Computer radiator

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a computer radiator which comprises a bottom plate, first radiating fins, a heat pipe and a cover plate, and the bottom plate corresponds to the cover plate in position. A supporting frame extending outwards is arranged on the bottom plate, a plurality of first cooling fins are arranged between the supporting frame and the cover plate, and the heights of the first cooling fins are distributed in a V shape; and the side wall of the first radiating fin is provided with conducting bulges which are distributed in a wave shape. The heat pipe penetrates through the first cooling fin and is fixedly connected with the first cooling fin. A plurality of second cooling fins are arranged between the supporting frame and the bottom plate on the side wall of the first cooling fin, and a third cooling fin is arranged at the lower end of the bottom plate. According to the design, the supporting frame extending outwards is arranged on the bottom plate, and the first cooling fins distributed in the V shape are arranged between the supporting frame and the cover plate, so that the cooling area is remarkably increased. Meanwhile, the side walls of the first cooling fins are provided with the conducting protrusions which are distributed in a wave shape, heat can be guided to be dissipated more effectively, and the cooling efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and in particular relates to a computer radiator. Background Art

[0002] With the rapid development of computer technology, computer performance has been greatly improved, but it has also brought more serious heat dissipation problems. Efficient heat dissipation design is crucial to ensure the stable operation of computers and extend their service life. Traditional computer radiators usually use a simple fan and heat sink structure with limited heat dissipation efficiency, especially when running under high load, the heat dissipation effect is often unsatisfactory. In addition, traditional radiators are often relatively simple in structural design and lack refined control of heat dissipation performance, making it difficult to further improve heat dissipation efficiency.

[0003] Therefore, developing a new type of computer radiator, improving the heat dissipation efficiency and reducing the heat generated when the computer is running by optimizing the structural design and material selection of the radiator, has important practical significance and application value for solving the current computer heat dissipation problem. Utility Model Content

[0004] The utility model aims to provide a computer radiator to solve the above problems.

[0005] To achieve the above-mentioned purpose, the utility model provides a computer radiator, including a base plate, a first heat sink, a heat pipe and a cover plate, and the base plate and the cover plate are positioned correspondingly. A support frame extending outward is provided on the base plate, and a plurality of first heat sinks are arranged between the support frame and the cover plate, and the height of the first heat sink is distributed in a V shape; a wave-shaped conductive protrusion is provided on the side wall of the first heat sink. The heat pipe passes through the first heat sink and is fixedly connected thereto. A plurality of second heat sinks are arranged between the support frame and the base plate on the side wall of the first heat sink, and a third heat sink is arranged at the lower end of the base plate.

[0006] Furthermore, mounting platforms are provided at both ends of the bottom plate, and penetrating mounting holes are provided on the mounting platforms.

[0007] Furthermore, the two first heat sinks located at the outermost ends are also connected to a protective plate, and the width of the mounting platform is consistent with the protective plate.

[0008] Furthermore, the distance between the first heat sinks is greater than 4 mm and less than 8 mm.

[0009] Furthermore, the first heat sink and the third heat sink are arranged vertically, and the second heat sink is arranged horizontally.

[0010] Furthermore, the base plate, the cover plate, the first heat sink, the second heat sink and the third heat sink are all made of carbon steel.

[0011] The above one or more technical solutions in the computer radiator provided by the embodiment of the utility model have at least the following technical effects:

[0012] This design significantly improves the heat dissipation area by setting an outwardly extending support frame on the bottom plate and setting a first heat sink with a V-shaped distribution between the support frame and the cover plate. At the same time, the side wall of the first heat sink is provided with a wave-shaped conductive protrusion, which can more effectively guide the heat dissipation and improve the heat dissipation efficiency. A number of second heat sinks are provided between the support frame and the bottom plate, and a third heat sink is provided at the lower end of the bottom plate. This multi-level heat dissipation design can form a more complex heat dissipation channel, so that the heat can be dissipated more evenly and avoid the occurrence of local overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0014] Figure 1 This is a front view of a computer radiator provided by an embodiment of the utility model.

[0015] Figure 2 A three-dimensional diagram of a computer radiator provided in an embodiment of the utility model.

[0016] Explanation of main reference numerals: 100, bottom plate; 110, first heat sink; 120, heat pipe; 130, cover plate; 140, support frame; 150, conductive protrusion; 160, second heat sink; 170, third heat sink; 180, mounting platform; 190, mounting hole; 200, protective plate. DETAILED DESCRIPTION

[0017] The following describes the embodiments of the present invention in detail. Figures 1-2 , wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. Figures 1-2 The described embodiments are exemplary and are intended to be used to explain the embodiments of the present invention, but should not be construed as limiting the present invention.

[0018] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0019] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0020] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0021] In the embodiment of the utility model, this case provides a computer radiator, including a base plate 100, a first heat sink 110, a heat pipe 120 and a cover plate 130, and the base plate 100 and the cover plate 130 are located in corresponding positions. A support frame 140 extending outward is provided on the base plate 100, and a plurality of first heat sinks 110 are arranged between the support frame 140 and the cover plate 130, and the height of the first heat sink 110 is distributed in a V shape. The side wall of the first heat sink 110 is provided with a wave-shaped conductive protrusion 150; the heat pipe 120 passes through the first heat sink 110 and is fixedly connected thereto. A plurality of second heat sinks 160 are arranged between the support frame 140 and the base plate 100 on the side wall of the first heat sink 110, and a third heat sink 170 is arranged at the lower end of the base plate 100.

[0022] Specifically, the present design significantly improves the heat dissipation area by providing an outwardly extending support frame 140 on the bottom plate 100 and providing a first heat sink 110 with a V-shaped distribution between the support frame 140 and the cover plate 130. At the same time, a wave-shaped conductive protrusion 150 is provided on the side wall of the first heat sink 110, which can more effectively guide the heat dissipation and improve the heat dissipation efficiency. A plurality of second heat sinks 160 are provided between the support frame 140 and the bottom plate 100, and a third heat sink 170 is provided at the lower end of the bottom plate 100. This multi-level heat dissipation design can form a more complex heat dissipation channel, so that the heat can be dissipated more evenly and avoid the occurrence of local overheating.

[0023] In another embodiment of the utility model, mounting platforms 180 are provided at both ends of the bottom plate 100, and through mounting holes 190 are provided on the mounting platforms 180. In this embodiment, by providing mounting platforms 180 at both ends of the bottom plate 100 and through mounting holes 190 are provided on the mounting platforms 180, the radiator can be quickly fixedly connected to the computer host or other heat dissipation equipment during the installation process. This design simplifies the installation steps, improves the installation efficiency, and reduces the installation cost.

[0024] In another embodiment of the utility model, the two first heat sinks 110 at the outermost ends are further connected with a protective plate 200, and the width of the mounting platform 180 is consistent with the protective plate 200. In this embodiment, the protective plate 200 is connected to the outermost heat sink, which enhances the structural strength of the edge of the heat sink, so that the entire heat sink can better resist deformation or damage when subjected to external forces. This enhanced structural stability helps to ensure the reliability of the heat sink during long-term use.

[0025] In another embodiment of the utility model, the distance between the first heat sinks 110 is greater than 4 mm and less than 8 mm.

[0026] In another embodiment of the utility model, the first heat sink 110 and the third heat sink 170 are arranged vertically, and the second heat sink 160 is arranged horizontally. The vertically arranged first heat sink 110 and the third heat sink 170 can better utilize the vertical space to form a vertical heat dissipation channel, so that the heat can be dissipated more smoothly in the vertical direction. At the same time, the horizontally arranged second heat sink 160 can form a horizontal heat dissipation channel, which complements the vertical heat dissipation channel to form a three-dimensional heat dissipation network, thereby improving the overall heat dissipation efficiency.

[0027] In another embodiment of the utility model, the base plate 100, the cover plate 130, the first heat sink 110, the second heat sink 160 and the third heat sink 170 are all made of carbon steel. Carbon steel, as a metal material, has good thermal conductivity. Using carbon steel as the main material of the radiator can quickly transfer the heat generated by the computer from the base plate 100 to each heat sink, and dissipate the heat into the air through the heat sink. This efficient heat conduction and dissipation mechanism helps to maintain the stable operation of the computer and prevent performance degradation or damage caused by overheating.

[0028] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A computer radiator, characterized in that: It includes a base plate, a first heat sink, a heat pipe and a cover plate, and the base plate and the cover plate are in corresponding positions; a support frame extending outward is provided on the base plate, and a plurality of first heat sinks are arranged between the support frame and the cover plate, and the height of the first heat sink is distributed in a V shape; a wave-shaped conductive protrusion is provided on the side wall of the first heat sink; the heat pipe passes through the first heat sink and is fixedly connected thereto; a plurality of second heat sinks are arranged on the side wall of the first heat sink between the support frame and the base plate, and a third heat sink is arranged at the lower end of the base plate.

2. The computer radiator according to claim 1, characterized in that: Both ends of the bottom plate are provided with mounting platforms, and the mounting platforms are provided with penetrating mounting holes.

3. The computer radiator according to claim 2, characterized in that: The two first heat sinks located at the outermost ends are also connected to a protective plate, and the width of the mounting platform is consistent with the protective plate.

4. The computer radiator according to claim 3, characterized in that: The distance between the first heat sinks is greater than 4 mm and less than 8 mm.

5. The computer heat sink according to claim 1, characterized in that: The first heat sink and the third heat sink are arranged vertically, and the second heat sink is arranged horizontally.

6. The computer radiator according to any one of claims 1 to 5, characterized in that: The base plate, the cover plate, the first heat sink, the second heat sink and the third heat sink are all made of carbon steel.

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