition chamber; 300, pipeline structure; 310, flange assembly; 311, flange; 312, flange clamp; 320, first pipeline; 330, second pipeline; 340, third pipeline; 400, insulation sleeve. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solution of the present invention, the temperature adjustment device and semiconductor process equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0034] like Figure 3 The first embodiment shown in the figure discloses a temperature regulating device, which is used for the pipeline structure 300 between the reaction chamber 100 and the ignition chamber 200. The temperature regulating device includes: a heat preservation structure 10, a heating component 20 (see Figure 4 ) and a detection device 30. The heat preservation structure 10 is used to be sleeved on the pipeline structure 300 between the reaction chamber 100 and the ignition chamber 200; the heating component 20 is arranged inside the heat preservation structure 10, and is used to heat the pipeline structure 300; the detection device 30 is used to detect the temperature of the pipeline structure 300, so as to control the heating power of the heating component 20 according to the temperature of the pipeline structure 300.

[0035] When in use, the heat loss rate of the pipeline structure 300 can be reduced through the insulation structure 10. In conjunction with the detection device 30 and the heating component 20, the current temperature of the pipeline structure 300 can be obtained through the detection device 30. When the temperature of the pipeline structure 300 is too low, the heating component 20 can be controlled to be turned on or the power of the heating component 20 can be increased to heat the pipeline structure 300, thereby increasing the temperature of the water vapor in the pipeline structure 300 and avoiding liquefaction of the water vapor; if the temperature of the pipeline structure 300 is too high, the heating component 20 can be controlled to be turned off or the power of the heating component 20 can be reduced, so that the pipeline structure 300 can dissipate heat and cool down naturally, avoiding melting of the sealing ring or gasket and reducing the risk of failure. The temperature regulating device for the pipeline structure 300 between the reaction chamber 100 and the ignition chamber 200 of the utility model is provided with a detection device 30 on the basis of the original heat preservation structure 10, and the temperature feedback of the pipeline structure 300 can be realized through the detection device 30, so that the heating power of the heating component 20 can be controlled according to the temperature of the pipeline structure 300, and the heating amount of the heating component 20 to the pipeline structure 300 can be adjusted, thereby adjusting the temperature of the water vapor inside the pipeline structure 300. Compared with the prior art, the pipeline temperature is effectively controlled, and while the sealing ring or gasket is prevented from melting, the water vapor temperature can also be prevented from being too low, and the adjustment method is more flexible and convenient.

[0036] It is understandable that the temperature regulating device may further include: a control device which is in communication with the detection device 30 and the heating assembly 20 respectively. By setting the control device, the control device may control the heating power of the heating assembly 20 according to the temperature of the pipeline structure 300 .

[0037] The first embodiment is described in detail below with reference to the accompanying drawings:

[0038] like Figure 3 As shown, the insulation structure 10 includes: an insulation sleeve 11. The insulation sleeve 11 is used to be installed on the flange assembly 310 of the pipeline structure 300. Figure 4 As shown, a heat preservation chamber 40 for accommodating the flange assembly 310 is provided inside the heat preservation sleeve 11 .

[0039] The heating assembly 20 includes: a first heating assembly, which is arranged between the inner wall and the outer wall of the insulation sleeve 11, that is, buried in the insulation sleeve 11; and a detection device 30 is arranged in the insulation cavity 40. When the insulation sleeve 11 is installed on the flange assembly 310, the detection device 30 is located between the inner wall of the insulation sleeve 11 and the flange assembly 310, so that the function of detecting the temperature of the flange assembly 310 can be realized.

[0040] like Figure 3 and Figure 4As shown, the insulation cover 11 includes: two insulation covers 111. The two insulation covers 111 are movably connected, and the insulation cover 11 has an insulation state and an avoidance state; in the insulation state of the insulation cover 11, the two insulation covers 111 are buckled together to enclose the insulation cavity 40; in the avoidance state of the insulation cover 11, the two insulation covers 111 are away from each other.

[0041] In this embodiment, if Figure 5 As shown, the two heat-insulating covers 111 are movably connected together by a connecting belt 114. The connecting belt 114 is made of ceramic fiber inside and is coated with alumina cloth outside. One end of the connecting belt 114 is sewn on one of the heat-insulating covers 111, and the other end of the connecting belt 114 is sewn on the other heat-insulating cover 111.

[0042] When in use, the two insulation covers 111 can be snapped together to enclose the insulation cavity 40 by being brought close to each other, so that the insulation cover 11 is in an insulation state; and by moving the two insulation covers 111 away from each other, a avoidance space is formed between the two insulation covers 111, so that the insulation cover 11 is in an avoidance state. During assembly or disassembly, the two insulation covers 111 can be moved away from each other, so that the insulation cover 11 is in an avoidance state. Due to the existence of the avoidance space, the insulation cover 111 can be easily assembled on the flange assembly 310 or removed from the flange assembly 310. After assembly, the two insulation covers 111 are snapped together from both sides of the flange assembly 310, so that the insulation cover 11 is in an insulation state. The flange assembly 310 is located in the insulation cavity 40 surrounded by the two accommodating spaces, and then the two insulation covers 111 are fixed by a drawstring to complete the installation. In this way, the installation and disassembly of the insulation cover 11 can be facilitated, and the assembly efficiency can be improved.

[0043] like Figure 4 As shown, the heat preservation cover 111 includes: a first heat preservation wall 1111, a second heat preservation wall 1112 and a third heat preservation wall 1113. Among them, the first heat preservation wall 1111 and the first direction (that is, Figure 4 The second insulation wall 1112 is parallel to the first insulation wall 1111, and the first insulation wall 1111 and the second insulation wall 1112 are arranged opposite to each other and spaced a distance apart in the first direction. The third insulation wall 1113 is respectively connected to the first insulation wall 1111 and the second insulation wall 1112, and the first insulation wall 1111, the second insulation wall 1112 and the third insulation wall 1113 together form a cover structure with an opening, that is, the insulation cover 111. The first insulation wall 1111, the second insulation wall 1112 and the third insulation wall 1113 together form a cover structure with an opening, so that the insulation cover 111 has a heat preservation function and can also be easily installed and disassembled, thereby improving maintenance efficiency.

[0044] It is understandable that, usually, the flange assembly 310 includes: a flange 311 and a flange clamp 312, the flange clamp 312 is sleeved on the flange 311, and the two sides of the flange 311 are respectively connected with pipes. Therefore, the insulation sleeve 11 also needs to be provided with corresponding first avoidance holes 51 and second avoidance holes 52 to avoid the pipes connected on both sides of the flange 311, so as to achieve better fit with the flange assembly 310, thereby improving the insulation effect, and can also improve the accuracy of temperature detection and the accuracy of temperature adjustment. Among them, the insulation sleeve 11 has a first end and a second end arranged oppositely in the first direction; the end wall of the first end of the insulation sleeve 11 is provided with a first avoidance hole 51 connected to the insulation chamber 40; the end wall of the second end of the insulation sleeve 11 is provided with a second avoidance hole 52 connected to the insulation chamber 40.

[0045] like Figure 4 As shown, the first heat-insulating wall 1111 is provided with a first avoidance groove 51a, and the second heat-insulating wall 1112 is provided with a second avoidance groove 52a. Figure 5 As shown, in the heat preservation state of the heat preservation cover 11, the first heat preservation walls 1111 on the two heat preservation covers 111 form the end wall of the first end of the heat preservation cover 11, and the two first avoidance grooves 51a surround the first avoidance hole 51; similarly, the second heat preservation walls 1112 on the two heat preservation covers 111 form the end wall of the second end of the heat preservation cover 11, and the two second avoidance grooves 52a surround the second avoidance hole 52. By arranging avoidance grooves on the heat preservation walls respectively and making the two avoidance grooves surround the avoidance hole, not only the assembly process is made more convenient, but also the avoidance grooves and the pipeline can be positioned with each other, so that the assembly of the heat preservation cover 111 is quick and convenient.

[0046] like Figure 4 As shown, the size of the first avoidance hole 51 is relatively large. This is because, during use, the large-sized first avoidance hole 51 allows the end of the heating belt to be inserted into the first avoidance hole 51, avoiding the formation of a gap between the insulation sleeve 11 and the heating belt, thereby improving the insulation effect.

[0047] It can be understood that in order to avoid excessive circumferential heat dissipation of the flange assembly 310, which may cause the circumferential surface temperature of the insulation sleeve 11 to be too high, in this embodiment, the thickness of the first insulation wall 1111 and the third insulation wall 1113 are relatively thick to increase the thermal insulation and reduce excessive circumferential heat dissipation of the flange assembly 310.

[0048] During use, the temperature of the flange assembly 310 is detected by the detection device 30. If the temperature of the flange assembly 310 is too high, it means that the risk of melting of the sealing ring or gasket is increased. Therefore, it is necessary to control the first heating assembly to reduce the heating power or stop heating, so as to reduce the temperature of the flange assembly 310 by natural heat dissipation. If the temperature of the flange assembly 310 is too low, it means that the risk of liquefaction of the internal water vapor is relatively high. Therefore, it is necessary to turn on the first heating assembly or increase the heating power to heat the flange assembly 310, so as to increase the temperature of the flange assembly 310, thereby increasing the temperature of the internal water vapor and reducing the risk of liquefaction.

[0049] The temperature regulating device of the utility model can regulate the temperature of the flange assembly 310 by setting the insulation sleeve 11. Since the flange plate and the flange clamp 312 at the position of the flange assembly 310 have a large area, the heat dissipation of the pipeline structure 300 at the position of the flange assembly 310 will be relatively large, resulting in a decrease in the internal water vapor temperature. The heat dissipation at the flange assembly 310 can be effectively reduced by setting the insulation sleeve 11. Moreover, by setting the detection device 30 and the first heating assembly, the power of the first heating assembly can be adjusted according to the temperature of the flange assembly 310 to avoid the water vapor temperature being too high, causing the internal sealing ring or the gasket between the flange clamp and the flange plate to melt, resulting in failure of the sealing or protective function. It can also avoid the water vapor being too low, causing the water vapor to liquefy and affect the process quality. Compared with the prior art, the control method is more flexible and more efficient.

[0050] like Figure 4 As shown, there are two first heating components, and one first heating component is arranged in each insulation sleeve 11. Among them, the first heating component includes: a first heating wire 21. The first heating wire 21 is buried in the third insulation wall 1113 along the first direction, that is, between the inner wall surface and the outer wall surface of the third insulation wall 1113. The first heating wire 21 extends to the first insulation wall 1111 and the second insulation wall 1112 in the first direction respectively, and the first heating wire 21 has a first heating section 211, a second heating section 212 and a third heating section 213 along the first direction. In this embodiment, the density of the first heating section 211 is equal to the setting density of the third heating section 213, and the setting density of the second heating section 212 is less than the setting density of the first heating section 211. Preferably, the setting density of the first heating section 211 is S1, the setting density of the second heating section 212 is S2, and the setting density of the third heating section 213 is S3, S3=S1, and the value range of S2:S1 is 1 / 3 to 1 / 2.

[0051] like Figure 4 As shown, since the second heating segment 212 is located in the middle of the flange assembly 310, which corresponds exactly to the position of the sealing ring, the second heating segment 212 at this position is arranged with a lower density to avoid affecting the sealing ring when the heating wire is heated.

[0052] It should be noted that, in this embodiment, S3=S1, but this is not restrictive. In some other embodiments not shown in the figure, S3 can be greater than S1, or S3 can be less than S1. When S3>S1, the value range of S2:S1 is 1 / 3 to 1 / 2, and when S1>S3, the value range of S2:S1 is 1 / 3 to 1 / 2. The above-mentioned setting density of the second heating section 212 is within the protection scope of the present utility model.

[0053] like Figure 4 As shown, the first heating component also includes: a second heating wire 22. Figure 4 As shown, the second heating wire 22 is arranged along the second direction ( Figure 4 The first direction is perpendicular to the second direction; the arrangement density of the first heating wire 21 is less than the arrangement density of the second heating wire 22. Preferably, the arrangement density of the second heating wire 22 is S4, and the value range of S2:S4 is 1 / 4 to 1 / 5.

[0054] Since the metal sheets on both sides of the flange 311 have a large area, the heat dissipation is faster. In addition, the installation space at this position is limited. In the first direction, the end wall thickness of the insulation sleeve 11 is thinner. Therefore, after the insulation sleeve 11 is set, the heat loss rate of the end wall at both ends of the insulation sleeve 11 is also high. Therefore, when the second heating wire 22 is set at the corresponding position, that is, inside the first insulation wall 1111 and the second insulation wall 1112, the second heating wire 22 is set at a higher density than the first heating wire 21, so that the heat of the heat dissipation is supplemented by the heating capacity of the second heating wire 22, the heat loss of the water vapor inside the flange assembly 310 is reduced, and the condensation of the water vapor is avoided.

[0055] like Figure 6 As shown, the insulation structure 10 also includes: an insulation sleeve 12, which is used to be sleeved on the pipe connected to the flange 311 in the pipeline structure 300, the detection device 30 is arranged on the inner wall of the insulation sleeve 12, and the heating component 20 is arranged between the inner wall and the outer wall of the insulation sleeve 12.

[0056] During use, the temperature of the pipe connected to the flange 311 is detected by the detection device 30. If the pipe temperature is too high, it means that the sealing ring or gasket on the flange 311 is at risk of melting. Therefore, it is necessary to control the heating component 20 to reduce the heating power or stop heating to reduce the temperature of the pipe by natural heat dissipation. If the temperature of the pipe is too low, it means that the risk of liquefaction of the internal water vapor is relatively high. Therefore, it is necessary to turn on the heating component 20 or increase the heating power to heat the pipe, increase the temperature of the pipe, and then increase the temperature of the internal water vapor to reduce the risk of liquefaction.

[0057] like Figure 6 As shown, the heating component 20 also includes a second heating component, wherein the second heating component includes: a third heating wire 23, the third heating wire 23 is arranged between the inner circumferential wall and the outer circumferential wall of the thermal insulation sleeve 12, and the setting density of the third heating wire 23 is less than the minimum setting density of the first heating wire 21. Preferably, the minimum setting density of the first heating wire 21 is S5, the setting density of the third heating wire 23 is S6, and the value range of S6:S5 is 1 / 5 to 1 / 4. Among them, in this embodiment, the minimum setting density of the first heating wire 21 is the setting density S2 of the second heating section 212. Therefore, in this embodiment, S2=S5, that is, the value range of S6:S2 is 1 / 5 to 1 / 4. In this embodiment, as Figure 7 As shown, the insulation sleeve 12 is arranged on the terminal pipeline of the ignition chamber 200, and the pipeline temperature is relatively high. Therefore, even if heating is required, the required heating amount is relatively small. Therefore, the setting density of the third heating wire 23 can be smaller than the setting density of the second heating section 212 in the insulation sleeve 12 to save costs and reduce the risk of overheating the water vapor inside the pipeline.

[0058] It should be noted that, in the present embodiment, the first heating wire 21 is a spiral structure extending along the first direction, and the setting density of the first heating section 211, the second heating section 212, and the third heating section 213 refers to three sections of spiral structures with different degrees of tightness connected in sequence in the first direction, wherein different degrees of tightness refer to different distances between adjacent coils in each section of the spiral structure. Taking the second heating section 212 as an example, the setting density of the second heating section 212 is relatively large, which means that the spiral structure of the second heating section 212 in the first direction is tightly packed, that is, the distance between adjacent coils in the spiral structure is relatively small. Conversely, the setting density of the second heating section 212 is relatively small, which means that the spiral structure of the first heating wire 21 in the first direction is tightly packed, that is, the distance between adjacent coils in the spiral structure is relatively large. Similarly, the first heating section 211 and the third heating section 213 are also the same, so they are not repeated here.

[0059] It can be understood that in this embodiment, the second heating wire 22 is a spiral structure extending along the second direction, and the spacing between the coils in the spiral structure is equal. Therefore, the arrangement density of the second heating wire 22 refers to the compactness of the spiral structure in the second direction, and can also be understood as the distance between adjacent coils in the spiral structure. Similarly, the third heating wire 23 is also the same, so it is not repeated.

[0060] Therefore, in the above embodiment, the ratio relationship between the setting density of different heating sections in the first heating wire 21 is equivalent to the inverse relationship between the spacing between adjacent coils in the spiral structure corresponding to each heating section. For example, the ratio relationship between S2 and S1 is equivalent to the inverse relationship between the spacing between adjacent coils in the spiral structure of the second heating section 212 and the spacing between adjacent coils in the spiral structure of the first heating section 211. Similarly, the ratio relationship between the setting density of the second heating section 212 and the second heating wire 22 and the third heating wire 23 is also the same, so it will not be repeated.

[0061] like Figure 4 As shown, from the perspective of thermal insulation materials, the thermal insulation sleeve 11 has a first thermal insulation layer 112, a second thermal insulation layer 113 and a protective layer which are arranged in sequence from the inside to the outside, and the protective layer covers the outer surface of the second thermal insulation layer 113, wherein the thermal insulation materials of the first thermal insulation layer 112 and the second thermal insulation layer 113 are thermal insulation blankets woven from ceramic fibers, and the material of the protective layer is alumina cloth, and the protective layer can protect the internal thermal insulation layer by setting the protective layer.

[0062] The first heating assembly (that is, the first heating wire 21 and the second heating wire 22) is arranged in the first insulation layer 112, and the density of the insulation material of the first insulation layer 112 is less than the density of the insulation material of the second insulation layer 113. Preferably, the density of the insulation material of the first insulation layer 112 is ρ1, and the density of the insulation material of the second insulation layer 113 is ρ2, and the value range of ρ1:ρ2 is 1 / 3 to 1 / 2. The first heating wire 21 and the second heating wire 22 are arranged in the first insulation layer 112. Since the density of the insulation material of the first insulation layer 112 is less than the density of the insulation material of the second insulation layer 113, it can ensure that more heat of the first heating wire 21 and the second heating wire 22 is transferred to the flange assembly 310, reduce the heat dissipation of the first heating wire 21 and the second heating wire 22, and improve the heating efficiency.

[0063] It can be understood that in this embodiment, the first insulation wall 1111, the second insulation wall 1112 and the third insulation wall 1113 are integrally formed, and the first insulation wall 1111, the second insulation wall 1112 and the third insulation wall 1113 all have a first insulation layer 112, a second insulation layer 113 and a protective layer.

[0064] like Figure 6As shown, similarly, from the perspective of thermal insulation materials, the thermal insulation sleeve 12 has a third thermal insulation layer 121, and the second heating assembly (that is, the third heating wire 23) is arranged in the third thermal insulation layer 121. Among them, the thermal insulation material of the third thermal insulation layer 121 is a thermal insulation blanket woven from ceramic fibers, and in order to protect the device and insulate, the outer surface of the third thermal insulation layer 121 is also covered with alumina cloth.

[0065] The density of the insulation material of the third insulation layer 121 is less than the density of the insulation material of the second insulation layer 113. Preferably, the density of the insulation material of the second insulation layer 113 is ρ2, and the density of the insulation material of the third insulation layer 121 is ρ3, and the value range of ρ3:ρ2 is 1 / 5 to 1 / 4. Figure 7 As shown, in the present embodiment, since the insulation sleeve 11 is arranged on the terminal pipeline of the ignition chamber 200, the pipeline temperature is relatively high. Therefore, in order to prevent the temperature of the water vapor in the terminal pipeline from being too high, the insulation material setting density ρ3 of the third insulation layer 121 is 1 / 5 to 1 / 4 of the insulation material setting density ρ2 of the second insulation layer 113. In this way, while ensuring that the terminal pipeline temperature is higher than the water vapor condensation temperature, if the temperature is too high, the heat can be dissipated in time to reduce the risk of overheating the water vapor inside the pipeline.

[0066] It should be noted that, in the present embodiment, the density of the insulation material setting of the first insulation layer 112 refers to the compactness of the insulation material setting, that is, the amount of the same insulation material filled in a unit space. The more the same insulation material is filled in a unit space, the better the insulation effect, and vice versa. In the present embodiment, the value range of ρ1:ρ2 is 1 / 3 to 1 / 2, indicating that the number of ceramic fibers in the first insulation layer 112 in a unit space is 1 / 3 to 1 / 2 of the number of ceramic fibers in the second insulation layer 113. Similarly, the value range of ρ3:ρ2 is 1 / 5 to 1 / 4, indicating that the number of ceramic fibers in the third insulation layer 121 in a unit space is 1 / 5 to 1 / 4 of the number of ceramic fibers in the second insulation layer 113.

[0067] In this embodiment, the detection device 30 includes a plurality of temperature sensors, which are spaced apart inside the insulation sleeve 11 and the insulation sleeve 12. Specifically, Figure 3 As shown, the temperature sensors are respectively arranged on the inner wall of the heat preservation chamber 40 of the heat preservation sleeve 11, and the temperature sensors are spaced apart and distributed along the first direction; Figure 6 and Figure 7 As shown, the temperature sensors on the thermal insulation sleeve 12 are arranged on the inner peripheral wall of the thermal insulation sleeve 12 and are distributed at intervals along the extension direction of the thermal insulation sleeve 12 .

[0068] This arrangement can detect the temperatures at different locations in the pipeline structure 300 respectively, and can more accurately obtain the temperature conditions at different locations in the pipeline structure 300, thereby better controlling the heating component 20 to adjust the temperature of the pipeline.

[0069] like Figure 8 The first embodiment shown also discloses a semiconductor process equipment, including: a reaction chamber 100, an ignition chamber 200, a pipeline structure 300, the above-mentioned temperature adjustment device and a heat preservation sleeve 400. The reaction chambers 100 are connected through the pipeline structure 300; the temperature adjustment device is arranged on the pipeline structure 300, and is used to adjust the temperature of the pipeline structure 300.

[0070] Specifically, if Figure 8 As shown, the pipeline structure 300 includes: a first pipeline 320, a second pipeline 330, a third pipeline 340 and a flange assembly 310, the first pipeline 320 is connected to the ignition chamber 200, and the third pipeline 340 is connected to the reaction chamber 100. The flange assembly 310 includes: a flange 311 and a flange clamp 312, the flange clamp 312 is sleeved on the flange 311, and the first pipeline 320 and the second pipeline 330, and the second pipeline 330 and the third pipeline 340 are connected through the flange 311; the insulation structure 10 includes an insulation sleeve 11 and an insulation sleeve 12, the insulation sleeve 11 is covered on the flange assembly 310, and the insulation sleeve 12 is sleeved on the first pipeline 320. The insulation sleeve 400 is sleeved on the second pipeline 330. In order to improve the insulation effect, the end of the insulation sleeve 400 can be set in the avoidance hole of the insulation sleeve 11.

[0071] When in use, the temperature regulating device can not only reduce the speed of heat loss in the pipeline, but also control the temperature of the entire pipeline structure 300. When the temperature of the pipeline structure 300 is too low, the heating component 20 can be controlled to be turned on or the power of the heating component 20 can be increased to heat the pipeline, thereby increasing the temperature of the water vapor in the pipeline to prevent the water vapor from liquefying; if the temperature of the pipeline structure 300 is too high, the heating component 20 can be controlled to be turned off or the power of the heating component 20 can be reduced, so that the pipeline naturally dissipates heat and cools down, avoiding the melting of the sealing ring or gasket, and reducing the risk of failure.

[0072] The reaction chamber 100 of the utility model can control the heating power of the heating component 20 according to the temperature of the pipeline structure 300 by providing a temperature regulating device, thereby regulating the heating amount of the pipeline structure 300 by the heating component 20, and further regulating the temperature of the water vapor inside the pipeline structure 300. Compared with the prior art, the pipeline temperature is effectively controlled, and while the sealing ring or gasket is prevented from melting, the water vapor temperature can also be prevented from being too low, and the regulating method is more flexible and convenient.

[0073] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A temperature regulating device, used for a pipeline structure (300) between a reaction chamber (100) and an ignition chamber (200), characterized in that: The temperature regulating device comprises: A heat-insulating structure (10), the heat-insulating structure (10) being used to be sleeved on a pipeline structure (300) between the reaction chamber (100) and the ignition chamber (200); a heating component (20), the heating component (20) being arranged inside the heat-insulating structure (10) and being used to heat the pipeline structure (300); A detection device (30) is used to detect the temperature of the pipeline structure (300) so as to control the heating power of the heating component (20) according to the temperature of the pipeline structure (300).

2. The temperature adjustment device according to claim 1, characterized in that: The thermal insulation structure (10) comprises: A thermal insulation sleeve (11), the thermal insulation sleeve (11) being used for being installed on a flange assembly (310) of the pipeline structure (300), and a thermal insulation cavity (40) for accommodating the flange assembly (310) being provided inside the thermal insulation sleeve (11); The heating component (20) comprises: a first heating component, the first heating component being arranged between the inner wall and the outer wall of the thermal insulation sleeve (11); The detection device (30) is arranged in the heat preservation chamber (40).

3. The temperature adjustment device according to claim 2, characterized in that: The thermal insulation cover (11) comprises: Two heat-insulating covers (111), the two heat-insulating covers (111) are movably connected, and the heat-insulating cover (111) has a heat-insulating state and an avoidance state; When the heat-insulating sleeve (11) is in a heat-insulating state, the two heat-insulating covers (111) are buckled together to enclose the heat-insulating chamber (40); In the avoidance state of the heat-insulating sleeve (11), the two heat-insulating covers (111) are away from each other.

4. The temperature adjustment device according to claim 3, characterized in that: The heat-insulating cover (111) comprises: A first heat-insulating wall (1111) perpendicular to the first direction; a second thermal insulation wall (1112) parallel to the first thermal insulation wall (1111), and the first thermal insulation wall (1111) and the second thermal insulation wall (1112) are arranged opposite to each other in the first direction; The third thermal insulation wall (1113) is connected to the first thermal insulation wall (1111) and the second thermal insulation wall (1112), respectively; the first thermal insulation wall (1111), the second thermal insulation wall (1112) and the third thermal insulation wall (1113) form the thermal insulation cover (111).

5. The temperature adjustment device according to claim 4, characterized in that: The thermal insulation sleeve (11) has a first end and a second end arranged opposite to each other in a first direction; A first avoidance hole (51) communicating with the heat preservation cavity (40) is provided on the end wall of the first end of the heat preservation sleeve (11); A second avoidance hole (52) communicating with the heat preservation cavity (40) is provided on the end wall of the second end of the heat preservation sleeve (11); The first avoidance hole (51) and the second avoidance hole (52) are used for passing a pipeline in the pipeline structure (300) connected to the flange (311) of the flange assembly (310).

6. The temperature adjustment device according to claim 5, characterized in that: The first heat-insulating wall (1111) is provided with a first avoidance groove (51a); The second heat-insulating wall (1112) is provided with a second avoidance groove (52a); In the heat-insulating state of the heat-insulating sleeve (11), the first heat-insulating walls (1111) on the two heat-insulating covers (111) form the end wall of the first end of the heat-insulating sleeve (11), and the two first avoidance grooves (51a) surround the first avoidance hole (51); The second heat-insulating walls (1112) on the two heat-insulating covers (111) form the end wall of the second end of the heat-insulating sleeve (11), and the two second avoidance grooves (52a) enclose the second avoidance hole (52).

7. The temperature adjustment device according to claim 4, characterized in that: The first heating component comprises: A first heating wire (21) is buried inside the third heat-insulating wall (1113) along the first direction; The first heating wire (21) has a first heating section (211), a second heating section (212) and a third heating section (213) along the first direction; The arrangement density of the second heating section (212) is smaller than the arrangement density of the first heating section (211), and / or The arrangement density of the second heating section (212) is smaller than the arrangement density of the third heating section (213).

8. The temperature adjustment device according to claim 7, characterized in that: The first heating component also includes: A second heating wire (22) is respectively buried inside the first thermal insulation wall (1111) and the second thermal insulation wall (1112) along a second direction, wherein the first direction intersects with the second direction; The arrangement density of the first heating wires (21) is smaller than the arrangement density of the second heating wires (22).

9. The temperature adjustment device according to claim 7, characterized in that: The thermal insulation sleeve (11) comprises a first thermal insulation layer (112) and a second thermal insulation layer (113) which are arranged in sequence from the inside to the outside, the first heating component is arranged in the first thermal insulation layer (112), and the thermal insulation material arrangement density of the first thermal insulation layer (112) is less than the thermal insulation material arrangement density of the second thermal insulation layer (113).

10. The temperature adjustment device according to claim 9, characterized in that: The thermal insulation structure (10) comprises: a heat-insulating sleeve (12), the heat-insulating sleeve (12) being used for being sleeved on a pipe connected to a flange (311) of the flange assembly (310) in the pipe structure (300), the detection device (30) being arranged on an inner wall of the heat-insulating sleeve (12); The heating component (20) further comprises: a second heating component, the second heating component being arranged between the inner wall and the outer wall of the thermal insulation sleeve (12).

11. The temperature adjustment device according to claim 10, characterized in that: The thermal insulation sleeve (12) has a third thermal insulation layer (121), the second heating component is arranged in the third thermal insulation layer (121), and the thermal insulation material setting density of the third thermal insulation layer (121) is less than the thermal insulation material setting density of the second thermal insulation layer (113).

12. The temperature adjustment device according to claim 11, characterized in that: The second heating assembly comprises: The third heating wire (23) is arranged between the inner wall and the outer wall of the thermal insulation sleeve (12), and the third heating wire (23) is located in the third thermal insulation layer (121), and the arrangement density of the third heating wire (23) is less than the minimum arrangement density of the first heating wire (21).

13. A semiconductor process equipment, characterized in that: include: A reaction chamber (100); an ignition chamber (200); A pipeline structure (300), wherein the reaction chamber (100) and the ignition chamber (200) are connected via the pipeline structure (300); The temperature regulating device according to any one of claims 1 to 12 is arranged on the pipeline structure (300) and is used to regulate the temperature of the pipeline structure (300).