FPC board binding structure
By adopting a double-row tie-in positioning design on the FPC board of the LCD screen, the problem of high production costs caused by excessive width of the FPC board in the prior art is solved, and the display effect with lower cost and higher driving capabilities is achieved.
Patent Information
- Application Number
- CN202420139334.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-01-19
AI Technical Summary
In the prior art, the driver IC on the LCD screen requires more binding and positioning, resulting in a wider design of the FPC board and increasing production costs.
By adjusting the binding positioning design, the first binding pin and the second binding pin are changed to a double-row design, and the width of the first communication area and the second communication area are reduced laterally, thereby reducing the width and production cost of the FPC board.
It realizes reducing production costs by reducing the width of the FPC board, while improving display effect and driving capabilities.
Smart Images
Figure CN222618935U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display screens, in particular to an FPC board binding structure. Background Art
[0002] At present, the driver IC on the LCD screen needs to be bound to conduct with the binding position, and the FPC board is hot pressed on the binding position through the conductive gold ball, so as to realize the connection between the driver IC input signal and the external device.
[0003] In the related art, the more binding bits are required for the input interface of the driver IC, the wider the corresponding FPC board needs to be designed, thereby increasing the production cost. Utility Model Content
[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide an FPC board binding structure, which can shorten the width of the FPC board by adjusting the design of the binding position, thereby reducing the production cost.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] The first aspect of the present application provides an FPC board binding structure, comprising: a board body, on which a first connection area and a second connection area are opened, and the first connection area and the second connection area are parallel to each other; and a conductive component, the conductive component includes a first binding pin and a second binding pin, the first binding pin is arranged in the first connection area, and the second binding pin is arranged in the second connection area.
[0007] The conductive component further includes a first power pin and a second power pin, the first power pin is arranged in the first connection area, the second power pin is arranged in the second connection area, and the first power pin is connected to the second power pin.
[0008] It also includes a driving IC, and the driving IC is electrically connected to the second power pin, the first binding pin and the second binding pin respectively.
[0009] The board body is also provided with a gap area, and the first binding pin passes through the gap area.
[0010] It also includes a positioning mark, which is arranged in the second connected area.
[0011] The driver IC is provided with an interface.
[0012] The cross-sectional structure of the plate body is a rectangular structure.
[0013] It also includes a plug-in end, which is arranged on the plate body.
[0014] It also includes a cover plate assembly, which includes a first glass cover plate and a second glass cover plate. The first glass cover plate is arranged on the second glass cover plate, and the plate body is arranged on the first glass cover plate.
[0015] The cover plate assembly further includes a first polarizer and a second polarizer, wherein the first polarizer is disposed on the first glass cover plate, and the second polarizer is disposed on the second glass cover plate.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] By changing the first binding pins and the second binding pins to a double-row design, the widths of the first connection area and the second connection area can be reduced laterally, and correspondingly, the width of the board can be reduced, thereby reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 It is a structural schematic diagram of the FPC board binding structure in one embodiment of the utility model;
[0020] Figure 2 It is a structural schematic diagram of another implementation of the FPC board binding structure in one embodiment of the utility model;
[0021] Figure 3 It is a structural schematic diagram of another implementation of the FPC board binding structure in one embodiment of the utility model. DETAILED DESCRIPTION
[0022] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0023] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0024] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0025] See also Figure 1 , an FPC board binding structure, including: a board body 100 and a conductive component 200, the board body 100 is provided with a first connecting area 110 and a second connecting area 120, the first connecting area 110 and the second connecting area 120 are parallel to each other; the conductive component 200 includes a first binding pin 210 and a second binding pin 220, the first binding pin 210 is arranged in the first connecting area 110, and the second binding pin 220 is arranged in the second connecting area 120.
[0026] Specifically, a driving IC 300 is further included. The driving IC 300 is electrically connected to the second power pin 240 , the first binding pin 210 and the second binding pin 220 , respectively.
[0027] It should be noted that a gap area 130 is also provided on the board body 100, and the first binding pin 210 passes through the gap area 130. The first binding pin 210 and the second binding pin 220 are designed in double rows, and the first binding pin 210 cross-connects the driver IC 300 by passing through the gap area 130 and the second binding pin 220. By adopting the above method, the width of the first connection area 110 and the second connection area 120 can be reduced laterally, and correspondingly, the width of the board body 100 can be reduced, thereby reducing the production cost.
[0028] See also Figure 2In one embodiment, the conductive component 200 further includes a first power pin 230 and a second power pin 240 , the first power pin 230 is disposed in the first connection area 110 , the second power pin 240 is disposed in the second connection area 120 , and the first power pin 230 is connected to the second power pin 240 .
[0029] It should be noted that the first power pin 230 and the second power pin 240 are combined into a plurality of binding positions, which can increase the area, reduce the ITO wiring impedance, enhance the overall driving capability of the LCD, and thus improve the display effect.
[0030] See also Figure 2 In one embodiment, it also includes a positioning mark 400, which is disposed in the second communication area 120.
[0031] It should be noted that the design of the alignment mark 400 can play a fool-proof role when the plate body 100 is bound to the binding position.
[0032] See also Figure 2 In one embodiment, the driver IC 300 is provided with an interface for binding with the first binding pin 210 , the second binding pin 220 , and the second power pin 240 .
[0033] See also Figure 1 In one embodiment, the cross-sectional structure of the plate body 100 is a rectangular structure. It should be noted that the plate body 100 of the present application can be designed as a rectangular structure, which reduces the width compared to the traditional structure and saves production costs.
[0034] See also Figure 1 In one embodiment, the board 100 further includes a plug-in terminal 500, which is disposed on the board 100. It should be noted that the plug-in terminal 500 is used to plug in an external mainboard.
[0035] See also Figure 3 In one embodiment, the cover assembly 600 is further included, and the cover assembly 600 includes a first glass cover 610 and a second glass cover 620, the first glass cover 610 is disposed on the second glass cover 620, and the plate body 100 is disposed on the first glass cover 610. Specifically, the cover assembly 600 also includes a first polarizer 630 and a second polarizer 640, the first polarizer 630 is disposed on the first glass cover 610, and the second polarizer 640 is disposed on the second glass cover 620.
[0036] It should be noted that a liquid crystal cell is formed between the first glass cover plate 610 and the second glass cover plate 620, and the liquid crystal is driven to reverse when powered on. The first polarizer 630 and the second polarizer 640 are used to adjust the polarization direction of light.
[0037] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.
[0038] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. An FPC board binding structure, characterized in that: include: A plate body, wherein a first communication area and a second communication area are formed on the plate body, and the first communication area and the second communication area are parallel to each other; and The conductive component includes a first binding pin and a second binding pin, wherein the first binding pin is arranged in the first connection area, and the second binding pin is arranged in the second connection area.
2. The FPC board binding structure according to claim 1, characterized in that: The conductive component further includes a first power pin and a second power pin, the first power pin is arranged in the first connection area, the second power pin is arranged in the second connection area, and the first power pin is connected to the second power pin.
3. The FPC board binding structure according to claim 2, characterized in that: It also includes a driving IC, and the driving IC is electrically connected to the second power pin, the first binding pin and the second binding pin respectively.
4. The FPC board binding structure according to claim 1, characterized in that: The board body is also provided with a gap area, and the first binding pin passes through the gap area.
5. The FPC board binding structure according to claim 1, characterized in that: It also includes a positioning mark, which is arranged in the second connected area.
6. The FPC board binding structure according to claim 3, characterized in that: The driver IC is provided with an interface.
7. The FPC board binding structure according to claim 1, characterized in that: The cross-sectional structure of the plate body is a rectangular structure.
8. The FPC board binding structure according to claim 1, characterized in that: It also includes a plug-in end, which is arranged on the plate body.
9. The FPC board binding structure according to claim 1, characterized in that: It also includes a cover plate assembly, which includes a first glass cover plate and a second glass cover plate. The first glass cover plate is arranged on the second glass cover plate, and the plate body is arranged on the first glass cover plate.
10. The FPC board binding structure according to claim 9, characterized in that: The cover plate assembly further includes a first polarizer and a second polarizer, wherein the first polarizer is disposed on the first glass cover plate, and the second polarizer is disposed on the second glass cover plate.