Integrated touch module structure capable of preventing water vapor from permeating into binding position of integrated circuit (IC) chip

Abstract

The utility model discloses an integrated touch module structure capable of preventing water vapor from permeating into a binding position of an IC (integrated circuit) chip. The integrated touch module structure comprises a cover plate, a display screen and a backlight structure which are sequentially stacked, the display screen comprises an upper piece of glass and a lower piece of glass, one side edge of the lower piece of glass extends in the direction away from the upper piece of glass to form a binding protruding part, an IC chip is bound on the binding protruding part, inclined planes are arranged on the side walls of the periphery of the IC chip, and UV glue is arranged on the inclined planes around the periphery of the IC chip; and silicone adhesive is arranged on the binding lug boss and covers the top surface of the IC chip and the UV adhesive respectively. Thus, the peripheral side walls of the IC chip are arranged to be the inclined planes, and the UV glue is arranged around the inclined planes, so that the coverage area of the UV glue is increased, water vapor is prevented from invading the binding position of the IC chip, and meanwhile, the silicone glue covers the surface of the IC chip and the UV glue, so that water seepage of the binding position of the IC chip can be further prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of touch modules, in particular to an integrated touch module structure capable of preventing water vapor from penetrating into an IC chip binding position. Background Art

[0002] The integrated touch module includes a display screen, which includes an upper glass and a lower glass. The lower glass extends outward relative to the upper glass to form a protrusion, on which an IC binding position is provided, and the IC chip is bound to the binding position. Usually, in order to protect the metal wiring on the lower glass to prevent the metal wiring from rusting, short circuiting, corrosion and other defects, a layer of UV glue is applied around the IC chip. However, the existing UV glue is too thin around the IC chip, which leads to the phenomenon that water vapor penetrates into the IC chip binding position after the reliability test, causing the IC chip to have defects such as short circuit, high current or open circuit, which in turn leads to display abnormality. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide an integrated touch module structure capable of preventing water vapor from penetrating into the binding position of an IC chip.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] An integrated touch module structure capable of preventing water vapor from penetrating into an IC chip binding position comprises: a cover plate, a display screen and a backlight structure stacked in sequence; the display screen comprises an upper glass and a lower glass, one side edge of the lower glass extends in a direction away from the upper glass to form a binding protrusion, an IC chip is bound to the binding protrusion, inclined surfaces are arranged on the four side walls of the IC chip, and UV glue is arranged on the inclined surfaces surrounding the IC chip; and silicone glue is arranged on the binding protrusion, and the silicone glue covers the top surface of the IC chip and the UV glue respectively.

[0006] In one embodiment, the cover plate is a glass cover plate.

[0007] In one embodiment, the thickness of the cover plate is 1.8 mm.

[0008] In one embodiment, the display screen further includes a lower polarizer and an upper polarizer, and the upper glass and the lower glass are between the upper polarizer and the lower polarizer.

[0009] In one of the embodiments, the display screen is bonded to the cover plate by optical adhesive.

[0010] In one embodiment, the optical adhesive is OCA optical adhesive.

[0011] In one of the embodiments, a display screen FPC is also bound to the binding protrusion.

[0012] In one embodiment, the backlight structure includes a backlight frame and an optical element. A limiting cavity is provided on the backlight frame, and the optical element is accommodated in the limiting cavity.

[0013] In one embodiment, the optical element includes a diffusion film, a light guide plate, a diffusion film, a lower brightness enhancement sheet and an upper brightness enhancement sheet stacked in sequence, the diffusion film is located near the bottom surface of the limiting cavity, and the upper brightness enhancement sheet is located near a side surface of the display screen.

[0014] In one of the embodiments, the backlight structure further includes light-shielding glue, the light-shielding glue is attached to the opening side of the backlight frame, and the display screen is bonded and connected to the backlight frame via the light-shielding glue.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The integrated touch module structure of the utility model capable of preventing water vapor from penetrating into the binding position of the IC chip is provided by setting the surrounding side walls of the IC chip into inclined surfaces, and at the same time arranging UV glue around the inclined surfaces. Thus, by setting the inclined surfaces, the coverage area of ​​the UV glue is increased, and at the same time, the path for water vapor to invade from the gap is increased, thereby reducing the intrusion of water vapor into the binding position of the IC chip. At the same time, by covering the binding protrusion with silicone glue, and making the silicone glue cover the surface of the IC chip and the UV glue, thus, a better protective effect can be achieved, and the strength of the product can be improved while further preventing water from seeping into the binding position of the IC chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a front view structural schematic diagram of an integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position in one embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of a stacked structure of an integrated touch module structure capable of preventing water vapor from penetrating into an IC chip binding position in one embodiment of the utility model;

[0020] Figure 3 for Figure 2 A schematic diagram of the partially enlarged structure of the integrated touch module structure at point A which can prevent water vapor from penetrating into the IC chip binding position. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0022] See also Figure 1 , Figure 2 and Figure 3 As shown, an integrated touch module structure 10 capable of preventing water vapor from penetrating into the IC chip binding position includes: a cover plate 100, a display screen 200 and a backlight structure 300 stacked in sequence; the display screen 200 includes an upper glass 210 and a lower glass 220, one side edge of the lower glass 220 extends in a direction away from the upper glass 210 to form a binding protrusion 221, an IC chip 222 is bound to the binding protrusion 221, inclined surfaces 222a are arranged on the surrounding side walls of the IC chip 222, and UV glue 223 is arranged on the inclined surfaces 222a surrounding the IC chip; and silicone glue 224 is arranged on the binding protrusion 221, and the silicone glue 224 covers the top surface of the IC chip 222 and the UV glue 223 respectively.

[0023] It should be noted that by setting the surrounding side walls of the IC chip 222 as inclined surfaces 222a, and setting UV glue 223 around the inclined surfaces 222a, the coverage area of ​​the UV glue 223 is increased by setting the inclined surfaces 222a, and the path for water vapor to invade from the gap is increased, thereby reducing the invasion of water vapor into the IC chip binding position. At the same time, by covering the binding protrusion with silicone glue, and making the silicone glue cover the surface of the IC chip and the UV glue, it can play a better protective role, improve the strength of the product, and further prevent water seepage at the IC chip binding position. The UV glue is an ultraviolet light curing glue, and its curing depends on ultraviolet light irradiation. Furthermore, the filling amount of silicone glue needs to ensure that the two sides of the silicone glue are respectively against the cover plate and the binding protrusion, thereby improving the strength of the binding protrusion and avoiding damage to the binding protrusion during reliability testing.

[0024] Preferably, the cover plate 100 is a glass cover plate.

[0025] Preferably, the thickness of the cover plate is 1.8 mm.

[0026] Furthermore, the display screen 200 further includes a lower polarizer 230 and an upper polarizer 240, and the upper glass and the lower glass are between the upper polarizer and the lower polarizer. The image display of the display screen is realized by the cooperation of the lower polarizer and the upper polarizer, and the display effect can be improved by the lower polarizer and the upper polarizer, making the image clearer.

[0027] Furthermore, the display screen 200 is bonded to the cover plate 100 by means of an optical glue 400. Preferably, the optical glue is an OCA (special adhesive) optical glue.

[0028] Furthermore, the binding protrusion is also bound with a display screen FPC 500. The display screen FPC is used to achieve electrical conduction of the display screen.

[0029] Furthermore, the backlight structure 300 includes a backlight frame and an optical element. A limited cavity is provided on the backlight frame, and the optical element is accommodated in the limited cavity. The optical element makes the backlight more uniform and brighter. Specifically, the optical element includes a diffusion film, a light guide plate, a diffusion film, a lower brightness enhancement sheet, and an upper brightness enhancement sheet stacked in sequence. The diffusion film is located near the bottom surface of the limited cavity, and the upper brightness enhancement sheet is located near a side of the display screen.

[0030] Furthermore, the backlight structure 300 also includes a light shielding glue, and the light shielding glue is attached to the opening side of the backlight frame, and the display screen is bonded and connected to the backlight frame through the light shielding glue. The light shielding glue plays a role of light shielding to prevent lateral light leakage.

[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position, characterized in that: include: A cover plate, a display screen and a backlight structure stacked in sequence; The display screen includes an upper glass and a lower glass, one side of the lower glass extends in a direction away from the upper glass to form a binding protrusion, an IC chip is bound to the binding protrusion, and inclined surfaces are arranged on the side walls around the IC chip, and UV glue is arranged on the inclined surfaces around the IC chip; Furthermore, silicone glue is arranged on the binding protrusion, and the silicone glue covers the top surface of the IC chip and the UV glue respectively.

2. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 1, characterized in that: The cover plate is a glass cover plate.

3. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 2, characterized in that: The thickness of the cover plate is 1.8 mm.

4. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 3, characterized in that: The display screen further comprises a lower polarizer and an upper polarizer, and the upper glass and the lower glass are between the upper polarizer and the lower polarizer.

5. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 4, characterized in that: The display screen is bonded and connected to the cover plate by optical adhesive.

6. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 5, characterized in that: The optical adhesive is OCA optical adhesive.

7. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 6, characterized in that: The binding protrusion is also bound with a display screen FPC.

8. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 7, characterized in that: The backlight structure comprises a backlight frame and an optical element. A limiting cavity is provided on the backlight frame, and the optical element is accommodated in the limiting cavity.

9. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 8, characterized in that: The optical element includes a diffusion film, a light guide plate, a diffusion film, a lower brightness enhancement sheet and an upper brightness enhancement sheet stacked in sequence. The diffusion film is located near the bottom surface of the limiting cavity, and the upper brightness enhancement sheet is located near a side surface of the display screen.

10. The integrated touch module structure capable of preventing water vapor from penetrating into the IC chip binding position according to claim 9, characterized in that: The backlight structure further comprises light-shielding glue, and the light-shielding glue is attached to the opening side of the backlight frame, and the display screen is bonded and connected to the backlight frame via the light-shielding glue.

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